JPH0319310B2 - - Google Patents
Info
- Publication number
- JPH0319310B2 JPH0319310B2 JP550288A JP550288A JPH0319310B2 JP H0319310 B2 JPH0319310 B2 JP H0319310B2 JP 550288 A JP550288 A JP 550288A JP 550288 A JP550288 A JP 550288A JP H0319310 B2 JPH0319310 B2 JP H0319310B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- solderability
- bath
- baths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 108
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 71
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- -1 amine borane compound Chemical class 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 22
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 16
- 229910000085 borane Inorganic materials 0.000 claims description 16
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 241000080590 Niso Species 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 5
- 239000010941 cobalt Substances 0.000 description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910001868 water Inorganic materials 0.000 description 5
- 229910000521 B alloy Inorganic materials 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 125000000623 heterocyclic group Chemical group 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000011133 lead Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- NDVLTZFQVDXFAN-UHFFFAOYSA-N 3-(2-cyanoethylsulfanyl)propanenitrile Chemical class N#CCCSCCC#N NDVLTZFQVDXFAN-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000008139 complexing agent Substances 0.000 description 3
- 125000006165 cyclic alkyl group Chemical group 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- FTLYMKDSHNWQKD-UHFFFAOYSA-N (2,4,5-trichlorophenyl)boronic acid Chemical compound OB(O)C1=CC(Cl)=C(Cl)C=C1Cl FTLYMKDSHNWQKD-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical compound NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- WVMHLYQJPRXKLC-UHFFFAOYSA-N borane;n,n-dimethylmethanamine Chemical compound B.CN(C)C WVMHLYQJPRXKLC-UHFFFAOYSA-N 0.000 description 2
- NNTOJPXOCKCMKR-UHFFFAOYSA-N boron;pyridine Chemical compound [B].C1=CC=NC=C1 NNTOJPXOCKCMKR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- VXAWCKIQYKXJMD-UHFFFAOYSA-N ethynamine Chemical group NC#C VXAWCKIQYKXJMD-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- YNBADRVTZLEFNH-UHFFFAOYSA-N methyl nicotinate Chemical compound COC(=O)C1=CC=CN=C1 YNBADRVTZLEFNH-UHFFFAOYSA-N 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 description 2
- 229940085605 saccharin sodium Drugs 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 150000003464 sulfur compounds Chemical class 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 1
- SBAJRGRUGUQKAF-UHFFFAOYSA-N 3-(2-cyanoethylamino)propanenitrile Chemical class N#CCCNCCC#N SBAJRGRUGUQKAF-UHFFFAOYSA-N 0.000 description 1
- YBAZINRZQSAIAY-UHFFFAOYSA-N 4-aminobenzonitrile Chemical class NC1=CC=C(C#N)C=C1 YBAZINRZQSAIAY-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- DTVWWIWHLAXIHG-UHFFFAOYSA-N B.C1CNCCN1 Chemical compound B.C1CNCCN1 DTVWWIWHLAXIHG-UHFFFAOYSA-N 0.000 description 1
- APQOEKJEHXFVRQ-UHFFFAOYSA-N B.COCCN(C)C Chemical compound B.COCCN(C)C APQOEKJEHXFVRQ-UHFFFAOYSA-N 0.000 description 1
- KHBQMWCZKVMBLN-UHFFFAOYSA-N Benzenesulfonamide Chemical compound NS(=O)(=O)C1=CC=CC=C1 KHBQMWCZKVMBLN-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- LSPHULWDVZXLIL-UHFFFAOYSA-N Camphoric acid Natural products CC1(C)C(C(O)=O)CCC1(C)C(O)=O LSPHULWDVZXLIL-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- XNNKQIPMIAMBJO-UHFFFAOYSA-N aniline;boron Chemical compound [B].NC1=CC=CC=C1 XNNKQIPMIAMBJO-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- UORVGPXVDQYIDP-BJUDXGSMSA-N borane Chemical class [10BH3] UORVGPXVDQYIDP-BJUDXGSMSA-N 0.000 description 1
- VDTVZBCTOQDZSH-UHFFFAOYSA-N borane N-ethylethanamine Chemical compound B.CCNCC VDTVZBCTOQDZSH-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- QHXLIQMGIGEHJP-UHFFFAOYSA-N boron;2-methylpyridine Chemical compound [B].CC1=CC=CC=N1 QHXLIQMGIGEHJP-UHFFFAOYSA-N 0.000 description 1
- YJROYUJAFGZMJA-UHFFFAOYSA-N boron;morpholine Chemical compound [B].C1COCCN1 YJROYUJAFGZMJA-UHFFFAOYSA-N 0.000 description 1
- VEWFZHAHZPVQES-UHFFFAOYSA-N boron;n,n-diethylethanamine Chemical compound [B].CCN(CC)CC VEWFZHAHZPVQES-UHFFFAOYSA-N 0.000 description 1
- ITQYPUFOGQVEHR-UHFFFAOYSA-N boron;n-propan-2-ylpropan-2-amine Chemical compound [B].CC(C)NC(C)C ITQYPUFOGQVEHR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-N bromic acid Chemical compound OBr(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-N 0.000 description 1
- 150000001661 cadmium Chemical class 0.000 description 1
- LSPHULWDVZXLIL-QUBYGPBYSA-N camphoric acid Chemical compound CC1(C)[C@H](C(O)=O)CC[C@]1(C)C(O)=O LSPHULWDVZXLIL-QUBYGPBYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- XOIWXJSPLXGSLZ-UHFFFAOYSA-L disodium;naphthalene-2,7-disulfonate Chemical compound [Na+].[Na+].C1=CC(S([O-])(=O)=O)=CC2=CC(S(=O)(=O)[O-])=CC=C21 XOIWXJSPLXGSLZ-UHFFFAOYSA-L 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- ICIWUVCWSCSTAQ-UHFFFAOYSA-M iodate Chemical compound [O-]I(=O)=O ICIWUVCWSCSTAQ-UHFFFAOYSA-M 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000002730 mercury Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- PMRYVIKBURPHAH-UHFFFAOYSA-N methimazole Chemical class CN1C=CNC1=S PMRYVIKBURPHAH-UHFFFAOYSA-N 0.000 description 1
