JPH03205118A - Mold with built-in heater for transfer molding - Google Patents
Mold with built-in heater for transfer moldingInfo
- Publication number
- JPH03205118A JPH03205118A JP12096990A JP12096990A JPH03205118A JP H03205118 A JPH03205118 A JP H03205118A JP 12096990 A JP12096990 A JP 12096990A JP 12096990 A JP12096990 A JP 12096990A JP H03205118 A JPH03205118 A JP H03205118A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- template
- heat
- mold
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001721 transfer moulding Methods 0.000 title claims description 8
- 125000006850 spacer group Chemical group 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000012774 insulation material Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒータを内蔵したトランスファー成型用金型に
係わり、特に、型板に配設した孔の中に先端部より基端
部の発熱量が大きい棒状のヒータを挿入して、放熱が大
きい型板外表面近傍をヒータの基端部により集中的に加
熱するようにした金型に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a transfer molding mold with a built-in heater, and in particular, the present invention relates to a transfer molding mold having a built-in heater. The present invention relates to a mold in which a rod-shaped heater with a large diameter is inserted so that the vicinity of the outer surface of the mold plate, where heat radiation is large, is heated more intensively by the base end of the heater.
一般に、熱硬化性樹脂を成型する金型においては、キャ
ビティの中に封入される樹脂を加熱して硬化させるため
に、ヒータを内蔵することが行われている。Generally, a mold for molding a thermosetting resin has a built-in heater in order to heat and harden the resin sealed in the cavity.
従来、会型の中にヒータを内蔵する場合、例えば、キャ
ビティの近傍に、金型の外側方と連通ずる複数の孔を配
設して、各孔の中に棒状のヒータを挿入するようにして
いる。Conventionally, when a heater is built into a mold, for example, multiple holes communicating with the outside of the mold are provided near the cavity, and a rod-shaped heater is inserted into each hole. ing.
Ｊ発明か解決しようとする課題３
しかしなから、金型の外表面から熱の一部が放赦するた
め、金型の中央部に比へて外表面近傍の温度か低くなり
易く、このため、金型の中央部に配設されるキャビティ
と外表面近傍のキャビティとの間に、熱硬化性樹脂のケ
ル化時間に差か生して、硬化状態にむらを生じ、戊型品
にビンホール、ポイｌ−等の欠陥か発生し易い。したが
って、金１′！各部の温匪調幣に多くの労力か必要で、
温度立１二げ時間か長くなる傾向にあった。また、この
場合、公型の外表面近傍に多くのヒータを密集状態に配
設するなとにより、金型温度の均−化を図ることか考え
；）れるか、構造か複雑になるなどの問題点か生しる。J Invention or problem to be solved 3 However, because some of the heat is released from the outer surface of the mold, the temperature near the outer surface tends to be lower than that at the center of the mold. , there is a difference in the curing time of the thermosetting resin between the cavity located in the center of the mold and the cavity near the outer surface, resulting in uneven curing, resulting in bottle holes in the molded product. , spots, etc. are likely to occur. Therefore, gold 1′! It takes a lot of effort to prepare each part,
There was a tendency for the temperature to rise to about 12 hours longer. Also, in this case, it would be better to try to equalize the mold temperature by not arranging many heaters close to the outer surface of the public mold, or the structure would become complicated. Is there a problem?
また、金型にヒータを配設する場合には、当然のごとく
、ヒータの熱効率の向上を図り、できるたけ少ない熱工
不ルキーで効率良くかつ均一に金型の各キャビティ内の
温度を保持する必要かある。In addition, when a heater is installed in a mold, it is a matter of course to improve the thermal efficiency of the heater and maintain the temperature in each cavity of the mold efficiently and uniformly with as little heat work as possible. Is it necessary?
本発明は前記問題点を有効に解決するもので、金型各部
における温度差を小さくして、温度立ち上げ時間を短縮
するとともに、その構造を簡略化する一方、金型からの
熱の放散をできるたけ抑制することを目的とする。The present invention effectively solves the above-mentioned problems, and reduces the temperature difference in each part of the mold, shortens the temperature rise time, and simplifies the structure, while reducing the dissipation of heat from the mold. The aim is to suppress it as much as possible.
