JPH03147517A - Disk substrate - Google Patents
Disk substrateInfo
- Publication number
- JPH03147517A JPH03147517A JP1287662A JP28766289A JPH03147517A JP H03147517 A JPH03147517 A JP H03147517A JP 1287662 A JP1287662 A JP 1287662A JP 28766289 A JP28766289 A JP 28766289A JP H03147517 A JPH03147517 A JP H03147517A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- formulas
- tables
- liquid crystal
- iii
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 229920000728 polyester Polymers 0.000 claims abstract description 34
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 31
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 3
- 125000001309 chloro group Chemical group Cl* 0.000 claims abstract description 3
- 239000003063 flame retardant Substances 0.000 claims description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 15
- 230000003287 optical effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- -1 polybutylene terephthalate Polymers 0.000 description 15
- 239000000835 fiber Substances 0.000 description 11
- 150000002903 organophosphorus compounds Chemical class 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 150000005526 organic bromine compounds Chemical class 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 description 2
- XCZKKZXWDBOGPA-UHFFFAOYSA-N 2-phenylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(C=2C=CC=CC=2)=C1 XCZKKZXWDBOGPA-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachloro-phenol Natural products OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001955 polyphenylene ether Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- CYTCTRAEJYIZRX-UHFFFAOYSA-N (9a-hydroxy-3,5a-dimethyl-9-methylidene-2-oxo-3,3a,4,5,6,7,8,9b-octahydrobenzo[g][1]benzofuran-6-yl) acetate Chemical compound C1CC2(C)C(OC(C)=O)CCC(=C)C2(O)C2C1C(C)C(=O)O2 CYTCTRAEJYIZRX-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- DGZQEAKNZXNTNL-UHFFFAOYSA-N 1-bromo-4-butan-2-ylbenzene Chemical class CCC(C)C1=CC=C(Br)C=C1 DGZQEAKNZXNTNL-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- JCJUKCIXTRWAQY-UHFFFAOYSA-N 6-hydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=CC=CC2=C1 JCJUKCIXTRWAQY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Polymers C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- AJPXTSMULZANCB-UHFFFAOYSA-N chlorohydroquinone Chemical compound OC1=CC=C(O)C(Cl)=C1 AJPXTSMULZANCB-UHFFFAOYSA-N 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Magnetic Record Carriers (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は成形加工性、寸法精度、機械特性に優れた、液
晶ポリエステルからなるディスク基板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to a disk substrate made of liquid crystal polyester that has excellent moldability, dimensional accuracy, and mechanical properties.
〈従来の技術〉
ディスク基板の表面あるいは表面から０．１〜０．２閣
内部に異物や傷が存在すると、ディスクの磁気特性を低
下させることになり、極めて優れた表面平滑性が要求さ
れている。このディスク材料としては、合成樹脂の例え
ばポリカーボネートやポリブチレンテレフタレート樹脂
等が検討されているが、これら公知のディスク材料には
以下に示す様な欠点がある。<Prior art> If foreign matter or scratches exist on the surface of a disk substrate or within 0.1 to 0.2 degrees from the surface, the magnetic properties of the disk will deteriorate, and extremely excellent surface smoothness is required. There is. Synthetic resins such as polycarbonate and polybutylene terephthalate resin have been considered as materials for this disk, but these known disk materials have the following drawbacks.
即ち、ポリカーボネート樹脂は成形性が必ずしも良好と
は言えず、ポリブチレンテレフタレート樹脂は熱特性が
劣るため、微細な凹凸を忠実に再現させるのが困難であ
ったり、熱変化による成形品の寸法変化が大きいため、
ディスク基板としての基本的性能を満足させることが困
難である。In other words, polycarbonate resin does not necessarily have good moldability, and polybutylene terephthalate resin has poor thermal properties, so it is difficult to faithfully reproduce minute irregularities, and dimensional changes in molded products due to thermal changes are difficult. Because it is large,
It is difficult to satisfy the basic performance as a disk substrate.
近年になり液晶ポリエステルが流動性のよいことが見い
出され、特開昭６１−１１７７３０号公報、特開昭６１
−９０３４３号公報に見られるように、液晶ポリエステ
ルをディスク材料として使用することが開示されている
。In recent years, it has been discovered that liquid crystal polyester has good fluidity, and it has been published in Japanese Patent Application Laid-open Nos. 117730-1982 and 1982-117730;
As seen in Japanese Patent No. 90343, the use of liquid crystal polyester as a disc material is disclosed.
