JPH0314246A - Wire bonding positioning mechanism - Google Patents
Wire bonding positioning mechanismInfo
- Publication number
- JPH0314246A JPH0314246A JP1151253A JP15125389A JPH0314246A JP H0314246 A JPH0314246 A JP H0314246A JP 1151253 A JP1151253 A JP 1151253A JP 15125389 A JP15125389 A JP 15125389A JP H0314246 A JPH0314246 A JP H0314246A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pin
- fine movement
- positioning mechanism
- slightly moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
ワイヤボンダにおけるボンディング位置決め機構に関し
、
ピン保持部材が駆動部材に対して制御性よく動くように
して、種々の仕様のリードフレームに対応できることを
目的とし、
チップがマウントされたリードフレームをワイヤボンダ
に位置決めするワイヤボンディング位置決め機構であっ
て、前記リードフレームの送り孔に挿入されるピンが植
えられたピン保持部材と、前記ピン保持部材が交換可能
に固定された微動部材と、上下に直線駆動される駆動部
材と、前記微動部材と駆動部材との間に設けられた微動
手段とを有し、前記微動部材の側面が、駆動部材の側面
に対して、リードフレームの移動方向と平行に摺動可能
に衝合され、かつ微動手段によって、制御性よく動かさ
れるように構成する。[Detailed Description of the Invention] [Summary] Regarding a bonding positioning mechanism in a wire bonder, the purpose of this invention is to allow a pin holding member to move relative to a driving member with good controllability and to be compatible with lead frames of various specifications. A wire bonding positioning mechanism for positioning a mounted lead frame on a wire bonder, the mechanism comprising: a pin holding member in which a pin to be inserted into a feed hole of the lead frame is planted; and a fine movement to which the pin holding member is fixed in a replaceable manner. a drive member linearly driven up and down, and fine movement means provided between the fine movement member and the drive member, the side surface of the fine movement member being aligned with the side surface of the drive member in a lead frame. are slidably abutted in parallel to the direction of movement, and are configured to be moved with good controllability by fine movement means.
本発明は、ワイヤボンダにおけるボンディング位置決め
機構に関する。The present invention relates to a bonding positioning mechanism in a wire bonder.
近年、半導体集積回路(IC)の進展は目ざましく、い
ろいろな産業分野でIC化が行われるにつれて、ICの
生産量は飛躍的に拡大している。In recent years, the development of semiconductor integrated circuits (ICs) has been remarkable, and as ICs are being used in various industrial fields, the production volume of ICs is increasing dramatically.
それに伴って、ウェーハの段階から半導体装置として製
品に仕上げるまでの一連の製造プロセスの製造技術の重
要性が益々増大している。Along with this, the importance of manufacturing technology for a series of manufacturing processes from the wafer stage to the finished product as a semiconductor device is increasing.
ICの製造プロセスの中で、ウェーハの段階から多数の
微細な素子を形成するまでのウェーハプロセスにおいて
は、ウェーハの寸法を大きくしたり、回路パターンをよ
り微細化したりして、生産性の向上が図られている。In the IC manufacturing process, from the wafer stage to the formation of a large number of minute elements, productivity can be improved by increasing the size of the wafer or making the circuit pattern smaller. It is planned.
ICの製造プロセスの中には、多数の素子が形成された
ウェーハをチップに切断し、そのチップを、まず、リー
ドフレームと呼ばれる枠状の端子に固着するダイボンデ
ィング(マウント)工程とか、その次に、チップの端子
とリードフレームの端子とを、細いワイヤで結線するワ
イヤボンディング工程などがある。The IC manufacturing process includes a die bonding (mounting) process, in which a wafer with a large number of elements formed thereon is cut into chips, and the chips are first fixed to a frame-shaped terminal called a lead frame. Another example is a wire bonding process in which the terminals of the chip and the terminals of the lead frame are connected using thin wires.
これらの工程は、何れも機械的動作を伴って行われる作
業である。All of these steps are operations that involve mechanical operations.
