JPH03130654A - Gas sensor - Google Patents
Gas sensorInfo
- Publication number
- JPH03130654A JPH03130654A JP26685389A JP26685389A JPH03130654A JP H03130654 A JPH03130654 A JP H03130654A JP 26685389 A JP26685389 A JP 26685389A JP 26685389 A JP26685389 A JP 26685389A JP H03130654 A JPH03130654 A JP H03130654A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- heater
- substrate
- electrodes
- sensitive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は可燃性ガスを検出するガスセンサに係り、特
に酸化物半導体の電気抵抗変化を利用するガスセンサの
構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a gas sensor for detecting combustible gas, and particularly to a structure of a gas sensor that utilizes changes in electrical resistance of an oxide semiconductor.
酸化物半導体を用いるガスセンサとしては、例えば厚膜
型のガスセンサが知られている。第６図は厚膜型のガス
センサを示す断面図である。厚膜型ガスセンサは絶縁性
基板３１の１主面に酸化スズのような感ガス層３２が、
また他の主面には感ガス層３２を加熱するためのヒータ
３３が形成される。感ガス層３２は一般に厚膜印刷技術
により所定形状に印刷後基板に焼き付けられる。As a gas sensor using an oxide semiconductor, for example, a thick film type gas sensor is known. FIG. 6 is a sectional view showing a thick film type gas sensor. The thick-film gas sensor has a gas-sensitive layer 32 such as tin oxide on one main surface of an insulating substrate 31.
Furthermore, a heater 33 for heating the gas-sensitive layer 32 is formed on the other main surface. The gas-sensitive layer 32 is typically printed into a predetermined shape using thick film printing techniques and then baked onto the substrate.
１対のヒータ用リード線３４Ａ、 ３４Ｂと１対のガス
検出用リード線３５Ａ、３５Ｂが電極３６＾、３６Ｂ、
３７Ａ、３７Ｂに接続され、これらのリード線の他端は
第７図に示すように絶縁性基材４１を貫通して埋め込ま
れた４本の金属製ピン４２Ａ、４２Ｂ、４２Ｃ，４２Ｄ
に接続される。A pair of heater lead wires 34A, 34B and a pair of gas detection lead wires 35A, 35B are connected to electrodes 36^, 36B,
37A and 37B, and the other ends of these lead wires are connected to four metal pins 42A, 42B, 42C, and 42D embedded through an insulating base material 41 as shown in FIG.
connected to.
しかしこのようなガスセンサはリード＆１３５Ａ。However, such a gas sensor is lead & 135A.
３５Ｂとリード線３４Ａ、３４Ｂとが相互に基板３１の
反対面にとりつけられるので溶接上不利である。このた
め、実開昭６３−１２７５７号公報には基板の同一主面
に全てのリード線を接続するガスセンサが開示されてい
る、第８図はこの従来の異なるガスセンサを示し、第８
図ｆａｔは平面図、第８図（ｂｌは下面図である。基板
５１の１主面に感ガス層５５．電極５４゜ヒータ用バッ
ド５３Ａ、５３Ｂが設けられ、また他の主面にはヒータ
６２．ヒータ用電極６１Ａ、６１Ｂが設けられる。ヒー
タ用電極６１Ａ、 ６１Ｂはスルーホール５２＾。35B and the lead wires 34A and 34B are attached to opposite sides of the substrate 31, which is disadvantageous in terms of welding. For this reason, Japanese Utility Model Application Publication No. 63-12757 discloses a gas sensor in which all lead wires are connected to the same main surface of a substrate. FIG. 8 shows a different conventional gas sensor.
FIG. 62. Heater electrodes 61A and 61B are provided.The heater electrodes 61A and 61B are through holes 52^.
５２Ｂを介して、ヒータ用パッド５３Ａ、５３Ｂとそれ
ぞれ接続する。It is connected to heater pads 53A and 53B via 52B.
しかしながらこのような従来の異なるガスセンサにあっ
ては、感ガス層５５とヒータ用パッド５２＾。However, in such a conventional gas sensor, a gas sensitive layer 55 and a heater pad 52^ are used.
５２Ｂとが近接して設けられるため印刷時のマスクパタ
ーンの位置決めが悪いと相互に接触したり、また惑ガス
層を印刷したあとの感ガス層用インクのダレによって接
触がおこるという問題があった。52B are provided in close proximity to each other, there is a problem that they may come into contact with each other if the mask pattern is poorly positioned during printing, or contact may occur due to dripping of the ink for the gas-sensitive layer after printing the gas-sensitive layer. .
