JPH03161912A - Inductance part - Google Patents

Inductance part

Info

Publication number
JPH03161912A
JPH03161912A JP30233789A JP30233789A JPH03161912A JP H03161912 A JPH03161912 A JP H03161912A JP 30233789 A JP30233789 A JP 30233789A JP 30233789 A JP30233789 A JP 30233789A JP H03161912 A JPH03161912 A JP H03161912A
Authority
JP
Japan
Prior art keywords
groove
resin
notch
flange
winding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30233789A
Other languages
Japanese (ja)
Inventor
Hidekazu Matsui
松井 英和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP30233789A priority Critical patent/JPH03161912A/en
Publication of JPH03161912A publication Critical patent/JPH03161912A/en
Pending legal-status Critical Current

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  • Coils Of Transformers For General Uses (AREA)

Abstract

PURPOSE:To restrain a resin from wetting out in the dipping process by a method wherein a groove for wiring a winding terminal end is cut in the end surface of a flange while a fixing electrode connecting to the winding terminal end is provided on a bottom surface of the flange. CONSTITUTION:A chip coil is composed of a core 1 comprising a barrel 2, an upper flange 3 and a lower flange 4 provided on both ends of the barrle 2 as well is a winding 5 wound around the barrel 2. One end part W1 of the wiring 5 is wired along the groove 6a cut in the end surface 4a of the lower flange 4 and another groove 6b cut in the bottom surface 4b so as to be electrically connected to a fixing electrode 10 formed in the groove 6b. Then, a notch 8 intersecting with the groove 6a is formed in the bottom 4b side of the groove 6a. In such a constitution, when dipped in a liquid resin, the notch 8 can restrain the resin from wetting out while enabling the resin to be stagnated in the notch 8 even if the resin is wetted out.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、例えばチップコイル、チップトランス等のイ
ングクタンス都品の構造に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure of inductance products such as chip coils and chip transformers.

史象q挟麹友速拉 従来、この種のインダクタンス部品として、第5図及ひ
第6図に示すチップコイルが知られている。第5図はチ
ップコイルの正面図、第6図はそ1ー の側面図を示す。チップコイルは、胴部32とこの胴部
32の両端に設げられた上鍔部33、下鍔部34とから
構成されるコア30と、胴部32に巻き目された巻線3
1とを備えている。巻線31の両終端部分31a,31
8はコア30の下鍔部34の端面34aに設+−Jられ
ている溝35a. 35a及び底面34bにRけられて
いる溝35b. 35bに沿って布線され、溝35b,
 35bに形成されている取付け電極36(第7図参照
)に電気的に接続されている。
Conventionally, chip coils shown in FIGS. 5 and 6 have been known as this type of inductance component. FIG. 5 shows a front view of the chip coil, and FIG. 6 shows a side view of part 1. The chip coil includes a core 30 composed of a body part 32, an upper collar part 33, and a lower collar part 34 provided at both ends of the body part 32, and a winding 3 wound on the body part 32.
1. Both end portions 31a, 31 of the winding 31
8 is a groove 35a. 35a and a groove 35b rounded on the bottom surface 34b. 35b, the grooves 35b,
It is electrically connected to a mounting electrode 36 (see FIG. 7) formed on 35b.

