JPH03226916A - Tape like multiple pair cable - Google Patents
Tape like multiple pair cableInfo
- Publication number
- JPH03226916A JPH03226916A JP1914590A JP1914590A JPH03226916A JP H03226916 A JPH03226916 A JP H03226916A JP 1914590 A JP1914590 A JP 1914590A JP 1914590 A JP1914590 A JP 1914590A JP H03226916 A JPH03226916 A JP H03226916A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- thin film
- pair
- film conductor
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 239000010409 thin film Substances 0.000 claims abstract description 21
- 239000011295 pitch Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気信号伝送用のテープ形多対ケーブルに関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape-shaped multi-pair cable for electrical signal transmission.
最近、ＯＡ機器の増加に伴い、オフィスにはアンダーカ
ーペットケーブルとしてテープ形の多対ケーブルが使用
されるようになってきている。Recently, with the increase in office automation equipment, tape-shaped multi-pair cables have come to be used as undercarpet cables in offices.
従来、この種のテープ形多対ケーブルで、簡単なものと
しては、多数本の導体を同一平面に平行に配列し、これ
を画面から絶縁テープで挟んで一体化した構造のものが
ある。このタイプのケーブルは隣合う２本の導体を対と
して使用するものであるが、多対の導体が平行配置にな
っているため対間の漏話特性がわるく、伝送信号の大容
量化、広帯域化に対応できない。Conventionally, a simple tape-type multi-pair cable of this type has a structure in which a large number of conductors are arranged in parallel on the same plane and are sandwiched from a screen with insulating tape to integrate them. This type of cable uses two adjacent conductors as a pair, but because the multiple pairs of conductors are arranged in parallel, the crosstalk characteristics between the pairs are poor, making it difficult to increase the capacity and wideband of the transmitted signal. cannot respond to
このため漏話特性が問題になる場合には、撚りピッチの
異なる複数本の対撚り線（２本の絶縁電線を撚ったもの
）を同一平面に平行に配列し、これを画面から絶縁テー
プで挟んで一体化した構造のテープ形多対ケーブルが使
用される。このタイプのケーブルは、多対の撚りピッチ
が異なるため漏話特性にはすぐれているが、２本の絶縁
電線を撚ったものをカバーリングテープで挟んだもので
あるため、２本の絶縁電線が上下に重なる部分があるこ
と、そしてその部分は外圧に弱いため耐圧縮性を高める
にはカバーリングテープの厚さを厚くする必要があるこ
と等から、ケーブルの厚さが厚くなるという欠点がある
。ちなみに０．４ｍｍφの銅線を使用したオフィス用ア
ンダーカーペットケーブルでは、絶縁被覆の厚さが０．
２ｍｍ、カバーリングテープの厚さが０．５ｍｍ必要で
あり、これらを合計するとケーブルの厚さは２．６ｍｍ
にもなる。Therefore, if crosstalk characteristics are a problem, arrange multiple twisted wire pairs (two insulated wires twisted together) with different twist pitches in parallel on the same plane, and then separate them from the screen with insulating tape. A tape-type multi-pair cable with a sandwiched and integrated structure is used. This type of cable has excellent crosstalk characteristics because the twisting pitch of the multiple pairs is different, but since it is made by twisting two insulated wires and sandwiching them with covering tape, This has the disadvantage that the cable becomes thicker because there are parts where the cables overlap above and below, and because those parts are vulnerable to external pressure, it is necessary to increase the thickness of the covering tape to increase compression resistance. be. By the way, in office undercarpet cables that use 0.4 mm diameter copper wire, the insulation coating thickness is 0.4 mm.
2mm, the thickness of the covering tape is 0.5mm, and the total thickness of the cable is 2.6mm.
It also becomes.
本発明は、上記のような課題を解決したテープ形多対ケ
ーブルを提供するもので、その構成は、絶縁テープの表
面に対撚りピッチ半ピッチ毎に形成した薄膜導体パター
ンと、その裏面に表面の薄膜導体パターンと交差部がで
きるように同じく対撚りピンチ半ピッチ毎に形成した薄
膜導体パターンとをスルーホールで導通させることによ
り対撚りパターンを形成し、このようにして形成される
対撚りパターンを上記絶縁テープに対撚りピンチを異な
らせて複数列形成し、その画面にカバーリングを施した
ことを特徴とする。The present invention provides a tape-type multi-pair cable that solves the above-mentioned problems, and is composed of a thin film conductor pattern formed on the surface of an insulating tape at every half pitch of twisted pairs, and a surface conductor pattern formed on the back surface of the thin film conductor pattern. A twisted pair pattern is formed by connecting the thin film conductor pattern with a thin film conductor pattern similarly formed at every half pitch of the twisted pair pinch so that an intersection is formed through a through hole, and the twisted paired pattern formed in this way The invention is characterized in that a plurality of rows are formed on the insulating tape with different twist twists, and a covering is applied to the screen.