本発明の第１のものは、熱硬化性樹脂か封入されるキャ
ビティを形成した一対のチェイスに、それぞれ型板か設
けられ、該型板に、前記キャビテイの近傍を通って外方
に連通ずる複数の孔か配設されるとともに、該孔の中に
、前記キャビテイ内の熱硬化性樹脂を加熱して硬化させ
るための棒状のヒータか挿入されてなり、該ヒータは、
その先端部より基端部の発熱量か大きく設定されている
一方、前記型板とその背部を支持するスベーサとの間に
断熱材が配設されたものである。A first aspect of the present invention is that a pair of chases each forming a cavity in which a thermosetting resin is sealed is provided with a mold plate, and a mold plate is connected to the mold plate and communicates with the outside through the vicinity of the cavity. A plurality of holes are provided, and a rod-shaped heater for heating and curing the thermosetting resin in the cavity is inserted into the hole, and the heater is
The amount of heat generated at the proximal end is set to be larger than that at the distal end, and a heat insulating material is provided between the template and the base plate supporting the back of the template.
また、本発明の第２のものは、前記構戊に加えて、前記
ヒータの基端に、その他の部分より大径のつば部が形成
されたものである。Further, in a second aspect of the present invention, in addition to the above structure, a flange portion having a larger diameter than other portions is formed at the base end of the heater.
ご作用〕
本発明のヒータを内蔵したトランスファー戊型用金型に
あー）では、型板にキャビティの近傍を通って外方に連
通ずるように配設された複数の孔の中に挿入され、かつ
先端部より基端部の発熱量か大きく設定されているヒー
タによって、金型各部に配設された各キャビティにおけ
る温度差を低減して、温度立ち上げ時間を短縮するとと
もに、各キャヒティて成型された成型品の品質を良好に
保持する−・方、金型構造を簡略化し、かつ前記型板の
背部を支持するスベーサと該型板との間に設けた断熱材
によって、型板からの主要な放熱経路てあるスベーサへ
の熱の放散を防止し得て、熱効率の向上を図る。Function] In the transfer die mold with a built-in heater of the present invention, the heater is inserted into a plurality of holes arranged in the mold plate so as to pass through the vicinity of the cavity and communicate with the outside. In addition, the heater is set to generate a larger amount of heat at the proximal end than at the distal end, reducing the temperature difference in each cavity arranged in each part of the mold, shortening the temperature rise time, and making it easier to mold each cavity. In order to maintain good quality of the molded product, the structure of the mold is simplified, and a heat insulating material is provided between the template and the base plate that supports the back of the template. It is possible to prevent heat dissipation to the substrate, which is the main heat dissipation path, and improve thermal efficiency.
以下、本発明のトランスファー成型用金型の一実施例に
ついて第１図ないし第４図に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a transfer molding die of the present invention will be described below with reference to FIGS. 1 to 4.
この実施例の金型は、上型ｌ、下型２におけるキャビテ
ィ３を形成するための各チェイス４を支持している型板
５に、複数の孔６か両型１・２の合わせ面と平行にかつ
貫通状態に設けられるとともに、これら各孔６に、棒状
のヒータ７が孔６の両側方から中央部までそれぞれ挿入
されてなり、該ヒータ７が、その先端部より基端部の発
熱量が大きく設定されているものである。すなわち、該
ヒータ７は、第４図に示すように、ケース８の中にコイ
ル状の電熱線９か収納されるとともに、先端部Ｃ１中央
部Ｂ、基端部Ａの順にコイルの巻き数が多くされたもの
で、電熱線９の単位長さ当りの発熱量は一定であるが、
その巻き数の相異により各部Ａ−Ｂ−Ｃ相互間における
相対的な抵抗が変えられて、その発熱量に差が生じる如
くされたものである。また、前記各ヒータ７の基端には
、その他の部分より大径のつば部７ａが形成されている
。The mold of this embodiment has a plurality of holes 6 or mating surfaces of both molds 1 and 2 in a mold plate 5 supporting each chase 4 for forming the cavity 3 in the upper mold 1 and the lower mold 2. Rod-shaped heaters 7 are inserted into each of these holes 6 from both sides of the holes 6 to the center, and the heaters 7 generate heat at the base end from the tip end. The amount is set large. That is, as shown in FIG. 4, in the heater 7, a coiled heating wire 9 is housed in a case 8, and the number of turns of the coil is arranged in the following order: distal end C1 center B, base end A. The amount of heat generated per unit length of the heating wire 9 is constant,
Due to the difference in the number of turns, the relative resistance between each part A, B, and C is changed, and the amount of heat generated is different. Furthermore, a flange portion 7a having a larger diameter than other portions is formed at the base end of each heater 7.
なお、前記各ヒータ７は、第１図および第３図に示す並
列状態の３本の孔６において、両側の孔の中に挿入され
ているヒータの全体発熱量が中央の孔の中のヒータより
も大きく設定されている。In addition, in the three holes 6 arranged in parallel as shown in FIG. 1 and FIG. is set larger than .