- 229960001238 methylnicotinate Drugs 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- JZJXKEWVUBVOEH-UHFFFAOYSA-N n,n-diethylprop-2-yn-1-amine Chemical compound CCN(CC)CC#C JZJXKEWVUBVOEH-UHFFFAOYSA-N 0.000 description 1
- ILBIXZPOMJFOJP-UHFFFAOYSA-N n,n-dimethylprop-2-yn-1-amine Chemical compound CN(C)CC#C ILBIXZPOMJFOJP-UHFFFAOYSA-N 0.000 description 1
- 235000005152 nicotinamide Nutrition 0.000 description 1
- 239000011570 nicotinamide Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- MZSDGDXXBZSFTG-UHFFFAOYSA-M sodium;benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC=CC=C1 MZSDGDXXBZSFTG-UHFFFAOYSA-M 0.000 description 1
- LDHXNOAOCJXPAH-UHFFFAOYSA-M sodium;prop-2-yne-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC#C LDHXNOAOCJXPAH-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 150000003475 thallium Chemical class 0.000 description 1
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical class OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- NJPKYOIXTSGVAN-UHFFFAOYSA-K trisodium;naphthalene-1,3,6-trisulfonate Chemical compound [Na+].[Na+].[Na+].[O-]S(=O)(=O)C1=CC(S([O-])(=O)=O)=CC2=CC(S(=O)(=O)[O-])=CC=C21 NJPKYOIXTSGVAN-UHFFFAOYSA-K 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Description
産業上の利用分野
本発明はハンダ付け性に優れた電気ニツケル又
はニツケル合金めつき被膜を与える電気めつき方
法に関する。
従来の技術及び発明が解決しようとする課題
従来、ハンダ付け性の良好な電気めつき被膜と
しては、ハンダめつき、錫めつき、金めつき、銀
めつき等の被膜が知られているが、これらのめつ
き法は材料が高価であつたり、めつき浴管理が難
しい等の問題がある。
これに対し、電気ニツケルめつきや電気ニツケ
ル合金めつき法は、材料も比較的安価であり、浴
管理も容易であるが、得られるめつき被膜は、光
沢浴、半光沢浴、添加剤無含有の無光沢浴のいず
れからのものもハンダ付け性に劣る。また、無電
解ニツケル−リン合金めつき被膜のハンダ付け性
も必ずしも十分でない。更に、ジメチルアミンボ
ランを還元剤とする無電解ニツケル−ホウ素合金
めつき被膜のハンダ付け性は上記のニツケルめつ
き被膜に比べて比較的良好であるといわれている
が、この無電解ニツケル−ホウ素めつき法はめつ
き速度が遅い等の問題があり、またいずれにして
も無電解めつき法は電気めつき法に比較してめつ
きコストが高くつく。
課題を解決しようとする手段及び作用
本発明者らは、上記事情に鑑み、電気ニツケル
又はニツケル合金めつき法によりハンダ付け性に
優れた電気めつき被膜を与える方法につき鋭意研
究を行なつた結果、第４級アンモニウム塩とアミ
ンボラン化合物とを添加した電気ニツケルめつき
浴又は電気ニツケル合金めつき浴から得られため
つき被膜のハンダ付け性が非常に優れていること
を知見した。即ち、第４級アンモニウム塩及びア
ミンボラン化合物を添加した電気ニツケル又はニ
ツケル合金めつき浴から得られためつき被膜は、
従来の電気ニツケル及びニツケル合金めつき浴か
ら得られるめつき被膜は勿論、ジメチルアミンボ
ラン等のホウ素系化合物を還元剤とする無電解ニ
ツケル−ホウ素合金めつき被膜よりもハンダ付け
性に優れ、従来よりハンダ付け性が優れていると
されているハンダめつきや錫めつき被膜と同等も
しくはそれ以上のハンダ付け性を有するめつき被
膜が得られることを知見し、本発明をなすに至つ
たものである。
従つて、本発明は第４級アンモニウム塩とアミ
ンボラン化合物とを含有する電気ニツケル又はニ
ツケル合金めつき浴中に被めつき物を浸漬し、電
気めつきすることを特徴とする電気めつき方法を
提供するものである。
本発明によれば、電気めつき法を採用するの
で、無電解めつき法に比較してめつき速度が大き
く、まためつき被膜の内部応力を小さくすること
もでき、しかもめつきコストも安価である上、全
硫酸塩浴、全塩化物浴、ワツト浴、スルフアミン
酸浴等の錯化剤を含有しないいわゆる単純塩浴を
使用することも可能で、これにより排水処理上の
問題を少なくすることができる。
本発明方法から得られるめつき被膜は、上述し
たようにハンダ付け性が良好であるが、更に種々
のろう付け性、溶接性にも優れているものであ
る。また、通常の電気ニツケルめつき被膜は400
℃程度の高温に加熱すると著しく変色する場合が
あるが、特にアミンボラン化合物を添加しためつ
き浴から得られるめつき被膜は400℃程度の高温
で加熱しても変色がなく、めつきしたままの光沢
が維持されるという特徴を有する（なお、この耐
変色性能は、本発明者の検討によると、アミンボ
ラン類のボランへの付加体として用いられている
アミン類を単独でめつき浴中に添加しても、得ら
れるめつき被膜には耐変色性能がないので、この
性能はボラン類に由来するものと考えられた）。
それ故、本発明により得られるめつき被膜は、
このように優れたハンダ付け性等の性能を有する
ため、現在ハンダ付け等の目的で行なわれている
ハンダ、錫、金、銀めつき等の代りに本発明電気
ニツケル及びニツケル合金めつき方法を採用で
き、例えばリードフレーム、フープ、半導体部
品、コンデンサー、抵抗体、コイル、リレー、ス
イツチ、コネクター、電気接点部品、プリント配
線基板等、種々の電気、電子部品のめつきに好適
に採用し得る。
以下、本発明につき更に詳しく説明する。
発明の構成
本発明に係るめつき方法は、第４級アンモニウ
ム塩及びアミンボラン化合物を添加した電気ニツ
ケルめつき浴又は電気ニツケル合金めつき浴中に
被めつき物を浸漬し、所用の電気を通じて電気め
つきを行なうものである。
ここで、電気ニツケル合金めつき浴を使用する
場合、ニツケルと合金を形成する金属又は非金属
としては、コバルト、鉄、錫、鉛、銅、クロム、
亜鉛、ビスマス、インジウム、タングステン、モ
リブデン、砒素、アンチモン、リン等が挙げられ
るが、ハンダ付け性の点からは、コバルト、鉄、
タングステン、リンが好ましい。これらの合金成
分の含有量は必ずしも制限されないが、めつき被
膜中に20％（重量％、以下同じ）以下、特に５％
以下含有することが好ましい。
また、電気ニツケルめつき浴及び電気ニツケル
合金めつき浴としては、全硫酸浴、全塩化物浴、
ワツト浴、スルフアミン酸浴、無機又は有機化合
物による錯化浴、ホウフツ化浴等が用いられる。
これらめつき浴のPH、それにめつき条件は、使
用するめつき浴の種類等によつて選定され、例え
ばPHは約１〜14、特に約２〜13、めつき温度は約
10〜90℃、特に約35〜60℃、陰極電流密度（Dk）
は約0.01〜100A／ｄm2、特に約0.1〜10A／ｄm2
とすることができる。また、必要により液撹拌を
行なうこともできるが、この場合液撹拌方法とし
ては、空気撹拌、カソードロツキング、ポンプに
よる液循環、プロペラ式撹拌機による液撹拌等の
方法が採用し得る。
なお、めつき浴中の塩類濃度を高くすると共
に、めつき温度を高くし、かつ強撹拌を採用する
ことにより高速めつきを行なうことができ、また
通常のラツクを用いるめつき法以外に、めつき浴
中の塩濃度、めつき条件を適宜選定することによ
り、バレルめつき、振動めつき等の各種めつき法
を採用し得る。
本発明に使用し得る電気ニツケルめつき浴の代
表的な例を下記に示す。
１ NiSO4・6H2O 280ｇ／
NiCl2・6H2O 45 〃
H3BO3 40 〃
PH 5.0
温 度 55℃
Dk 5A／ｄm2
２ NiSO4・6H2O 280ｇ／
H3BO3 40 〃
PH 5.0
温 度 55℃
Dk 4A／ｄm2
３ NiSO4・6H2O 60ｇ／
エチレンジアミン 120 〃
NaOH 80 〃
PH 12.5
温 度 55℃
Dk 3A／ｄm2
４ NiSO4・6H2O 80ｇ／
クエン酸ナトリウム 40 〃
乳 酸 20 〃
PH 7.0
温 度 40℃
Dk 3A／ｄm2
５ NiSO4・6H2O 60ｇ／
NiCl2・6H2O 20 〃
ピロリン酸カリウム 150 〃
PH 10.0
温 度 60℃
Dk 3A／ｄm2
６ NiSO4・7H2O 250ｇ／
NiCl2・6H2O 40 〃
（NH4）2SO4 100 〃
PH（アンモニアで調整） 8.5
温 度 50℃
Dk 4A／ｄm2
７ Ni（BF4）2 220ｇ／
H3BO3 30 〃
PH 3.0〜4.5
温 度 50〜60℃
Dk 7A／ｄm2
８ スルフアミン酸ニツケル 300ｇ／
NiCl2・6H2O 10 〃
H3BO3 30 〃
PH 3.5〜4.5
温 度 30〜60℃
Dk ２〜25A／ｄm2
９ スルフアミン酸ニツケル 450ｇ／
H3BO3 30 〃
PH ３〜５
温 度 40〜60℃
Dk ２〜3A／ｄm2
10 NiSO4・6H2O 80〜150ｇ／
NiCl2・6H2O 40〜110 〃
硫酸第１鉄 ５〜20 〃
H3BO3 40〜50 〃
PH 2.8〜3.5
温 度 55〜65℃
Dk ２〜8A／ｄm2
なお、合金めつきの場合は上記の浴に合金化に
必要な適宜な塩類を添加する。
本発明においては、上述した電気ニツケル又は
ニツケル合金めつき浴に第４級アンモニウム塩を
添加するものであるが、この場合第４級アンモニ
ウム塩としては、下記(A)式で示されるピリジン骨
格を有する第４級アンモニウム塩並びに(B)式及び
(C)式で示される化合物が好適に用いられる。
但し、(A)式において、
R1は(1) 炭素数１〜18の鎖状アルキル基；
(2) 炭素数１〜18の環状アルキル基；
(3) 合計炭素数６〜18で、１個以上の芳香
環を含有する基；
(4) 炭素数３〜15のヘテロ環を含有する
基；
(5) 炭素数９〜18の芳香環及びヘテロ環を
含有する基；
(6) ヒドロキシエチル基；
(7) ヒドロキシプロピル基；又は
(8) エチレンオキシド及び／又はプロピレ
ンオキシドの重合物で重合度20までの