〈発明が解決しようとする課題〉
しかしながら、前記特開昭６１−１１７７３０号公報、
特開昭６１−９０３４３号公報などで知られている液晶
ポリエステルは、成形加工性がディスク材料としては未
だ不十分であり、微細な凹凸を持つディスク基板を成形
した場合には、樹脂が末端まで十分には流れないために
表面状態が悪くなり、ディスクの磁気特性を低下させる
などの問題のあることがわかった。<Problem to be solved by the invention> However, the above-mentioned Japanese Patent Application Laid-open No. 117730/1983,
Liquid crystalline polyester, which is known from Japanese Patent Application Laid-open No. 61-90343, still has insufficient moldability as a disk material, and when molding a disk substrate with minute irregularities, the resin will reach the ends. It was found that problems such as insufficient flow caused the surface condition to deteriorate and deteriorated the magnetic properties of the disk.
本発明は上述の問題を解消し、耐熱性と流動性の優れた
特定構造の液晶ポリエステルからなるディスク基板を得
ることを課題とする。It is an object of the present invention to solve the above-mentioned problems and to obtain a disk substrate made of liquid crystal polyester having a specific structure that has excellent heat resistance and fluidity.
く課題を解決するための手段〉
本発明者らは上記課題を解決すべく鋭意検討した結果、
本発明に到達した。Means for Solving the Problems> As a result of the inventors' intensive studies to solve the above problems,
We have arrived at the present invention.
すなわち、本発明は、
（１）下記構造単位（１）、（Ｉ［）、（ＩＩＩ）およ
び（１ｖ）からなり、構造単位［（Ｉ＞＋ （ＩＩ）］
が［（ＩＩ ＋ （Ｉ［） ＋ （Ｉ［Ｉ） ］の７５
〜９５モル％、構造単位（ＩＩ）が［（Ｉ）＋ （ＩＩ
）＋ （ＩＩＩ） ］の２５〜５モル％であり、構造単
位（Ｉ）／（Ｉ）のモル比が７５／２５〜９５１５であ
る溶融成形可能な液晶ポリエステルからなるディスク基
板。That is, the present invention provides: (1) Consisting of the following structural units (1), (I[), (III) and (1v), the structural unit [(I>+ (II)]
is [(II + (I[) + (I[I) ] 75
~95 mol%, the structural unit (II) is [(I) + (II
) + (III)] and has a structural unit (I)/(I) molar ratio of 75/25 to 9515.
＋０−ＣＨ２ＣＨ，−０＋−
＋ＣＯ−Ｒ２−Ｃ０−）−
（ＩＩＩ）
（ＩＶ）
ＣＨ３
から選ばれた１種以上の基を、Ｒ２は
＋Ｏ−Ｒ，−０＋−
（ＩＩ）
の基を示す。また、式中のＸは水素原子または塩素原子
を示す。）
（２）請求項（１）記載の液晶ポリエステル１００重量
部に対して、有機難燃剤０，２〜３０重量部を含有せし
めた難燃性液晶ポリエステル組成物からなるディスク基
板を提供するものである。+0-CH2CH, -0+- +CO-R2-C0-)- (III) (IV) CH3, and R2 represents a group of +O-R, -0+- (II). Moreover, X in the formula represents a hydrogen atom or a chlorine atom. ) (2) Provides a disk substrate made of a flame-retardant liquid crystal polyester composition containing 0.2 to 30 parts by weight of an organic flame retardant to 100 parts by weight of the liquid crystal polyester according to claim (1). be.
上記構造単位（Ｉ＞はｐ−ヒドロキシ安息香酸から生成
したポリエステルの構造単位であり、構造単位（ＩＩ）
は４．４−一ジヒドロキシビフェニル、ハイドロキノン
、２．６−シヒドロキシナフタレン、ｔ−ブチルハイド
ロキノン、３゜３−．５．５−−テトラメチル−４，４
−一ジヒドロキシビフェニルおよびフェニルハイドロキ
ノンから選ばれた１種以上の芳香族ジオールから生成し
た構造単位を、構造単位（ＩＩＩ）はエチレングリコー
ルから生成した構造単位を、構造単位（ＩＶ）はテレフ
タル酸、４，４−−ジフェニルジカルボン酸、２，６−
ナフタレンジカルボン酸、１，２−ビス（フェノキシ）
エタン−４，４−−ジカルボン酸、１，２−ビス（２−
クロルフェノキシ）エタン−４，４−−ジカルボン酸お
よび４，４−−ジフェニルエーテルジカルボン酸から選
ばれた１種以上の芳香族ジカルボン酸から生成した構造
単位を各々示す。The above structural unit (I> is a structural unit of polyester produced from p-hydroxybenzoic acid, and the structural unit (II)
is 4.4-monodihydroxybiphenyl, hydroquinone, 2.6-dihydroxynaphthalene, t-butylhydroquinone, 3°3-. 5.5-tetramethyl-4,4
- a structural unit produced from one or more aromatic diols selected from monodihydroxybiphenyl and phenylhydroquinone, structural unit (III) a structural unit produced from ethylene glycol, structural unit (IV) a structural unit produced from terephthalic acid, , 4--diphenyldicarboxylic acid, 2,6-
naphthalene dicarboxylic acid, 1,2-bis(phenoxy)
Ethane-4,4-dicarboxylic acid, 1,2-bis(2-
Each shows a structural unit produced from one or more aromatic dicarboxylic acids selected from chlorophenoxy)ethane-4,4-dicarboxylic acid and 4,4-diphenyl ether dicarboxylic acid.
