JPH0322277B2 - - Google Patents
Info
- Publication number
- JPH0322277B2 JPH0322277B2 JP59121176A JP12117684A JPH0322277B2 JP H0322277 B2 JPH0322277 B2 JP H0322277B2 JP 59121176 A JP59121176 A JP 59121176A JP 12117684 A JP12117684 A JP 12117684A JP H0322277 B2 JPH0322277 B2 JP H0322277B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- reflecting
- rotating mirror
- oscillator
- laser oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000010355 oscillation Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 2
- 238000003672 processing method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はレーザー光を利用して加工を行うレー
ザー加工機に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a laser processing machine that performs processing using laser light.
従来例の構成とその問題点
レーザー加工機はレーザー発振器とレーザー光
を導き収束する光学系とによつて構成される。Conventional configuration and its problems A laser processing machine is composed of a laser oscillator and an optical system that guides and focuses laser light.
レーザー加工機を用いた生産システムを構成す
る場合、同時に数ケ所で加工を行うことが必要と
なる。そのために大出力のレーザー発振器を１台
設け、光学系にレーザー光を分岐するビームスプ
リツターを設けて、数ケ所でレーザー加工を行え
るように構成する方法が従来から行われている。
このビームスプリツターを用いたレーザー光の分
岐法を第１図を用いて説明する。 When configuring a production system using a laser processing machine, processing must be performed at several locations at the same time. For this purpose, a conventional method has been used in which a single high-output laser oscillator is provided and a beam splitter is provided in the optical system to split the laser beam, so that laser processing can be performed at several locations.
A method of splitting laser light using this beam splitter will be explained with reference to FIG.
１はレーザー発振器である。２はレーザー光を
半分透過させ半分反射させるビームスプリツター
である。３はレーザー光を反射させるミラーであ
る。４，５はそれぞれレーザー加工の被加工材で
ある。６，７，８はレーザー光である。レーザー
発振器１より発振するレーザー光６をビームスプ
リツタ２によりレーザー光７と８に分岐する。レ
ーザー光７はそのまま被加工材４へ、レーザー光
８はミラー３により偏向させて被加工材５へ照射
される。このビームスプリツター２を用いたレー
ザー光の分岐法では、次のような問題がある。第
１に分岐後のレーザー光の出力は発振器の出力の
分岐分の１にしかならない。たとえば100ワツト
のレーザー光を２つに分岐する場合分岐後のレー
ザー光は50ワツトにしかすぎない。第２に、ビー
ムスプリツタ２により分岐したレーザー光７，８
はすべて同じ比率の出力になる。そのため、それ
ぞれで加工条件を変えた加工ができない。第３
に、レーザー発振器１として大出力のものが必要
となる。第４に、ビームスプリツター２によるレ
ーザー光のエネルギー損失があり、高出力の発振
ではミラーの損傷が激しい。 1 is a laser oscillator. 2 is a beam splitter that transmits half the laser beam and reflects the other half. 3 is a mirror that reflects the laser beam. 4 and 5 are workpieces for laser processing, respectively. 6, 7, and 8 are laser beams. A laser beam 6 oscillated by a laser oscillator 1 is split into laser beams 7 and 8 by a beam splitter 2. The laser beam 7 is directly irradiated onto the workpiece 4, and the laser beam 8 is deflected by the mirror 3 and irradiated onto the workpiece 5. This laser beam splitting method using the beam splitter 2 has the following problems. First, the output of the laser beam after branching is only one part of the output of the oscillator. For example, when a 100 watt laser beam is split into two, the resulting laser beam is only 50 watts. Second, the laser beams 7 and 8 split by the beam splitter 2
all have the same ratio of output. Therefore, it is not possible to perform machining with different machining conditions for each. Third
Therefore, a high output laser oscillator 1 is required. Fourthly, there is energy loss of the laser beam due to the beam splitter 2, and the mirror is seriously damaged in high-output oscillation.