;ユのヂップコイルは下鍔部34の一部を残してその周
囲を外装樹脂で被覆される。被覆方法としては、通常は
、このブーツブコイルを液状の樹脂にディソピンクする
工法が採用される。この工法はマルチ処理に対応し易く
、樹脂使用量の無駄も少なく安価であるという利点を有
している。ところが、チップコイルを液状の樹脂にデイ
ッピングした際、樹脂が下鍔部34の端面34aの溝3
5aに沿って濡れ上がり易く、ひいては底面34bに設
げられている溝35bに沿って取付け電極36にまで達
し、グーツブコイルをプリント配線板等へ半田付けずる
のに悪=2 影響を生し,さυることかある。第7図によりさらに詳
しく説明4゛る。第7図は第6図の失印Bでノ云した部
分を拡大した図である。グイッピングの際は、チップコ
イルは上下逆にされ、″:1ア30の−ト鍔部34の底
面34bがデイッピング装1;,I1の保持部37に取
り付(』られる。この状態て゛チップ″:Jイルは液状
の拘脂かλつ−Cいる伺脂槓に拘脂の液而か−ト鍔部3
4の而34.aに接する位置までディッピングされる。
; Yu's dip coil is covered with an exterior resin around the lower flange 34, except for a portion thereof. As a coating method, a method is usually adopted in which the boot coil is diso-pinked with liquid resin. This method has the advantage of being easily applicable to multi-processing and being inexpensive with little wasted resin usage. However, when the chip coil is dipped in liquid resin, the resin is stuck to the groove 3 of the end surface 34a of the lower flange 34.
5a, and even reaches the mounting electrode 36 along the groove 35b provided on the bottom surface 34b, causing an adverse effect on soldering the Gootsub coil to a printed wiring board, etc. There are some things that happen. This will be explained in more detail with reference to FIG. FIG. 7 is an enlarged view of the part indicated by the missing mark B in FIG. When dipping, the tip coil is turned upside down, and the bottom surface 34b of the tip flange 34 of the dipping device 1; :J Il is a liquid type of fat, or is it a liquid type of liquid?
4 no 34. It is dipped to the position where it touches a.

このとき、界面張力によって、ド鍔ril( 34の端
面34aに説0られた溝35aに沿っC液状樹脂が非常
に五1.;れ1・かり易い状態となり、31支i;P、
のときは、111I+35bに形成された取イ4け電極
36にも達してしまう。
At this time, due to the interfacial tension, the C liquid resin becomes very easy to spread along the groove 35a formed on the end surface 34a of the dotsuba ril (34), and the 31 support i;
In this case, it also reaches the four electrodes 36 formed at 111I+35b.

また、外装樹脂には通常熱硬化樹脂を使用4′るが、熱
硬化の際に一時拘脂粘度が極端に下がるため、樹脂自身
が濡れ上がり易い状態となり、硬化後に濡れ[一がって
いることもある。
In addition, thermosetting resin is usually used for the exterior resin, but the viscosity of the resin temporarily drops dramatically during thermosetting, so the resin itself becomes easily wetted, and after curing, it becomes wet [uneven]. Sometimes.

そこで、本発明の課題は、テイッピング工法時に外装樹
脂が取付け電極に達するのを防IFずる構逍をイTしノ
、−イングククンス部品を提供することにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an integrated component with a structure that prevents the exterior resin from reaching the attached electrode during the tapping method.

課題全解決するだめの下段 以卜の課題を解決するため、木発四に係るインダクタン
ス部品は、鍔部の端面に巻線の終会;1^部全布線する
ための溝を設(づ、かつ前記鍔部底面に1)11言己右
線終端部と接続する取付0電極を設けると共に、荊記溝
に切欠きを形成したことを特徴とする。
In order to solve the problems listed below, the inductance parts related to the four-piece construction have grooves for the end of the winding; , and is characterized in that: 1) an attachment electrode is provided on the bottom surface of the flange portion to connect with the terminal end portion of the right line, and a notch is formed in the groove.

fl’  J’+’1 イングククンス部品をデイツビングした際、溝に設(3
られた切欠き臥、液状の樹脂と鍔部端簡の溝との間の界
而張力を弱める働きをし、液状の構脂がt}5れ1−が
るのをJrll +I−t−4−ると八に、たとλ樹脂
が6?11れ上がってきても溝に設けられたこの切欠き
が・61、;れ」二がってきた樹脂を溜める働きをする
fl'J'+'1 When the Ingkukunsu parts are date-sized, the groove is set (3
This notch acts to weaken the tension between the liquid resin and the groove of the flange edge, and prevents the liquid resin from sliding. - Then, even if the resin rises by 6~11, this notch provided in the groove acts to collect the resin that has risen.