また、図中符号１０は、型板５とその背部を支持するス
ペーサＩｔとの間に配設される断熱材、符号ｌ２は、キ
ャビティ３と連通状態に設けられて、内部に熱硬化性樹
脂か投入されるポノトである。In the figure, reference numeral 10 indicates a heat insulating material disposed between the template 5 and a spacer It supporting the back thereof, and reference numeral 12 indicates a heat insulating material provided in communication with the cavity 3, and a thermosetting resin inside. It is a ponoto that is thrown in.
このように構成される金型において、各ヒータ７に通電
して発熱させると、その熱により型板５かカ［１熱され
、該型板５の熱は、断熱材１０によってスベーサ１１へ
の熱伝達か抑制されることにより、型板５に密接してい
るチェイス４等を主としテ加，鴇する。この場合、型板
５およひチェイス４等の外表面から熱の一部が放散する
が、３本の孔６における両側の孔の中のヒータの発熱量
か中央より大きく、かつ、各ヒータ７における基端部の
発熱量が先端部より大きいのて、型板５およひチェイス
４等の外表面近傍に中央部より多くの熱か集中的に伝達
され、その多い分の熱によりチェイス４等の外表面から
放散される熱を相殺し得て、各キャビティ３の温度をほ
ほ均一にすることができるものである。In the mold configured as described above, when each heater 7 is energized to generate heat, the template 5 is heated by [1], and the heat of the template 5 is transferred to the base plate 11 by the heat insulating material 10. By suppressing heat transfer, the chase 4 and the like that are in close contact with the template 5 are mainly heated and pressed. In this case, a portion of the heat is dissipated from the outer surfaces of the template 5, chase 4, etc., but the amount of heat generated by the heaters in the holes on both sides of the three holes 6 is larger than that in the center, and each heater Since the amount of heat generated at the proximal end of 7 is larger than that at the distal end, more heat is intensively transmitted to the outer surfaces of the mold plate 5, chaser 4, etc. than the central part, and the chase The heat dissipated from the outer surfaces of the cavities 3 and the like can be canceled out, and the temperature of each cavity 3 can be made almost uniform.
また、ヒータ７の基端に形威された、その他の部分より
大径のつば部７ａを利用することによって、型板５の孔
６にヒータ７を挿入する際、あるイハヒータ７の交換を
するために型板５の孔６からヒータ７を引き抜く際に、
ヒータ７の着脱操作を容易に行うことができる。そして
、前記ヒータ７のつば部７ａを利用して型板５の孔６に
ヒータ７を挿入する場合に、きつい嵌合間係であっても
容易に挿入を行うことができるから、ヒータ７のケース
８と型板５の孔６との密着性を良好にすることかでき、
従って、ヒータ７と型板５との間の熱伝達性を大幅に向
上させることができる。In addition, by using the flange 7a formed at the base end of the heater 7 and having a larger diameter than other parts, it is possible to replace a certain heater 7 when inserting the heater 7 into the hole 6 of the template 5. When pulling out the heater 7 from the hole 6 of the template 5,
The heater 7 can be easily attached and detached. When inserting the heater 7 into the hole 6 of the template 5 using the flange 7a of the heater 7, the insertion can be easily performed even with a tight fitting distance. 8 and the hole 6 of the template 5 can be improved,
Therefore, the heat transfer between the heater 7 and the template 5 can be greatly improved.
なお、各ヒータ７毎の発熱量あるいはヒータ７各部にお
ける発熱量は、金型の大きさ、ヒータ７およひキャビテ
ィ３の配段数や配設位置等と、希望する金型温度との関
連により設定される。また、前紀一実施例では、一体的
なコイル状の電熱線９によりヒータ７を構成して、電熱
線９の巻き数をヒータ７の各部て変えるようにしたが、
該一実施例の構成に限定されるものではなく、例えば抵
抗か異なる電熱線を横−列に並へて、これ与を直列ある
いは並列に連結した構成としてもよく、要は、ヒータの
先端部より基端部の発熱量を大きくするものであればよ
い。The amount of heat generated by each heater 7 or the amount of heat generated at each part of the heater 7 depends on the size of the mold, the number and position of the heaters 7 and cavities 3, and the desired mold temperature. Set. In addition, in the first embodiment of the present invention, the heater 7 was configured with an integral coil-shaped heating wire 9, and the number of turns of the heating wire 9 was changed in each part of the heater 7.
The configuration is not limited to the one embodiment, and for example, a configuration may be adopted in which heating wires with different resistances are arranged in rows and connected in series or in parallel. Any material that increases the amount of heat generated at the base end may be used.
