JPH03230539A - Wire bonding equipment - Google Patents

Wire bonding equipment

Info

Publication number
JPH03230539A
JPH03230539A JP2026515A JP2651590A JPH03230539A JP H03230539 A JPH03230539 A JP H03230539A JP 2026515 A JP2026515 A JP 2026515A JP 2651590 A JP2651590 A JP 2651590A JP H03230539 A JPH03230539 A JP H03230539A
Authority
JP
Japan
Prior art keywords
wire
linear motor
lever
current
clamp piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2026515A
Other languages
Japanese (ja)
Inventor
Satoru Waga
悟 和賀
Hisashi Nakaoka
中岡　久
Nariyuki Uenishikubo
上西窪　成幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP2026515A priority Critical patent/JPH03230539A/en
Publication of JPH03230539A publication Critical patent/JPH03230539A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve workability by equipping a lever with a linear motor, driving a wire clamper by changing a current for the linear motor, and controlling the clamping pressure of a wire. CONSTITUTION:When a current is supplied to a linear motor 11, a lever 2 is revolved clockwise around a rotary shaft 6 as a center, and a clamping piece 3 fixed to the tip pinches a wire 7. When an inverse direction current is supplied to the linear motor 11, the lever 2 is revolved counterclockwise around the rotary shaft 6 as a center; the clamp piece 3 fixed to the tip is opened and release the wire 7. Further the quantity of current supplied to the linear motor 11 is changed in response to the diameter of a wire to be used, and the thrust of the linear motor 11 is controlled, thereby pinching the wire 7 with adequate pressure. Hence, when the wire diameter is changed, mechanical adjustment is unnecessitated, and workability can be improved.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体素子と外部電極とをワイヤ（金線、鋼
線など）によって接続するワイヤボンディング装置に関
する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding device for connecting a semiconductor element and an external electrode using a wire (gold wire, steel wire, etc.).

従来の技術 第２図は従来のワイヤボンディング装置のワイヤクラン
パの構成を示しており、１はワイヤクランパを駆動する
ソレノイド、２は一端に設けたクランプピース３を動作
させるレバー、４はクランプピース３に圧力を与えるば
ね、５はばね４の圧力を調整する圧力調整つまみ、６は
しｔ＜、−２の回動中心である回動軸、７はクランプピ
ース３に挟持された金線、銅線などのワイヤ、８はワイ
ヤ７をクランプピース３へ導くワイヤガイド、９はワイ
ヤ７を半導体素子と外部電極とにボンディングするため
の超音波ホーン、１０はワイヤ７を圧着するキャピラリ
である。BACKGROUND ART FIG. 2 shows the configuration of a wire clamper of a conventional wire bonding apparatus. 1 is a solenoid that drives the wire clamper, 2 is a lever that operates a clamp piece 3 provided at one end, and 4 is a clamp piece 3. 5 is a pressure adjustment knob that adjusts the pressure of spring 4; 6 is a rotation axis that is the rotation center of t<, -2; 7 is a gold wire and copper clamped by clamp piece 3. A wire such as a wire, 8 is a wire guide for guiding the wire 7 to the clamp piece 3, 9 is an ultrasonic horn for bonding the wire 7 to a semiconductor element and an external electrode, and 10 is a capillary for crimping the wire 7.

次にその動作について説明する。Next, its operation will be explained.

クランプピース３は、通電によってソレノイド１が駆動
され、レバー２が回動軸６を中心に動くことによって開
き、閉じるときは通電を断つことで、ソレノイドｌが復
帰し、ばね４の力によってレバー２が回動軸６を中心に
動き閉じるものである。When the clamp piece 3 is energized, the solenoid 1 is driven, and the lever 2 moves around the rotation shaft 6, which opens the clamp piece 3. When the clamp piece 3 is closed, the energization is cut off, the solenoid 1 returns to its original position, and the lever 2 is moved by the force of the spring 4. moves around the rotation axis 6 and closes.