大檄遡 以下、本発明に係るインクククンス部品の−実施例を図
面を参照して説明4−る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of ink-kunk parts according to the present invention will be described with reference to the drawings.

実施例では、チップコイルについて説明4′る。In the embodiment, a chip coil will be explained.

第1図はチップコイルを側面から見た図である。FIG. 1 is a side view of the chip coil.

チップコイルは、胴部2とこの胴部2の両端に設けられ
た−1一鍔部3、下鍔部4とから構成されるコア1と、
胴部2に巻き回された巻線5とを備えている。巻線5の
−力の終端部分W1i.l. l”鍔部4の端而4aに
設けられている溝6a及ひ底而4bに設けられでいる′
/ll6bに沿っ“〔布線され、溝6bに形成されてい
る取付(ノ電極10(第2図参照)に電気的に接続され
ている。他方の終端部分1)同様に底而4bに前記溝6
bと平行に形或されCいる溝内の取付け電極に電気的に
接続されている(図示U゛ず)。溝6aの底面4b{+
1!Iに、この溝68と交差する方向に切欠き8が形成
され−Cいる。
The chip coil includes a core 1 composed of a body part 2, a -1 collar part 3, and a lower collar part 4 provided at both ends of the body part 2;
A winding 5 is wound around a body 2. − force terminal portion W1i. of winding 5; l. l"The grooves 6a and bottom 4b of the flange 4 are provided in the groove 6a and the bottom 4b, respectively.
/ll 6b, and the mounting formed in the groove 6b (which is electrically connected to the electrode 10 (see FIG. Groove 6
It is electrically connected to a mounting electrode in a groove C formed parallel to b (not shown). Bottom surface 4b of groove 6a {+
1! A notch 8 is formed in a direction intersecting this groove 68 at I.

第2図に、第1図の矢印Aで7J< L/た部分を拡大
した因を示す。第2IAはチップコイルが上下逆にされ
、コア1の下鍔郡4の底面4bがディッピング装置の保
持部17に取り付けられた状態を示す。巻線5の終端部
W1は下鍔部4の端面4aに設けられている溝6aに布
線され、さらに溝6aに形成された切欠き8と交范して
底面4bに設1−)られーCいる溝6bに布線される。
FIG. 2 shows the reason why the portion where 7J<L/ is enlarged by arrow A in FIG. 1. The second IA shows a state in which the chip coil is turned upside down and the bottom surface 4b of the lower flange group 4 of the core 1 is attached to the holding part 17 of the dipping device. The terminal end W1 of the winding 5 is wired in a groove 6a provided in the end surface 4a of the lower collar portion 4, and is further provided in the bottom surface 4b intersecting with a notch 8 formed in the groove 6a. -C is placed in the groove 6b.

そして、その終端は溝6biコ形成された取{=Iけ電
極10に半口]付←ノ、あるいは溶接等で電気的に接続
されている。なお、6aの底面4b側に形5 威された切欠き8の高さTは下鍔部4の厚みの約1/5
〜1/2とずるの力11J’ましい。
The terminal end thereof is electrically connected with a groove 6bi formed therein (half-opening to the I-shaped electrode 10) or by welding or the like. Note that the height T of the notch 8 formed on the bottom surface 4b side of 6a is approximately 1/5 of the thickness of the lower flange portion 4.
~1/2 force of 11 J' is desirable.

