JPH03236248A - Method for forming conductive protrusion of lead part of tape for tab - Google Patents
Method for forming conductive protrusion of lead part of tape for tabInfo
- Publication number
- JPH03236248A JPH03236248A JP2033206A JP3320690A JPH03236248A JP H03236248 A JPH03236248 A JP H03236248A JP 2033206 A JP2033206 A JP 2033206A JP 3320690 A JP3320690 A JP 3320690A JP H03236248 A JPH03236248 A JP H03236248A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- lead
- light sensitive
- tab
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 238000000206 photolithography Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、マイクロエレクトロニクス分野における電気
回路部品間の接続方式の１つであるＴＡＢ（Ｔａｐｅ
Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）法に用いられる
キャリアテープに関し、更に詳述すればそのリード部分
の電極に接続の為の導電突起を形成する方法に関する。Detailed Description of the Invention [Field of Industrial Application] The present invention applies to TAB (Tape), which is one of the connection methods between electric circuit components in the field of microelectronics.
The present invention relates to a carrier tape used in an automated bonding method, and more specifically, to a method for forming conductive protrusions for connection to electrodes of lead portions thereof.
近年、半導体素子は、これの小型化に伴って半導体素子
と外部端子とを接続する素子上の電極が狭ピッチ、多ピ
ン化する傾向にある。そこで、このような傾向に対して
接続の信幀性が高く、高速実装が可能な実装技術として
ＴＡＢ法が注目されている。In recent years, as semiconductor devices have become smaller, the electrodes on the device that connect the semiconductor device and external terminals have tended to have narrower pitches and more pins. Therefore, in response to this trend, the TAB method is attracting attention as a mounting technology that provides high connection reliability and enables high-speed mounting.
ＴＡＢ法により半導体素子上の電極と、キャリアテープ
のリード部分に設けられた電極とを接続する方法として
リードの電極上に金属導体を転写形成しておき、この金
属導体を用いて接続する方法がある（例えば特開昭５７
−１５２１４７号公報、特開昭６０−１３０１４７号公
報等）。A method of connecting an electrode on a semiconductor element and an electrode provided on a lead portion of a carrier tape using the TAB method is to transfer and form a metal conductor onto the electrode of the lead, and then use this metal conductor to make the connection. There are (for example, Japanese Patent Application Laid-Open No. 1983)
-152147, JP-A-60-130147, etc.).
第５図はその接続方法を示す模式図である。予め基板３
９上にメ・ツキ法等により導電突起３７をパターン形成
しておき、この導電突起３７とキャリアテープ３８のリ
ード３６の電極とを位置合せした後、熱圧着してリード
３６の電極に導電突起３７を転写し、基板３９を除去す
る（第５図（ａ））。次いで、転写。FIG. 5 is a schematic diagram showing the connection method. Board 3 in advance
A pattern of conductive protrusions 37 is formed on the surface of the conductive protrusion 37 by a metallizing method or the like, and after aligning the conductive protrusion 37 and the electrode of the lead 36 of the carrier tape 38, the conductive protrusion 37 is attached to the electrode of the lead 36 by thermocompression bonding. 37 is transferred and the substrate 39 is removed (FIG. 5(a)). Next, transcription.
形成されたリード３６の電極上の導電突起３７とＩＣチ
ップ３１の電極３２とを位置合せした後、熱圧着して、
導電突起３７と電極３２とを接続する（第５図（ｂ））
。After aligning the conductive projections 37 on the electrodes of the leads 36 and the electrodes 32 of the IC chip 31, they are bonded by thermocompression.
Connecting the conductive protrusion 37 and the electrode 32 (FIG. 5(b))
.
ところで、上述したようなリード上における導電突起の
形成方法にあっては、リードの電極と導電突起とを１対
ｌで対応させている為、ＩＣチップの電極の狭ピッチ化
及び多ビン化に伴うリード部分の微細化により、リード
の電極部分の中央に導電突起を正確に位置合せして転写
するのが困難となる。この結果、ＩＣチ・７ブの電極に
対して位置ずれが起こり、接続強度の低下、又は電極間
の短絡をもたらすという問題がある。By the way, in the method for forming conductive protrusions on the leads as described above, since the electrodes of the leads and the conductive protrusions are matched in a one-to-one ratio, it is possible to reduce the pitch of the electrodes of IC chips and increase the number of bins. Due to the accompanying miniaturization of the lead portion, it becomes difficult to accurately align and transfer the conductive protrusion to the center of the electrode portion of the lead. As a result, there is a problem in that positional deviation occurs with respect to the electrodes of the IC chip 7, resulting in a reduction in connection strength or a short circuit between the electrodes.