もの
であり、
R2及びR3はそれぞれ
(1) 炭素数１〜４のアルキル基；
(2) カルボキシル基又はその水素原子が金
属原子で置換されたもの；
(3) −CONH2又はその誘導体；又は
(4) 水素原子
であるか（なお、R2とR3は互に同一であつても
異なつていてもよく、またオルト、メタ、パラ位
のいずれの位置関係にあつてもよい）、或いは
(5) R2とR3とで環を形成する
（例えばベンゼン環を形成することにより、ピ
リジン環との間でキノリン、イソキノリン等の環
状体を形成する）ものであり、そして
Xはハロゲンイオン、NO3 -、SO2- 4、
CH3COO-等である。
但し、(B)及び(C)式において、
R1及びR2はそれぞれ炭素数１〜４のアルキル
基又はヒドロキシアルキル基であり（R1とR2は
互に同じでも異なつていてもよい）、
R3は炭素数１〜18の鎖状アルキル基、ヒドロ
キシアルキル基、環状アルキル基、炭素数６〜18
で芳香環を含有する基、炭素数３〜15でヘテロ環
を含有する基、又は炭素数９〜18で芳香環とヘテ
ロ環とを含有する基であり、
R4は−CH2COOH基、その水素原子を金属原
子で置換したもの、ヒドロキシエチル基、ヒドロ
キシプロピル基、エチレンオキシド及び／又はプ
ロピレンオキシドの重合物で重合度20までのも
の、又はベンジル基又はその誘導体であり、
R5は炭素数１〜10の直鎖又は分枝鎖のアルキ
レン基であり、そして
Xはハロゲンイオン、NO3 -、SO2- 4、
CH3COO-等である。
以下に本発明に用いる第４級アンモニウム塩の
代表例を示す。
INDUSTRIAL APPLICATION FIELD The present invention relates to an electroplating method for providing an electroplated nickel or nickel alloy coating with excellent solderability. Conventional Technology and Problems to be Solved by the Invention Conventionally, films such as solder plating, tin plating, gold plating, and silver plating are known as electroplated films with good solderability. However, these plating methods have problems such as expensive materials and difficult plating bath management. On the other hand, electric nickel plating and electric nickel alloy plating methods use relatively inexpensive materials and easy bath management, but the resulting plating films are only available in glossy baths, semi-bright baths, and without additives. Solderability from any of the included matte baths is poor. Furthermore, the solderability of the electroless nickel-phosphorus alloy plating film is not necessarily sufficient. Furthermore, it is said that the solderability of an electroless nickel-boron alloy plating film using dimethylamine borane as a reducing agent is relatively better than that of the above-mentioned nickel plating film. The plating method has problems such as slow plating speed, and in any case, the plating cost of the electroless plating method is higher than that of the electroplating method. Means and Effects for Solving the Problems In view of the above circumstances, the present inventors have conducted intensive research on a method of providing an electroplated film with excellent solderability by electroplating of nickel or nickel alloy. It has been found that the solderability of a tough coating obtained from an electric nickel plating bath or an electric nickel alloy plating bath to which a quaternary ammonium salt and an amine borane compound are added has excellent solderability. That is, the frosted coating obtained from an electric nickel or nickel alloy plating bath containing a quaternary ammonium salt and an amine borane compound is
Not only plating films obtained from conventional electric nickel and nickel alloy plating baths, but also electroless nickel-boron alloy plating films using boron-based compounds such as dimethylamine borane as reducing agents, have better solderability than conventional plating baths. It was discovered that a plating film having solderability equal to or better than solder plating and tin plating films, which are said to have better solderability, can be obtained, and this led to the present invention. It is. Therefore, the present invention provides an electroplating method characterized by immersing the object to be plated in an electric nickel or nickel alloy plating bath containing a quaternary ammonium salt and an amine borane compound, and electroplating the object. This is what we provide. According to the present invention, since the electroplating method is adopted, the plating speed is higher than that of the electroless plating method, and the internal stress of the plating film can be reduced, and the plating cost is also low. In addition, it is also possible to use so-called simple salt baths that do not contain complexing agents, such as all-sulfate baths, all-chloride baths, Watt baths, and sulfamic acid baths, which reduce problems in wastewater treatment. be able to. The plating film obtained by the method of the present invention has good solderability as described above, and is also excellent in various brazing and welding properties. In addition, the normal electric nickel plating film is 400
When heated to a high temperature of around 400°C, the color may change significantly, but the plated film obtained from a matting bath containing an amine borane compound does not change color even when heated to a high temperature of around 400°C, and remains plated. It has the characteristic that gloss is maintained. (According to the study of the present inventor, this color fastness is achieved by adding amines, which are used as adducts of amine borane to borane, alone into the plating bath.) However, since the resulting plating film had no color fastness, it was thought that this performance was derived from the borane). Therefore, the plating film obtained by the present invention is