上記構造単位（Ｉ）〜（１ｖ）のうち、構造単位［（Ｉ
）＋（ＩＩ）］は［（ＩＩ ＋ （ＩＩ＞ ＋（■）］
の７５〜９５モル％であり、好ましくは８２〜９３モル
％、さらに好ましくは８５〜９０モル％である。Among the above structural units (I) to (1v), the structural unit [(I
) + (II)] is [(II + (II> + (■)]
It is 75 to 95 mol%, preferably 82 to 93 mol%, and more preferably 85 to 90 mol%.
また構造単位（ＩＩＩ）は［（Ｉ＞＋ （ＩＩ＞ ＋（
■）］の２５〜５モル％であり、好ましくは１８〜７モ
ル％、さらに好ましくは１５〜１０モル％である。構造
単位［（Ｉ＞＋（ＩＩ）］が［（ＩＩ ＋ （ＩＩ）
＋ （ＩＩＩ） ］の９５モル％より大きいと溶融流動
性が低下して重合時に固化し、７５モル％より小さいと
耐熱性が不良となり好ましくない。Moreover, the structural unit (III) is [(I>+ (II> +(
2)] is 25 to 5 mol%, preferably 18 to 7 mol%, and more preferably 15 to 10 mol%. The structural unit [(I>+(II)] is [(II + (II)
+(III)] is undesirable because if it is more than 95 mol %, the melt fluidity decreases and solidification occurs during polymerization, and if it is less than 75 mol %, the heat resistance becomes poor.
また、構造単位（Ｉ）／（ＩＩ）のモル比は７５／２５
〜９５１５であり、好ましくは７８／２２〜９３／７で
ある。７５／２５未溝であったり、９５１５より大きい
場合には耐熱性、流動性が不良となり、本発明の目的を
達成することができない。また、構造単位（ＩＶ）は構
造単位［（ＩＩ＞ ＋ （ＩＩＩ） ］と実質的に等モ
ルである。In addition, the molar ratio of structural units (I)/(II) is 75/25
~9515, preferably 78/22 ~ 93/7. If the groove is not 75/25 or is larger than 9515, the heat resistance and fluidity will be poor and the object of the present invention cannot be achieved. Moreover, the structural unit (IV) is substantially equimolar to the structural unit [(II> + (III) )].
本発明に用いる液晶ポリエステルの製造方法については
特に限定するものではなく、公知のポリエステルの重縮
合方法に準じて製造できる。The method for producing the liquid crystal polyester used in the present invention is not particularly limited, and it can be produced according to known polyester polycondensation methods.
また、本発明で使用する液晶ポリエステルの溶融粘度は
１０〜１５．０００ボイズが好ましく、特に２０〜５．
０００ポイズがより好ましい。Further, the melt viscosity of the liquid crystal polyester used in the present invention is preferably 10 to 15,000 bois, particularly 20 to 5,000 bois.
000 poise is more preferable.
なお、この溶融粘度はく液晶開始温度＋４０℃）ですり
速度１．０００ （１／秒）の条件下で高化式フローテ
スターによって測定した値である。Note that this melt viscosity is a value measured using a Koka type flow tester under conditions of a liquid crystal start temperature + 40° C. and a slip rate of 1.000 (1/sec).
一方、この液晶ポリエステルの対数粘度は０゜ｔｇ／ｄ
−１度、６０℃のペンタフルオロフェノール中で測定可
能であり、０．５〜５．Ｏｄ、１！ ／ ｚが好ましく
、１．０〜３．Ｏｄ、ｌ）／ｇが特に好ましい。On the other hand, the logarithmic viscosity of this liquid crystal polyester is 0°tg/d
-1 degree, measurable in pentafluorophenol at 60°C, 0.5-5. Od, 1! /z is preferable, and 1.0 to 3. Od, l)/g is particularly preferred.