本発明は斯かる事情に鑑みてなされたものであり、ＩＣ
チップの電極の狭ピッチ化及び多ビン化に伴って微細化
するＴＡＢ用テープのリード部分の電極に、高精度の位
置合わせを要することなく、確実にＩＣチップの電極と
の接続を行う為の導電突起を形成する方法を提供するこ
とを目的とする。The present invention has been made in view of such circumstances, and is an IC
In order to reliably connect the electrodes of the IC chip without requiring high-precision alignment to the electrodes of the lead part of the TAB tape, which are becoming finer due to the narrower pitch of chip electrodes and the increase in the number of bins. An object of the present invention is to provide a method for forming conductive protrusions.
［課題を解決するための手段〕
本発明に係るＴＡＢ用テープのリード部分の導電突起形
成方法は、配線用のリードを有するＴＡＢ用テープの前
記リードの電極に導電突起を形成する方法において、前
記リードの電極に感光性樹脂を塗布してフォトリソグラ
フィ法にて選択的に感光性樹脂を除去することにより、
感光性樹脂にこれの表面から前記リードの電極にまで至
る穴を形成し、該大の中に前記導電突起となる金属を充
填することを第１発明の特徴とし、前記導電突起となる
金属の充填後、前記感光性樹脂を前記リードの電極から
除去することを第２発明の特徴とする。[Means for Solving the Problems] A method for forming a conductive projection on a lead portion of a TAB tape according to the present invention is a method for forming a conductive projection on an electrode of the lead of a TAB tape having wiring leads. By applying photosensitive resin to the lead electrode and selectively removing the photosensitive resin using photolithography,
The first aspect of the invention is characterized in that a hole extending from the surface of the photosensitive resin to the electrode of the lead is formed, and the hole is filled with a metal that will become the conductive projection. The second invention is characterized in that the photosensitive resin is removed from the electrodes of the leads after filling.
第１発明のＴＡＢ用テープのリード部分の導電突起形成
方法においては、リードの電極に感光性樹脂が塗布され
、フォトリソグラフィ法にてその樹脂が選択的に除去さ
れることにより、感光性樹脂の表面からリードの電極に
至るまでの穴が形成され、この穴の中に金属が充填され
て導電突起が形成される。In the method for forming conductive protrusions on the lead portion of a TAB tape of the first invention, a photosensitive resin is applied to the electrode of the lead, and the resin is selectively removed by photolithography. A hole is formed from the surface to the electrode of the lead, and the hole is filled with metal to form a conductive protrusion.
第２発明にあっては、第１発明にて使用された感光性樹
脂が導電突起の形成後、リードの電極から除去される。In the second invention, the photosensitive resin used in the first invention is removed from the electrode of the lead after the conductive projections are formed.
これにより導電突起だけが電極上に残る。This leaves only the conductive protrusions on the electrodes.
以下、本発明をその実施例を示す図面に基づき具体的に
説明する。第１図は本発明に係るＴＡＢ用テープのリー
ド部分の導電突起形成方法を示す模式図である。まず、
ＴＡＢ用テープ１のリード１ａの端部に設けられた電極
ｌｂ上に感光性有機樹脂２を塗布する（第１図（ａ））
。次にフォトリソグラフィ法にて感光性有機樹脂２を選
択的に除去して感光性有機樹脂２の表面から電極１ｂに
まで至る複数の穴２ａを形成する（第１図（ｂ））。こ
こで、この穴２ａを形成するのにマスク３ （本実施例
においては複数の孔が散在するポジ型のものを用いる）
を使用するが、そのマスクは開孔パターンが電極１ｂよ
り広い領域に形成され、孔の開孔面積が電極１ｂの面積
よりも小さいものを用いる。これによりマスク３を高精
度に位置合せしなくとも、少なくともマスクの１つの孔
を感光性有機樹脂２上に位置させて載置することができ
、マスクの孔の間隔を密にする程、穴２ａを多く形成で
きる。次にこの穴２ａ内の電極ｌｂ上にメツキ法、又は
蒸着等の適宜の方法にて金等の金属を充填し、感光性有
機樹脂２０表面から突出させることにより導電突起４を
形成する（第１図（Ｃ））。ここで導電突起４は単一層
、又は他の金属との複数層として形成することができる
。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on drawings showing embodiments thereof. FIG. 1 is a schematic diagram showing a method for forming conductive protrusions on a lead portion of a TAB tape according to the present invention. first,
A photosensitive organic resin 2 is applied onto the electrode lb provided at the end of the lead 1a of the TAB tape 1 (Fig. 1(a)).