Because of this excellent performance such as solderability, the electric nickel and nickel alloy plating method of the present invention can be used in place of the solder, tin, gold, silver plating, etc. currently used for soldering purposes. It can be suitably used for plating various electrical and electronic parts, such as lead frames, hoops, semiconductor parts, capacitors, resistors, coils, relays, switches, connectors, electrical contact parts, and printed wiring boards. The present invention will be explained in more detail below. Structure of the Invention In the plating method according to the present invention, the object to be plated is immersed in an electric nickel plating bath or an electric nickel alloy plating bath to which a quaternary ammonium salt and an amine borane compound have been added. It is used for plating. When using an electric nickel alloy plating bath, the metals or non-metals that form an alloy with nickel include cobalt, iron, tin, lead, copper, chromium,
Examples include zinc, bismuth, indium, tungsten, molybdenum, arsenic, antimony, phosphorus, etc., but from the viewpoint of solderability, cobalt, iron,
Tungsten and phosphorus are preferred. The content of these alloy components is not necessarily limited, but the content of these alloy components in the plating film is 20% (weight%, the same hereinafter) or less, especially 5%.
It is preferable to contain the following: In addition, electric nickel plating baths and electric nickel alloy plating baths include all-sulfuric acid baths, all-chloride baths,
A Watts bath, a sulfamic acid bath, a complexing bath with an inorganic or organic compound, a hofusing bath, etc. are used. The pH of these plating baths and the plating conditions are selected depending on the type of plating bath used, etc. For example, the pH is about 1 to 14, especially about 2 to 13, and the plating temperature is about
10~90℃, especially about 35~60℃, cathodic current density (Dk)
is about 0.01 to 100 A/dm 2 , especially about 0.1 to 10 A/dm 2
It can be done. In addition, liquid stirring can be performed if necessary, and in this case, methods such as air stirring, cathode locking, liquid circulation using a pump, and liquid stirring using a propeller type stirrer can be employed. In addition, high-speed plating can be performed by increasing the salt concentration in the plating bath, raising the plating temperature, and using strong stirring. By appropriately selecting the salt concentration in the plating bath and the plating conditions, various plating methods such as barrel plating and vibration plating can be employed. Representative examples of electric nickel plating baths that can be used in the present invention are shown below. 1 NiSO 4・6H 2 O 280g/ NiCl 2・6H 2 O 45 〃 H 3 BO 3 40 〃 PH 5.0 Temperature 55℃ Dk 5A/dm 2 2 NiSO 4・6H 2 O 280g/ H 3 BO 3 40 〃 PH 5.0 Temperature 55℃ Dk 4A/dm 2 3 NiSO 4・6H 2 O 60g/ Ethylenediamine 120 〃 NaOH 80 〃 PH 12.5 Temperature 55℃ Dk 3A/dm 2 4 NiSO 4・6H 2 O 80g/ Sodium citrate 40 〃 Lactic acid 20 〃 PH 7.0 Temperature 40℃ Dk 3A/dm 2 5 NiSO 4・6H 2 O 60g/ NiCl 2・6H 2 O 20 〃 Potassium pyrophosphate 150 〃 PH 10.0 Temperature 60℃ Dk 3A/dm 2 6 NiSO 4・7H 2 O 250g/ NiCl 2・6H 2 O 40 〃 (NH 4 ) 2 SO 4 100 〃 PH (adjusted with ammonia) 8.5 Temperature 50℃ Dk 4A/dm 2 7 Ni (BF 4 ) 2 220g/H 3 BO 3 30 〃 PH 3.0~4.5 Temperature 50~60℃ Dk 7A/dm 2 8 Nickel sulfamate 300g/ NiCl 2・6H 2 O 10 〃 H 3 BO 3 30 〃 PH 3.5~4.5 Temperature 30~60℃ Dk 2~25A/dm 2 9 Nickel sulfamate 450g/ H 3 BO 3 30 〃 PH 3~5 Temperature 40~60℃ Dk 2~3A/dm 2 10 NiSO 4・6H 2 O 80~150g/ NiCl 2・6H 2 O 40~110 〃 Ferrous sulfate 5~20 〃 H 3 BO 3 40~50 〃 PH 2.8~3.5 Temperature 55~65℃ Dk 2~8A/dm 2 In addition, in the case of alloy plating, use the above bath. Appropriate salts necessary for alloying are added to the mixture. In the present invention, a quaternary ammonium salt is added to the above-mentioned electric nickel or nickel alloy plating bath. In this case, the quaternary ammonium salt has a pyridine skeleton represented by the following formula (A). and a quaternary ammonium salt having the formula (B) and
A compound represented by formula (C) is preferably used. However, in formula (A), R 1 is (1) a chain alkyl group having 1 to 18 carbon atoms; (2) a cyclic alkyl group having 1 to 18 carbon atoms; (3) a total of 6 to 18 carbon atoms, and 1 (4) A group containing a heterocycle having 3 to 15 carbon atoms; (5) A group containing an aromatic ring and a heterocycle having 9 to 18 carbon atoms; (6) Hydroxyethyl (7) Hydroxypropyl group; or (8) A polymer of ethylene oxide and/or propylene oxide with a degree of polymerization of up to 20, and R 2 and R 3 are each (1) an alkyl group having 1 to 4 carbon atoms; (2) A carboxyl group or its hydrogen atom substituted with a metal atom; (3) -CONH 2 or a derivative thereof; or (4) A hydrogen atom (R 2 and R 3 are the same) or (5) R 2 and R 3 form a ring (for example, a benzene ring (by forming a cyclic body such as quinoline or isoquinoline with the pyridine ring), and X is a halogen ion, NO 3 - , SO 2- 4 ,
CH 3 COO - etc. However, in formulas (B) and (C), R 1 and R 2 are each an alkyl group or a hydroxyalkyl group having 1 to 4 carbon atoms (R 1 and R 2 may be the same or different). ), R 3 is a chain alkyl group having 1 to 18 carbon atoms, a hydroxyalkyl group, a cyclic alkyl group, or a cyclic alkyl group having 6 to 18 carbon atoms.