そして、特にワイヤボンディング工程においては、IC
の高密度化に伴って、ボンディングを要する端子の数が
増えているので、装置の加工精度を上げたり、加工速度
をあげたりして、生産性の向上を図ることが精力的に行
われている。Especially in the wire bonding process, IC
With the increasing density of devices, the number of terminals that require bonding is increasing, so efforts are being made to improve productivity by increasing the processing accuracy of equipment and increasing processing speed. There is.
一般に、ワイヤボンディングにおいては、ワイヤボンダ
と呼ばれる装置自体の効率化に加えて、そのワイヤボン
ダに被加工物であるチップがマウントされたリードフレ
ームを、如何に効率よく運んできて決められた位置に支
持するかも、ボンディング工程上無視できない。In general, in wire bonding, in addition to improving the efficiency of the device itself called a wire bonder, it is also important to efficiently transport and support the lead frame on which the workpiece (chip) is mounted to the wire bonder at a predetermined position. However, this cannot be ignored in the bonding process.
しかも、最近では、IC自体の多用化に伴って、チップ
の品種が多くなり、しかも生産数量が少ない注文生産が
増大傾向にある。Moreover, as ICs themselves have become more widely used, there has been an increase in the number of types of chips, and there has been an increasing trend toward order-made products with small production quantities.
そこで、ワイヤボンダにおける生産性にとって、チップ
の品種が異なるごとに、異なった仕様のリードフレーム
の位置決めが高精度に、しかも安定に行えることが、重
要な課題となってきた。Therefore, for productivity in wire bonders, it has become an important issue to be able to accurately and stably position lead frames of different specifications for different types of chips.
ICの製造プロセスにおいて、ウェーハから個々のチッ
プにスクライブされたチップは、ダイボンダと呼ばれる
装置によって、長尺のリードフレームのヘッドと呼ばれ
るチップの載置部に1個ずつマウントされる。In the IC manufacturing process, individual chips are scribed from a wafer and are mounted one by one on a chip mounting section called a head of a long lead frame using a device called a die bonder.
そして、ヘッドにチップがマウントされた数個分の長さ
に切断されて、これをシートと呼び、1シート、2シー
トなどと数えられる。Then, it is cut into lengths corresponding to several chips mounted on the head, and these are called sheets, which are counted as 1 sheet, 2 sheets, etc.
シートの長さは、リードフレームの仕様によって異なり
一定ではない。The length of the sheet varies depending on the specifications of the lead frame and is not constant.
しかし、その後の工程においては、このシート単位で取
り扱われ、例えば、マガジンに格納されて運ぶとか、樹
脂封止に際してはローディングフレームに取り付けられ
たりする。However, in the subsequent process, the sheet is handled in units of sheets, and for example, it is stored in a magazine and transported, or it is attached to a loading frame during resin sealing.
ところで、ワイヤボンダにおいても、チップは、このシ
ート単位のリードフレームに載つかった状態で搬入され
る。Incidentally, also in the wire bonder, chips are carried in a state in which they are placed on the lead frame in units of sheets.
そして、所定の位置に位置決めされて停止し、それぞれ
のチップのワイヤボンディングが終わるごとに間欠的に
前進し、ワイヤボンディング作業が1シ一ト分が全部路
わると、チップはリードフレームに載つかった状態で搬
出される。Then, it stops when it is positioned at a predetermined position, and moves forward intermittently each time the wire bonding of each chip is completed, and when the wire bonding work has been completed for one sheet, the chip is placed on the lead frame. It will be transported out in the same condition.
第2図は従来の位置決め機構の説明図である。FIG. 2 is an explanatory diagram of a conventional positioning mechanism.