以上示したように、ビームスプリツター２を用
いたレーザー光を分割するレーザー加工機は多く
の問題がある。 As shown above, the laser processing machine that uses the beam splitter 2 to split laser light has many problems.
発明の目的
本発明は、以上に示した問題点を解決し、レー
ザー加工機を生産システムとして幅広く効率良く
用いるために、各分岐先での加工法を任意に行う
ことができ、エネルギーの損失を小さくしたレー
ザー加工機を提供することを目的とするものであ
る。Purpose of the Invention The present invention solves the above-mentioned problems, and in order to use a laser processing machine widely and efficiently as a production system, it is possible to arbitrarily perform the processing method at each branch destination, thereby reducing energy loss. The purpose is to provide a miniaturized laser processing machine.
発明の構成
レーザー加工機で加工を行う場合に、加工材料
加工法（切断、溶接、微細加工等）に応じて、レ
ーザー発振器の出力のコントロールが必要であ
り、本発明はレーザー光の発振をパルス発振さ
せ、そのパルスの周波数とパルスデユーテイ比を
変えてレーザー発振器の出力のコントロールを可
能にすることにより上記目的を達成するもので、
レーザー発振器と、前記レーザー発振器の光軸上
に設けられた複数の反射部を有し、前記反射部の
各反射面の法線方向がそれぞれ異なつた角度をも
つて取り付けられている回転ミラーと、前記回転
ミラーの各ミラーの位置を検出する検出器とを備
え、前記検出器の出力波形に基づいて、タイミン
グパルスを発生させてレーザー発振器の発振周波
数、パルスデユテイ比を整形しレーザーの発振を
行うことによつてレーザー発振器１つで複数の加
工を同時に行えるレーザー加工機を提供するもの
である。Structure of the Invention When processing with a laser processing machine, it is necessary to control the output of the laser oscillator depending on the processing method of the processed material (cutting, welding, microfabrication, etc.), and the present invention provides pulsed laser oscillation. The above purpose is achieved by making it possible to control the output of the laser oscillator by oscillating the laser and changing the frequency and pulse duty ratio of the pulse.
a rotating mirror having a laser oscillator and a plurality of reflecting sections provided on the optical axis of the laser oscillator, the normal direction of each reflecting surface of the reflecting section being attached at a different angle; and a detector for detecting the position of each mirror of the rotating mirror, and generates a timing pulse based on the output waveform of the detector to shape the oscillation frequency and pulse duty ratio of the laser oscillator to oscillate the laser. The present invention provides a laser processing machine that can simultaneously perform multiple processing operations using a single laser oscillator.
実施例の説明
以下に本発明の実施例を図面を用いて説明す
る。DESCRIPTION OF EMBODIMENTS Examples of the present invention will be described below with reference to the drawings.
第２図は本発明の一実施例であるレーザー加工
機の構成図である。図は一つの発振器で三つの加
工材を加工する場合の例を示している。 FIG. 2 is a configuration diagram of a laser processing machine which is an embodiment of the present invention. The figure shows an example of processing three workpieces with one oscillator.