is a group containing an aromatic ring, a group containing 3 to 15 carbon atoms and a heterocycle, or a group containing 9 to 18 carbon atoms and an aromatic ring and a heterocycle, R 4 is a -CH 2 COOH group, The hydrogen atom is replaced with a metal atom, a hydroxyethyl group, a hydroxypropyl group, a polymer of ethylene oxide and/or propylene oxide with a polymerization degree of up to 20, or a benzyl group or a derivative thereof, and R 5 is the number of carbon atoms. 1 to 10 linear or branched alkylene groups, and X is a halogen ion, NO 3 - , SO 2- 4 ,
CH 3 COO - etc. Representative examples of quaternary ammonium salts used in the present invention are shown below.
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】【formula】
【式】
上述した第４級アンモニウム塩は、その１種を
単独で使用しても２種以上を組合せて用いてもよ
い。その添加量は必ずしも制限されないが、0.01
〜10ｇ／、特に0.1〜１ｇ／とすることが好
ましい。
また、本発明においては、上述した第４級アン
モニウム塩に加えてアミンボラン化合物を添加す
るものである。
ここで、アミンボラン化合物としては、例えば
トリメチルアミンボラン、モルフオリンボラン、
Ｎ−メチルモルフオリンボラン、モルフオリンジ
エチルボラン、ターシヤリーブチルアミンボラ
ン、ジメチルアミンボラン、ジエチルアミンボラ
ン、ピリジンボラン、ピコリンボラン、ジメチル
プロピルアミンボラン、アニリンボラン、ジメチ
ルアミンジメチルボラン、トリエチルアミンボラ
ン、ジメチルドデシルアミンボラン、ピリジンボ
ラン、ピペラジンボラン、２−メトキシエチルジ
メチルアミンボラン、ジイソプロピルアミンボラ
ン等が挙げられ、これらの１種又は２種以上を組
合せて使用することができるが、これらのうちで
は下記(D)，(E)及び(F)式で示される第３級アミンの
ボラン付加体が好適に用いられる。
（但し、R1，R2及びR3はそれぞれメチル基又は
エチル基を示し、R1，R2及びR3は互に同じであ
つても異なつていてもよい。）
CH3（OCH2CH2）oＮ（CH3）2BH3 ……(E)
（但し、ｎは１〜４の整数である。）
（但し、Ｒはメチル基又はエチル基を示す。）
上記の第３級アミンボランは、水及びニツケ
ル、コバルト、鉄イオン等によつて分解され難い
ため、全硫酸浴、全塩化物浴、ワツト浴、スルフ
アミン酸浴等の錯化剤を含まない単純塩浴に対し
て好適に使用し得る。これに対し、第１級アミン
ボランや第２級アミンボランは水、ニツケル、コ
バルト、鉄イオン等によつて若干分解されること
があるので、めつき浴のPHを上げたり、これらの
イオンを封鎖する錯化剤を添加することが好まし
い。
なお、上述したアミンボラン化合物の添加量は
４ｇ／以下、好ましくは0.1〜２ｇ／、特に
0.5〜１ｇ／である。
また、上記アミンボラン化合物を使用する場
合、特に第１級及び第２級アミンを使用する場
合、めつき液によるこれらアミンボラン化合物の
分解及びアノード表面におけるアミンボラン化合
物の分解を抑制する添加剤、例示すると、２，
2′−チオジエタノール、３，3′−チオジプロピオ
ニトリル、２−メルカプトベンゾチアゾール、２
−メルカプト−１−メチルイミダゾール、３，
3′−イミノジプロピオニトリル、４−アミノベン
ゾニトリル、カドミウム塩、水銀塩、鉛塩、タリ
ウム塩、１，１，３，３−テトラメチルチオ尿
素、チオ尿素、ヨウ素酸塩、臭素酸塩等の１種又
は２種以上を通常0.1ｇ／以下の濃度で添加す
ることができる。
更に、上記アミンボラン化合物に加えて、
NaBH4、KBH4、ジボラン、テトラボラン、デ
カボラン化合物等を添加することができる。
本発明において、電気ニツケル又はニツケル合
金めつき浴には必要に応じて通常これらめつき浴
に使用する一次光沢剤又は応力減少剤や二次光沢
剤又はレベラーを加えても差支えない。
この場合、一次光沢剤又は応力減少剤として
は、サツカリンナトリウム、ベンゼンスルホン酸
ナトリウム、２，７−ナフタリンジスルホン酸ナ
トリウム、１，３，６−ナフタリントリスルホン
酸ナトリウム、ベンゼンスルホンアミド、３，３
−チオジプロピオニトリル、チオ硫酸ナトリウ
ム、亜硫酸ナトリウム、アゾジスルホン酸ナトリ
ウム、クマリン、安息香酸、フタル酸、樟脳酸、
酢酸等が例示され、これらの１種又は２種以上を
通常0.01〜10ｇ／、特に0.01〜0.3ｇ／の範囲
で添加することができるが、有機又は無機硫黄化
合物を多量に添加するとめつき被膜中の硫黄量が
多くなり、めつき被膜のハンダ付け性を低下させ
たり、加熱による変色を生じさせたり、更には耐
