JPH0317656U - - Google Patents
Info
- Publication number
- JPH0317656U JPH0317656U JP1989078044U JP7804489U JPH0317656U JP H0317656 U JPH0317656 U JP H0317656U JP 1989078044 U JP1989078044 U JP 1989078044U JP 7804489 U JP7804489 U JP 7804489U JP H0317656 U JPH0317656 U JP H0317656U
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- chip array
- conductive pattern
- transparent
- electrode film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図ａは本考案のＬＥＤチツプアレイの一実
施例の側断面図、第１図ｂは同平面図、第２図ａ
は本考案の他の実施例の側断面図、第２図ｂは同
平面図、第３図ａは本考案の他の実施例の側断面
図、第３図ｂは同平面図、第４図ａは本考案の他
の実施例の側断面図、第４図ｂは同平面図、第５
図ａは従来のＬＥＤチツプアレイの側断面図、第
５図ｂは同平面図である。
１…ＬＥＤチツプアレイベース基板、２…導電
性パターン、４ａ〜４ｆ…ＬＥＤチツプ、９…透
明絶縁封止樹脂、１２…透明電極フイルム。
Figure 1a is a side sectional view of an embodiment of the LED chip array of the present invention, Figure 1b is a plan view of the same, Figure 2a is
is a side sectional view of another embodiment of the present invention, FIG. 2b is a plan view of the same, FIG. 3a is a side sectional view of another embodiment of the present invention, FIG. Figure a is a side sectional view of another embodiment of the present invention, Figure 4b is a plan view of the same, Figure 5
FIG. 5A is a side sectional view of a conventional LED chip array, and FIG. 5B is a plan view thereof. DESCRIPTION OF SYMBOLS 1... LED chip array base substrate, 2... Conductive pattern, 4a-4f... LED chip, 9... Transparent insulating sealing resin, 12... Transparent electrode film.
Claims (1)
グするための導電性パターンがその絶縁基板上に
形成されているＬＥＤチツプアレイベース基板と
、上記導電性パターン上にダイボンデイングされ
たＬＥＤチツプと、上記ＬＥＤチツプの周囲に上
記ＬＥＤチツプと略同じ高さの厚みを有して、上
記ＬＥＤチツプアレイベース基板上に形成された
透明絶縁封止樹脂と、上記ＬＥＤチツプ及び上記
透明絶縁封止樹脂上に、上記透明絶縁封止樹脂と
で、上記ＬＥＤチツプを封止するように形成され
ＬＥＤチツプを点燈させる為の電圧を供給する為
の導電パターン部を有する透明電極フイルムから
成ることを特徴とするＬＥＤチツプアレイ。 (2) 透明電極フイルム上の導電パターン部と、
ＬＥＤチツプアレイベース基板上に形成されたＬ
ＥＤチツプアレイ点燈用導電パターン間を導電性
スペーサーによつて接続してなる請求項１記載の
ＬＥＤチツプアレイ。 (3) 透明電極フイルム上の導電パターンの一部
と、絶縁基板上形成されたＬＥＤチツプアレイ点
燈用導電パターン間を直接接続した請求項１記載
のＬＥＤチツプアレイ。 (4) 透明導電性ペーストを透明電極フイルムに
かえて使用する請求項１、または２または３記載
のＬＥＤチツプアレイ。[Claims for Utility Model Registration] (1) An LED chip array base substrate having at least a conductive pattern formed on the insulating substrate for die-bonding the LED chips, and an LED chip array base substrate having a conductive pattern formed on the insulating substrate; an LED chip, a transparent insulating sealing resin formed around the LED chip on the LED chip array base substrate and having a thickness substantially the same as that of the LED chip; and the LED chip and the transparent insulating resin. A transparent electrode film is formed on the sealing resin to seal the LED chip with the transparent insulating sealing resin, and has a conductive pattern portion for supplying a voltage for lighting the LED chip. An LED chip array characterized by: (2) a conductive pattern portion on the transparent electrode film;
L formed on the LED chip array base substrate
2. The LED chip array according to claim 1, wherein conductive patterns for lighting the ED chip array are connected by conductive spacers. (3) The LED chip array according to claim 1, wherein a part of the conductive pattern on the transparent electrode film and a conductive pattern for lighting the LED chip array formed on the insulating substrate are directly connected. (4) The LED chip array according to claim 1, 2 or 3, wherein a transparent conductive paste is used in place of the transparent electrode film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078044U JPH0317656U (en) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078044U JPH0317656U (en) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317656U true JPH0317656U (en) | 1991-02-21 |