第２図において、９はレーザー発振器でパルス
発振しレーザー光１０を発振する。１１は回転数
を制御できる回転駆動部１２により回転する回転
ミラーである。１３−Ａ，１３−Ｂ，１３−Ｃは
反射鏡（１３−Ｂ，１３−Ｃは図示せず）で回転
ミラー１１にレーザー光１０をそれぞれ１４，１
５，１６に反射するように取り付けられている。
１７〜２２は反射鏡で、各レーザー光１４，１
５，１６を被加工材２３，２４，２５へ照射す
る。第３図に回転ミラー１１の概観図を示す。第
３図ａは回転ミラーの正面図、第３図ｂは回転ミ
ラーのXOX′断面図である。回転ミラー１１に、
反射鏡１３−Ａ，１３−Ｂ及び１３−Ｃが取り付
け調整台２６−Ａ，２６−Ｂ及び２６−Ｃを介し
て取り付けられている。反射鏡１３−Ａ，１３−
Ｂ及び１３−Ｃはそれぞれ回転軸に対してα，β
及びγ（図示せず）の角度をもつている。各角度
の調整が取り付け調整台２６−Ａ，２６−Ｂ及び
２６−Ｃの調整ねじ２７と調整ばね２８によつて
行われる。第２図において、２９はセンサーで、
第３図ａに示す反射鏡１３−Ａ〜１３−Ｃの各位
置を、反射鏡１３−Ａ〜１３−Ｃに対応して設け
られた回転ミラー１１の切欠３０によつて検出す
るものである。３１はセンサー２９の検出信号Ｐ
に基づいてパルス信号を発生させレーザー発振器
９の発振を制御するレーザー発振制御装置であ
る。 In FIG. 2, a laser oscillator 9 oscillates a laser beam 10 by oscillating pulses. Reference numeral 11 denotes a rotating mirror rotated by a rotation drive unit 12 whose rotation speed can be controlled. 13-A, 13-B, and 13-C are reflecting mirrors (13-B and 13-C are not shown) that direct the laser beams 10 to the rotating mirror 11 at 14 and 13-C, respectively.
5, 16 so as to reflect.
17 to 22 are reflecting mirrors, and each laser beam 14,1
5 and 16 are irradiated onto the workpieces 23, 24, and 25. FIG. 3 shows an overview of the rotating mirror 11. FIG. 3a is a front view of the rotating mirror, and FIG. 3b is a cross-sectional view of the rotating mirror at XOX'. On the rotating mirror 11,
Reflecting mirrors 13-A, 13-B and 13-C are attached via attachment adjustment stands 26-A, 26-B and 26-C. Reflector 13-A, 13-
B and 13-C are α and β with respect to the rotation axis, respectively.
and γ (not shown). Adjustment of each angle is performed by adjustment screws 27 and adjustment springs 28 of attachment adjustment stands 26-A, 26-B, and 26-C. In Figure 2, 29 is a sensor;
Each position of the reflecting mirrors 13-A to 13-C shown in FIG. . 31 is the detection signal P of the sensor 29
This is a laser oscillation control device that generates a pulse signal based on the oscillation of the laser oscillator 9 and controls the oscillation of the laser oscillator 9.
本実施例の加工動作について、第２図と第４図
に示すレーザー発振制御のタイミングチヤートと
を用いて説明する。回転数制御された回転駆動部
１２により回転チヨツパーミラー１１は回転して
いる。第４図１にセンサー２９の出力波形を示
す。出力波形でＨが反射鏡１３−Ａ〜１３−Ｃの
各位置に対応している。ここで、例として、レー
ザー光を３ケ所Ａ，Ｂ，Ｃに分割し、それぞれの
加工がＡの厚板の切断、Ｂは薄板の切断、Ｃは溶
接と異なつた加工を行う場合について説明する。
第４図１に示すセンサー２９の出力波形に基づ
き、レーザー発振器９を第４図２に示すように発
振制御する。これにより発振したレーザー光１０
は反射鏡１３−Ａ，１３−Ｂ，１３−Ｃで反射さ
れてそれぞれレーザー光１４，１５，１６となり
さらに反射鏡１７〜２２で反射されて被加工材２
３，２４，２５へ照射される。第４図３〜５にレ
ーザー光１４，１５，１６の波形を示す。前述の
ようにレーザー光のパルス発振のオンタイム、オ
フタイムのデユーテイ比増減によつて加工を変え
ることができることを生かし１つの発振器で３ケ
所でそれぞれ異なつた加工が可能となる。 The processing operation of this embodiment will be explained using the timing chart of laser oscillation control shown in FIG. 2 and FIG. 4. The rotary chopper mirror 11 is rotated by a rotation drive unit 12 whose rotation speed is controlled. FIG. 4 shows the output waveform of the sensor 29. In the output waveform, H corresponds to each position of the reflecting mirrors 13-A to 13-C. Here, as an example, we will explain a case in which the laser beam is divided into three locations A, B, and C, and the respective processing is to perform different processing such as cutting a thick plate in A, cutting a thin plate in B, and welding in C. .