食性を低下させ、硫黄脆性を生じさせる場合があ
るので、硫黄化合物は添加しないか、添加しても
少量とすることが好ましい。
また、二次光沢剤又はベラーとしては、２−ブ
チン−１，４−ジオール、プロパギルアルコー
ル、２−ブチン−１，４−ジオールにエチレンオ
キシドやプロピレンオキシドを付加した化合物、
プロパギルアルコールにエチレンオキシドやプロ
ピレンオキシドを付加した化合物、アリールスル
ホン酸ナトリウム、プロパルギルスルホン酸ナト
リウム、３，３−チオジプロピオニトリル、ホル
マリン、更には１−ジメチルアミノ−２−プロピ
ン、１−ジエチルアミノ−２−プロピン、１−ジ
エチルアミノ−４−ヒドロキシ−２−プロピン、
１−ジエチルアミノ−４−ヒドロキシ−２−プロ
ピンなどといつたアミノアセチレン化合物やアミ
ノアセチレンアルコール等が例示され、これらの
１種又は２種以上が使用し得るが、これらの中で
は特にハンダ付け性の点でアミノアセチレン化合
物、アミノアセチレンアルコールが好適に用いら
れる。その添加量は、多量に添加するとめつき応
力が増大するので少なめとすることが望ましく、
0.01〜0.5ｇ／、特に0.01〜0.3ｇ／程度が適
当である。
本発明に係るめつき方法は、上記の第４級アン
モニウム塩及びアミンボラン化合物を加えた電気
ニツケル又はニツケル合金めつき浴に被めつき物
を浸漬し、これを陰極として陽極との間に所用の
電圧を印加し、電気めつきを行なうものである
が、この場合被めつき物としては、スチール、
鉄、銅、ニツケル、コバルト、亜鉛、これらの合
金等の金属素材、プラスチツクやセラミツク等の
非金属素材に導電化処理を施したものなどが使用
し得、またこれらに直接本発明のめつき処理を施
すこともできるが、銅、無光沢ニツケル、半光沢
ニツケル、光沢ニツケルなどの下地めつき被膜を
単層又は複層形成した上に本発明めつき処理を施
すこともできる。なお、陽極としては、炭素棒、
白金板等の不溶性陽極を用いてもよいが、ニツケ
ル板、ニツケルボール等のニツケル陽極が好まし
く、例えば電気ニツケル、デポラライズドニツケ
ル、カーボナイズドニツケル等を用いることがで
きる。
具体的には、被めつき物として、リードフレー
ム、フープ、半導体部品、コンデンサー、抵抗
体、コイル、リレー、スイツチ、コネクター、電
気接点部品、プリント配線基板等を挙げることが
でき、これら被めつき物の種類に応じた前処理を
施した後、本発明めつき法を適用することができ
る。
ここで、本発明めつき法によりめつき被膜を形
成する場合、そのめつき被膜の膜厚は必ずしも制
限されず、被めつき物の種類等により適宜選定さ
れるが、一般に１〜20μm、特に２〜5μmとする
ことが好ましい。
発明の効果
以上述べたように、本発明によれば、ハンダ付
け性に優れた電気ニツケル又はニツケル合金めつ
き被膜を得ることができ、種々の電気、電子部品
等に対し、ハンダ付け性を付与するためのめつき
法として有効に採用することができる。
以下、実施例と比較例を示し、本発明を具体的
に説明するが、本発明は下記の実施例に制限され
るものではない。
実施例 １
バフ研磨した銅板を50×５×0.5mmに切断し、
これを脱脂、水洗、酸洗、水洗した後、下記組成
のめつき浴を用い、下記のめつき条件で電気ニツ
ケルめつきを行なつた。
めつき浴組成
NiSO4・6H2O 280ｇ／
NiCl2・6H2O 20 〃
H3BO3 40 〃
第４級アンモニウム塩＊ 0.3 〃
ジメチルアミンボラン 0.5 〃
PH 5.2
＊エピクロルヒドリンでピリジン核の窒素原子を
４級化したニコチン酸アミドを使用
めつき条件
陰極電流密度 3A／ｄm2
めつき温度 45℃
撹 拌 空 気
陽 極 ニツケル
めつき膜厚 3μm
実施例 ２
下記組成のめつき浴を用い、実施例１と同様に
してめつきを行なつた。
めつき浴組成
NiSO4・6H2O 280ｇ／
NiCl2・6H2O 20 〃
H3BO3 40 〃
Ｎ−ベンジルニコチン酸無水物 0.3 〃
トリメチルアミンボラン 0.5 〃
１−ジエチルアミノ−２−プロパン 0.1 〃
PH 5.2
実施例 ３
実施例１の第４級アンモニウム塩の代わりにＮ
−フエニルニコチン酸アミド臭化物を使用した以
外は実施例１と同様にしてめつきを行なつた。
実施例 ４
実施例１の第４級アンモニウム塩の代わりにＮ
−メチルニコチン酸塩化物を使用した以外は実施
例１と同様にしてめつきを行なつた。
比較例 １
下記組成のめつき浴を用い、下記の条件で電気
ニツケルめつきを行なつた。
めつき浴組成
NiSO4・6H2O 280ｇ／
NiCl2・6H2O 20 〃
H3BO3 40 〃
PH 5.2
めつき条件
陰極電流密度 3A／ｄm2
めつき温度 45℃
撹 拌 空 気
陽 極 ニツケル
めつき膜厚 3μm
比較例 ２
比較例１のめつき液にサツカリンナトリウム２
ｇ／と２−ブチン−１，４−ジオール0.2ｇを
添加しためつき浴を用い、比較例１と同様にして
めつきを行なつた。
比較例 ３
下記組成の無電解ニツケル−ホウ素合金めつき
浴を使用し、上記銅板上に3μmの無電解ニツケル
−ホウ素合金めつき被膜を形成した。
めつき浴組成
NiCl2・6H2O 25ｇ／
CH3COONa 15 〃
ジメチルアミンボラン ４ 〃
PH ６
めつき温度 55℃
次に、上記めつき浴から得られためつき被膜の
ハンダ付け性を下記方法によつて評価した。
ハンダ付け性試験法
めつき終了後、水洗し、次いでメタノールに浸
漬して素早く乾燥しためつき試片を用い、下記No.