同図において、リードフレーム送り機構10は、図示し
てないカムなどの駆動源によって前進・後退および上昇
・下降の直線運動を行う送り軸11と、その送り軸11
にアーム12を介して固定されている爪13と突起14
、および緩衝部材15を介して突起14が突き当たると
前進している送り軸11が停止するストッパ16とから
構成されている。In the figure, the lead frame feed mechanism 10 includes a feed shaft 11 that performs forward/backward, upward/downward linear motion by a drive source such as a cam (not shown), and the feed shaft 11.
A claw 13 and a protrusion 14 are fixed via an arm 12 to
, and a stopper 16 that stops the advancing feed shaft 11 when the protrusion 14 abuts against it via the buffer member 15.
そして、チップ2がマウントされているリードフレーム
3は、リードフレーム送り機構10の爪13がリードフ
レーム3の送り孔4に挿入されることによって、間欠的
に搬送される。The lead frame 3 on which the chip 2 is mounted is intermittently transported by inserting the claws 13 of the lead frame transport mechanism 10 into the feed holes 4 of the lead frame 3.
すなわち、送り軸11は、下降して爪13が送り孔4に
挿入されると前進し、リードフレーム3を前に送り出す
。That is, when the feed shaft 11 descends and the pawl 13 is inserted into the feed hole 4, it moves forward and feeds the lead frame 3 forward.
そして、送り軸11は、突起14が緩衝部材15を介し
てストンパ16に突き当たると停止し、−旦上昇してか
ら後退し、元の位置に戻る。Then, the feed shaft 11 stops when the protrusion 14 hits the stopper 16 via the buffer member 15, rises once, then retreats, and returns to its original position.
こ\で、再び下降して、リードフレーム3を前進させる
動作を繰り返す。At this point, the lead frame 3 is lowered again and the operation of advancing the lead frame 3 is repeated.
ストッパ16の位置は、調整ねじ17によって、ある程
度調整可能にできている。The position of the stopper 16 can be adjusted to some extent by an adjusting screw 17.
しかし、このリードフレーム送り機構10によって、前
進して停止したリードフレーム3の停止位置の精度は、
例えば、±0 、25mm程度で粗っぽく、そのま−ワ
イヤボンディングを実施できるような位置決め精度には
なっていない。However, the accuracy of the stop position of the lead frame 3 that has moved forward and stopped due to this lead frame feeding mechanism 10 is
For example, the positioning accuracy is roughly ±0.25 mm, and the positioning accuracy is not high enough to perform direct wire bonding.
一方、位置決め機構1は、リードフレーム3の送り孔4
に対して、精度よく嵌合するピン5が植えられたピン保
持部材6と、このピン保持部材6が載つかって、図示し
てないカムなどの駆動源によって、上昇・下降する駆動
部材8とで構成されている。On the other hand, the positioning mechanism 1 has a feed hole 4 in the lead frame 3.
, a pin holding member 6 on which a pin 5 that fits accurately is planted, and a driving member 8 on which this pin holding member 6 is placed and which is raised and lowered by a driving source such as a cam (not shown). It consists of
この位置決め機構1は、μm単位の煩い精度が必要なの
で、ピン保持部材6と駆動部材8とは、例えば、ノック
ピンで強固に支持されている。Since this positioning mechanism 1 requires precision on the order of μm, the pin holding member 6 and the driving member 8 are firmly supported by, for example, knock pins.
この位置決め機構1は、リードフレーム3がリードフレ
ーム送り機構10に送られて前進して粗っぽ(停止する
と、直ちに上昇を開始する。This positioning mechanism 1 immediately starts rising when the lead frame 3 is sent to the lead frame feeding mechanism 10, advances and roughly stops.
そして、精度よ(加工されたピン5が、リードフレーム
3の送り孔4に嵌合して位置決めするが、その位置決め
精度は、例えば、±8μmといった高い精度である。The processed pin 5 is fitted into the feed hole 4 of the lead frame 3 for positioning, and the positioning accuracy is as high as, for example, ±8 μm.
精度よく位置決めされたリードフレーム3は、ワイヤボ
ンディングの作業中に動かないように、図示してないシ
ートクランパによって上から抑えられる。The accurately positioned lead frame 3 is held down from above by a sheet clamper (not shown) so that it does not move during the wire bonding operation.
