JPH03155487A - Laser beam welding method - Google Patents
Laser beam welding methodInfo
- Publication number
- JPH03155487A JPH03155487A JP1294334A JP29433489A JPH03155487A JP H03155487 A JPH03155487 A JP H03155487A JP 1294334 A JP1294334 A JP 1294334A JP 29433489 A JP29433489 A JP 29433489A JP H03155487 A JPH03155487 A JP H03155487A
- Authority
- JP
- Japan
- Prior art keywords
- welded
- welding
- laser
- laser beam
- welding method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims description 18
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
一ザ溶接方法に関し、
レーザ溶接による被溶接部材への熱的影響を小さくする
レーザ溶接方法を提供することを目的とし、
第１の溶接部材に板状の第２の溶接部材を密着させ、溶
接部分にレーザ光を照射して溶接するレーザ溶接方法に
おいて、前記第２の溶接部材の溶接部分を薄く加工し、
前記第２の溶接部材の溶接部分にレーザ光を照射するこ
とにより前記第１の溶接部材と第２の溶接部材を溶接す
るように構成する。DETAILED DESCRIPTION OF THE INVENTION Regarding a laser welding method, an object of the present invention is to provide a laser welding method that reduces the thermal influence of laser welding on a member to be welded. In a laser welding method in which welding parts are brought into close contact with each other and the welding part is irradiated with a laser beam, the welding part of the second welding part is processed to be thin,
The first welding member and the second welding member are welded by irradiating a welding portion of the second welding member with a laser beam.
［産業上の利用分野］
本発明は、第１の溶接部材に板状（・第２の溶接部材を
密着させ、溶接部分にレーザ光を照射して溶接するレー
ザ溶接方法に関する。[Industrial Field of Application] The present invention relates to a laser welding method in which a plate-shaped second welding member is brought into close contact with a first welding member, and the welding portion is irradiated with laser light for welding.
［ＩｌＩ要］
［従来の技術］第１の溶接部材に板状の第２の溶接
部材を密着 レーザ溶接は、金属等の１ｊｌＩＡ１
１１部分を溶接する徹させ、溶接部分にレーザ光を照射
して溶接するし 細溶接法として用いられる。従来の
レーザ溶接方法を第５図を用いて説明する。板状の被溶
接部材１を被溶接部材２に密着させ、被溶接部材１側か
ら溶接部分にレーザ光を照射する（第５図（ａ））、レ
ーザ光により被溶接部材１と被溶接部材２の密着部分が
溶融して溶融部分３が形成され、被溶接部材１が被溶接
部材２に溶接される（第５図（ｂ））。[IlI required]
[Prior art] A plate-shaped second welding member is closely attached to a first welding member. Laser welding is used to weld metals, etc.
It is used as a fine welding method in which 11 parts are welded thoroughly and the welded parts are irradiated with laser light. A conventional laser welding method will be explained using FIG. A plate-shaped member to be welded 1 is brought into close contact with a member to be welded 2, and a laser beam is irradiated to the welding portion from the side of the member to be welded 1 (Fig. 5 (a)). The member to be welded 1 and the member to be welded are 2 is melted to form a fused portion 3, and the member to be welded 1 is welded to the member to be welded 2 (FIG. 5(b)).
この場合、レーザ溶接は溶接幅を１ｍｍ以下にしぼるこ
とができるが、被溶接部材の幅がレーザ溶接幅に近い場
合は、溶接の熱影響により、非溶接部分に残留応力や変
形が生じる可能性がある。In this case, laser welding can reduce the welding width to 1 mm or less, but if the width of the welded part is close to the laser welding width, there is a possibility that residual stress or deformation will occur in the non-welded part due to the thermal effect of welding. There is.
このため、最小限のレーザ熱量で、確実に溶接を行う必
要がある。Therefore, it is necessary to perform welding reliably with a minimum amount of laser heat.
従来のレーザ溶接においては、確実に溶接するためにレ
ーザ熱量等の条件或いは溶接材質を選択している。この
ため、レーザの吸収率が低い材質を溶接する場合におい
てはレーザ熱量を増加させる必要があった。In conventional laser welding, conditions such as the amount of laser heat or the welding material are selected in order to ensure reliable welding. Therefore, when welding materials with low laser absorption rate, it is necessary to increase the amount of laser heat.