クランプピース３がワイヤ７を締めつける圧力はばね４
の有する力に依存する。−したがって、ばね４の力が強
いと、クランプピース３はワイヤ７を強く締めっけるた
め、ワイヤ７に傷がつき変形する。この変形を防止する
ためには、ワイヤ７を締めつける圧力をワイヤ７に対し
適正なものとする必要がある。この圧力を調整するのが
、圧力調整つまみ５であり、従来、ワイヤ７の径が変わ
る度に圧力調整っまみ５を調整しはね４の力を可変して
いた。The pressure with which the clamp piece 3 tightens the wire 7 is the force of the spring 4
depends on the power of - Therefore, when the force of the spring 4 is strong, the clamp piece 3 tightly tightens the wire 7, which damages and deforms the wire 7. In order to prevent this deformation, it is necessary to apply an appropriate pressure to tighten the wire 7. This pressure is adjusted by the pressure adjustment knob 5. Conventionally, the pressure adjustment knob 5 was adjusted every time the diameter of the wire 7 changed to vary the force of the spring 4.

発明が解決しようとする課題 しかしながら、上記従来の構成では、圧力調整つまみ５
ではね４の力を調節し、ワイヤ７を締めつける力を制御
していたため、ワイヤ７の変形を防止し、かつワイヤ７
を締めっける力を適正に制御するためには、ワイヤ７の
線径を変更するたびに圧力調整つまみ５によってはね４
の力を調整しなければならないという課題があった。Problems to be Solved by the Invention However, in the above conventional configuration, the pressure adjustment knob 5
By adjusting the force of the spring 4 and controlling the force that tightens the wire 7, deformation of the wire 7 can be prevented and the wire 7 can be tightened.
In order to appropriately control the tightening force of the wire 7, each time the wire diameter of the wire 7 is changed, the pressure adjustment knob 5 must be used to adjust the tightening force.
The problem was that we had to adjust the power of the

本発明は、上記従来の課題を解決するものであり、ワイ
ヤを交換しても挟持圧力の調整を必要としない作業性に
優れたワイヤボンディング装置を提供することを目的と
するものである。The present invention has been made to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a wire bonding device with excellent workability that does not require adjustment of the clamping pressure even when the wire is replaced.

課題を解決するための手段 本発明は上記目的を達成するために、リニアモータをレ
バーに設け、そのリニアモータへの電流を可変すること
によってワイヤクランパを駆動し、ワイヤのクランプ圧
力を制御するようにしたものである。Means for Solving the Problems In order to achieve the above object, the present invention provides a lever with a linear motor, and changes the current to the linear motor to drive the wire clamper and control the clamping pressure of the wire. This is what I did.

作用 したがって本発明によれば、ワイヤを締めっける力をリ
ニアモータへ供給する電流を可変にすることによって制
御できるためボンディング装置の作業性を向上できる。According to the present invention, the force for tightening the wire can be controlled by varying the current supplied to the linear motor, thereby improving the workability of the bonding apparatus.

実施例 以下、本発明の実施例について、第１図とともに第２図
における部分と同一部分については同一番号を付して説
明を省略し、相違する点についてのみ説明する。すなわ
ち、本発明においては、従来のソレノイド１に代えてリ
ニアモータ１１を使用し、レバー２を駆動するようにし
たものである。したがって本発明においては従来使用し
ていたばね４と圧力調整つまみ５は不要となる。Embodiments Hereinafter, regarding embodiments of the present invention, parts that are the same as those in FIG. 1 and FIG. That is, in the present invention, a linear motor 11 is used in place of the conventional solenoid 1 to drive the lever 2. Therefore, in the present invention, the spring 4 and pressure adjustment knob 5 that have been used in the past are not necessary.

リニアモータ１１の特性として、その推力とリニアモー
タ１１に供給する電流との関係は比例関係にあり、また
電流の方向を変えることによってその推力の方向を変え
ることができる。したがってリニアモータ１１へ供給す
る電流の方向と量を変えることによって、ワイヤ７を締
めっける力を制御することができる。As a characteristic of the linear motor 11, the relationship between its thrust and the current supplied to the linear motor 11 is proportional, and the direction of the thrust can be changed by changing the direction of the current. Therefore, by changing the direction and amount of current supplied to the linear motor 11, the force that tightens the wire 7 can be controlled.

次にその動作について説明する。Next, its operation will be explained.

リニアモータ１１に電流を供給すると、レバー２は回動
軸６を中心に時計方向に回転し、その先端に取り付けら
れたクランプピース３はワイヤ７を挟持する。またリニ
アモータ１１に反、対方向の電流を供給すると、レバー
２は回動軸６を中心に反時計方向に回転し、その先端に
取り付けられたクランプピース３が開き、ワイヤ７を開
放する。When a current is supplied to the linear motor 11, the lever 2 rotates clockwise about the rotation shaft 6, and the clamp piece 3 attached to the tip thereof clamps the wire 7. Furthermore, when a current in the opposite direction is supplied to the linear motor 11, the lever 2 rotates counterclockwise about the rotation shaft 6, and the clamp piece 3 attached to the tip thereof opens to release the wire 7.