このようにして、チップ2がマウントされたリードフレ
ーム3は、ワイヤポンダの中において、リードフレーム
送り機構10と位置決め機構1との協業によって、所定
の位置に精度よく位置決めされる。In this way, the lead frame 3 on which the chip 2 is mounted is precisely positioned at a predetermined position in the wireponder by the cooperation of the lead frame feeding mechanism 10 and the positioning mechanism 1.
ところで、チップ2の仕様が違うと、それにつれて、い
ろいろ仕様の異なるリードフレーム3が用いられる。By the way, if the specifications of the chip 2 differ, lead frames 3 with various specifications are used accordingly.
そして、この仕様の中で、ストロークと呼ばれる単位、
つまり1つのチップが専有する1素子分のリードフレー
ム3の長さが変わると、それに伴って送り孔4の間隔が
変わる。And within this specification, a unit called a stroke,
In other words, when the length of the lead frame 3 corresponding to one element occupied by one chip changes, the interval between the feed holes 4 changes accordingly.
そうすると、当然のことながら送りピッチを変更する必
要があり、これは、リードフレーム送り機構10の前進
・後退の距離、つまりストロークを変更することを意味
している。Naturally, then, it is necessary to change the feed pitch, which means changing the forward and backward distance of the lead frame feed mechanism 10, that is, the stroke.
第3図はストロークの異なるリードフレームの例を示し
、同図(A)はフラットパッケージ用、同図(B)はD
T P (Dual In1ine Packag
e)用である。Figure 3 shows examples of lead frames with different strokes; (A) is for a flat package, and (B) is for a D
T P (Dual In1ine Packag)
e) It is for.
同図において、L、とL2は、それぞれリードフレーム
3のストロークである。In the figure, L and L2 are the strokes of the lead frame 3, respectively.
このストロークは、チップの大きさとか、端子の数や配
置とか、パッケージの仕方などが異なると、それにつれ
て異なった値となる。This stroke takes a different value depending on the size of the chip, the number and arrangement of terminals, the way it is packaged, etc.
例えば、Llは26.42 mmで、L2は14mmと
いった値である。For example, Ll is 26.42 mm and L2 is 14 mm.
さて、第2図に話を戻す。Now, let's return to Figure 2.
こ−で、ストロークを変更する量がそれ程大きくな(、
リードフレーム送り機構10のストッパ16の調整ねじ
17の調整範囲内であり、しかもリードフレーム3の停
止位置が、送り孔4に対して変化しない場合には、スト
ロークの補正を、ストッパ16の調整ねじ17によって
行うことができる。This way, the amount to change the stroke is not that large (,
If it is within the adjustment range of the adjustment screw 17 of the stopper 16 of the lead frame feeding mechanism 10 and the stop position of the lead frame 3 does not change with respect to the feed hole 4, the stroke is corrected by adjusting the adjustment screw 17 of the stopper 16. 17.
ところが、ストロークの変更ばかりでなく、停止位置も
変更しなければならないときには、位置決め機構lのピ
ン5の位置を変更しなければならない。However, when not only the stroke but also the stop position must be changed, the position of the pin 5 of the positioning mechanism 1 must be changed.
このピン5の位置変更は、ピン保持部材6の交換によっ
て行うことになる。The position of the pin 5 is changed by replacing the pin holding member 6.
しかし、従来の位置決め機構1においては、ピン保持部
材6と駆動部材8とがノックピンによって固定されてい
るので、ピン保持部材6の交換は手間が掛り厄介である
。However, in the conventional positioning mechanism 1, since the pin holding member 6 and the driving member 8 are fixed by a knock pin, replacing the pin holding member 6 is time-consuming and troublesome.
このことは、多品種少量生産を余儀無くされるカスタム
設計などのICの製造工程においては、ワイヤボンダの
稼働率を悪くし、生産性を低下させる原因となる。This causes poor operation rate of the wire bonder and lowers productivity in IC manufacturing processes such as custom designs that require high-mix, low-volume production.