［発明が解決しようとする課題］
しかしながら、上記従来のレーザ溶接方法では、被溶接
部材への熱的影響が大きくなるため、被溶接部材に残留
応力や変形を発生させる可能性が高かった。[Problems to be Solved by the Invention] However, in the conventional laser welding method described above, the thermal influence on the welded members becomes large, so there is a high possibility that residual stress or deformation will occur in the welded members.
本発明は上記事情を考慮してなされたもので、レーザ溶
接による被溶接部材への熱的影響を小さくするレーザ溶
接方法を提供することを目的とする。The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a laser welding method that reduces the thermal influence of laser welding on a member to be welded.
［課題を解決するための手段］
第１図は本発明を説明する原理図である。板状の被溶接
部材１の、レーザ光を照射する溶接部分４の厚さを薄く
加工し、被溶接部材１と被溶接部材２を密着し、被溶接
部材１側からレーザ光を照射し、被溶接部材１と被溶接
部材２を溶接する。[Means for Solving the Problems] FIG. 1 is a diagram illustrating the principle of the present invention. The thickness of the welding part 4 of the plate-shaped member to be welded 1 to be irradiated with laser light is processed to be thin, the member to be welded 1 and the member to be welded 2 are brought into close contact with each other, and the laser light is irradiated from the side of the member to be welded 1, A member to be welded 1 and a member to be welded 2 are welded.
［作用］
本発明によれば、溶接部分４を薄く加工することにより
、溶融部分５を小さくすることができるので確実に溶接
できる。従って、レーザ溶接による被溶接部材への熱的
影響を小さくすることができるから、被溶接部材に残留
応力や変形を発生させること無く溶接ができる。[Function] According to the present invention, by processing the welding portion 4 thinner, the molten portion 5 can be made smaller, so that welding can be performed reliably. Therefore, it is possible to reduce the thermal influence of laser welding on the members to be welded, so that welding can be performed without generating residual stress or deformation in the members to be welded.
［実施例］
本発明の一実施例によるレーザ溶接方法を第２図乃至第
４図を用いて説明する。[Example] A laser welding method according to an example of the present invention will be described with reference to FIGS. 2 to 4.
第２図は本発明のレーザ溶接方法を用いたＰＧＡ（Ｐｉ
ｎ Ｇｒｉｄ Ａｒｒａｙ ｐａｃｋａｇｅ）の
断面図、第３図は本発明のレーザ溶接方法を用いたＰＧ
Ａの平面図、第４図は本発明のレーザ溶接方法に用いる
ハーフエツチング製造工程断面図である。Figure 2 shows PGA (Pi) using the laser welding method of the present invention.
Figure 3 is a cross-sectional view of the PG using the laser welding method of the present invention.
A is a plan view, and FIG. 4 is a cross-sectional view of the half-etching manufacturing process used in the laser welding method of the present invention.
ＰＧＡは、多ピン構造を有するパッケージである。リー
ドフレーム１３のアイランド９に半導体チップ８が搭載
され、半導体チップ８はボンディングワイヤ１０により
ＰＧＡの内部配線のためのリードフレーム１３のインナ
ーリード１２と電気的に接続されている。インナーリー
ド１２は、ビン６との溶接部分において例えば円形の膨
らみ部２０を有し、膨らみ部２０中央に凹部７が形成さ
れている（第３図）、この膨らみ部２０が本実施例によ
るレーザ溶接方法により外部リードとなるビン６と溶接
され接続されている。半導体チップ８を保護するため全
体がモールド樹脂１１内に封止されている。PGA is a package with a multi-pin structure. A semiconductor chip 8 is mounted on an island 9 of a lead frame 13, and the semiconductor chip 8 is electrically connected to inner leads 12 of the lead frame 13 for internal wiring of the PGA by bonding wires 10. The inner lead 12 has, for example, a circular bulge 20 at the welded portion with the bottle 6, and a recess 7 is formed in the center of the bulge 20 (FIG. 3). It is welded and connected to the bottle 6 which becomes an external lead by a welding method. The entire semiconductor chip 8 is sealed within a mold resin 11 to protect it.
次に、ＰＧＡの製造工程について説明する。Next, the manufacturing process of PGA will be explained.