. Next, the photosensitive organic resin 2 is selectively removed by photolithography to form a plurality of holes 2a extending from the surface of the photosensitive organic resin 2 to the electrode 1b (FIG. 1(b)). Here, a mask 3 (in this embodiment, a positive type mask with a plurality of holes scattered about) is used to form the holes 2a.
However, a mask is used in which the opening pattern is formed in a wider area than the electrode 1b, and the opening area of the hole is smaller than the area of the electrode 1b. As a result, the mask 3 can be placed with at least one hole positioned on the photosensitive organic resin 2 without having to align the mask 3 with high precision. 2a can be formed in large numbers. Next, a metal such as gold is filled onto the electrode lb in the hole 2a by a suitable method such as plating or vapor deposition, and is made to protrude from the surface of the photosensitive organic resin 20, thereby forming a conductive protrusion 4 (the first Figure 1 (C)). Here, the conductive protrusion 4 can be formed as a single layer or as multiple layers with other metals.
第２発明に係るＴＡＢ用テープのリード部分の導電突起
形成方法は前記第１図（Ｃｌまで同様であり、この後、
第２図に示すように感光性有機樹脂２を有機系溶媒を用
いて除去することにより、導電突起４のみを電極ｌｂ上
に残す。この場合は、導電突起４を感光性有機樹脂２か
ら突出するまで形成する必要がない。The method for forming conductive protrusions on the lead portion of the TAB tape according to the second invention is the same as that shown in FIG.
As shown in FIG. 2, by removing the photosensitive organic resin 2 using an organic solvent, only the conductive projections 4 remain on the electrode lb. In this case, it is not necessary to form the conductive projections 4 until they protrude from the photosensitive organic resin 2.
第３図は導電突起の形成状態を示すリード部分の平面図
及び側面図である。第３図（ａ）はリード１ａの幅方向
の全体に電極１ｂが形成しである場合、第３図（ｂ）は
幅方向の中央部にのみ電極１ｂが形成しである場合を夫
々示してあり、本実施例において電極１ｂはＳｎメツキ
にて形成したものを使用しである。FIG. 3 is a plan view and a side view of the lead portion showing the state in which conductive protrusions are formed. FIG. 3(a) shows a case in which the electrode 1b is formed over the entire width of the lead 1a, and FIG. 3(b) shows a case in which the electrode 1b is formed only in the center in the width direction. In this embodiment, the electrode 1b is formed by Sn plating.
各電極１ｂに対していずれも複数の導電突起４が転写さ
れている。導電突起は各電極１ｂに対して単数であって
も良い。A plurality of conductive protrusions 4 are transferred to each electrode 1b. A single conductive protrusion may be provided for each electrode 1b.
第４図は本発明方法にてリードの一部に導電突起が形成
されたＴＡＢ用テープとＩＣチップとの接続工程を示す
模式図である。FIG. 4 is a schematic diagram showing the process of connecting an IC chip to a TAB tape in which a conductive protrusion is formed on a part of the lead by the method of the present invention.
第４図（ａｌに示すようにＴＡＢ用テープ１のリード１
ａの電極１ｂ、即ちこの上に形成された導電突起４と、
ＩＣチップ５の電極５ａとを対向させ、ボンディングツ
ール６を用いて圧着する。Lead 1 of TAB tape 1 as shown in Figure 4 (al)
an electrode 1b of a, that is, a conductive protrusion 4 formed thereon;
The electrodes 5a of the IC chip 5 are made to face each other and are crimped using the bonding tool 6.
これにより、第４図（ｂｌに示すように各接続部分にお
いて複数の導電突起４を介してＩＣチップ５の電極５ａ
と、ＴＡＢ用テープ１のリード１ａの電極１ｂとの電気
的接続がなされる。As a result, as shown in FIG. 4 (bl), the electrodes 5a of the IC chip 5 are
Then, an electrical connection is made between the lead 1a of the TAB tape 1 and the electrode 1b.