0
〔発明が解決しようとする課題〕
以上述べたように、ワイヤボンダにおける従来のリード
フレームの位置決め機構は、リードフレームの送り孔と
嵌合するピンが植えられたピン保持部材と、このピン保
持部材を上下動させる駆動部材とが、高精度を得るため
にノックピンなどによって強固に固定されていた。0 [Problems to be Solved by the Invention] As described above, the conventional positioning mechanism for a lead frame in a wire bonder consists of a pin holding member in which a pin that fits into the feed hole of the lead frame is installed, and this pin holding member. The drive member that moves it up and down was firmly fixed with a dowel pin or the like to achieve high accuracy.
従って、チップの品種の違いによって、用いられるリー
ドフレームの仕様が異なるとき、ピンの位置を変更しよ
うとすると、交換の厄介なピン保持部材を、その都度、
手間を掛けて交換しなければならなかった。Therefore, when the specification of the lead frame used differs depending on the type of chip, when trying to change the pin position, the pin holding member, which is difficult to replace, must be replaced each time.
I had to go through the trouble of replacing it.
そのため、多品種少量生産を余儀無くされる、カスタム
設計などのICの製造工程においては、ワイヤボンダの
稼働率を著しく低下させ、生産性を悪くさせる問題があ
った。Therefore, in the manufacturing process of ICs such as custom design, which requires high-mix, low-volume production, there is a problem in that the operating rate of the wire bonder is significantly lowered, resulting in poor productivity.
本発明は、位置決め機構におけるピン保持部材が、駆動
部材と強固に固定していた従来の機構に替えて、ピン保
持部材が駆動部材に対して制御性よく動くようにして、
種々の仕様のリードフレームに対応できるようにした位
置決め機構を提供することを目的としている。In place of the conventional mechanism in which the pin holding member in the positioning mechanism is firmly fixed to the driving member, the present invention enables the pin holding member to move relative to the driving member with good controllability.
The object of the present invention is to provide a positioning mechanism that is compatible with lead frames of various specifications.
上で述べた課題は、チップがマウントされたリードフレ
ームをワイヤボンダに位置決めするワイヤボンディング
位置決め機構であって、前記リードフレームの送り孔に
挿入されるピンが植えられたピン保持部材と、前記ピン
保持部材が交換可能に固定された微動部材と、上下に直
線駆動される駆動部材と、前記微動部材と駆動部材との
間に設けられた微動手段とを有し、前記微動部材の側面
が、駆動部材の側面に対して、リードフレームの移動方
向と平行に摺動可能に衝合され、かつ微動手段によって
、制御性よく動かされるように構成されたワイヤボンデ
ィング位置決め機構によって解決される。The problem described above is a wire bonding positioning mechanism that positions a lead frame on which a chip is mounted on a wire bonder, and includes a pin holding member in which a pin is inserted into a feed hole of the lead frame, and a pin holding member that is inserted into a feed hole of the lead frame. It has a fine movement member in which members are fixed to be exchangeable, a drive member that is linearly driven up and down, and a fine movement means provided between the fine movement member and the drive member, and a side surface of the fine movement member The problem is solved by a wire bonding positioning mechanism which is slidably abutted against the side surface of the member parallel to the direction of movement of the lead frame and is configured to be moved in a controlled manner by fine movement means.
本発明においては、チップがマウントされたす1
2
ドフレームに設けられている送り孔にピンを挿入して、
リードフレームをワイヤボンダの所定の位置に停止させ
るワイヤボンディング位置決め機構において、ピンの位
置を適宜調整できるようにしている。In the present invention, a pin is inserted into a feed hole provided in a frame on which a chip is mounted.
In a wire bonding positioning mechanism that stops a lead frame at a predetermined position on a wire bonder, the position of a pin can be adjusted as appropriate.