なお、本発明で使用する液晶ポリエステルを重縮合する
際には上記構造単位（Ｉ）〜（１ｖ）を構成する成分以
外にイソフタル酸、３．３−一ジフエニルジカルボン酸
、２．２−−ジフェニルジカルボン酸などの芳香族ジカ
ルボン酸、アジピン酸、アゼライン酸、セバシン酸、ド
デカンジオン酸などの脂肪族ジカルボン酸、ヘキサヒド
ロテレフタル酸などの脂環式ジカルボン酸、クロルハイ
ドロキノン、メチルハイドロキノン、４．４−一ジヒド
ロキシジフェニルスルフィド、４．４−一ジヒドロキシ
ベンゾフェノン、４．４゛−ジヒドロキシジフェニルエ
ーテル等の芳香族ジオール、１．４−ブタンジオール、
１．６−ヘキサンジオール、ネオペンチルグリコール、
１．４−シクロヘキサンジオール、１．４−シクロヘキ
サンジメタツール等の脂肪族、脂環式ジオールおよびｍ
−ヒドロキシ安息香酸、２．６−ヒドロキシナフトエ酸
などの芳香族ヒドロキシカルボン酸あるいは芳香族イミ
ド化合物などを本発明の目的を損なわない程度の少割合
でさらに共重合せしめることができる。In addition, when polycondensing the liquid crystal polyester used in the present invention, in addition to the components constituting the structural units (I) to (1v), isophthalic acid, 3.3-monodiphenyldicarboxylic acid, 2.2-- Aromatic dicarboxylic acids such as diphenyldicarboxylic acid, aliphatic dicarboxylic acids such as adipic acid, azelaic acid, sebacic acid, dodecanedioic acid, alicyclic dicarboxylic acids such as hexahydroterephthalic acid, chlorohydroquinone, methylhydroquinone, 4.4 Aromatic diols such as -1-dihydroxydiphenyl sulfide, 4.4-1-dihydroxybenzophenone, 4.4'-dihydroxydiphenyl ether, 1,4-butanediol,
1.6-hexanediol, neopentyl glycol,
Aliphatic, cycloaliphatic diols such as 1,4-cyclohexanediol, 1,4-cyclohexane dimetatool and m
Aromatic hydroxycarboxylic acids such as -hydroxybenzoic acid and 2,6-hydroxynaphthoic acid, or aromatic imide compounds can be further copolymerized in a small proportion so as not to impair the object of the present invention.
本発明において使用する液晶ポリエステルに有機難燃剤
を添加することにより、難燃性を付与することが可能で
あり、本発明のディスク基板の用途、目的に対し難燃性
を必要とする場合には、有機難燃剤を添加し、難燃性液
晶ポリエステル組成物として使用するのが好ましい。By adding an organic flame retardant to the liquid crystal polyester used in the present invention, it is possible to impart flame retardancy, and if flame retardancy is required for the use or purpose of the disk substrate of the present invention, It is preferable to add an organic flame retardant and use it as a flame retardant liquid crystal polyester composition.
本発明において使用できる有機難燃剤とは、有機臭素化
合物および／または有機リン化合物などであり、有機臭
素化合物は分子中に臭素原子を有するものであり、有機
臭素化合物とじては、臭素含有量２０重量％以上のもの
が好ましい。具体的にはデカブロモジフェニルエーテル
、エチレンビス−（テトラブロモフタルイミド）等の低
分子量有機臭素化合物、臭素化ポリカーボネート（例え
ば臭素化ビスフェノールＡを原料として製造されたポリ
カーボネートオリゴマーあるいはそのビスフェノールＡ
との共重合物）、臭素化エポキシ化合物（例えば臭素化
ビスフェノールＡとエピクロルヒドリンとの反応によっ
て製造されるジェポキシ化合物や臭素化フェノール類と
エピクロルヒドリンとの反応によって得られるモノエポ
キシ化合物）、ポリ（臭素化ベンジルアクリレート）、
臭素化ポリフェニレンエーテル、臭素化ビスフェノール
Ａ、塩化シアヌルおよび臭素化フェノールの縮合物、臭
素化ポリスチレン、架橋臭素化ポリスチレン、架橋臭素
化ポリα−メチルスチレン等のハロゲン化されたポリマ
ーやオリゴマーあるいは、これらの混合物が挙げられ、
なかでもエチレンビス−（テトラブロモフタルイミド）
、臭素化エポキシオリゴマーまたはポリマー、臭素化ポ
リスチレン、架橋臭素化ポリスチレン、臭素化ポリフェ
ニレンエーテルおよび臭素化ポリカーボネートが好まし
く、特にエチレンビス−（テトラブロモフタルイミド）
、臭素化ポリスチレン、臭素化ポリカーボネートが特に
好ましく使用できる。The organic flame retardant that can be used in the present invention is an organic bromine compound and/or an organic phosphorus compound, and the organic bromine compound has a bromine atom in the molecule. It is preferable that the amount is % by weight or more. Specifically, low molecular weight organic bromine compounds such as decabromodiphenyl ether and ethylene bis(tetrabromophthalimide), brominated polycarbonates (for example, polycarbonate oligomers produced from brominated bisphenol A or their bisphenol A)
brominated epoxy compounds (for example, jepoxy compounds produced by the reaction of brominated bisphenol A and epichlorohydrin, and monoepoxy compounds obtained by the reaction of brominated phenols and epichlorohydrin), poly(brominated benzyl acrylate),
Halogenated polymers and oligomers such as brominated polyphenylene ether, brominated bisphenol A, condensates of cyanuric chloride and brominated phenol, brominated polystyrene, crosslinked brominated polystyrene, crosslinked brominated polyα-methylstyrene, or Mixtures are mentioned;
Among them, ethylene bis(tetrabromophthalimide)
, brominated epoxy oligomers or polymers, brominated polystyrene, crosslinked brominated polystyrene, brominated polyphenylene ethers and brominated polycarbonates are preferred, especially ethylene bis-(tetrabromophthalimide)
, brominated polystyrene, and brominated polycarbonate are particularly preferably used.
