JPH0320461A - Vacuum vapor deposition device - Google Patents
Vacuum vapor deposition deviceInfo
- Publication number
- JPH0320461A JPH0320461A JP15442789A JP15442789A JPH0320461A JP H0320461 A JPH0320461 A JP H0320461A JP 15442789 A JP15442789 A JP 15442789A JP 15442789 A JP15442789 A JP 15442789A JP H0320461 A JPH0320461 A JP H0320461A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vapor deposition
- cooling
- heat
- support jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007740 vapor deposition Methods 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000007738 vacuum evaporation Methods 0.000 claims description 11
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 24
- 230000005855 radiation Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、蒸着下地となる基板を冷却状態にして蒸着
を行う真空蒸“着装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a vacuum evaporation apparatus that performs evaporation while cooling a substrate that is a base for evaporation.
第３図はこの種の従来の真空蒸着装置の要部を示す側面
図である。図において、ｌは蒸着下地となる基板、２は
火板１を支持しかつ冷却する基板支持治具で、冷却部２
ａには冷却用水路等が内蔵され、本体側には冷却可能な
手段が備えられている。３はこの基板支持治具２に基板
１を密着させて固定するホルダ、４はその止めネジであ
る。FIG. 3 is a side view showing the main parts of this type of conventional vacuum evaporation apparatus. In the figure, 1 is a substrate that becomes a base for vapor deposition, 2 is a substrate support jig that supports and cools the fire plate 1, and a cooling part 2
A has a built-in cooling water channel, and the main body side is equipped with cooling means. 3 is a holder for tightly fixing the substrate 1 to the substrate support jig 2, and 4 is a set screw thereof.
上記基板支持治具２の基板接合面は精度良く平面に仕上
げられており、蒸着時にはその接合面に基板１を密着さ
せ、ホルダ３により固定する。この状態で基板１と基板
支持治具２の両接触面が熱的に結合し、蒸着中の輻射熱
やプラズマエネルギーによって生じる基板１の熱が支持
治具側に移動する。そして、この基板支持治具２を冷却
することにより、結果的に基板１が冷却される。The substrate bonding surface of the substrate support jig 2 is precisely finished into a flat surface, and during vapor deposition, the substrate 1 is brought into close contact with the bonding surface and fixed by the holder 3. In this state, the contact surfaces of the substrate 1 and the substrate support jig 2 are thermally coupled, and the heat of the substrate 1 generated by radiant heat or plasma energy during vapor deposition moves to the support jig side. By cooling this substrate support jig 2, the substrate 1 is cooled as a result.
（発明が解決しようとする課題〕
しかしながら、上記のような従来の真空蒸着装置にあっ
ては、基板支持治具の冷却部が露出しており、また基板
を保持するホルダがその冷却部と熱的に接触しているた
め、基板支持治具の温度が上昇し易く、実質冷却部容量
が増加し、基板冷却能力が低下するという問題点があっ
た。(Problem to be Solved by the Invention) However, in the conventional vacuum evaporation apparatus as described above, the cooling part of the substrate support jig is exposed, and the holder that holds the substrate is in contact with the cooling part. Since the two substrates are in direct contact with each other, the temperature of the substrate support jig tends to rise, resulting in an increase in the actual capacity of the cooling section and a reduction in the substrate cooling ability.
この発明は、このような問題点に着目してなされたもの
で、冷却能力が基板冷却に効率よく費され、基板冷却能
力が向上した真空蒸着装置を得ることを目的としている
。The present invention was made in view of these problems, and an object of the present invention is to provide a vacuum evaporation apparatus in which the cooling capacity is efficiently used for cooling the substrate and the substrate cooling capacity is improved.
この発明の真空蒸着装置は、蒸着下地となる基板を支持
しかつ冷却する基板支持治具を備え、前記基板の蒸着部
と対応する位置に開口部を設けた熱遮蔽板を、該韮板と
の間に所定の間隙を持つように配置したものであり、ま
た、前記基板の蒸着部と対応する位置に開口部を有し、
該基板を覆うマスクを設けたものである。The vacuum evaporation apparatus of the present invention includes a substrate support jig that supports and cools a substrate as a base for evaporation, and a heat shielding plate having an opening at a position corresponding to the evaporation area of the substrate is connected to the thin plate. and an opening at a position corresponding to the vapor deposition part of the substrate,
A mask is provided to cover the substrate.
