JPH03229461A - Solid image pickup device - Google Patents
Solid image pickup deviceInfo
- Publication number
- JPH03229461A JPH03229461A JP2025407A JP2540790A JPH03229461A JP H03229461 A JPH03229461 A JP H03229461A JP 2025407 A JP2025407 A JP 2025407A JP 2540790 A JP2540790 A JP 2540790A JP H03229461 A JPH03229461 A JP H03229461A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- pickup device
- protective glass
- protrusions
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 title abstract 7
- 239000011521 glass Substances 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 238000003384 imaging method Methods 0.000 claims description 25
- 239000010409 thin film Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000004840 adhesive resin Substances 0.000 abstract description 7
- 229920006223 adhesive resin Polymers 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 208000022435 Light chain deposition disease Diseases 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明ｉ；ＬＣＣＤ等の固体撮像素子を用いた固体撮像
装置に関すム
従来の技術
従来の固体撮像装置における撮像素子は、 一般的にセ
ラミック等のパッケージに実装されたちのが大半であム
これは第３図（ａ）及びその断面図である同図（ｂ）
に示すよう圏 例えばコバールなどから成る電極１を有
し セラミックを数層に積層したパッケージ２に固体撮
像素子３を銀ペースト４などでダイボンドしたａ Ａ
ｌ線などの導電線５で固体撮像素子３と電極１の一端を
電気的に接続していも
さらに 撮像素子３Ｃ友 保護ガラス７により例えば
Ｎ２ガスのような不活性ガスと共に密封されている。[Detailed Description of the Invention] Industrial Application Field of the Invention (i) Related to a solid-state imaging device using a solid-state imaging device such as an LCDD Conventional technology The imaging device in a conventional solid-state imaging device is generally made of ceramic or the like. Most of them are mounted on the package.This is Figure 3 (a) and its cross-sectional view (b).
As shown in Figure 1, a solid-state image sensing device 3 is die-bonded with silver paste 4 to a package 2 having an electrode 1 made of, for example, Kovar, and laminated in several layers of ceramic.
Even if the solid-state image sensor 3 and one end of the electrode 1 are electrically connected to each other by a conductive wire 5 such as an L line, the image sensor 3 is further sealed with an inert gas such as N2 gas by a protective glass 7.
さて、この様にセラミックなどを用いたパッケージ２で
は、 パッケージ２を高温中で焼き固めるた敢 固体撮
像素子３のダイボンドを行なう面と保護ガラス７を貼つ
ける面の平行精度を出すのが困難だっ總
そのため撮像素子３の受光面と保護ガラスの光の入射面
との平行度は３０μｍ程度のものである。Now, with the package 2 made of ceramic or the like like this, it is difficult to achieve parallelism between the die-bonding surface of the solid-state image sensor 3 and the surface to which the protective glass 7 is attached due to the fact that the package 2 is baked and hardened at high temperatures. Therefore, the parallelism between the light receiving surface of the image sensor 3 and the light incident surface of the protective glass is about 30 μm.
また 撮像素子３への入射光の一部は、 受光面８上に
形成されるＡＩの配線パターンにより反射され それか
保護ガラス７において反射されて再び受光面８に入射し
フレアを引き起こす。Also, a part of the light incident on the image sensor 3 is reflected by the AI wiring pattern formed on the light receiving surface 8, or is reflected by the protective glass 7 and enters the light receiving surface 8 again, causing flare.
発明が解決しようとする課題
しかしながら前記のような固体撮像装置を用いた３板式
のカラーテレビジョン用の撮像装置で法色分解プリズム
により、入射光像を例えばＲ，Ｇ。Problems to be Solved by the Invention However, in an imaging device for a three-panel color television using a solid-state imaging device as described above, an incident light image is divided into, for example, R and G by a color separation prism.
Ｂの所定の色成分の光像に分解し それぞれの光像を３
つの撮像装置によって撮像し それらを合成してカラー
画像を撮像すム この啄 ３つの撮像素子の受光面は、
入射する光軸に垂直に位置決めされる必要があると共
に 互いに関連をもって精度よく位置決めされていない
と、カラー画像を正確に合成することができなｌ、％
従来の撮像素子では 上記のように保護ガラス面と受光
面とが良好な平行度を有しないたム 保護ガラスを面を
精度的な基準面として考えることかできず、上記精度の
実現には複雑な位置調整機構か必要となるとともに 色
分解プリズムと撮像装置との間に別の部品 例えばガラ
スブロックなどを取り付ける必要かあり構成が複雑とな
り小型化か困難となる。Separate B into light images of predetermined color components, and divide each light image into 3
The light-receiving surfaces of the three image sensors are:
They must be positioned perpendicularly to the incident optical axis, and if they are not precisely positioned in relation to each other, it will not be possible to accurately synthesize a color image.In conventional image sensors, a protective glass is used as described above. If the surface and the light-receiving surface do not have good parallelism, the surface of the protective glass cannot be considered as an accurate reference surface, and achieving the above accuracy requires a complicated position adjustment mechanism and color separation. It is necessary to attach another component, such as a glass block, between the prism and the imaging device, which complicates the configuration and makes it difficult to miniaturize.
