JPH0313743U - - Google Patents
Info
- Publication number
- JPH0313743U JPH0313743U JP1989074670U JP7467089U JPH0313743U JP H0313743 U JPH0313743 U JP H0313743U JP 1989074670 U JP1989074670 U JP 1989074670U JP 7467089 U JP7467089 U JP 7467089U JP H0313743 U JPH0313743 U JP H0313743U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- main body
- lid member
- package
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Products (AREA)
Description
第１図は本考案の一実施例に係る電子部品用パ
ツケージの縦断面図、第２図は蓋部材の縦断面斜
視図、第３Ａ図から第３Ｄ図は蓋部材の製造工程
を示す図、第４図は蓋部材を製造するために用い
られる他の治具を示す図、第５図は従来例の第１
図に相当する図である。 １０……パツケージ、１１……電子部品、１２
……絶縁基体、１３……蓋部材、１６……面取部
、１７……メタライズ層、１８……メツキ層、２
０……セラミツクグリンーシート。
ツケージの縦断面図、第２図は蓋部材の縦断面斜
視図、第３Ａ図から第３Ｄ図は蓋部材の製造工程
を示す図、第４図は蓋部材を製造するために用い
られる他の治具を示す図、第５図は従来例の第１
図に相当する図である。 １０……パツケージ、１１……電子部品、１２
……絶縁基体、１３……蓋部材、１６……面取部
、１７……メタライズ層、１８……メツキ層、２
０……セラミツクグリンーシート。
Claims (1)
- 【実用新案登録請求の範囲】 絶縁基体と蓋部材とからなる電子部品用パツケ
ージにおいて、 前記蓋部材は、セラミツクグリーンシートを所
定形状に裁断した後焼成することにより得られる
板状の本体部と、該本体部の一方の主面の周縁部
に形成された金属層と、前記セラミツクグリーン
シートを前記金属層側から裁断することにより前
記本体部の周縁に金属層を有する面取部とを備え
ていることを特徴とする電子部品用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989074670U JPH0313743U (ja) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989074670U JPH0313743U (ja) | 1989-06-26 | 1989-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313743U true JPH0313743U (ja) | 1991-02-12 |
Family
ID=31614564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989074670U Pending JPH0313743U (ja) | 1989-06-26 | 1989-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313743U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50129281U (ja) * | 1974-04-06 | 1975-10-23 | ||
| JP2017152598A (ja) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | 金属層付きサファイア基板、およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180053A (ja) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | 半導体パッケージ用リード基板 |
-
1989
- 1989-06-26 JP JP1989074670U patent/JPH0313743U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180053A (ja) * | 1988-12-30 | 1990-07-12 | Narumi China Corp | 半導体パッケージ用リード基板 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50129281U (ja) * | 1974-04-06 | 1975-10-23 | ||
| JP2017152598A (ja) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | 金属層付きサファイア基板、およびその製造方法 |