Family
ID=31620975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989078044U Pending JPH0317656U (en) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317656U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078171A (en) * | 2001-09-03 | 2003-03-14 | Sony Corp | Wiring and its forming method, connection hole and its manufacturing method, wiring body and its forming method, display element and its manufacturing method, and image display device and its manufacturing method |
| WO2004077578A2 (en) * | 2003-02-28 | 2004-09-10 | Osram Opto Semiconductors Gmbh | Lighting module based on light-emitting diodes and method for the production thereof |
| JP2008515208A (en) * | 2004-09-30 | 2008-05-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic device with wireless contact |
| JP2015109331A (en) * | 2013-12-04 | 2015-06-11 | シャープ株式会社 | Nitride semiconductor light-emitting device |
| JP2016181502A (en) * | 2015-03-23 | 2016-10-13 | ヒュンダイ・モービス・カンパニー・リミテッド | Lighting device |
| KR101847447B1 (en) * | 2017-11-23 | 2018-04-10 | 류양석 | Buckle |
| JP2021068920A (en) * | 2021-02-02 | 2021-04-30 | 富士ゼロックス株式会社 | Light-emitting element array |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689780A (en) * | 1979-12-22 | 1981-07-21 | Fujitsu Ltd | Production of lighttemittinggdiode display panel |
| JPS5752073A (en) * | 1980-09-16 | 1982-03-27 | Tokyo Shibaura Electric Co | Method of producing display unit |
| JPS5850582A (en) * | 1981-09-22 | 1983-03-25 | 株式会社東芝 | Display using light emitting diode |
| JPS58140782A (en) * | 1982-02-16 | 1983-08-20 | 株式会社東芝 | Luminous display |
| JPS63164482A (en) * | 1986-12-26 | 1988-07-07 | Res Dev Corp Of Japan | Light emitting diode device |
-
1989
- 1989-06-30 JP JP1989078044U patent/JPH0317656U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689780A (en) * | 1979-12-22 | 1981-07-21 | Fujitsu Ltd | Production of lighttemittinggdiode display panel |
| JPS5752073A (en) * | 1980-09-16 | 1982-03-27 | Tokyo Shibaura Electric Co | Method of producing display unit |
| JPS5850582A (en) * | 1981-09-22 | 1983-03-25 | 株式会社東芝 | Display using light emitting diode |
| JPS58140782A (en) * | 1982-02-16 | 1983-08-20 | 株式会社東芝 | Luminous display |
| JPS63164482A (en) * | 1986-12-26 | 1988-07-07 | Res Dev Corp Of Japan | Light emitting diode device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078171A (en) * | 2001-09-03 | 2003-03-14 | Sony Corp | Wiring and its forming method, connection hole and its manufacturing method, wiring body and its forming method, display element and its manufacturing method, and image display device and its manufacturing method |
| WO2004077578A2 (en) * | 2003-02-28 | 2004-09-10 | Osram Opto Semiconductors Gmbh | Lighting module based on light-emitting diodes and method for the production thereof |
| WO2004077578A3 (en) * | 2003-02-28 | 2005-07-21 | Osram Opto Semiconductors Gmbh | Lighting module based on light-emitting diodes and method for the production thereof |
| US7560741B2 (en) | 2003-02-28 | 2009-07-14 | Osram Opto Semiconductors Gmbh | Lighting module and method for the production thereof |
| JP2008515208A (en) * | 2004-09-30 | 2008-05-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optoelectronic device with wireless contact |
| JP2015109331A (en) * | 2013-12-04 | 2015-06-11 | シャープ株式会社 | Nitride semiconductor light-emitting device |
| JP2016181502A (en) * | 2015-03-23 | 2016-10-13 | ヒュンダイ・モービス・カンパニー・リミテッド | Lighting device |
| KR101847447B1 (en) * | 2017-11-23 | 2018-04-10 | 류양석 | Buckle |
| JP2021068920A (en) * | 2021-02-02 | 2021-04-30 | 富士ゼロックス株式会社 | Light-emitting element array |