さらに その様な構成では温度変化によって相対的位置
ズレを起こしやすく画像の重ね合わせ時に誤差が生じテ
レビ画面上で色ズレとなって現われる。さらに 固体撮
像素子の受光面周辺ζ！Ａｌの配線パターンが設けてあ
り、前記配線パターンは入射光像を反射しフレアの要因
となム 本発明は 上記問題点に鑑み簡易な構成で固体
撮像素子の相対的な位置ズレを小さくするとともに反射
光によるフレアを最小限に出来る固体撮像部品を提供す
ることを目的とすム
課題を解決するための手段
上記課題を解決するための手段は次の通りである。Furthermore, such a configuration is susceptible to relative positional deviation due to temperature changes, resulting in errors when superimposing images, which appears as color misalignment on the television screen. Furthermore, ζ around the light-receiving surface of the solid-state image sensor! An Al wiring pattern is provided, and the wiring pattern reflects the incident light image and becomes a cause of flare.The present invention has been made in view of the above-mentioned problems, and reduces the relative positional deviation of the solid-state image sensor with a simple configuration. Means for solving the problem Aiming at providing a solid-state imaging component that can minimize flare caused by reflected light The means for solving the above problem are as follows.
保護ガラスを、固体撮像素子上の受光部外周部に設けた
複数個の凸部に固着すも さらに 前記保護ガラスには
、 固体撮像素子の受光窓以外への光の入射を遮光する
薄膜を有した構成となすものである。A protective glass is fixed to a plurality of convex portions provided on the outer periphery of the light-receiving portion of the solid-state image sensor, and the protective glass further includes a thin film that blocks light from entering other than the light-receiving window of the solid-state image sensor. The structure is as follows.
作用
上記の構成により平行平板ガラスなどの保護ガラスの光
入射面あるいは出射面にたいして固体撮像素子受光面の
平行を高精度に保って固着できるため色分解プリズムな
どに直接貼付けが可能となり、撮像装置の構成 構造を
簡素化することが可能となム
更に この構成 構造の簡素化によって、温度変化によ
る複数の固体撮像素子の相対的な位置ズレを起こす要因
を少なくすることが出来ムさら番ミ 保護ガラスの固
体撮像素子側に設けたＣｒ等の薄膜で構成した遮光膜に
より入射された光は、 余分な反射を抑えるためフレア
の少ない固体撮像装置が実現できる。Function: With the above configuration, the solid-state image sensor light-receiving surface can be fixed with high precision while maintaining parallelism to the light incident surface or light-emitting surface of the protective glass such as parallel flat glass, making it possible to directly attach it to a color separation prism, etc. Furthermore, by simplifying the structure, it is possible to reduce the factors that cause the relative positional deviation of multiple solid-state image sensors due to temperature changes.Protective glass The light incident on the light shielding film made of a thin film of Cr or the like provided on the solid-state imaging device side suppresses unnecessary reflection, making it possible to realize a solid-state imaging device with less flare.
実施例 以下に本発明の実施例を図面に基づいて説明する。Example Embodiments of the present invention will be described below based on the drawings.