Ｃ発明の効果〕
以上説明したように、本発明におけるヒータを内蔵した
トランスファー成型用金型によれば、次のような効果を
奏することかできる。C Effects of the Invention] As explained above, the transfer molding mold having a built-in heater according to the present invention can provide the following effects.
（１）型板の孔の中に挿入されているヒータの基端部の
発熱量か先端部より大きく設定されていることにより、
該ヒータの基端部がＳ発生される熱か型板のタト表面近
傍を集中的に加熱し得て、型板の外表面から放散される
熱を相殺し得るので、型板及びチーイスにおける温度差
を小さくし得て、温度の均−・化を図ることか容易にな
り、したがって、チェイスの温度立ち上げ時間を短縮し
得るとともに、各キャビティにおける熱硬化性樹脂の硬
化状態をほぼ一定にし得て、成型品の品質を向上させる
ことかできる。(1) The amount of heat generated at the base end of the heater inserted into the hole in the template is set to be larger than the distal end.
The heat generated by the base end of the heater can intensively heat the vicinity of the top surface of the mold plate and offset the heat dissipated from the outer surface of the mold plate, so that the temperature in the mold plate and the die can be reduced. The difference can be reduced, making it easier to equalize the temperature, thereby shortening the temperature rise time of the chaser, and making it possible to make the curing state of the thermosetting resin in each cavity almost constant. It is possible to improve the quality of molded products.
（ｉｉ）棒状のヒータにおける基端部の発熱量を先端部
より大きく設定したので、型板の外側方から孔の中に挿
入することにより、確実に型板外表面近傍に多くの熱を
伝達し得て、前記従来例における多数本のヒータを型板
外表面近傍に密集状態に配設する場合等に比べて、その
構造を簡略化することかてきる。(ii) Since the amount of heat generated at the base end of the rod-shaped heater is set to be larger than that at the tip, by inserting it into the hole from the outside of the template, more heat is reliably transferred to the vicinity of the outer surface of the template. Therefore, the structure can be simplified compared to the conventional example in which a large number of heaters are densely arranged near the outer surface of the template.
（ｉｉｉ）型板とその背部を支持するスベーサとの間に
配設した断熱材によって、型板からの主要な熱の放散経
路であるスペーサへの熱伝達を遮断し、かつ型板からの
放熱を抑制することにより、ヒータの熱効率の向上を図
ることができると共に、できるたけ少ない熱工不ルキー
によって効率良くかつ均一にチェイスの各キャビティ内
の温度を保持することができる。(iii) The heat insulating material placed between the template and the spacer that supports its back blocks the heat transfer from the template to the spacer, which is the main heat dissipation path, and also prevents heat radiation from the template. By suppressing this, it is possible to improve the thermal efficiency of the heater, and it is also possible to efficiently and uniformly maintain the temperature in each cavity of the chaser with as little heat processing as possible.
また、本発明の第２のものによれば、上記（ｉ），（ｉ
ｎ， （ｉｉｉ）の効果に加えて、（ｉｖ）棒状のヒー
タの基端に形戊された、その他の部分より大径のっぽ部
を利用することによって、型板の孔に対するヒータの着
脱操作をより容易に行うことかできる上に、型板の孔と
ヒータとの嵌め含いかより厳しくなっても、ヒータを型
板の孔に円滑に挿入することかできるから、ヒータと型
板の孔との密着性を大幅に向上させることかてきて、ヒ
ータから型板への熱伝達性を著しく改善でき、従って、
熱効率の向上を図ることかできる。Further, according to the second aspect of the present invention, the above (i), (i)
In addition to the effects of n and (iii), (iv) the heater can be attached and detached from the hole in the template by using the tail portion formed at the base end of the rod-shaped heater and having a larger diameter than the other portions. Not only is it easier to insert the heater into the hole in the template, even if the fit between the heater and the hole in the template becomes more difficult, the heater can be inserted smoothly into the hole in the template. This greatly improves the adhesion of the heater and the heat transfer from the heater to the template.
It is possible to improve thermal efficiency.
第１図は本発明のトランスファ−成型用金型の一実施例
を示す側面図、第２図は第１図のｎ−ｎ線にｌＯう一部
を省略した矢視断面図、第３図は第１図のＩＩＩ−ｆｌ
Ｉ線に沿う矢視図、第４図は第１図の金型に内蔵される
ヒータの断面図である。
ｌ 上型、２ ・下型、３・・キャビティ、４ チェイ
ス、５・型板、６ 一孔、７ ヒータ、７ａ つば部、
８ ケース、９ ・電熱線、１０−・断熱材、１ｌ・・
スペーサ、１２・・ボノト、Ａ・・基端部、Ｂ中央部、
Ｃ・先端部。FIG. 1 is a side view showing an embodiment of the transfer molding mold of the present invention, FIG. 2 is a sectional view taken along the line nn in FIG. is III-fl in Figure 1.