まず、リードフレーム１３及び凹部７の製造工程を第４
図を用いて説明する。同図は、第３図に示す膨らみ部２
０のＡ−ＡＩＩＲ面の製造工程を示す図である。First, the manufacturing process of the lead frame 13 and the recess 7 is performed in the fourth step.
This will be explained using figures. The figure shows the bulge 2 shown in FIG.
FIG. 2 is a diagram showing the manufacturing process of the A-AIIR surface of No. 0.
リードフレーム１３及び凹部７は、例えばケミカルエツ
チングにより同時に形成する。The lead frame 13 and the recess 7 are formed simultaneously by, for example, chemical etching.
初めに、リードフレーム部材２２の両面にレジストを塗
布してレジスト層２４を形成する（第４図（ａ））、こ
のレジスト層２４をマスクとして（第４図（ｂ））、リ
ードフレーム部材２２を両面からエツチングしてリード
フレーム１３及び凹部７を形成する（第４図（ｃ））。First, resist is applied to both sides of the lead frame member 22 to form a resist layer 24 (FIG. 4(a)). Using this resist layer 24 as a mask (FIG. 4(b)), the lead frame member 22 is coated with resist. is etched from both sides to form the lead frame 13 and the recess 7 (FIG. 4(c)).
一般に使われている、リードフレーム用のエツチンダ液
の場合、リードフレーム片面だけのエツチングではリー
ドフレーム部材を完全に溶解することはできずハーフエ
ツチングされ、ある程度の深さまで溶解してそこで終わ
ってしまう、この場合、片面のみにレジストのある部分
では、レジストの無い面から部材断面の厚さに対し６０
パ一セント程度の半球状の凹部７が形成される（第４図
（ｄ））。In the case of commonly used etching agents for lead frames, etching only one side of the lead frame does not completely dissolve the lead frame member, resulting in half etching, which dissolves to a certain depth and ends there. In this case, in a part with resist on only one side, 60% of the thickness of the cross section of the member from the non-resist side.
A hemispherical recess 7 about the size of a cent is formed (FIG. 4(d)).
次に、このようにして得られたリードフレーム１３のア
イランド９に半導体チップ８を搭載し、半導体チップ８
とインナーリード１２をボンディングワイヤ１０で接続
後、インナーリード１２とビン６について溶接部分であ
る凹部７にレーザ光を照射し溶接する。ａ後にモールド
樹脂１１により封止する。Next, the semiconductor chip 8 is mounted on the island 9 of the lead frame 13 obtained in this way.
After connecting the inner lead 12 and the inner lead 12 with the bonding wire 10, a laser beam is irradiated onto the recess 7, which is the welding part, of the inner lead 12 and the bottle 6 to perform welding. After a, sealing is performed with mold resin 11.
このようにして溶接部分に凹部７を設けることにより、
レーザ溶接による被溶接部材であるインナーリード１２
とピン６への熱的影響を小さくすることができる。この
ためインナーリード１２とピン６に残留応力や変形を発
生させること無く溶接ができ、インナーリード１２の変
形、跳ね上がりを防止できる。By providing the recess 7 in the welded part in this way,
Inner lead 12 which is a member to be welded by laser welding
Therefore, the thermal influence on the pin 6 can be reduced. Therefore, welding can be performed without generating residual stress or deformation in the inner lead 12 and pin 6, and deformation and jumping of the inner lead 12 can be prevented.
本発明は上記実施例に限らず種々の変形が可能である０
例えば、凹部を形成する場合にケミカルエツチングでな
ぐ型押（コイニング）で形成してもよい。The present invention is not limited to the above embodiments, and can be modified in various ways.
For example, when forming the recessed portion, it may be formed by coining using chemical etching.
また、本発明は上記実施例の被溶接部材に限らず他の被
溶接部材にも適用できる１例えば、リードフレーム同士
を溶接する場合には、一方のリードフレームに凹部を形
成しレーザ溶接する。また、リードフレームを放熱用ブ
ロックに溶接する場合には、リードフレームに凹部を形
成しレーザ溶接する。Furthermore, the present invention is applicable not only to the members to be welded in the above embodiments but also to other members to be welded. For example, when lead frames are welded together, a recess is formed in one lead frame and laser welding is performed. Further, when welding the lead frame to the heat dissipation block, a recess is formed in the lead frame and laser welding is performed.