これらの有機難燃剤の添加量は液晶ポリエステル１００
重量部当り０．２〜３０重量部が好ましく、より好まし
くは１〜２０重量部であるが、難燃性は液晶ポリエステ
ルの前記構造単位（Ｉ（［）の共重合量と密接な関係が
あるため、次のような添加量にするのが好ましい。すな
わち有機臭素化合物の添加量は液晶ポリエステル中の構
造単位（ＩＩＩ）の１００重量部に対して６０〜２８０
重量部が好ましく、１００〜２００重量部が特に好まし
い。The amount of these organic flame retardants added is 100% of liquid crystal polyester.
It is preferably 0.2 to 30 parts by weight, more preferably 1 to 20 parts by weight, but flame retardancy is closely related to the copolymerization amount of the structural unit (I ([)) of the liquid crystal polyester. Therefore, it is preferable to add the organic bromine compound in the following amount: 60 to 280 parts by weight of the organic bromine compound per 100 parts by weight of the structural unit (III) in the liquid crystal polyester.
Parts by weight are preferred, and 100 to 200 parts by weight are particularly preferred.
一方、本発明において用いられる有機リン化合物は、分
子中にリン原子を有するものであり、リン酸、亜リン酸
、ホスホン酸などから合成される化合物、ホスフィン、
ホスフィンオキシト、ホスホランなどの化合物や下記構
造式の化合物およびこれら化合物を少なくとも一成分と
して含有するポリマーである。On the other hand, the organic phosphorus compound used in the present invention has a phosphorus atom in its molecule, and is a compound synthesized from phosphoric acid, phosphorous acid, phosphonic acid, etc., phosphine,
Compounds such as phosphine oxyto and phosphorane, compounds having the following structural formulas, and polymers containing these compounds as at least one component.
このポリマーとしては下記構造単位からなるポリマーを
挙げることができる。Examples of this polymer include polymers having the following structural units.
そしてこれらのうち最も好ましい有機リン化合物は下記
ポリマーである。Among these, the most preferred organic phosphorus compounds are the following polymers.
なおこれらの有機リン化合物は一部が金属塩であっても
よい。この有機リン化合物の添加量は構造式（Ｉ）、（
ＩＩ）、（ＩＩＩ）および（ＩＶ）からなる液晶ポリエ
ステル１００重量部に対して０．２〜３０重量部、好ま
しくは０．５〜１５重量部であり、液晶ポリエステル中
の構造単位（ＩＩＩ）の１００重量部に対して２〜１５
０重量部が好ましく、１０〜１００重量部が特に好まし
い。Note that some of these organic phosphorus compounds may be metal salts. The amount of this organic phosphorus compound added is determined by the structural formula (I), (
It is 0.2 to 30 parts by weight, preferably 0.5 to 15 parts by weight, based on 100 parts by weight of the liquid crystal polyester consisting of II), (III) and (IV), and the structural unit (III) in the liquid crystal polyester is 2-15 per 100 parts by weight
0 parts by weight is preferred, and 10 to 100 parts by weight are particularly preferred.
また本発明において、有機リン化合物が下記構造単位か
らなるポリマーのように臭素を含有した有機リン化合物
であってもよい。Further, in the present invention, the organic phosphorus compound may be an organic phosphorus compound containing bromine such as a polymer consisting of the following structural unit.
本発明の液晶ポリエステルは構造単位（ＩＩＩ）が構造
単位［（Ｉ＞＋ （ｆｆ＞＋ （ＩＩＩ） ］の５〜２
５モル％であるため、前記の難燃剤添加量でＵＬ９４規
格の垂直型燃焼テスト（ＡＳＴＭＤ７９０規格） で１
／３２”厚みでＶ−ｏにすることができる。構造単位（
ＩＩＩ）が５モル％未溝では、液晶ポリエステルの融点
が高くなるため難燃剤によって溶融時に液晶ポリエステ
ルが分解し重合度低下が起こり、充填剤を添加しても機
械物性が低下したり、燃焼時に成形品がドリップしたり
して好ましくない。一方、構造単位（Ｉ［Ｉ）が２５モ
ル％より多いと荷重たわみ温度などの耐熱性が大きく低
下するのみならず、難燃性を付与するには多量の有機臭
素化合物またはリン化合物を添加する必要があったり、
アンチモン化合物などの難燃助剤をさらに添加する必要
があるため、耐熱性や機械的特性が大きく低下するため
好ましくない。In the liquid crystal polyester of the present invention, the structural unit (III) is 5 to 2 of the structural unit [(I>+ (ff>+ (III))].