Based on the output waveform of the sensor 29 shown in FIG. 41, the laser oscillator 9 is controlled to oscillate as shown in FIG. 42. Laser light 10 oscillated by this
are reflected by the reflecting mirrors 13-A, 13-B, and 13-C to become laser beams 14, 15, and 16, respectively, and are further reflected by the reflecting mirrors 17 to 22 to strike the workpiece 2.
3, 24, and 25 are irradiated. 4. Waveforms of the laser beams 14, 15, and 16 are shown in FIGS. 3 to 5. As mentioned above, by taking advantage of the fact that processing can be changed by increasing or decreasing the duty ratio of the on-time and off-time of the pulse oscillation of the laser light, it is possible to perform different processing at three locations with one oscillator.
なおこの場合のレーザー発振器９の発振出力パ
ルスは、オンタイム、オフタイムのデユーテイ比
を変えた第４図２に示した波形に限定されること
なく、間欠的にすることでＡ，Ｂ及びＣの各出力
周波数を変えることやレーザー出力の印加電流の
増減により加工法を変えることができる。また、
発振周波数を変えることでも加工法を変えること
が可能であり、この場合、回転ミラーの回転数を
変えることによつて行うことができる。 Note that the oscillation output pulse of the laser oscillator 9 in this case is not limited to the waveform shown in FIG. The processing method can be changed by changing each output frequency or increasing or decreasing the applied current of the laser output. Also,
It is also possible to change the processing method by changing the oscillation frequency, and in this case, this can be done by changing the rotation speed of the rotating mirror.
さらに反射鏡の数は任意に選択することがで
き、その場合各反射鏡の角度調整は前記実施例に
制限されるものではなく、レーザー光軸に対し、
各反射鏡の反射面の法線方向がそれぞれ異なるよ
うに各反射鏡の反射面を設ければ良い。このよう
に角度を任意に選択することにより所望の方向に
レーザー光線を取り出すことができる。 Further, the number of reflecting mirrors can be arbitrarily selected, and in that case, the angle adjustment of each reflecting mirror is not limited to the above embodiment, and the angle adjustment of each reflecting mirror is not limited to the above embodiment.
The reflecting surfaces of each reflecting mirror may be provided so that the normal directions of the reflecting surfaces of each reflecting mirror are different from each other. By arbitrarily selecting the angle in this manner, the laser beam can be extracted in a desired direction.
発明の効果
以上要するに本発明はレーザー発振器からのレ
ーザー光線を、回転ミラーに設けられた互いに異
なる角度を有する反射面を持つ複数個の反射鏡に
より異なつた方向に反射させるようにしたもの
で、レーザー発振器１台で複数個所の加工を同時
に行うことが可能であり、またその加工法も各加
工場所でそれぞれ異なつた加工法が同時に可能と
なる。さらに、１つのレーザー発振器を用いて同
時に複数個所で異なる加工作業を行うことができ
るために、レーザー発振器を効率よく利用するこ
とが可能となり、本発明のレーザー加工機を導入
した生産システムの効率が非常に高くなる。Effects of the Invention In summary, the present invention reflects a laser beam from a laser oscillator in different directions by a plurality of reflecting mirrors each having a reflecting surface having different angles provided on a rotating mirror. It is possible to process multiple locations at the same time with one machine, and different processing methods can be used simultaneously at each processing location. Furthermore, since one laser oscillator can be used to perform different processing operations at multiple locations at the same time, the laser oscillator can be used efficiently, increasing the efficiency of the production system that incorporates the laser processing machine of the present invention. becomes very expensive.