下記第１表及び第２表は、上述の方法によりＴＡＢ用テ
ープのリード上の電極に導電突起を形成し、ｒｃチップ
上の電極と接続して導通試験を行った結果を示してあり
、共にリード上の電極面積と、ＩＣチップ上の電極面積
とは等しくしてあり、第１表は前記第３図（ａ）に示し
たようにリードの幅方向の全体に電極が形成しである場
合、また第２表は前記第３図（ｂ）に示したように幅方
向の中央部にのみ電極が形成しである場合について夫々
示しである。Tables 1 and 2 below show the results of conducting a continuity test by forming conductive protrusions on the electrodes on the leads of the TAB tape and connecting them to the electrodes on the RC chip using the method described above. The electrode area on the lead is equal to the electrode area on the IC chip, and Table 1 shows the case where the electrode is formed over the entire width of the lead as shown in FIG. 3(a) above. Also, Table 2 shows the case where the electrode is formed only at the center in the width direction, as shown in FIG. 3(b).
例えば第１表のリード幅が５０μｍで、電極面積がリー
ド及びＩＣチップ側共に５０ Ｘ ５０μｍの場合は、
前記導電体保持材に導電突起を縦横１５μｍのピッチで
形成したものを使用して５０ビンの接続、つまりＩＣチ
ップの一辺に配列された５０個の電極に対して５０本の
リードを有するＴＡＢ用テープにて一括接続を行った場
合、圧着状態及び導通状態は共に良好であった。なお、
他のリード幅及び電極面積の場合も同じ接続ビン数で試
験を行った。For example, if the lead width in Table 1 is 50 μm and the electrode area is 50 x 50 μm on both the lead and IC chip sides, then
Using the conductor holding material with conductive protrusions formed at a pitch of 15 μm vertically and horizontally, it is possible to connect 50 bins, that is, for a TAB having 50 leads for 50 electrodes arranged on one side of an IC chip. When the connection was made all at once using tape, both the crimped state and the conductive state were good. In addition,
Tests were also conducted with the same number of connection bins for other lead widths and electrode areas.
第１表
第２表
突起の配設ピッチを変更することにより、位置合せする
ことなく、数μｍ程度のリード幅まで確実に導電突起を
形成でき、ＩＣチップの電極と良好な導通状態を保つ接
続が行われる。Table 1 Table 2 By changing the arrangement pitch of the protrusions, conductive protrusions can be reliably formed up to a lead width of several μm without alignment, and connections that maintain good conductivity with the electrodes of the IC chip. will be held.
また、下記第３表はリード幅が５０μｍで電極面積が３
０ Ｘ ３０μｍ１導電突起の配設ピッチを５μｍとし
た場合に接続ビン数を変えて一括接続を行った場合の導
通試験結果である。導通試験結果は１０００個をサンプ
リングした場合の導通不良個数を示しである。In addition, Table 3 below shows that the lead width is 50 μm and the electrode area is 3.
0 x 30 μm 1 This is the continuity test result when the arrangement pitch of the conductive protrusions was 5 μm and batch connection was performed by changing the number of connection bins. The continuity test result shows the number of conductivity failures when 1000 samples were sampled.
第３表
上記表から分かるように電極面積に応じて導電上記表か
ら分かるように接続ビン数が増加しても導通試験結果は
良好である。Table 3 As can be seen from the above table, conductivity depends on the electrode area.As can be seen from the above table, even if the number of connected bins increases, the continuity test results are good.
なお、本実施例においては導電突起の配設形態を規則正
しく配列したものを示しであるが、これに限定されるも
のではな（、任意の形態に配設できる。In this embodiment, the arrangement of the conductive protrusions is shown as being arranged in a regular manner, but the arrangement is not limited to this (although they can be arranged in any arbitrary arrangement).
また、本発明は銅箔のみからなる一層ＴＡＢは勿論、銅
箔と有機樹脂とからなる二層ＴＡＢ、三層ＴＡＢへの適
用も可能である。Further, the present invention can be applied not only to a single-layer TAB made of only copper foil, but also to a two-layer TAB and a three-layer TAB made of copper foil and an organic resin.
以上の如く本発明に係るＴＡＢ用テープのリード部分の
導電突起形成方法においては、導電突起を形成すべきリ
ードの電極上に感光性樹脂を塗布し、電極より広い領域
に開孔パターンが形成されたマスクを用いるフォトリソ
グラフィ法にて感光性樹脂から電極まで至る穴を形成し
、この穴の中の電極上に導電突起を直接形成する。As described above, in the method for forming conductive protrusions on the lead portion of a TAB tape according to the present invention, a photosensitive resin is applied onto the electrode of the lead on which the conductive protrusion is to be formed, and an aperture pattern is formed in an area wider than the electrode. A hole extending from the photosensitive resin to the electrode is formed by photolithography using a mask, and a conductive protrusion is directly formed on the electrode in this hole.