Since it is 5 mol%, the flame retardant added amount above 1 in the UL94 standard vertical combustion test (ASTMD790 standard).
/32" thickness can be made into V-o. Structural unit (
If 5 mol% of III) is not present in the groove, the melting point of the liquid crystal polyester becomes high, so the flame retardant decomposes the liquid crystal polyester during melting, resulting in a decrease in the polymerization degree. The molded product may drip, which is undesirable. On the other hand, if the structural unit (I[I) is more than 25 mol%, not only will heat resistance such as deflection temperature under load be greatly reduced, but also a large amount of organic bromine compound or phosphorus compound must be added to impart flame retardance. There is a need or
Since it is necessary to further add a flame retardant aid such as an antimony compound, heat resistance and mechanical properties are significantly reduced, which is not preferable.
本発明に使用する液晶ポリエステル、および難燃性液晶
ポリエステル組成物に対してさらに充填剤を含有させた
組成物がより好ましく本発明で使用できる。充填剤を添
加する場合、その添加量は液晶ポリエステル１００重量
部に対して２００重量部以下が好ましく、１５〜１００
重量部が特に好ましい。A composition in which a filler is further contained in the liquid crystal polyester used in the present invention and a flame-retardant liquid crystal polyester composition can be more preferably used in the present invention. When adding a filler, the amount added is preferably 200 parts by weight or less, and 15 to 100 parts by weight, based on 100 parts by weight of the liquid crystal polyester.
Parts by weight are particularly preferred.
本発明において用いることができる充填剤としては、ガ
ラス繊維、炭素繊維、芳香族ポリアミド繊維、チタン酸
カリウム繊維、石コウ繊維、黄銅繊維、ステンレス繊維
、スチール繊維、セラミックス繊維、ボロンウィスカ繊
維、マイカ、タルク、シリカ、炭酸カルシウム、ガラス
ピーズ、ガラスフレーク、ガラスマイクロバルーン、ク
レー、ワラステナイト、酸化チタン等の繊維状、粉状、
粒状あるいは板状の無機フィラーが挙げられる。Fillers that can be used in the present invention include glass fibers, carbon fibers, aromatic polyamide fibers, potassium titanate fibers, gypsum fibers, brass fibers, stainless steel fibers, steel fibers, ceramic fibers, boron whisker fibers, mica, Fibrous and powdered materials such as talc, silica, calcium carbonate, glass peas, glass flakes, glass microballoons, clay, wollastenite, titanium oxide, etc.
Examples include granular or plate-shaped inorganic fillers.
上記充填剤中、ガラス繊維が好ましく使用される。ガラ
ス繊維の種類は、一般に樹脂の強化用に用いるものなら
特に限定はなく、例えば長繊維タイプや短繊維タイプの
チョップトストランド、ミルドファイバーなどから選択
して用いることができる。また、ガラス繊維はエチレン
／酢酸ビニル共重合体などの熱可塑性樹脂、エポキシ樹
脂などの熱硬化性樹脂で被覆あるいは集束されていても
よく、またシラン系、チタネート系などのカップリング
剤、その他の表面処理剤で処理されていてもよい。Among the fillers mentioned above, glass fibers are preferably used. The type of glass fiber is not particularly limited as long as it is generally used for reinforcing resins, and can be selected from, for example, long fiber type, short fiber type chopped strand, milled fiber, etc. Additionally, the glass fibers may be coated or bundled with a thermoplastic resin such as ethylene/vinyl acetate copolymer, a thermosetting resin such as an epoxy resin, or a coupling agent such as a silane type or titanate type, or other It may be treated with a surface treatment agent.
更に、本発明の組成物には、本発明の目的を損なわない
程度の範囲で、酸化防止剤および熱安定剤（たとえばヒ
ンダードフェノール、ヒドロキノン、ホスファイト類お
よびこれらの置換体など）、紫外線吸収剤（たとえばレ
ゾルシノール、サリテレート、ベンゾトリアゾール、ベ
ンゾフェノンなど）、滑剤および離型剤（モンタン酸お
よびその塩、そのエステル、そのハーフエステル、ステ
アリルアルコール、ステアラミドおよびポリエチレンワ
ックスなど）、染料（たとえばニトロシンなど）および
顔料（たとえば硫化カドミウム、フタロシアニン、カー
ボンブラックなど）を含む着色剤、可塑剤、帯電防止剤
などの通常の添加剤や他の熱可塑性樹脂を添加して、所
定の特性を付与することができる。Furthermore, the composition of the present invention may contain antioxidants, heat stabilizers (for example, hindered phenol, hydroquinone, phosphites, and substituted products thereof), ultraviolet absorbers, etc., to the extent that the objects of the present invention are not impaired. agents (such as resorcinol, saliterates, benzotriazoles, benzophenones, etc.), lubricants and mold release agents (such as montanic acid and its salts, its esters, its half esters, stearyl alcohol, stearamide and polyethylene waxes), dyes (such as nitrosine) and Conventional additives such as colorants, including pigments (e.g. cadmium sulfide, phthalocyanines, carbon black, etc.), plasticizers, antistatic agents, and other thermoplastics can be added to impart desired properties.