FIG. 4 is a sectional view of the heater built into the mold of FIG. 1, which is a view taken along line I. l upper mold, 2 lower mold, 3 cavity, 4 chase, 5 mold plate, 6 one hole, 7 heater, 7a collar,
8 Case, 9 - Heating wire, 10 - Insulation material, 1l...
Spacer, 12... Bonoto, A... Proximal end, B center part,
C. Tip.
Claims (1)
対のチェイスに、それぞれ型板が設けられ、該型板に、
前記キャビティの近傍を通って外方に連通する複数の孔
が配設されるとともに、該孔の中に、前記キャビティ内
の熱硬化性樹脂を加熱して硬化させるための棒状のヒー
タが挿入されてなり、該ヒータは、その先端部より基端
部の発熱量が大きく設定されている一方、前記型板とそ
の背部を支持するスペーサとの間に断熱材が配設された
ことを特徴とするヒータを内蔵したトランスファー成型
用金型。 ２）熱硬化性樹脂が封入されるキャビティを形成した一
対のチェイスに、それぞれ型板が設けられ、該型板に、
前記キャビティの近傍を通って外方に連通する複数の孔
が配設されるとともに、該孔の中に、前記キャビティ内
の熱硬化性樹脂を加熱して硬化させるための棒状のヒー
タが挿入されてなり、該ヒータは、その先端部より基端
部の発熱量が大きく設定されている一方、前記ヒータの
基端に、その他の部分より大径のつば部が形成され、ま
た、前記型板とその背部を支持するスペーサとの間に断
熱材が配設されたことを特徴とするヒータを内蔵したト
ランスファー成型用金型。[Claims] 1) A template is provided on each of a pair of chases forming a cavity in which a thermosetting resin is sealed, and the template includes:
A plurality of holes are provided that communicate with the outside through the vicinity of the cavity, and a rod-shaped heater is inserted into the holes to heat and harden the thermosetting resin in the cavity. The heater is characterized in that the amount of heat generated at the base end is set to be larger than that at the distal end, and a heat insulating material is provided between the template and a spacer that supports the back of the template. Transfer molding mold with built-in heater. 2) A template is provided on each of the pair of chases forming a cavity in which the thermosetting resin is sealed, and the template includes:
A plurality of holes are provided that communicate with the outside through the vicinity of the cavity, and a rod-shaped heater is inserted into the holes to heat and harden the thermosetting resin in the cavity. The heater is set to generate a larger amount of heat at its base end than at its distal end, while a collar portion having a larger diameter than other parts is formed at the base end of the heater, and the template A transfer molding mold with a built-in heater, characterized in that a heat insulating material is provided between the spacer and the spacer that supports the back of the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12096990A JPH03205118A (en) | 1990-05-10 | 1990-05-10 | Mold with built-in heater for transfer molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12096990A JPH03205118A (en) | 1990-05-10 | 1990-05-10 | Mold with built-in heater for transfer molding |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6617385A Division JPS61225009A (en) | 1985-03-29 | 1985-03-29 | Mold having heater mounted therein for molding thermosetting resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03205118A true JPH03205118A (en) | 1991-09-06 |
| JPH0521729B2 JPH0521729B2 (en) | 1993-03-25 |
Family
ID=14799506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12096990A Granted JPH03205118A (en) | 1990-05-10 | 1990-05-10 | Mold with built-in heater for transfer molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03205118A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5311328A (en) * | 1976-07-19 | 1978-02-01 | Hitachi Ltd | Heater and resin-packing metal mold equipped with heater |
| JPS5353952U (en) * | 1976-10-08 | 1978-05-09 | ||
| JPS5776394U (en) * | 1980-10-29 | 1982-05-11 | ||
| JPS5993315A (en) * | 1982-11-19 | 1984-05-29 | Hitachi Ltd | Mold |
-
1990
- 1990-05-10 JP JP12096990A patent/JPH03205118A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5311328A (en) * | 1976-07-19 | 1978-02-01 | Hitachi Ltd | Heater and resin-packing metal mold equipped with heater |
| JPS5353952U (en) * | 1976-10-08 | 1978-05-09 | ||
| JPS5776394U (en) * | 1980-10-29 | 1982-05-11 | ||
| JPS5993315A (en) * | 1982-11-19 | 1984-05-29 | Hitachi Ltd | Mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521729B2 (en) | 1993-03-25 |
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