JPH0318470A - Soldering device - Google Patents

Abstract

PURPOSE:To eliminate the differences in height of the gushing solder on guide plates and to extend the part where soldering is executed so that the sure soldering is executed by forming the flow resistance parts projecting upward atop the guide plates. CONSTITUTION:The jet solder ejecting from an ejection port 7 is guided by the guide plates 10, 11 and is forced to spread laterally but is affected by the respective flow resistance parts 12, 13, by which the height from the guide plates is increased as a whole and the differences in the height in the ejection port 2 and on the right and left thereof are eventually decreased. As a result, the soldering body can execute soldering in the long part on the guide plates 10, 11. The soldering time is prolonged and the sure soldering is executed.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はいわゆるフロー半田付装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a so-called flow soldering device.

従来の技術 従来この種の半田付装置は第４図に示すようになってい
た。すなわち、半田噴流発生部１の上方には噴出口２を
開口して設けて唄シ、噴出口の左右に水平方向に案内板
３を設けている。そして噴出口から噴出させ案内板３上
を流れる噴流半田部に半田付製品４を移動させ、半田付
をするようになっている。2. Description of the Related Art Conventionally, this type of soldering apparatus has been designed as shown in FIG. That is, a spout 2 is opened and provided above the solder jet generating section 1, and guide plates 3 are provided horizontally on the left and right sides of the spout. Then, the soldering product 4 is moved to the jet solder part that is ejected from the spout and flows over the guide plate 3, and soldering is performed.

発明が解決しようとする課題 上記の構成とした場合、案内板３上に形成される半田流
はどうしても、噴出口２部が高く左右にゆくに従って低
くなってし渣う。従ってここに半田付製品４を搬送して
きた場合、噴出口２の最も高い部分で半田付が行われる
ようにするように搬送してくるしかないので、充分な半
田付時間がとれず、半田付が確実になされないものも生
じてし１うという問題があった。そこで本発明は、この
半田付が確実になされることを目的とするものである。Problems to be Solved by the Invention With the above configuration, the solder flow formed on the guide plate 3 inevitably becomes higher at the 2 parts of the spout and becomes lower as it goes left and right. Therefore, when the soldering product 4 is transported here, it has no choice but to be transported so that the soldering is performed at the highest part of the spout 2, so there is not enough soldering time, and the soldering is not completed. There was a problem in that there were things that could not be done reliably. Therefore, an object of the present invention is to ensure that this soldering can be performed reliably.

課題を解決するための手段 そしてこの目的を達成するために、本発明は案白板の上
面の上方に突出した流れ抵抗部を形或したものである。SUMMARY OF THE INVENTION In order to achieve this object and to achieve this object, the present invention forms a flow resistor projecting above the top surface of the billboard.

作用 この構成とすれば、流れ抵抗部に釦いて案内板上の、噴
流半田は、噴出口部とそれから離れる部分において、高
低差が減少され、高さレベルが圧縮されるので、半田付
をすることができる距離が長くなる。従って半田付時間
が長くなるので半田付が確実になされるようになるもの
である。Effect With this configuration, the height difference of the jet solder on the guide plate when the button is pressed to the flow resistance part is reduced between the jet nozzle part and the part away from it, and the height level is compressed, so that soldering is easy. The distance you can travel becomes longer. Therefore, since the soldering time becomes longer, the soldering can be performed more reliably.

実施例 第１図に釦いて、６は半田流発生部で、ダクト６を介し
て溶融半田が定量供給されてきている。Embodiment As shown in FIG. 1, numeral 6 denotes a solder flow generating section, into which molten solder is supplied in a fixed amount through a duct 6.

この半田流発生部６上方には噴出口７に従って壁面間が
せ壕くなる対向壁８と９が設けられている。Opposing walls 8 and 9 are provided above the solder flow generating portion 6 in accordance with the spout 7 and forming a trench between the walls.

１た噴出口７の左右にはほぼ水平で、弱冠末下さがりと
なったステンレス製（表面テフロンコーティング）の案
内板１０．１１が設けられている。On the left and right sides of the nozzle 7, guide plates 10 and 11 made of stainless steel (surface coated with Teflon) are provided which are approximately horizontal and whose crowns are slightly downward.