本発明の樹脂組成物は溶融混練することが好ましく、溶
融混練には公知の方法を用いることができる。たとえば
、バンバリーミキサ−、ゴムロール機、ニーダ−５車軸
もしくは二軸押出機などを用い、２００〜３５０℃の温
度で溶融混練して組成物とすることができる。The resin composition of the present invention is preferably melt-kneaded, and known methods can be used for melt-kneading. For example, the composition can be prepared by melt-kneading at a temperature of 200 to 350°C using a Banbury mixer, a rubber roll machine, a kneader with 5 axles, a twin-screw extruder, or the like.
〈実施例〉 以下、実施例により本発明を詳述する。<Example> Hereinafter, the present invention will be explained in detail with reference to Examples.
参考例１
ｐ−ヒドロキシ安息香酸８８１重量部、４゜４゛−ジヒ
ドロキシビフェニル１５８重量部、無水酢酸９０７重量
部、テレフタル酸１４１重量部および固有粘度が約０．
６ｄｊｌ／ｇのポリエチレンテレフタレート２４５重量
部を攪拌翼、留出管を備えた反応容器に仕込み、次の条
件で脱酢酸重縮合を行った。Reference Example 1 881 parts by weight of p-hydroxybenzoic acid, 158 parts by weight of 4゜4゛-dihydroxybiphenyl, 907 parts by weight of acetic anhydride, 141 parts by weight of terephthalic acid, and an intrinsic viscosity of about 0.
245 parts by weight of polyethylene terephthalate (6 djl/g) was charged into a reaction vessel equipped with a stirring blade and a distillation tube, and acetic acid depolycondensation was performed under the following conditions.
まず窒素ガス雰囲気下に１００〜２５０℃で５時間、２
５０〜３００℃で１．５時間反応させたのち、３００℃
、１時間で０．５ｍｍＨ（］に減圧し、さらに２．２５
時間反応させ、重縮合を完結させたところ、はぼ理論量
の酢酸が留出し、下記の理論構造式を有する樹脂（ａ）
を得た。First, under a nitrogen gas atmosphere at 100 to 250°C for 5 hours,
After reacting at 50-300℃ for 1.5 hours, 300℃
, the pressure was reduced to 0.5 mmH (] in 1 hour, and the pressure was further reduced to 2.25
When the reaction was carried out for a period of time to complete the polycondensation, almost a theoretical amount of acetic acid was distilled out, resulting in a resin (a) having the following theoretical structural formula.
I got it.
＋０ＣＨ２ＣＨ，Ｏ→−７／
ｋ／ｌ ／ｍ／ｎ＝７５／１０／１５／２５また、この
ポリエステルを偏光顕微鏡の試料台にのせ、昇温しで、
光学異方性の確認を行った結果、液晶開始温度は２６４
℃であり、良好な光学異方性を示した。このポリエステ
ルの対数粘度（０，１ｇ／ｄＪＩの濃度でペンタフルオ
ロフェノール中、６０℃で測定）は１．９６ｄ１／「で
あり、３０４℃、すり速度１０００（１／秒）での溶融
粘度は９１０ポイズであった。+0CH2CH,O→-7/k/l/m/n=75/10/15/25 Also, place this polyester on the sample stage of a polarizing microscope and raise the temperature.
As a result of confirming the optical anisotropy, the liquid crystal starting temperature was 264
℃, showing good optical anisotropy. The logarithmic viscosity of this polyester (measured at 60°C in pentafluorophenol at a concentration of 0.1 g/dJI) is 1.96 d1/', and the melt viscosity at 304°C and a sliding rate of 1000 (1/s) is 910 It was Poise.
実施例１
参考例１の液晶ポリエステル（ａ）１００重量部に対し
て、臭素化ポリスチレン（８産フェロ−（株）製“パイ
ロチエツク”６８ＰＢ）８゜５重量部をリボンブレンダ
ーで混合後、４０ｍｍφベント付押出機を使用し、３０
０℃で溶融混練−ベレット化した０次に得られたベレッ
トを住友ネスタール射出成形機プロマット（住友重機械
工業（株）製）に供し、シリンダー温度は２９５℃、金
型温度９０℃で直径１００閣、厚さ１．２ｍの円形状の
ディスク基板を成形した。Example 1 100 parts by weight of the liquid crystal polyester (a) of Reference Example 1 was mixed with 8.5 parts by weight of brominated polystyrene (“Pyrocheck” 68PB manufactured by Yasan Ferro Co., Ltd.) using a ribbon blender, and then mixed with a 40 mm diameter vent. Using an extruder with
The pellet obtained by melt-kneading and pelletizing at 0°C was subjected to a Sumitomo Nestal injection molding machine Promat (manufactured by Sumitomo Heavy Industries, Ltd.), and the cylinder temperature was 295°C and the mold temperature was 90°C. A circular disk substrate of 100 parts and 1.2 m thick was molded.