すなわち、ピンが植え込まれているピン保持部材と、そ
のピン保持部材を上下に直線駆動させる駆動部材とが、
従来は、例えば、ノックピンなどによって直接固定され
ていたのに替えて、本発明においては、この両者の間に
、微動部材を介在させるようにしている。That is, a pin holding member into which a pin is implanted, and a driving member that linearly drives the pin holding member up and down,
In the past, for example, they were directly fixed by a knock pin, but in the present invention, a fine movement member is interposed between the two.
そして、この微動部材には、ピン保持部材を交換可能に
保持させるようにしている。The fine movement member is configured to hold a pin holding member in a replaceable manner.
それとともに、この微動部材と駆動部材との支持部分に
微動手段を設け、両者の壁面同士が摺動しながら、駆動
部材に対して微動部材がリードフレームの移動方向に平
行な方向に微動するようにしている。At the same time, a fine movement means is provided in the supporting portion of the fine movement member and the drive member, so that the fine movement member moves slightly with respect to the drive member in a direction parallel to the moving direction of the lead frame while the walls of both slide. I have to.
この微動手段には、例えば、駆動部材に調整ねじを回転
自在に固定し、そのねじと噛み合うねじ穴をピン保持部
材に設け、ねじの回すことによって微動部材が駆動部材
に対して前後に、μmの単位で微動できるようにしてい
る。In this fine movement means, for example, an adjustment screw is rotatably fixed to the drive member, and a screw hole that engages with the screw is provided in the pin holding member, and by turning the screw, the fine movement member is moved back and forth with respect to the drive member by μm. It is possible to make slight movements in units of .
こうすると、チップの種類が変わることによって、送り
孔の仕様の異なるリードフレームをワイヤボンダにおい
て取り扱う際に、従来のように手間を掛けてピン保持部
材を交換しな(て済む。In this way, when the wire bonder handles a lead frame with a different specification for the feed hole due to a change in the type of chip, it is no longer necessary to take the time and effort to replace the pin holding member as in the conventional case.
従って、ワイヤボンダの稼働率の向上を図ることができ
る。Therefore, it is possible to improve the operating rate of the wire bonder.
さらに、調整ねじによってピンの位置を微調節できるの
で、ボンディング位置決めが安定し、ワイヤボンディン
グの品質の向上も図れる。Furthermore, since the position of the pin can be finely adjusted using the adjustment screw, bonding positioning is stable and the quality of wire bonding can be improved.
第1図は本発明の詳細な説明図である。 FIG. 1 is a detailed explanatory diagram of the present invention.
同図において、ピン5、ピン保持部材6、微動部材7、
駆動部材8などは、全て不精鋼を用いて製作した。In the figure, a pin 5, a pin holding member 6, a fine movement member 7,
The drive member 8 and the like were all manufactured using stainless steel.
この中で、ピン5は、リードフレーム3の送り孔4と嵌
合して、ボンディング位置決めを精度よ3
4
く行わせる要の部品であり、送り孔4に挿入する先端部
分は、直径が2mmに対して、±0.002 mmの公
差で仕上げた。Among these, the pin 5 is a key part that fits into the feed hole 4 of the lead frame 3 and performs bonding positioning with high precision.The tip portion inserted into the feed hole 4 has a diameter of 2 mm. It was finished with a tolerance of ±0.002 mm.
また、ピン保持部材6に設けた穴は、呼び寸法4mmに
対して、H7の公差で仕上げた。Further, the hole provided in the pin holding member 6 was finished with a tolerance of H7 with respect to the nominal size of 4 mm.
一方、この穴と嵌め合うピン5の根本部は、h6に仕」
二げてとまりばめとした。On the other hand, the root part of pin 5 that fits into this hole is H6.
I doubled it and made a stop fit.
さらに、ピン保持部材6と微動部材7とは、テーパピン
によって位置合わせを行った後、図示してないねしによ
って取外し可能に固定した。Further, the pin holding member 6 and the fine movement member 7 were aligned using taper pins and then removably fixed using screws (not shown).