１〜３のハンダ付け性試験用サンプルを作成し
た。
No.１：室内に７日間自然放置したもの。
No.２：ASTM Ｂ−545規格に準じ、100℃で１時
間の沸騰蒸気処理を行なつたもの。
No.３：電気炉によつて400℃±５℃で５分間加熱
処理を行なつたもの。
次に、上記サンプルにつき、RHESCA
CO.LTD製SAT−2000型のSOLDER
CHECKERを用い、メニスコグラフ法によつて
ハンダ付け性試験を下記の試験条件で行なつた。
即ち、ハンダ温度230℃のハンダへの浸漬時間は
10秒、浸漬深さは２mm、浸漬温度は1.6mm／秒の
試験条件で、上記サンプルに活性ロジンフラツク
スを塗布した後、浸漬開始から表面張力による浮
力が０になるまでの時間T2秒及びハンダ表面張
力による浮力のピーク値WBgrを測定することに
よつてハンダ付け性（ぬれ性）を下記基準により
評価した。ここで、T2，WBの値が小さい程ハン
ダ付け性は良好である。
ハンダ付け性評価基準
T2及びWBを上記サンプルにつきＡ〜Ｅの５段
階で評価した。
サンプルNo.１
評価段階 T2 WB
Ａ 0.66〜0.70秒 0.56〜0.58gr
Ｂ 0.71〜0.75 0.59〜0.61
Ｃ 0.76〜0.80 0.62〜0.64
Ｄ 0.81〜0.85 0.65〜0.67
Ｅ 0.86〜0.90 0.68〜0.70
サンプルNo.２
評価段階 T2 WB
Ａ 0.75〜0.82秒 0.65〜0.68gr
Ｂ 0.83〜0.90 0.69〜0.72
Ｃ 0.91〜0.98 0.73〜0.76
Ｄ 0.99〜1.06 0.77〜0.81
Ｅ 1.07〜1.14 0.82〜0.85
サンプルNo.３
評価段階 T2 WB
Ａ 0.68〜0.82秒 0.54〜0.59gr
Ｂ 0.83〜0.97 0.60〜0.65
Ｃ 0.98〜1.12 0.66〜0.71
Ｄ 1.13〜1.27 0.72〜0.77
Ｅ 1.28以上 0.78〜0.83
ハンダ付け性評価結果
上記めつき浴から得られためつき被膜のハンダ
付け性結果を第１表に示す。[Formula] The above-mentioned quaternary ammonium salts may be used alone or in combination of two or more. The amount added is not necessarily limited, but 0.01
The amount is preferably 10 g/, particularly 0.1 to 1 g/. Further, in the present invention, an amine borane compound is added in addition to the above-mentioned quaternary ammonium salt. Here, examples of the amine borane compound include trimethylamine borane, morpholine borane,
N-methylmorpholineborane, morpholinediethylborane, tertiarybutylamineborane, dimethylamineborane, diethylamineborane, pyridineborane, picolineborane, dimethylpropylamineborane, anilineborane, dimethylaminedimethylborane, triethylamineborane, dimethyldodecylamineborane , pyridine borane, piperazine borane, 2-methoxyethyldimethylamine borane, diisopropylamine borane, etc., and these can be used alone or in combination of two or more, but among these, the following (D), Borane adducts of tertiary amines represented by formulas (E) and (F) are preferably used. (However, R 1 , R 2 and R 3 each represent a methyl group or an ethyl group, and R 1 , R 2 and R 3 may be the same or different.) CH 3 (OCH 2 CH 2 ) o N(CH 3 ) 2 BH 3 ...(E) (However, n is an integer from 1 to 4.) (However, R represents a methyl group or an ethyl group.) The above-mentioned tertiary amine borane is difficult to decompose with water and nickel, cobalt, iron ions, etc.; It can be suitably used for simple salt baths that do not contain complexing agents, such as sulfamic acid baths. On the other hand, primary amine borane and secondary amine borane may be slightly decomposed by water, nickel, cobalt, iron ions, etc., so raise the pH of the plating bath or sequester these ions. Preferably, a complexing agent is added. The amount of the above-mentioned amine borane compound added is 4 g/or less, preferably 0.1 to 2 g/, especially
It is 0.5-1 g/. In addition, when using the above amine borane compounds, especially when using primary and secondary amines, additives that suppress the decomposition of these amine borane compounds by the plating solution and the decomposition of the amine borane compounds on the anode surface, for example, 2,
2'-thiodiethanol, 3,3'-thiodipropionitrile, 2-mercaptobenzothiazole, 2
-mercapto-1-methylimidazole, 3,
3'-iminodipropionitrile, 4-aminobenzonitrile, cadmium salt, mercury salt, lead salt, thallium salt, 1,1,3,3-tetramethylthiourea, thiourea, iodate, bromate, etc. One or more kinds can be added at a concentration of usually 0.1 g/or less. Furthermore, in addition to the above-mentioned amine borane compounds, NaBH 4 , KBH 4 , diborane, tetraborane, decaborane compounds, etc. can be added. In the present invention, the electric nickel or nickel alloy plating bath may contain, if necessary, a primary brightener or stress reducer, a secondary brightener or a leveler that is normally used in these plating baths. In this case, the primary brighteners or stress reducers include saccharin sodium, sodium benzenesulfonate, sodium 2,7-naphthalene disulfonate, sodium 1,3,6-naphthalene trisulfonate, benzenesulfonamide, 3,3
-thiodipropionitrile, sodium thiosulfate, sodium sulfite, sodium azodisulfonate, coumarin, benzoic acid, phthalic acid, camphoric acid,
Acetic acid is exemplified, and one or more of these can be added usually in the range of 0.01 to 10 g/, especially 0.01 to 0.3 g/; however, if a large amount of organic or inorganic sulfur compounds is added, the plating film may be damaged. Do not add sulfur compounds because the amount of sulfur in the product may increase, reducing the solderability of the plating film, causing discoloration due to heating, and further reducing corrosion resistance and causing sulfur embrittlement. However, even if it is added, it is preferable to keep it in a small amount. In addition, as secondary brighteners or levelers, 2-butyne-1,4-diol, propargyl alcohol, compounds obtained by adding ethylene oxide or propylene oxide to 2-butyne-1,4-diol,
Compounds obtained by adding ethylene oxide or propylene oxide to propargyl alcohol, sodium arylsulfonate, sodium propargyl sulfonate, 3,3-thiodipropionitrile, formalin, and also 1-dimethylamino-2-propyne, 1-diethylamino-2 -propyne, 1-diethylamino-4-hydroxy-2-propyne,
Examples include aminoacetylene compounds such as 1-diethylamino-4-hydroxy-2-propyne, aminoacetylene alcohol, etc., and one or more of these can be used, but among these, particularly those with good solderability In this respect, aminoacetylene compounds and aminoacetylene alcohols are preferably used. It is desirable to add a small amount, as adding too much will increase the plating stress.