この成形品の表面は優れた鏡面性を有していた。The surface of this molded article had excellent specularity.
また、この成形機で燃焼試験片（１／３２“および１／
８″Ｘ１／２”Ｘ５″）を成形し、ＵＬ９４規格にした
がって垂直型燃焼テストを行い、いずれもＶ−Ｏであっ
た。In addition, combustion test pieces (1/32" and 1/32"
8''X1/2''X5'') was molded and subjected to a vertical combustion test according to UL94 standards, and all were VO.
〈発明の効果〉
本発明によれば成形加工性、寸法精度、機械特性に優れ
たディスク基板、すなわち磁気ディスク基板、光学ディ
スク等の基板が得られる。<Effects of the Invention> According to the present invention, a disk substrate having excellent moldability, dimensional accuracy, and mechanical properties, that is, a substrate for a magnetic disk substrate, an optical disk, etc., can be obtained.
特許出願大東し株式会社Patent application Daitoshi Co., Ltd.
Claims (2)
IV）からなり、構造単位［（ I ）＋（II）］が［（ I
）＋（II）＋（III）］の７５〜９５モル％、構造単位
（III）が［（ I ）＋（II）＋（III）］の２５〜５モ
ル％であり、構造単位（ I ）／（II）のモル比が７５
／２５〜９５／５である溶融成形可能な液晶ポリエステ
ルからなるディスク基板。 ▲数式、化学式、表等があります▼（ I ） ▲数式、化学式、表等があります▼（II） ▲数式、化学式、表等があります▼（III） ▲数式、化学式、表等があります▼（IV） （ただし式中のＲ＿１は▲数式、化学式、表等がありま
す▼、 ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼、▲数式、化学式、表等があります▼
、 ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼ から選ばれた１種以上の基を、Ｒ＿２は ▲数式、化学式、表等があります▼、▲数式、化学式、
表等があります▼、▲数式、化学式、表等があります▼
、 ▲数式、化学式、表等があります▼、 ▲数式、化学式、表等があります▼から選ばれた１種以
上 の基を示す。また、式中のＸは水素原子または塩素原子
を示す。）(1) The following structural units (I), (II), (III) and (
IV), and the structural unit [( I ) + (II)] is [( I
)+(II)+(III)], the structural unit (III) is 25-5 mol% of [(I)+(II)+(III)], and the structural unit (I) /(II) molar ratio is 75
A disk substrate made of melt-formable liquid crystal polyester having a molecular weight of /25 to 95/5. ▲There are mathematical formulas, chemical formulas, tables, etc.▼(I) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(II) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(III) ▲There are mathematical formulas, chemical formulas, tables, etc.▼( IV) (However, R_1 in the formula is ▲There are mathematical formulas, chemical formulas, tables, etc.▼, ▲There are mathematical formulas, chemical formulas, tables, etc.▼, ▲Mathematical formulas, chemical formulas,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
, ▲There are mathematical formulas, chemical formulas, tables, etc.▼,▲Mathematical formulas, chemical formulas,
There are tables, etc. ▼ R_2 is ▲ there are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ mathematical formulas, chemical formulas,
There are tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼
, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ , ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ Indicates one or more groups selected from. Moreover, X in the formula represents a hydrogen atom or a chlorine atom. )
部に対して、有機難燃剤０．２〜３０重量部を含有せし
めた難燃性液晶ポリエステル組成物からなるディスク基
板。(2) A disk substrate made of a flame-retardant liquid crystal polyester composition containing 0.2 to 30 parts by weight of an organic flame retardant based on 100 parts by weight of the liquid crystal polyester according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287662A JPH03147517A (en) | 1989-11-02 | 1989-11-02 | Disk substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1287662A JPH03147517A (en) | 1989-11-02 | 1989-11-02 | Disk substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03147517A true JPH03147517A (en) | 1991-06-24 |
Family
ID=17720106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1287662A Pending JPH03147517A (en) | 1989-11-02 | 1989-11-02 | Disk substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03147517A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104891A (en) * | 1991-10-21 | 1993-04-27 | Teijin Ltd | Magnetic card |
| JP2002511513A (en) * | 1998-04-09 | 2002-04-16 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Low viscosity liquid crystal polymer composition |
-
1989
- 1989-11-02 JP JP1287662A patent/JPH03147517A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104891A (en) * | 1991-10-21 | 1993-04-27 | Teijin Ltd | Magnetic card |
| JP2002511513A (en) * | 1998-04-09 | 2002-04-16 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Low viscosity liquid crystal polymer composition |
| JP2010196074A (en) * | 1998-04-09 | 2010-09-09 | E I Du Pont De Nemours & Co | Low viscosity liquid crystalline polymer composition |
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