JPH0315463U - - Google Patents
Info
- Publication number
- JPH0315463U JPH0315463U JP7657089U JP7657089U JPH0315463U JP H0315463 U JPH0315463 U JP H0315463U JP 7657089 U JP7657089 U JP 7657089U JP 7657089 U JP7657089 U JP 7657089U JP H0315463 U JPH0315463 U JP H0315463U
- Authority
- JP
- Japan
- Prior art keywords
- contact piece
- interposed
- lead wire
- set state
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 3
Description
第1図はこの考案の実施例による結線装置が用
いられた蛍光灯用ソケツトの分解斜視図、第2図
および第3図は上記結線装置の縦断断面図、第4
図および第5図は上記結線装置の水平断面図であ
る。
3……基体、7……スペーサ、8……リード線
、31……ガイド孔、41……第1接片、51…
…第2接片、72……第1位置、73……第2位
置、74……傾斜面、A……第1接片と第2接片
との間隔。
FIG. 1 is an exploded perspective view of a fluorescent lamp socket using a wiring device according to an embodiment of the invention, FIGS. 2 and 3 are longitudinal cross-sectional views of the wiring device, and FIG.
5 and 5 are horizontal sectional views of the above-mentioned wiring device. 3... Base body, 7... Spacer, 8... Lead wire, 31... Guide hole, 41... First contact piece, 51...
...second contact piece, 72...first position, 73...second position, 74...inclined surface, A...distance between first contact piece and second contact piece.
Claims (1)
る基体に、第1接片と第2接片との間にリード線
を導くガイド孔が形成されていると共に、第1接
片と第2接片との間にスペーサが介在され、 上記スペーサは、先端側の第1位置とそれより
も基端側の第2位置とが上記第1接片を倣わせる
滑らかな傾斜面により連続されていると共に、第
1接片と第2接片との間に第1位置が介在される
非セツト状態と第2位置が介在されるセツト状態
との間で出退可能に基体に保持されており、 非セツト状態では第1接片と第2接片との間隔
がそれらの間にリード線を挿通し得る広さに拡が
り、かつ、セツト状態では上記間隔が第1接片と
第2接片との間でリード線を挾持し得る広さに狭
まるように上記第1接片および第2接片の少なく
とも一方にばね性が付与されていることを特徴と
する結線装置。[Claims for Utility Model Registration] A guide hole for guiding a lead wire between the first contact piece and the second contact piece is formed in the base body that accommodates the first contact piece and the second contact piece opposing the first contact piece. and a spacer is interposed between the first contact piece and the second contact piece, and the spacer has a first position on the distal side and a second position on the proximal side of the first contact piece. and a non-set state in which the first position is interposed between the first contact piece and the second contact piece and a set state in which the second position is interposed between the first contact piece and the second contact piece. In the unset state, the gap between the first contact piece and the second contact piece is wide enough to allow the lead wire to be inserted between them, and in the set state, At least one of the first contact piece and the second contact piece is provided with spring properties so that the distance is narrowed to a width that allows the lead wire to be held between the first contact piece and the second contact piece. A wiring device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7657089U JPH0315463U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7657089U JPH0315463U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0315463U true JPH0315463U (en) | 1991-02-15 |
Family
ID=31618162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7657089U Pending JPH0315463U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0315463U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002263547A (en) * | 2001-03-05 | 2002-09-17 | Kyokuto Sanki Co Ltd | Laminating apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148573B2 (en) * | 1979-05-01 | 1986-10-24 | Tamagawa Kikai Kinzoku Kk |
-
1989
- 1989-06-29 JP JP7657089U patent/JPH0315463U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148573B2 (en) * | 1979-05-01 | 1986-10-24 | Tamagawa Kikai Kinzoku Kk |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002263547A (en) * | 2001-03-05 | 2002-09-17 | Kyokuto Sanki Co Ltd | Laminating apparatus |