絶縁テープの画面の薄膜導体パターンおよびスルーホー
ルは通常の印刷回路方式で形成できる。The thin film conductor pattern and through-holes on the screen of the insulating tape can be formed using conventional printed circuit methods.
このようにすると、絶縁テープ、薄膜導体パターンおよ
びカバーリングがそれぞれ厚さの薄いものであるため、
テープ形多対ケーブルの厚さをきわめて薄くすることが
可能となる。In this way, since the insulating tape, thin film conductor pattern, and covering ring are each thin,
It becomes possible to make the thickness of the tape-type multi-pair cable extremely thin.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１および図−２は本発明の一実施例を示す。FIG. 1 and FIG. 2 show an embodiment of the present invention.
このテープ形多対ケーブルは絶縁テープｌに３列の対撚
りパターン２Ａ〜２Ｃを形成したものである。第一の対
撚りパターン２Ａについて説明すると、これは絶縁テー
プ１０表面に対撚りピンチ半ピンチ（Ｐが１ピッチ）毎
に薄膜導体パターン３ａを形成し、その裏面に表面の薄
膜導体パターン３ａと交差部ができるように同じく対撚
りピッチ半ピッチ毎に薄膜導体パターン３ｂを形成し、
表裏の導体パターン３ａ、３ｂをスルーホール４で導通
させることにより形成されているものである。This tape-type multi-pair cable has three rows of twisted pair patterns 2A to 2C formed on an insulating tape 1. To explain the first twisted pair pattern 2A, this is formed by forming a thin film conductor pattern 3a on the surface of the insulating tape 10 every pinch and half a pinch (P is 1 pitch) of the twisted pair, and on the back side thereof intersects with the thin film conductor pattern 3a on the front side. Similarly, thin film conductor patterns 3b are formed at every half pitch of the twisted pair pitch so that
It is formed by connecting conductor patterns 3a and 3b on the front and back sides through a through hole 4.
第二の対撚りパターン２Ｂは対撚りピンチが第一の対撚
りパターン２Ａより大きくなっており、第三の対撚りパ
ターン２Ｃは対撚りピッチがさらに大きくなっているだ
けで、構成としては第一の対撚りパターン２人と同じで
ある。The second twist pair pattern 2B has a larger twist pair pinch than the first twist pair pattern 2A, and the third twist pair pattern 2C has a larger twist pitch than the first twist pattern. The pair twist pattern is the same as that of the two people.
対撚りパターン２Ａ〜２Ｃを形成した絶縁テープ１の画
面には絶縁材からなるカバーリング５が施され、一体化
されている。A covering ring 5 made of an insulating material is applied to the screen of the insulating tape 1 on which the twisted pair patterns 2A to 2C are formed, and is integrated.
なお前記の導体パターン３ａ、３ｂを形成する方法とし
ては、絶縁テープ１の画面に導電ペーストを印刷する方
法、銅を無電解メツキする方法または絶縁テープ１の画
面に張りつけた銅箔をパターンエツチングする方法など
がある。またスルーホール４は、その部分に穴をあけ、
その穴に導電ペーストを充填するか、或いは内面メツキ
を施すことにより形成される。The conductive patterns 3a and 3b can be formed by printing a conductive paste on the screen of the insulating tape 1, by electroless plating copper, or by pattern etching a copper foil pasted on the screen of the insulating tape 1. There are methods. Also, for the through hole 4, make a hole in that part,
It is formed by filling the hole with conductive paste or by plating the inside.
次にサイズ、材質等の具体例を説明する。Next, specific examples of size, material, etc. will be explained.