駆動部材8は、図示してないカムによって、精度よく上
下に直線駆動するようにした。The drive member 8 is linearly driven vertically with high precision by a cam (not shown).
この駆動部材8には、微動部材7が乗っかるように配置
し1.互いに鏡面仕上げした壁面同士が摺動するように
した。The fine movement member 7 is arranged so as to be placed on the drive member 8.1. The mirror-finished walls are designed to slide against each other.
そして、微動手段9には、微動部材7の側壁に設けた長
孔を貫通して止めねじ71を設け、駆動部材8としっか
り固定できるようにした。The fine movement means 9 is provided with a set screw 71 passing through a long hole provided in the side wall of the fine movement member 7, so that it can be firmly fixed to the drive member 8.
つぎに、微動手段9には、直径6mmφで、ピッチ0.
5mmの極細口のねじ91を用い、このねじ91を駆動
部材8の凸部81に設げたばか孔の両側をE IJソン
グよって回転自在に支持した。Next, the fine movement means 9 has a diameter of 6 mmφ and a pitch of 0.
A screw 91 with a very fine opening of 5 mm was used, and the screw 91 was rotatably supported on both sides of a hole provided in the protrusion 81 of the drive member 8 by an E IJ song.
そして、このねじ91の先端は、微動部材7に設けたね
じ穴92に噛み合うようにした。The tip of this screw 91 was adapted to mesh with a screw hole 92 provided in the fine movement member 7.
また、ねじ91の頭部にはローレットを切り、手によっ
て回せるようにした。Further, the head of the screw 91 is knurled so that it can be turned by hand.
こうして組み立てた位置決め機構1の性能をリードフレ
ーム送り機構10と組み合わせて動作させ評価を行った
。The performance of the positioning mechanism 1 thus assembled was evaluated by operating it in combination with the lead frame feeding mechanism 10.
その結果、リードフレーム送り機構10によるリードフ
レーム3の搬送は、ストッパ16を調整しても、停止位
置精度は高々±0.25mmであるが、それをこの位置
決め機構1によって、停止位置を微調整すると、±8m
mの精度でリードフレーム3の位置決めを行えることが
確認できた。As a result, when the lead frame 3 is transported by the lead frame feeding mechanism 10, even if the stopper 16 is adjusted, the stopping position accuracy is at most ±0.25 mm, but the positioning mechanism 1 can finely adjust the stopping position. Then, ±8m
It was confirmed that the lead frame 3 could be positioned with an accuracy of m.
こ−では、微動手段にねじとねし穴を用いたが、ねじと
ばねの組み合わせとか、梃子やカムを用いるなど、種々
の変形が可能である。In this case, a screw and a tapped hole are used as the fine movement means, but various modifications are possible, such as a combination of a screw and a spring, or a lever or a cam.
また、摺動する壁の形状は、方形でなく、円形でもよく
、例えば、駆動部材を丸い軸にして、微5
6
動部材に丸孔を設けてすきまばめにするなど、種々の変
形が可能である。In addition, the shape of the sliding wall may be circular instead of rectangular. For example, various modifications can be made, such as using a round shaft for the driving member and providing a loose fit by providing a round hole in the micro-moving member. It is possible.
以上述べたように、従来の、ワイヤボンダにおけるリー
ドフレームの位置決め機構は、ピン保持部材が駆動部材
と直結しているので、ピンを調整して移動させることが
できなかった。As described above, in the conventional positioning mechanism for a lead frame in a wire bonder, the pin holding member is directly connected to the driving member, and therefore the pin cannot be adjusted and moved.
そのため、リードフレームの仕様が変わると、ピン保持
部材を交換しなければならない手間が掛り、装置の可動
率を著しく悪くしていた。Therefore, when the specifications of the lead frame change, it is time consuming to replace the pin holding member, which significantly reduces the operating rate of the device.