こうしてデイッピング装置の保持部17に取り付1−)
られた状態でチップコイルは液状の樹脂に′/−イッピ
ングされる。デイッピング工法を第3図(8),(b)
. (C)を参照して説明→゛る。ま4゛、保持部17
にト;ド逆に取り付けられL−チツブ:Iイル{5i、
液状の樹脂11が入っている樹脂柚の七に搬送される[
第3図(8)参照]。次に、樹脂11の液面が下鍔部4
の面4cに接ずる位置までデイツビングされる[第3図
(b)参照]。このとき、界面張力によって下鍔部4の
端面4aに設けられた溝6aに沿って液状樹脂11が濡
れ上がろうとするが、溝68に設けられた切欠き8が、
液状の樹脂11と下鍔部4の端面4aの溝6aとの間の
界面張力を弱める働きをし、液状の樹脂が濡れ七がるの
を抑止すると共に、たとえ樹脂が濡れ−1−かってきて
もこの切欠き8が濡れ−1二がってきた樹脂を溜める働
きをして、溝6bに形成された取付け電極10(第2図
参照)に達しない。
In this way, it is attached to the holding part 17 of the dipping device 1-)
In this state, the chip coil is immersed in liquid resin. The dipping method is shown in Figure 3 (8) and (b).
.. Explain with reference to (C). 4゛、Holding part 17
It is installed in reverse L-chip:I {5i,
The resin is transported to Yuzu no Shichi, which contains liquid resin 11 [
See Figure 3 (8)]. Next, the liquid level of the resin 11 is lower than the lower flange 4.
3(b)]. At this time, the liquid resin 11 tends to wet along the groove 6a provided in the end surface 4a of the lower flange 4 due to interfacial tension, but the notch 8 provided in the groove 68
It functions to weaken the interfacial tension between the liquid resin 11 and the groove 6a of the end surface 4a of the lower flange 4, and prevents the liquid resin from getting wet and spreading. However, this notch 8 acts to collect the wet resin and does not reach the mounting electrode 10 (see FIG. 2) formed in the groove 6b.

こうして、チップコイルはF鍔部4の−・部を残6 してその周fiF+を樹脂11’r被覆された状態で構
脂$illiから取り出される[第3図(c)参照]。
In this way, the chip coil is taken out from the plastic assembly with the remaining part of the F flange 4 and its periphery fiF+ coated with the resin 11'r [see FIG. 3(c)].

また、外装用樹脂11に通常使用される熱硬化樹脂が熱
硬化の際に一時粘医が極端に下がり、樹脂自身が濡れ上
がり易い状態となっても切欠き8によって濡れ上かりが
抑止されるため濡れ上がることはない。
In addition, even if the thermosetting resin normally used for the exterior resin 11 is thermoset, its viscosity is extremely low and the resin itself is easily wetted, but the notch 8 prevents it from getting wet. You won't get wet.

なお、本発明に係るインククタンス部品は前記実施例に
限定するものではなく、その要旨の範聞内で種々に変形
することか−Cきる。
It should be noted that the inktance component according to the present invention is not limited to the embodiments described above, and can be modified in various ways within the scope of the gist.

第4図に示−すように、下鍔部4の端面4aに設けられ
た溝68の中央部に切欠き20を形成しても同様の効果
が得られる。
As shown in FIG. 4, a similar effect can be obtained by forming a notch 20 in the center of the groove 68 provided in the end surface 4a of the lower collar portion 4.

また、本発+1JIは濡れ−Lがりを防止するための他
の方法と相み合わせてもよい。
Further, the present invention +1JI may be combined with other methods for preventing wetting-L.