第１図（友 本発明の固体撮像装置における一実施例を
示す断面図であり、第２図は分解斜視図である。固体撮
像素子１０（友 例えばコバールなどから成る電極１１
とセラミックとを数層に積層したパッケージ１２に銀ペ
ースト１３でダイボンドされていも 固体撮像素子１０
の取り出し電極２０と電極１１をφ２５〜３０μｍのＡ
ｕ線などのワイヤー１４を用いてＡｕポールボンディン
グを行ない電気的に接続すム
この固体撮像素子１０上の受光面１５及び取り出し電極
２０以外の部分に前記ワイヤー１４のＡＵボールのみを
超音波ボンディング眞 先端部が平坦なツールを用いて
Ａｕボールを一定圧力で加圧することにより高さ１０〜
３０μｍの範囲において高さバラツキ１〜２μｍ以下の
複数個の凸部１６を形成すも またＣＬ 前記凸部１
６はＡｕメツキ、蒸着などにより厚みの精度良く形成す
ることも可能であム
このようにワイヤーボンディング及び凸部１６を形成し
た固体撮像素子１０の受光面１５に粘度８００〜１００
０ｃｐｓの接着樹脂１７を適量滴下し 固体撮像素子１
０の受光窓ピッチ例えば５から１０μｍピッチで数μｍ
幅の遮光膜１８を蒸着とエツチングで格子状に形成した
保護ガラス１９を固体撮像素子１０上へ載せ凸部１６へ
圧接後接着樹脂１７を硬化させａ な抵 凸部への圧接
により、保護ガラス１９と凸部１６との間にある程度の
接着力が発生するので、両者間の仮止めには好都合であ
ム もちろん 両者は接着樹脂１７により固定されるの
であるか収 本実施例においては、 要は凸部１６は保
護ガラス１９の位置規制の機能が第１義であって、上記
の接着力は必ずしも必要とするものではなしも
保護ガラス１９は、 厚み０．８〜１． ５ｍｍのもの
で両面を光学研磨して面粗さを緑色の光の波長λ （５
５０ｎｍ）以下、平行度１０”以下の精度のものを用い
ている。前記接着樹脂１７は 紫外線硬化型接着剤を用
いるとよい。この様に保護ガラス１９接着寵 封止用樹
脂２１としてシリコン樹脂またはエポキシ樹脂を注入し
硬化させる。FIG. 1 is a sectional view showing an embodiment of the solid-state imaging device of the present invention, and FIG. 2 is an exploded perspective view.
Even if the solid-state image sensing device 10 is die-bonded with silver paste 13 to the package 12 which is made of several layers of laminate and ceramic.
The extraction electrode 20 and electrode 11 are
Au pole bonding is performed using a wire 14 such as a U-line to electrically connect.Only the AU ball of the wire 14 is ultrasonically bonded to a portion of the solid-state image sensor 10 other than the light receiving surface 15 and the extraction electrode 20. By pressing the Au ball with a constant pressure using a tool with a flat tip, the height of 10~
A plurality of convex portions 16 having a height variation of 1 to 2 μm or less within a range of 30 μm are formed.
6 can also be formed with high accuracy in thickness by Au plating, vapor deposition, etc. In this way, the light receiving surface 15 of the solid-state image sensor 10 with the wire bonding and the protrusion 16 formed has a viscosity of 800 to 100.
Drop an appropriate amount of 0 cps adhesive resin 17 onto the solid-state image sensor 1
0 light receiving window pitch, for example, several μm at a pitch of 5 to 10 μm
A protective glass 19 with a light-shielding film 18 of a width formed in a lattice shape by vapor deposition and etching is placed on the solid-state image sensor 10 and pressed onto the convex portion 16, and then the adhesive resin 17 is cured. Since a certain amount of adhesive force is generated between the convex part 19 and the convex part 16, it is convenient for temporary fixing between them. The primary purpose of the convex portion 16 is to regulate the position of the protective glass 19, and the above adhesive force is not necessarily required. Both sides were optically polished with a 5 mm one, and the surface roughness was measured at the wavelength of green light λ (5
50 nm) or less and a parallelism of 10" or less. The adhesive resin 17 is preferably an ultraviolet curable adhesive. In this way, the protective glass 19 is bonded to the sealing resin 21, which is silicone resin or Inject the epoxy resin and let it harden.