そしてこれらの案内板１０．１１の上面には第２図のご
とく長方形となった噴出口７に対してほぼ平行となるよ
うに（これは噴出口７から噴出して案内板１０．１１上
を流れる噴流半田に対してほぼ直角方向）複数個の流れ
抵抗部１２．１３が千鳥状に配置されている。これらの
流れ抵抗部１２．１３はステンレスで形或されるもので
あり、断面形状は半円状になっている。もちろんこれら
の流れ抵抗部１２．１３は案内板１０．１１から一体に
突出させて形或することもできる。さて以上の構戒とす
れば、噴出口了かも噴出した噴流半田は、案内板１０．
１１に案内されて左右に広がろうとするが、各流れ抵抗
部１２．１３の影響を受けて全体として、案内板からの
高さが高くなって、結果として噴出口２とその左右に釦
ける高低差が少なくなる。この結果、半田付体は案内板
１０．１１の上に釦いて長い部分で半田付をすることが
できるようになり、半田付時間が長くなり、確実な半田
付がなされるようになる。第３図は本発明の他の実施例
を示し、この実施例では流れ抵抗部１４，１６を噴出口
７から案内板１０．１１上を流れる噴出半田に対して傾
斜して配置したものである。The upper surface of these guide plates 10.11 is arranged so as to be almost parallel to the rectangular jet nozzle 7 as shown in FIG. A plurality of flow resistance parts 12, 13 are arranged in a staggered manner (substantially perpendicular to the flowing jet solder). These flow resistance parts 12, 13 are made of stainless steel and have a semicircular cross-sectional shape. Of course, these flow resistance parts 12.13 can also be designed to project integrally from the guide plate 10.11. Now, if we take the above precautions, the jet of solder that spouted out from the spout will be at the guide plate 10.
11, it tries to spread to the left and right, but due to the influence of each flow resistance part 12 and 13, the height from the guide plate increases as a whole, and as a result, the jet nozzle 2 and its left and right buttons increase. The height difference will be reduced. As a result, the soldering body can be buttoned onto the guide plate 10.11 and soldered at a long portion, increasing the soldering time and ensuring reliable soldering. FIG. 3 shows another embodiment of the present invention, in which the flow resistance parts 14, 16 are arranged at an angle with respect to the jetted solder flowing from the spout 7 onto the guide plate 10.11. .

発明の効果 以上のように、本発明によれば案内板上にｋける噴出半
田の高低差が少なくなり、実際半田付を行う部分が長く
なり、従って半田付時間も長くなシ、確実な半田付がな
されるようになるのである。Effects of the Invention As described above, according to the present invention, the difference in height of the spouted solder on the guide plate is reduced, the part to be actually soldered becomes longer, the soldering time is longer, and the soldering is more reliable. As a result, they will be labeled as such.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の断面図、第２図はその上面
図、第３図は本発明の他の実施例の上面図、第４図は従
来例の断面図である。 ６・・・・・・半田流発生部、６・・・・・・ダクト、
７・・・・・・噴出口、８．９・・・・・・対向壁、１
０．１１・・・・・・案内板、１２，１３，１４，１５
・・・・・・流れ抵抗部。FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is a top view thereof, FIG. 3 is a top view of another embodiment of the invention, and FIG. 4 is a sectional view of a conventional example. 6...Solder flow generation part, 6...Duct,
7... Ejection port, 8.9... Opposing wall, 1
0.11... Information board, 12, 13, 14, 15
...Flow resistance section.

Claims (3)

【特許請求の範囲】[Claims] （１）半田噴流発生部と、この半田噴流発生部の上方に
おいて開口した噴出口と、この噴出口の左右の少なくと
も一方に略水平方向に設けた案内板とを備え、前記案内
板の上面には上方に突出した流れ抵抗部を形成した半田
付装置。(1) A solder jet generating section, a jet opening opening above the solder jet generating section, and a guide plate provided in a substantially horizontal direction on at least one of the left and right sides of the jet nozzle, the guide plate being provided on the upper surface of the guide plate. is a soldering device with a flow resistance part that protrudes upward. （２）流れ抵抗部は噴出口から案内板を流れる半田流に
対して、ほぼ直角方向に複数個設けた特許請求の範囲第
１に記載の半田付装置。(2) The soldering device according to claim 1, wherein a plurality of flow resistance portions are provided in a direction substantially perpendicular to the solder flow flowing from the spout to the guide plate. （３）流れ抵抗部は案内板を流れる半田流に対して傾斜
状に複数個数設けた特許請求の範囲第１項に記載の半田
付装置。(3) The soldering device according to claim 1, wherein a plurality of flow resistance portions are provided in an inclined manner with respect to the solder flow flowing through the guide plate.