それに対して、本発明になる位置決め機構においては、
ピン保持部材と駆動部材との間に、微動部材を配置し、
微動手段によってピン保持部材とそれに植え込まれたピ
ンをμm単位で微動できるようにしている。On the other hand, in the positioning mechanism according to the present invention,
A fine movement member is arranged between the pin holding member and the driving member,
The pin holding member and the pin implanted therein can be finely moved by the fine movement means in micrometer units.
従って、粗っぽい位置決めをリードフレーム送り機構で
行った後、微調整を本発明になる位置決め機構によって
行い、ワイヤホンダの所定の位置をリードフレームを位
置決めをする。Therefore, after rough positioning is performed by the lead frame feeding mechanism, fine adjustment is performed by the positioning mechanism according to the present invention, and the lead frame is positioned at a predetermined position of the wire honda.
こうして、ワイヤボンディング工程における装置の稼働
率の向上と、ボンディングの位置精度が高いので、ワイ
ヤボンディングの品質向上に大きな効果が期待できる。In this way, since the operating rate of the apparatus in the wire bonding process is improved and the bonding position accuracy is high, a great effect on improving the quality of wire bonding can be expected.
第1図は本発明の詳細な説明図、
第2図は従来の位置決め機構の説明図、第3図はストロ
ークの異なるリードフレームの例、
である。
図において、
■は位置決め機構、
3はリードフレーム、
5はピン、
7は微動部材、
9は微動手段、
である。
はチップ、
は送り孔、
はピン保持部材、
は駆動部材、FIG. 1 is a detailed explanatory diagram of the present invention, FIG. 2 is an explanatory diagram of a conventional positioning mechanism, and FIG. 3 is an example of lead frames with different strokes. In the figure, (2) is a positioning mechanism, 3 is a lead frame, 5 is a pin, 7 is a fine movement member, and 9 is a fine movement means. is the chip, is the feed hole, is the pin holding member, is the drive member,
Claims (1)
ワイヤボンダに位置決めするワイヤボンディング位置決
め機構であって、 前記リードフレーム(3)の送り孔(4)に挿入される
ピン(5)が植えられたピン保持部材(6)と、前記ピ
ン保持部材(6)が交換可能に固定された微動部材(7
)と、 上下に直線駆動される駆動部材(8)と、 前記微動部材(7)と前記駆動部材(8)との間に設け
られた微動手段(9)とを有し、 前記微動部材(7)の側面が、前記駆動部材(8)の側
面に対して、前記リードフレーム(3)の移動方向と平
行に摺動可能に衝合され、かつ前記微動手段(9)によ
って、制御性よく動かされることを特徴とするワイヤボ
ンディング位置決め機構。[Claims] A wire bonding positioning mechanism for positioning a lead frame (3) on which a chip (2) is mounted on a wire bonder, comprising: a pin ( 5), and a fine movement member (7) to which the pin holding member (6) is fixed in a replaceable manner.
), a driving member (8) that is linearly driven up and down, and a fine movement means (9) provided between the fine movement member (7) and the drive member (8), and the fine movement member ( 7) is slidably abutted against the side surface of the drive member (8) in parallel to the moving direction of the lead frame (3), and is controlled by the fine movement means (9) with good controllability. A wire bonding positioning mechanism characterized by being moved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1151253A JPH0314246A (en) | 1989-06-13 | 1989-06-13 | Wire bonding positioning mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1151253A JPH0314246A (en) | 1989-06-13 | 1989-06-13 | Wire bonding positioning mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0314246A true JPH0314246A (en) | 1991-01-22 |
Family
ID=15514621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1151253A Pending JPH0314246A (en) | 1989-06-13 | 1989-06-13 | Wire bonding positioning mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0314246A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07176562A (en) * | 1993-12-17 | 1995-07-14 | Nec Corp | Wire bonder |
-
1989
- 1989-06-13 JP JP1151253A patent/JPH0314246A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07176562A (en) * | 1993-12-17 | 1995-07-14 | Nec Corp | Wire bonder |
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