この結果として従来の固体撮像装置では保護ガラス１９
と受光面１５の平行度が１０〜３０μｍであるのに比へ
平行度１〜２μｍ以下の高精度化が容易に可能となると
ともに従来の固体撮像装置では保護ガラス１９と受光面
１５の隙間が約１ｍｍあり保護ガラス１９の受光面１５
側に遮光膜１８を形成した場合、斜めの入射光に対して
遮光膜１８の役目を果たせなかったが本発明では前記隙
間が１０〜３０μｍであるため殆ど問題にならなしもそ
して遮光膜１８の効果により入射光の余分な反射の非常
に少ない固体撮像装置を得ることが出来るものであも
発明の詳細
な説明したように本発明によれば 保護ガラスの入射面
あるいは出射面にたいして固体撮像素子受光面の平行を
高精度に保って容易に固着できる。さらに単板固体撮像
装置やカラ一対応の複数固体撮像装置への固体撮像素子
の位置決めが簡略か出来る。また保護ガラスに遮光膜が
形成されているため固体撮像素子受光面側及び入射光像
の光の反射が最小限に抑えられるためフレアの少ない固
体撮像装置が実現できもAs a result, in conventional solid-state imaging devices, the protective glass 19
Compared to the parallelism of the light-receiving surface 15 of 10-30 μm, the parallelism can be easily increased to 1-2 μm or less, and in the conventional solid-state imaging device, the gap between the protective glass 19 and the light-receiving surface 15 is Approximately 1 mm light receiving surface 15 of protective glass 19
When the light shielding film 18 was formed on the side, the light shielding film 18 could not play its role against obliquely incident light, but in the present invention, since the gap is 10 to 30 μm, there is hardly any problem. According to the present invention, as described in detail, it is possible to obtain a solid-state imaging device with very little unnecessary reflection of incident light. It can be easily fixed by keeping the parallelism of the surfaces with high precision. Furthermore, positioning of the solid-state image sensor in a single-chip solid-state image sensor or a plurality of color-compatible solid-state image sensors can be simplified. In addition, since a light-shielding film is formed on the protective glass, reflection of light from the light-receiving surface of the solid-state image sensor and the incident light image is minimized, making it possible to realize a solid-state image sensor with less flare.
第１図は 本発明の一実施例の固体撮像装置における撮
像装置の要部断面諷 第２図１よ 第１図に示す固体撮
像装置の分解斜視医 第３図（ａ）は、 従来の固体撮
像装置に置ける斜視医 第３図（ｂ）は 第３図（ａ）
に示す固体撮像装置の要部断面図である。
１０・・・固体撮像素子、 １１・・・霧氷 １２・・
・パッケージ、 １３・・・銀ペースト、 １４・・・
ワイヤー、 １５・ ・受光ｆｆｉ １６・・・ロム
１７・・・接着樹脂 １８・・・遮光膜１９・・・保
護ガラ／、２０・・・取り出し霧氷２１・・・封止用樹
Ｂ乱FIG. 1 is a cross-sectional view of the main parts of a solid-state imaging device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the solid-state imaging device shown in FIG. Figure 3 (b) is the strabismus doctor placed on the imaging device as shown in Figure 3 (a).
FIG. 2 is a sectional view of main parts of the solid-state imaging device shown in FIG. 10... Solid-state image sensor, 11... Hoarfrost 12...
・Package, 13...Silver paste, 14...
Wire, 15... Light receiving ffi 16... ROM 17... Adhesive resin 18... Light shielding film 19... Protective glass /, 20... Removal hoarfrost 21... Sealing tree B disorder
Claims (2)
し、前記固体撮像素子上部に一定の隙間を保ち保護ガラ
スを搭載する固体撮像装置において、前記固体撮像素子
上の受光部の外周部近傍に設けた複数個の凸部で前記保
護ガラスの位置規制を行なうことを特徴とする固体撮像
装置(1) In a solid-state imaging device in which a solid-state imaging device is mounted on a substrate having a wiring pattern, and a protective glass is mounted on the top of the solid-state imaging device with a certain gap maintained, a portion near the outer periphery of a light receiving section on the solid-state imaging device is provided. A solid-state imaging device characterized in that the position of the protective glass is regulated by a plurality of provided convex portions.
の光の入射を遮光する薄膜を有することを特徴とする請
求項１記載の固体撮像装置。(2) The solid-state imaging device according to claim 1, wherein the protective glass has a thin film that blocks light from entering other than the light-receiving window of the solid-state imaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025407A JPH03229461A (en) | 1990-02-05 | 1990-02-05 | Solid image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025407A JPH03229461A (en) | 1990-02-05 | 1990-02-05 | Solid image pickup device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03229461A true JPH03229461A (en) | 1991-10-11 |
Family
ID=12165062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025407A Pending JPH03229461A (en) | 1990-02-05 | 1990-02-05 | Solid image pickup device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03229461A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05236361A (en) * | 1991-10-30 | 1993-09-10 | Philips Gloeilampenfab:Nv | Picture detector |
| JP2007242692A (en) * | 2006-03-06 | 2007-09-20 | Matsushita Electric Ind Co Ltd | Optical device and manufacturing method therefor |
-
1990
- 1990-02-05 JP JP2025407A patent/JPH03229461A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05236361A (en) * | 1991-10-30 | 1993-09-10 | Philips Gloeilampenfab:Nv | Picture detector |
| JP2007242692A (en) * | 2006-03-06 | 2007-09-20 | Matsushita Electric Ind Co Ltd | Optical device and manufacturing method therefor |
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