第１図は従来のレーザー加工機の概略図、第２
図は本発明の一実施例であるレーザー加工機の概
略図、第３図は上記実施例の回転ミラーの概略図
でａは平面図、ｂはａのXOX′における断面図、
第４図は本発明のレーザー加工機の加工動作を示
すタイミングチヤートである。
９……レーザー発振器、１０，１４，１５，１
６……レーザー光、１１……回転ミラー、１２…
…回転駆動部、１３−Ａ，１３−Ｂ，１３−Ｃ，
１７，１８，１９，２０，２１，２２………反射
鏡、２３，２４，２５……被加工材、２６−Ａ，
２６−Ｂ，２６−Ｃ……反射ミラー取り付け台、
２７……調整ねじ、２８……調整ばね、２９……
センサー、３０……切欠、３１……レーザー発振
制御装置。
Figure 1 is a schematic diagram of a conventional laser processing machine, Figure 2
The figure is a schematic diagram of a laser processing machine that is an embodiment of the present invention, and FIG. 3 is a schematic diagram of a rotating mirror of the above embodiment, where a is a plan view, b is a sectional view at XOX' of a,
FIG. 4 is a timing chart showing the processing operation of the laser processing machine of the present invention. 9... Laser oscillator, 10, 14, 15, 1
6... Laser light, 11... Rotating mirror, 12...
...Rotation drive unit, 13-A, 13-B, 13-C,
17, 18, 19, 20, 21, 22...Reflector, 23, 24, 25... Work material, 26-A,
26-B, 26-C...Reflection mirror mounting stand,
27...adjustment screw, 28...adjustment spring, 29...
Sensor, 30... Notch, 31... Laser oscillation control device.
Claims (1)
のレーザー光を反射する反射部を回転軸の周辺に
複数個設けた回転ミラーと、前記回転ミラーの各
反射部の位置を検出する検出器とを備え、前記回
転ミラーの各反射部の反射面の法線方向がそれぞ
れ異なるように各反射部の反射面が設けられてお
り、前記検出器の出力波形に基づいてタイミング
パルスを発生させてレーザー発振器の発振制御を
行うことを特徴とするレーザー加工機。 ２ 回転ミラーの複数個の反射部の各反射面が回
転軸に対してそれぞれ異なつた角度で取り付けら
れていることを特徴とする特許請求の範囲第１項
記載のレーザー加工機。[Scope of Claims] 1. A laser oscillator, a rotating mirror including a plurality of reflecting parts around a rotating shaft that reflect laser light from the laser oscillator, and detection for detecting the position of each reflecting part of the rotating mirror. The reflecting surface of each reflecting portion of the rotating mirror is provided such that the normal direction of the reflecting surface of each reflecting portion of the rotating mirror is different, and a timing pulse is generated based on the output waveform of the detector. A laser processing machine characterized by controlling the oscillation of a laser oscillator. 2. The laser processing machine according to claim 1, wherein the reflecting surfaces of the plurality of reflecting parts of the rotating mirror are attached at different angles with respect to the rotation axis.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121176A JPS611493A (en) | 1984-06-12 | 1984-06-12 | Laser beam machine |
| US06/668,855 US4701591A (en) | 1983-11-07 | 1984-11-06 | Apparatus for processing multiple workpieces utilizing a single laser beam source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59121176A JPS611493A (en) | 1984-06-12 | 1984-06-12 | Laser beam machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS611493A JPS611493A (en) | 1986-01-07 |
| JPH0322277B2 true JPH0322277B2 (en) | 1991-03-26 |
Family
ID=14804728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59121176A Granted JPS611493A (en) | 1983-11-07 | 1984-06-12 | Laser beam machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611493A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4728773A (en) * | 1986-12-08 | 1988-03-01 | Ex-Cell-O Corporation | Laser processing center |
| US5037183A (en) * | 1989-02-22 | 1991-08-06 | United Technologies Corporation | Laser drilling |
| EP1695787A1 (en) * | 2005-02-25 | 2006-08-30 | Trumpf Laser- und Systemtechnik GmbH | Laser working method using a plurality of working stations |
| CN102658425A (en) * | 2012-04-24 | 2012-09-12 | 北京中鼎高科自动化技术有限公司 | Online continuous laser processing device of adhesive products with more than one layer |
-
1984
- 1984-06-12 JP JP59121176A patent/JPS611493A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS611493A (en) | 1986-01-07 |
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