この発明の真空蒸着装置においては、基板の外側に所定
の間隙を有して熱遮蔽板が配置されるので、輻射熱やプ
ラズマエネルギーによる熱はほとんど基板支持治具には
到達しない。In the vacuum evaporation apparatus of the present invention, the heat shield plate is placed outside the substrate with a predetermined gap, so that almost no heat due to radiant heat or plasma energy reaches the substrate support jig.
〔実施例）
第Ｉ図はこの発明の一実旅例による真空蒸着装置の要部
を示す側面図であり、第３図と同一符号は同一構成部分
を示している。図中、１は蒸着下地となる基板、２はこ
の基板１を支持しかつ冷却する基板支持治具、２ａはそ
の冷却部、３は基板１を基板支持治具２に固定するホル
ダ、４はその止めネジ、５は基板１と間に所定の間隙を
Ｉ，テつように配置した熱遮蔽板で、基板１の蒸着部と
対応する位置に開口部５ａが設けられている。[Embodiment] FIG. I is a side view showing the main parts of a vacuum evaporation apparatus according to an example of the present invention, and the same reference numerals as in FIG. 3 indicate the same components. In the figure, 1 is a substrate serving as a base for vapor deposition, 2 is a substrate support jig that supports and cools the substrate 1, 2a is a cooling part thereof, 3 is a holder that fixes the substrate 1 to the substrate support jig 2, and 4 is a holder for fixing the substrate 1 to the substrate support jig 2. The set screw 5 is a heat shielding plate arranged with a predetermined gap I between it and the substrate 1, and an opening 5a is provided at a position corresponding to the vapor deposition part of the substrate 1.
上記のように構成された真空蒸着装置においては、基板
１が基板支持治具２に熱的に密着されるので、この基板
支持治具２を冷却することによって基板１の冷却が行わ
れる。その際、基板ｌを密着した基板支持治具２を覆う
ように熱遮蔽板５が配置されているので、蒸着源等から
の輻射熱やプラズマエネルギーによる熱はその熱遮蔽板
５によって遮られ、基板支持治具２にはほとんど到達し
ない。このため、基板支持治具２の冷却能力は損失され
ることなく基板冷却に効率よく費され、実質的な基板冷
却能力は向上する。In the vacuum evaporation apparatus configured as described above, the substrate 1 is thermally closely attached to the substrate support jig 2, so that the substrate 1 is cooled by cooling the substrate support jig 2. At this time, since the heat shield plate 5 is arranged to cover the substrate support jig 2 that is in close contact with the substrate l, the heat due to the radiant heat from the evaporation source or the plasma energy is blocked by the heat shield plate 5, and the substrate It hardly reaches the support jig 2. Therefore, the cooling capacity of the substrate support jig 2 is efficiently used for cooling the substrate without being lost, and the substantial substrate cooling capacity is improved.
また、熱遮蔽板５には基板１の蒸着部位に影響を及ぼさ
ない範囲内で最小限の開口部５ａが設けられているので
、基板１に対する成膜などには問題が生じることはない
。Furthermore, since the heat shielding plate 5 is provided with a minimum opening 5a within a range that does not affect the vapor deposition site of the substrate 1, no problem occurs in film formation on the substrate 1.
第２図はこの発明の他の実施例を示す側面図である。FIG. 2 is a side view showing another embodiment of the invention.
上述の実施例において、熱遮蔽板５あるいはホルダ３に
マスク機能を持たせても良いが、この実施例のように基
板１の蒸着面側に独立した薄いマスクを設けてもよい。In the above embodiment, the heat shielding plate 5 or the holder 3 may have a mask function, but an independent thin mask may be provided on the vapor deposition surface side of the substrate 1 as in this embodiment.