［発明の効果］
以上の通り、本発明によれば、レーザ溶接による被溶接
部材への熱的影響を小さくすることができるから、被溶
接部材に残留応力や変形を発生させること無く溶接がで
きる。[Effects of the Invention] As described above, according to the present invention, it is possible to reduce the thermal influence of laser welding on the parts to be welded, so welding can be performed without generating residual stress or deformation in the parts to be welded. .
第１図は本発明のレーザ溶接方法を示す図、第２図は本
発明の一実施例によるＰＧＡの断面図、
第３図は本発明の一実施例によるＰＧＡの平面図、
第４図は本発明の一実施例による溶接部の製造工程図、
第５図は従来のレーザ溶接方法を示す図である。
９・・・アイランド
１０・・・ボンディングワイヤ
１１・・・モールド樹脂
１２・・・インナーリード
１３・・・リードフレーム
２０・・・膨らみ部
２２・・・リードフレーム部材
２４・・・レジスト層
図において、
１・・・被溶接部材
２・・・被溶接部材
３・・・溶融部分
４・・・溶接部分
５・・・溶融部分
６・・・ビン
７・・・凹部
８・・・半導体チップFIG. 1 is a diagram showing the laser welding method of the present invention, FIG. 2 is a cross-sectional view of a PGA according to an embodiment of the present invention, FIG. 3 is a plan view of a PGA according to an embodiment of the present invention, and FIG. 4 is a diagram showing a PGA according to an embodiment of the present invention. FIG. 5 is a diagram showing a manufacturing process of a welded part according to an embodiment of the present invention, and is a diagram showing a conventional laser welding method. 9...Island 10...Bonding wire 11...Mold resin 12...Inner lead 13...Lead frame 20...Bulging portion 22...Lead frame member 24...In the resist layer diagram , 1... Part to be welded 2... Part to be welded 3... Melted part 4... Welded part 5... Melted part 6... Bottle 7... Recessed part 8... Semiconductor chip
Claims (1)
接部分にレーザ光を照射して溶接するレーザ溶接方法に
おいて、 前記第２の溶接部材の溶接部分を薄く加工し、前記第２
の溶接部材の溶接部分にレーザ光を照射することにより 前記第１の溶接部材と第２の溶接部材を溶接することを
特徴とするレーザ溶接方法。[Claims] A laser welding method in which a plate-shaped second welding member is brought into close contact with a first welding member, and the welding portion is irradiated with a laser beam to weld the welding portion of the second welding member. Processed thinly, the second
A laser welding method, characterized in that the first welding member and the second welding member are welded by irradiating a welding portion of the welding member with a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1294334A JPH03155487A (en) | 1989-11-13 | 1989-11-13 | Laser beam welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1294334A JPH03155487A (en) | 1989-11-13 | 1989-11-13 | Laser beam welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03155487A true JPH03155487A (en) | 1991-07-03 |
Family
ID=17806360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1294334A Pending JPH03155487A (en) | 1989-11-13 | 1989-11-13 | Laser beam welding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03155487A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5299965A (en) * | 1991-12-28 | 1994-04-05 | Goldstar Co., Ltd. | Laser welding method for preparation of electron gun of color cathode-ray tube |
| JP2009090349A (en) * | 2007-10-10 | 2009-04-30 | Hitachi Plant Technologies Ltd | Method and apparatus for welding impeller |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61226195A (en) * | 1985-03-30 | 1986-10-08 | Toshiba Corp | Fusion joining method |
-
1989
- 1989-11-13 JP JP1294334A patent/JPH03155487A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61226195A (en) * | 1985-03-30 | 1986-10-08 | Toshiba Corp | Fusion joining method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5299965A (en) * | 1991-12-28 | 1994-04-05 | Goldstar Co., Ltd. | Laser welding method for preparation of electron gun of color cathode-ray tube |
| JP2009090349A (en) * | 2007-10-10 | 2009-04-30 | Hitachi Plant Technologies Ltd | Method and apparatus for welding impeller |
| US8426766B2 (en) | 2007-10-10 | 2013-04-23 | Hitachi Plant Technologies, Ltd. | Welding method and welding apparatus for an impeller |
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