この為、従来の転写方法のように高精度の位置合せを行
うことなく、容易にリードの電極上に少なくとも１以上
の導電突起を形成することができ、ＩＣチップ上の電極
の狭ピッチ化及び多ビン化に伴うＴＡＢ用テープの微細
化に対しても、接続強度の低下、又は電極間の短絡をも
たらすことなく、確実にＴＡＢ用テープとＩＣチップと
を電気的に接続することができ、半導体装置の信韻性を
大幅に高めることができる等、本発明は優れた効果を奏
する。Therefore, it is possible to easily form at least one or more conductive protrusions on the electrodes of the leads without having to perform high-precision positioning as in conventional transfer methods, and it is possible to narrow the pitch of the electrodes on the IC chip. Even when the TAB tape becomes finer due to the increase in the number of bins, it is possible to reliably electrically connect the TAB tape and the IC chip without reducing connection strength or shorting between electrodes. The present invention has excellent effects such as being able to significantly improve the reliability of a semiconductor device.
第１図は第１発明に係るＴＡＢ用テープのリード部分の
導電突起形成方法の工程を示す模式図、第２図は第２発
明に係る導電突起形成方法によるＴＡＢ用テープ上の導
電突起を示す模式図、第３図は導電突起の形成状態を示
すリード部分の平面図及び側面図、第４図は本発明方法
にてリードの一部に導電突起が形成されたＴＡＢ用テー
プとＩＣチップとの接続工程を示す模式図、第５図は従
来のＴＡＢ用テープとＩＣチップとの接続工程を示す模
式図である。FIG. 1 is a schematic diagram showing the steps of a method for forming conductive protrusions on the lead portion of a TAB tape according to the first invention, and FIG. 2 shows conductive protrusions on a TAB tape by the method for forming conductive protrusions according to the second invention. A schematic diagram, FIG. 3 is a plan view and a side view of a lead portion showing the state in which conductive protrusions are formed, and FIG. 4 is a diagram showing a TAB tape and an IC chip in which conductive protrusions are formed on a part of the lead by the method of the present invention. FIG. 5 is a schematic diagram showing the connection process between a conventional TAB tape and an IC chip.
Claims (1)
ドの電極に導電突起を形成する方法において、 前記リードの電極に感光性樹脂を塗布して フォトリソグラフィ法にて選択的に感光性樹脂を除去す
ることにより、感光性樹脂にこれの表面から前記リード
の電極にまで至る穴を形成し、該穴の中に前記導電突起
となる金属を充填すること を特徴とするＴＡＢ用テープのリード部分の導電突起形
成方法。 ２、前記導電突起となる金属の充填後、前記感光性樹脂
を前記リードの電極から除去する請求項１記載のＴＡＢ
用テープのリード部分の導電突起形成方法。[Scope of Claims] 1. A method for forming conductive protrusions on the electrodes of the leads of a TAB tape having leads for wiring, including applying a photosensitive resin to the electrodes of the leads and selectively applying the photosensitive resin to the electrodes using photolithography. TAB characterized in that by removing the photosensitive resin, a hole is formed in the photosensitive resin from the surface thereof to the electrode of the lead, and the hole is filled with a metal that becomes the conductive protrusion. A method for forming conductive protrusions on the lead part of tape. 2. The TAB according to claim 1, wherein the photosensitive resin is removed from the electrode of the lead after filling with the metal that becomes the conductive protrusion.
A method for forming conductive protrusions on the lead part of tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2033206A JP2827393B2 (en) | 1990-02-13 | 1990-02-13 | Method for forming conductive protrusions on lead portion of TAB tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2033206A JP2827393B2 (en) | 1990-02-13 | 1990-02-13 | Method for forming conductive protrusions on lead portion of TAB tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03236248A true JPH03236248A (en) | 1991-10-22 |
| JP2827393B2 JP2827393B2 (en) | 1998-11-25 |
Family
ID=12379991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2033206A Expired - Fee Related JP2827393B2 (en) | 1990-02-13 | 1990-02-13 | Method for forming conductive protrusions on lead portion of TAB tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2827393B2 (en) |
-
1990
- 1990-02-13 JP JP2033206A patent/JP2827393B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2827393B2 (en) | 1998-11-25 |
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