すなわち、第２図に示すように、基板！の蒸着部と対応
する位置に開口部を有し、該基板１を覆うマスク６を設
けることもできる。That is, as shown in FIG. 2, the substrate! It is also possible to provide a mask 6 that covers the substrate 1 and has an opening at a position corresponding to the vapor deposition portion.
第２図（ａ）は、スバッタ蒸着，イオンブレーティング
等で蒸着物７の回り込みがある場合を示している。この
場合、マスク６は基板１と共にホルダ３により所定の圧
力で基板支持治具２に固定される。FIG. 2(a) shows a case where the deposit 7 wraps around due to spatter deposition, ion blating, etc. In this case, the mask 6 and the substrate 1 are fixed to the substrate support jig 2 by the holder 3 with a predetermined pressure.
また第２図（ｂ）は、ＥＢ（電子ビーム）．抵抗加熱等
による蒸着物７の回り込みがない場合を示している。こ
の場合、マスク６を基板１からある間隙を持って配置す
ることができるので、更に基板１への熱流入を減少させ
ることができる。Moreover, FIG. 2(b) shows an EB (electron beam). This shows a case where the deposit 7 does not wrap around due to resistance heating or the like. In this case, since the mask 6 can be placed with a certain gap from the substrate 1, the heat flow into the substrate 1 can be further reduced.
（発明の効果）
以上のように、この発明によれば、基板の外側に所定の
間隙を持って熱遮蔽板を配置した構成としたため、輻射
熱やプラズマエネルギーによる熱はほとんど基板支持治
具に到達せず、基板支持治具の冷却能力が基板冷却に効
率よく費され、実質的な基板冷却能力が向上するという
効果がある。(Effects of the Invention) As described above, according to the present invention, since the heat shield plate is arranged outside the substrate with a predetermined gap, most of the heat due to radiant heat and plasma energy reaches the substrate support jig. Instead, the cooling capacity of the substrate support jig is efficiently used for cooling the substrate, resulting in an effect that the substantial substrate cooling capacity is improved.
第１図はこの発明の一実施例を示す側面図、第２図（ａ
）．（ｂ）はこの発明の他の実施例を示す側面図、第３
図は従来の真空蒸着装置の要部を示す側面図である。
ｉ−−−−−基板
２ −−−−−−基板支持治具
２
５
ａ・・・・・・冷却部
３・・・・・・ホルダ
４・・・・・・止めネジ
５・・・・・・熱遮蔽板
ａ・・・・・・開口部
６・・・・・・マスク
？ −−−−−・蒸着物FIG. 1 is a side view showing an embodiment of the present invention, and FIG.
). (b) is a side view showing another embodiment of the present invention;
The figure is a side view showing the main parts of a conventional vacuum evaporation apparatus. i------- Board 2 --- Board support jig 2 5 a... Cooling part 3... Holder 4... Set screw 5... ...Heat shielding plate a...Opening 6...Mask? −−−−−・Vapor deposits
Claims (2)
支持治具を備え、前記基板の蒸着部と対応する位置に開
口部を設けた熱遮蔽板を、該基板との間に所定の間隙を
持つように配置したことを特徴とする真空蒸着装置。(1) A heat shielding plate equipped with a substrate support jig that supports and cools a substrate serving as an evaporation base, and has an opening at a position corresponding to the evaporation area of the substrate, is installed with a predetermined gap between the substrate and the substrate. A vacuum evaporation device characterized by being arranged so as to have a
し、該基板を覆うマスクを設けたことを特徴とする請求
項１記載の真空蒸着装置。(2) The vacuum evaporation apparatus according to claim 1, further comprising a mask having an opening at a position corresponding to the evaporation portion of the substrate and covering the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15442789A JPH0320461A (en) | 1989-06-19 | 1989-06-19 | Vacuum vapor deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15442789A JPH0320461A (en) | 1989-06-19 | 1989-06-19 | Vacuum vapor deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320461A true JPH0320461A (en) | 1991-01-29 |
Family
ID=15583938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15442789A Pending JPH0320461A (en) | 1989-06-19 | 1989-06-19 | Vacuum vapor deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320461A (en) |
-
1989
- 1989-06-19 JP JP15442789A patent/JPH0320461A/en active Pending
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