（１１絶縁テープ１として厚さ２００μｍのポリイミド
テープを使用し、その画面に銅ペーストを厚さ７０μｍ
、幅１．８ｍｍに印刷して導体パターン３ａ、３ｂを形
成した。対撚りピッチの平均は４０ｍｍとした。スルー
ホール形成部分には内径０．４ｍｍの穴をあけ、そこに
銅ペーストを充填してスルーホール４を形成し、表裏の
導体パターンを導通させた。(11 Use polyimide tape with a thickness of 200 μm as the insulating tape 1, and apply copper paste to the screen with a thickness of 70 μm.
, to form conductive patterns 3a and 3b with a width of 1.8 mm. The average twist pitch was 40 mm. A hole with an inner diameter of 0.4 mm was made in the through-hole forming part, and the hole was filled with copper paste to form a through-hole 4, and the conductor patterns on the front and back sides were made conductive.
カバーリング５としては厚さ２５μｍの片面粘着ポリエ
ステルテープを使用した。以上の構成で厚さ約０．５１
のテープ形多対ケーブルを得ることができた。As the covering 5, a single-sided adhesive polyester tape with a thickness of 25 μm was used. With the above configuration, the thickness is approximately 0.51
We were able to obtain a tape-shaped multi-pair cable.
（２）絶縁テープ１として厚さ１００μＭのガラスエポ
キシテープを使用し、その画面に銅の無電解メツキで厚
さ５μｍ、幅１ｍｍの導体パターン３ａ、３ｂを形成し
た。スルーホール形成部分には予め内径５０μｍの穴を
あけておき、導体パターンの形成と同時にその穴に内面
メツキを施した。カバーリング５はエポキシ樹脂を全面
に塗布することにより形成した。(2) A glass epoxy tape with a thickness of 100 μM was used as the insulating tape 1, and conductive patterns 3a and 3b with a thickness of 5 μm and a width of 1 mm were formed on the screen by electroless copper plating. A hole with an inner diameter of 50 μm was pre-drilled in the through-hole formation portion, and the inner surface of the hole was plated at the same time as the conductor pattern was formed. Covering 5 was formed by applying epoxy resin to the entire surface.
なお絶縁テープとしてはこのほか、ポリエステルテープ
、ポリテトラフルオロエチレンテープ、紙フエノールテ
ープ等を使用できる。また伝送損失低減、伝送速度アッ
プが課題となる場合には、発泡プラスチックテープを使
用するとよい。In addition, as the insulating tape, polyester tape, polytetrafluoroethylene tape, paper phenol tape, etc. can be used. Furthermore, when reducing transmission loss and increasing transmission speed are issues, it is recommended to use foamed plastic tape.
またカバーリングの材料としてはこのほか、紫外線硬化
型樹脂、ポリ塩化ビニル、ポリエチレン等を用いること
ができる。また外部誘導雑音の問題がある場合には、ア
ルミ箔または銅箔をラミネートした複合テープを使用す
るとよい。In addition, as the material for the covering, ultraviolet curable resin, polyvinyl chloride, polyethylene, etc. can be used. Furthermore, if there is a problem with externally induced noise, a composite tape laminated with aluminum foil or copper foil may be used.
また前記の実施例では対撚りパターンが３列の場合を説
明したが、対撚りパターンの列数は用途により適宜選定
されるものである。Further, in the above embodiment, the case where the paired twist pattern is three rows has been described, but the number of rows of the paired twist pattern is appropriately selected depending on the application.
また各対撚りパターンはそれぞれ対撚りピンチが異なっ
ていることが好ましいが、対撚りパターンの列数が多い
場合には、漏話が起こらない程度に離れていれば、同じ
ピンチの対撚りパターンが存在していても差し支えない
。また隣合う２列の対撚りパターンは、長手方向に交差
部分を半ピッチずらせば、対撚りピンチを同じにしても
漏話を防止できる。Also, it is preferable that each pair twist pattern has a different pair twist pinch, but if there are many rows of pair twist patterns, there are pair twist patterns with the same pinch as long as the rows are far enough apart that crosstalk does not occur. It's okay to do so. Further, if the intersecting portions of two adjacent rows of twisted pairs are shifted by half a pitch in the longitudinal direction, crosstalk can be prevented even if the twisted pairs are the same.