A suitable amount is about 0.01 to 0.5 g/, especially about 0.01 to 0.3 g/. In the plating method according to the present invention, the object to be plated is immersed in an electric nickel or nickel alloy plating bath containing the above-mentioned quaternary ammonium salt and amine borane compound, and this is used as a cathode, and a desired distance is set between the anode and the anode. Electroplating is performed by applying a voltage, and in this case, the material to be plated is steel,
Metal materials such as iron, copper, nickel, cobalt, zinc, and alloys thereof, and non-metal materials such as plastic and ceramics that have been subjected to conductive treatment can be used, and the plating treatment of the present invention can be applied directly to these materials. However, it is also possible to perform the plating treatment of the present invention on a single layer or multilayer base plating film of copper, matte nickel, semi-bright nickel, bright nickel, etc. In addition, as an anode, a carbon rod,
Although an insoluble anode such as a platinum plate may be used, a nickel anode such as a nickel plate or a nickel ball is preferable, and for example, electric nickel, depolarized nickel, carbonized nickel, etc. can be used. Specifically, lead frames, hoops, semiconductor parts, capacitors, resistors, coils, relays, switches, connectors, electrical contact parts, printed wiring boards, etc. can be mentioned as the objects to be covered with. The plating method of the present invention can be applied after pretreatment depending on the type of object. Here, when a plating film is formed by the plating method of the present invention, the film thickness of the plating film is not necessarily limited, and is appropriately selected depending on the type of the object to be plated, etc., but is generally 1 to 20 μm, particularly It is preferable to set it as 2-5 micrometers. Effects of the Invention As described above, according to the present invention, it is possible to obtain an electric nickel or nickel alloy plating film with excellent solderability, and to impart solderability to various electrical and electronic components. It can be effectively employed as a plating method for EXAMPLES Hereinafter, the present invention will be specifically explained by showing examples and comparative examples, but the present invention is not limited to the following examples. Example 1 A buffed copper plate was cut into 50 x 5 x 0.5 mm,
After degreasing, washing with water, pickling, and washing with water, electric nickel plating was performed under the following plating conditions using a plating bath having the following composition. Plating bath composition NiSO 4・6H 2 O 280g/ NiCl 2・6H 2 O 20 〃 H 3 BO 3 40 〃 Quaternary ammonium salt * 0.3 〃 Dimethylamine borane 0.5 〃 PH 5.2 *Remove the nitrogen atom of the pyridine nucleus with epichlorohydrin Plating conditions using quaternized nicotinic acid amide Cathode current density 3A/dm 2 Plating temperature 45℃ Stirring Air Anode Nickel plating film thickness 3μm Example 2 Using a plating bath with the following composition, Example 2 Plating was carried out in the same manner as in 1. Plating bath composition NiSO 4・6H 2 O 280g/ NiCl 2・6H 2 O 20 〃 H 3 BO 3 40 〃 N-Benzylnicotinic anhydride 0.3 〃 Trimethylamine borane 0.5 〃 1-Diethylamino-2-propane 0.1 〃 PH 5.2 Example 3 N instead of the quaternary ammonium salt in Example 1
- Plating was carried out in the same manner as in Example 1 except that phenylnicotinamide bromide was used. Example 4 N in place of the quaternary ammonium salt in Example 1
- Plating was carried out in the same manner as in Example 1 except that methylnicotinate acid chloride was used. Comparative Example 1 Electric nickel plating was carried out under the following conditions using a plating bath having the following composition. Plating bath composition NiSO 4・6H 2 O 280g/ NiCl 2・6H 2 O 20 〃 H 3 BO 3 40 〃 PH 5.2 Plating conditions Cathode current density 3A/ dm 2Plating temperature 45℃ Stirring Air Positive Electrode Nickel Plating film thickness 3 μm Comparative example 2 Added saccharin sodium 2 to the plating solution of Comparative example 1
Plating was carried out in the same manner as in Comparative Example 1 using a plating bath to which 0.2 g of 2-butyne-1,4-diol was added. Comparative Example 3 An electroless nickel-boron alloy plating film having a thickness of 3 μm was formed on the copper plate using an electroless nickel-boron alloy plating bath having the following composition. Plating bath composition NiCl 2.6H 2 O 25g/ CH 3 COONa 15 〃 Dimethylamine borane 4 〃 PH 6 Plating temperature 55℃ Next, the solderability of the plating film obtained from the above plating bath was evaluated using the following method. I evaluated it accordingly. Solderability test method After plating, use a soldering test piece that was washed with water, then dipped in methanol and quickly dried, and then solderized using the following No.
Samples 1 to 3 for solderability testing were prepared. No. 1: Items left indoors naturally for 7 days. No. 2: Subjected to boiling steam treatment at 100°C for 1 hour in accordance with ASTM B-545 standard. No. 3: Heat treated in an electric furnace at 400°C ± 5°C for 5 minutes. Next, for the above sample, SAT-2000 model SOLDER made by RHESCA CO.LTD.
A solderability test was conducted using CHECKER by the meniscograph method under the following test conditions.
In other words, the immersion time in solder with a solder temperature of 230℃ is
After applying the activated rosin flux to the above sample under the test conditions of 10 seconds, immersion depth of 2 mm, and immersion temperature of 1.6 mm/second, the time from the start of immersion until the buoyancy due to surface tension becomes 0 is T 2 seconds. The solderability (wettability) was evaluated according to the following criteria by measuring the peak value W B gr of buoyancy due to solder surface tension. Here, the smaller the values of T 2 and W B , the better the solderability. Solderability evaluation criteria T 2 and W B were evaluated for the above samples in five grades from A to E. Sample No. 1 Evaluation stage T 2 W B A 0.66~0.70 seconds 0.56~0.58gr B 0.71~0.75 0.59~0.61 C 0.76~0.80 0.62~0.64 D 0.81~0.85 0.65~0.67 E 0.86~0.90 0.68~0. 70 Sample No. 2 Evaluation stage T 2 W B A 0.75-0.82 seconds 0.65-0.68gr B 0.83-0.90 0.69-0.72 C 0.91-0.98 0.73-0.76 D 0.99-1.06 0.77-0.81 E 1.07-1.14 0.82-0.85 Sample No. 3 Evaluation stage T 2 W B A 0.68~0.82 seconds 0.54~0.59gr B 0.83~0.97 0.60~0.65 C 0.98~1.12 0.66~0.71 D 1.13~1.27 0.72~0.77 E 1.28 or more 0.78~0.83 Solderability evaluation results Above plating from the bath Table 1 shows the results of the solderability of the obtained tamping film.
Claims (1)
物を含有する電気ニツケルめつき浴又は電気ニツ
ケル合金めつき浴中に被めつき物を浸漬し、電気
めつきすることを特徴とする電気めつき方法。1. An electroplating method characterized by immersing the object to be plated in an electric nickel plating bath or an electric nickel alloy plating bath containing a quaternary ammonium salt and an amine borane compound, and electroplating the object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP550288A JPS63171892A (en) | 1988-01-13 | 1988-01-13 | Electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP550288A JPS63171892A (en) | 1988-01-13 | 1988-01-13 | Electroplating method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21233484A Division JPS6191384A (en) | 1984-10-09 | 1984-10-09 | Electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63171892A JPS63171892A (en) | 1988-07-15 |
| JPH0319310B2 true JPH0319310B2 (en) | 1991-03-14 |
Family
ID=11612989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP550288A Granted JPS63171892A (en) | 1988-01-13 | 1988-01-13 | Electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63171892A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5104313B2 (en) * | 2005-10-28 | 2012-12-19 | 株式会社村田製作所 | Multilayer electronic component and manufacturing method thereof |
| JP2014227570A (en) * | 2013-05-22 | 2014-12-08 | 日東電工株式会社 | Electroless plating method, multilayer base material manufacturing method, multilayer base material, and input device |
| JP2020524746A (en) * | 2017-06-23 | 2020-08-20 | アトテック ドイチェランド ゲーエムベーハー | Nickel electroplating bath for depositing a decorative nickel coating on a substrate |
| US10718059B2 (en) * | 2017-07-10 | 2020-07-21 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with cationic polymers and methods of electroplating nickel |
| JP7197933B2 (en) * | 2021-05-27 | 2022-12-28 | 石原ケミカル株式会社 | Structure including underbarrier metal and solder layer |
-
1988
- 1988-01-13 JP JP550288A patent/JPS63171892A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63171892A (en) | 1988-07-15 |
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| LAPS | Cancellation because of no payment of annual fees |