さらに、使用するワイヤ径に合わせてリニアモータ１１
に供給する電流量を可変し、リニアモータ１１の推力を
制御することによってワイヤ７を適正な圧力で挟持する
ことができる。Furthermore, the linear motor 11 can be adjusted according to the wire diameter used.
By varying the amount of current supplied to the linear motor 11 and controlling the thrust of the linear motor 11, the wire 7 can be held with an appropriate pressure.

発明の効果 本発明は上記実施例より明らかなように、電流制御によ
ってワイヤの挟持圧力を制御できるようにしたものであ
り、ワイヤ径が変わった場合でも機械的な調整を行う必
要がなく、ワイヤボンディング装置の作業性を向上でき
るという利点を有する。Effects of the Invention As is clear from the above embodiments, the present invention enables the clamping pressure of the wire to be controlled by current control, and there is no need to perform mechanical adjustment even when the wire diameter changes. This has the advantage that the workability of the bonding device can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例におけるワイヤボンディング
装置のワイヤクランパ部分の斜視図、第２図は従来のワ
イヤボンディング装置のワイヤクランパ部分の斜視図で
ある。 ２・・・・・・レバー　３・・・・・・クランプピース
、７・・・・・・ワイヤ、９・・・・・・超音波ホーン
、１０・・・・・・キャピラリ、１１・・・・・・リニ
アモータ。FIG. 1 is a perspective view of a wire clamper portion of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of a wire clamper portion of a conventional wire bonding apparatus. 2... Lever 3... Clamp piece, 7... Wire, 9... Ultrasonic horn, 10... Capillary, 11... ...Linear motor.

Claims (1)

【特許請求の範囲】[Claims] レバーの一端に設けたクランプピースと超音波ホーンに
設けたキャピラリを通してワイヤを送給し、そのワイヤ
を半導体素子等の電極に圧着するワイヤボンディング装
置において、前記レバーの駆動にリニアモータを用い、
そのリニアモータに供給する電流の方向と電流量を制御
することにより前記クランプピースによるワイヤの保持
の開閉および締結力を調整可能としたワイヤボンディン
グ装置。A wire bonding device that feeds a wire through a clamp piece provided at one end of a lever and a capillary provided to an ultrasonic horn, and crimps the wire to an electrode of a semiconductor element, etc., in which a linear motor is used to drive the lever,
A wire bonding device in which the opening and closing of the wire holding by the clamp piece and the fastening force can be adjusted by controlling the direction and amount of current supplied to the linear motor.
JP2026515A 1990-02-06 1990-02-06 Wire bonding equipment Pending JPH03230539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2026515A JPH03230539A (en) 1990-02-06 1990-02-06 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2026515A JPH03230539A (en) 1990-02-06 1990-02-06 Wire bonding equipment

Publications (1)

Publication Number Publication Date
JPH03230539A true JPH03230539A (en) 1991-10-14

Family

ID=12195615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2026515A Pending JPH03230539A (en) 1990-02-06 1990-02-06 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JPH03230539A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
WO2016208345A1 (en) * 2015-06-23 2016-12-29 日特エンジニアリング株式会社 Gripping device and gripping method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988841A (en) * 1982-11-12 1984-05-22 Toshiba Corp Wire bonding device
JPS63136536A (en) * 1986-11-27 1988-06-08 Toshiba Corp Wire bonding method
JPH01261836A (en) * 1988-04-12 1989-10-18 Mitsubishi Electric Corp Wire bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988841A (en) * 1982-11-12 1984-05-22 Toshiba Corp Wire bonding device
JPS63136536A (en) * 1986-11-27 1988-06-08 Toshiba Corp Wire bonding method
JPH01261836A (en) * 1988-04-12 1989-10-18 Mitsubishi Electric Corp Wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5277355A (en) * 1992-11-25 1994-01-11 Kulicke And Soffa Investments, Inc. Self-aligning fine wire clamp
WO2016208345A1 (en) * 2015-06-23 2016-12-29 日特エンジニアリング株式会社 Gripping device and gripping method
KR20170063867A (en) * 2015-06-23 2017-06-08 닛또꾸 엔지니어링 가부시키가이샤 Gripping device and gripping method

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