以上説明したように本発明によれば、絶縁テープと、そ
の画面に形成した薄膜導体パターンと、画面の薄膜導体
パターンを導通させるスルーホールと、画面のカバーリ
ングによりテープ形多対ケーブルを構成したので、テー
プ形多対ケーブルの厚さをきわめて薄くできる利点があ
る。しかもこのテープ形多対ケーブルは対撚り構造にな
っているので漏話特性に優れている。またこのケーブル
は印刷回路と同じ方式で製造できるので、製造が容易で
あり、量産性にも優れている。As explained above, according to the present invention, a tape-shaped multi-pair cable is constructed by an insulating tape, a thin film conductor pattern formed on the screen, a through hole for connecting the thin film conductor pattern on the screen, and a covering on the screen. Therefore, there is an advantage that the thickness of the tape-type multi-pair cable can be made extremely thin. Moreover, this tape-type multi-pair cable has a twisted pair structure, so it has excellent crosstalk characteristics. Furthermore, since this cable can be manufactured using the same method as printed circuits, it is easy to manufacture and has excellent mass productivity.
図−１は本発明の一実施例に係るテープ形多対ケーブル
の一部切開平面図、図−２は図−１の■■線における断
面図である。
１：絶縁テープ ２Ａ〜２Ｃ：対撚りパターン３ａ、３
ｂ：薄膜導体パターン
４ニスルーホール ５：カバーリングFIG. 1 is a partially cutaway plan view of a tape-shaped multi-pair cable according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line ■■ in FIG. 1. 1: Insulating tape 2A to 2C: Paired twist patterns 3a, 3
b: Thin film conductor pattern 4 varnish through hole 5: Covering
Claims (1)
した薄膜導体パターンと、その裏面に表面の薄膜導体パ
ターンと交差部ができるように同じく対撚りピッチ半ピ
ッチ毎に形成した薄膜導体パターンとをスルーホールで
導通させることにより対撚りパターンを形成し、このよ
うにして形成される対撚りパターンを上記絶縁テープに
対撚りピッチを異ならせて複数列形成し、その画面にカ
バーリングを施したことを特徴とするテープ形多対ケー
ブル。1. A thin film conductor pattern formed on the surface of the insulating tape at every half pitch of the twisted pair, and a thin film conductor pattern formed on the back side at every half pitch of the twisted pair so that there are intersections with the thin film conductor pattern on the front surface. A twisted pair pattern was formed by conducting through a through hole, and the thus formed twisted pair pattern was formed in multiple rows on the above insulating tape with different twist pitches, and the screen was covered. A tape-shaped multi-pair cable characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1914590A JPH03226916A (en) | 1990-01-31 | 1990-01-31 | Tape like multiple pair cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1914590A JPH03226916A (en) | 1990-01-31 | 1990-01-31 | Tape like multiple pair cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03226916A true JPH03226916A (en) | 1991-10-07 |
Family
ID=11991280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1914590A Pending JPH03226916A (en) | 1990-01-31 | 1990-01-31 | Tape like multiple pair cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03226916A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100441847B1 (en) * | 1997-02-05 | 2004-10-26 | 삼성전자주식회사 | Flexible print circuit cable having two-layer structure for low voltage differential signal transmission, including signal transmission lines arranged into zigzag shapes on both sides of insulation layer |
| CN101866714A (en) * | 2010-05-25 | 2010-10-20 | 江苏通鼎光电科技有限公司 | Indoor compressed cable for digital communication and manufacturing method thereof |
| WO2015111638A1 (en) * | 2014-01-22 | 2015-07-30 | 宇部興産株式会社 | Method for forming conductor layer, and method for producing multilayer wiring substrate using method for forming conductive layer |
-
1990
- 1990-01-31 JP JP1914590A patent/JPH03226916A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100441847B1 (en) * | 1997-02-05 | 2004-10-26 | 삼성전자주식회사 | Flexible print circuit cable having two-layer structure for low voltage differential signal transmission, including signal transmission lines arranged into zigzag shapes on both sides of insulation layer |
| CN101866714A (en) * | 2010-05-25 | 2010-10-20 | 江苏通鼎光电科技有限公司 | Indoor compressed cable for digital communication and manufacturing method thereof |
| WO2015111638A1 (en) * | 2014-01-22 | 2015-07-30 | 宇部興産株式会社 | Method for forming conductor layer, and method for producing multilayer wiring substrate using method for forming conductive layer |
| US10149394B2 (en) | 2014-01-22 | 2018-12-04 | Ube Industries, Ltd. | Method for forming conductor layer, and method for producing multilayer wiring substrate using same |
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| US3641520A (en) | Interstitial conductors between plated memory wires | |
| JPS6037796A (en) | Circuit board | |
| JPS6333442Y2 (en) |