込明−の効米 本発明は、鍔部の端面に設けられた溝に切欠きを形成し
たため、溝に沿ってW7iiれ上がってきた拘脂はこの
り欠きで抑止Xされ、あるいは溜められたりして、鍔部
の底面に設0られた取{=Iけ電極に77 まで樹脂が達せず、実装侍の半III {−j(−)が
良好なイングクタンス部品が得られる。
The present invention has a notch formed in the groove provided on the end face of the flange, so that the fat that has risen along the groove is suppressed or collected by this notch. As a result, the resin does not reach up to 77 degrees to the electrode provided at the bottom of the flange, and an inductance component with a good half-III {-j (-) of the mounting samurai can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本発明の−実施例であるインクク
クンス部品を示し、第1図は側面から見た− 部垂直断
面図、第2図は第1図の矢印A−C示した部分を拡大し
た垂直断面図、第3図(a), (b),(C)はイン
ダクタンス部品のディッピングT程の説1!J]凶であ
る。第4 1X+ 4よMJ欠き位置を変央した場合の
変形例を示す垂直断面図である。第5図ないし第7図は
従来のイングククンス部品を,」\し、第5図はjE面
から見た−・部垂直断面図、第6図は側面から見た一部
垂直断面図、第7図は第6図の矢印Bで示した部分全拡
大した垂直断ini図である。 1・・・コア、2・・・胴部、4・・・鍔部(下鍔部)
、5・・・巻線、6a・・・溝、8・・・助欠き、】0
・・・取イ・1げ電極、20・・・切欠き、Wl・・・
巻線終端部。
1 to 3 show an ink-kukunsu component that is an embodiment of the present invention, FIG. 1 is a vertical sectional view of the part seen from the side, and FIG. 2 is a portion indicated by arrows A-C in FIG. 1. The enlarged vertical cross-sectional views of Figure 3 (a), (b), and (C) are theory 1 of the dipping T of the inductance component! J] It is evil. FIG. 4 is a vertical cross-sectional view showing a modification example in which the MJ notch position is shifted from 1X+4. Figures 5 to 7 show conventional Ingkukunsu parts, Figure 5 is a vertical cross-sectional view of the part viewed from the JE plane, Figure 6 is a partial vertical cross-sectional view of the part viewed from the side, and Figure 7 The figure is a fully enlarged vertical sectional ini view of the part indicated by arrow B in FIG. 6. 1...Core, 2...Body part, 4...Brim part (lower brim part)
, 5...Winding, 6a...Groove, 8...Socket, ]0
...Take-out/1-ge electrode, 20...Notch, Wl...
Winding end.

Claims (1)

【特許請求の範囲】[Claims] 1.胴部と該胴部の端に設けられた鍔部とから構成され
るコアと、前記胴部に巻き回された巻線とを備えたイン
ダクタンス部品において、 前記鍔部の端面に前記巻線の終端部を布線するための溝
を設け、かつ前記鍔部底面に前記巻線終端部と接続する
取付け電極を設けると共に、前記溝に切欠きを形成した
ことを特徴とするインダクタンス部品。
1. An inductance component including a core configured of a body and a flange provided at an end of the body, and a winding wound around the body, wherein the winding is attached to an end surface of the flange. An inductance component characterized in that a groove is provided for wiring a terminal end, an attachment electrode is provided on the bottom surface of the flange portion to connect to the winding terminal, and a notch is formed in the groove.
JP30233789A 1989-11-20 1989-11-20 Inductance part Pending JPH03161912A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30233789A JPH03161912A (en) 1989-11-20 1989-11-20 Inductance part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30233789A JPH03161912A (en) 1989-11-20 1989-11-20 Inductance part

Publications (1)

Publication Number Publication Date
JPH03161912A true JPH03161912A (en) 1991-07-11

Family

ID=17907723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30233789A Pending JPH03161912A (en) 1989-11-20 1989-11-20 Inductance part

Country Status (1)

Country Link
JP (1) JPH03161912A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680087A (en) * 1993-05-11 1997-10-21 Murata Manufacturing Co., Ltd. Wind type coil
JP2009158735A (en) * 2007-12-27 2009-07-16 Taiyo Yuden Co Ltd Surface-mounting coil component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5680087A (en) * 1993-05-11 1997-10-21 Murata Manufacturing Co., Ltd. Wind type coil
JP2009158735A (en) * 2007-12-27 2009-07-16 Taiyo Yuden Co Ltd Surface-mounting coil component

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