この発明は上述の点に鑑みてなされ、その目的は基板上
の積層構造を改良してマスクパターンの位置決め精度が
ゆるやかで製造容易なガスセンサを提供することにある
。The present invention has been made in view of the above-mentioned points, and an object thereof is to provide a gas sensor that improves the laminated structure on a substrate, has a moderate positioning accuracy of a mask pattern, and is easy to manufacture.
上述の目的はこの発明によれば、基板と、その上に形成
される感ガス層、１対のガス検出用電極。According to the invention, the above-mentioned object provides a substrate, a gas-sensitive layer formed thereon, and a pair of gas-detecting electrodes.
１対のガス検出用バッド、ヒータ、１対のヒータ用電極
とを有し、酸化物半導体からなる感ガス層と、この感ガ
ス層が可燃性ガスと接触して生ずる電気的抵抗の変化を
検出するガス検出用電極とは基板の同一主面上に設けら
れ、基板を所定温度に保持するヒータと、このヒータに
加熱用の電圧を印加するとともにヒータ用リード線が接
続されるヒータ用電極と、ガス検出用リード線が接続さ
れるガス検出用バッドとは基板の他の同一主面上に形成
され、前記ガス検出用バッドは基板のスルーホールを介
してガス検出用電極と電気的に接続されることによって
達成される。It has a pair of gas detection pads, a heater, and a pair of heater electrodes, and has a gas-sensitive layer made of an oxide semiconductor, and changes in electrical resistance that occur when this gas-sensitive layer comes into contact with combustible gas. The gas detection electrode to be detected includes a heater that is provided on the same main surface of the substrate and that maintains the substrate at a predetermined temperature, and a heater electrode that applies a heating voltage to the heater and connects the heater lead wire. and a gas detection pad to which the gas detection lead wire is connected are formed on the other same main surface of the substrate, and the gas detection pad is electrically connected to the gas detection electrode through the through hole of the substrate. This is achieved by being connected.
本発明のガスセンサは印刷法の他、真空蒸着法。The gas sensor of the present invention can be produced using a vacuum deposition method as well as a printing method.
スパフタ、スプレー法等を用いて製造することができる
。It can be manufactured using a spafter method, a spray method, etc.
ヒータと、ヒータ用電極と、ガス検出用バッドとは同一
のマスクパターンを用いて同時に形成することができる
。The heater, heater electrode, and gas detection pad can be formed simultaneously using the same mask pattern.
次にこの発明の実施例を図面に基いて説明する。 Next, embodiments of the present invention will be described based on the drawings.
第１図はこの発明の実施例に係るガスセンサを示し、第
１図ｔ８）は平面図、第１図〜）は下面図である。FIG. 1 shows a gas sensor according to an embodiment of the present invention, FIG. 1 t8) is a plan view, and FIGS. 1-) are bottom views.
ガスセンサの１つの主面にはガス検出用電極１２Ａ。A gas detection electrode 12A is provided on one main surface of the gas sensor.
１２Ｂと感ガス層１１とが設けられ、他の主面にはヒー
タ２３とヒータ用電極２４Ａ、２４Ｂとガス検出用バッ
ド２１＾、２１Ｂが設けられ、リード線２２Ａ 、 ２
２Ｂがガス検出用バッド２１Ａ、２１Ｂに、またリード
線２５Ａ、２５Ｂがヒータ用電極２４Ａ、２４Ｂにそれ
ぞれ接続される。12B and a gas-sensitive layer 11 are provided, and the other main surface is provided with a heater 23, heater electrodes 24A, 24B, gas detection pads 21^, 21B, and lead wires 22A, 2.
2B are connected to gas detection pads 21A and 21B, and lead wires 25A and 25B are connected to heater electrodes 24A and 24B, respectively.
ガス検出用パッド２１Ａ、２１Ｂはそれぞれスルーホー
ル１３＾、１３Ｂを介して、ガス検出用電極１２Ａ、１
２Ｂと電気的に接続される。Gas detection pads 21A and 21B are connected to gas detection electrodes 12A and 1 through through holes 13^ and 13B, respectively.
It is electrically connected to 2B.
このようなガスセンサは次に述べる方法で調製すること
ができる。白金ペーストをガス検出用電極１２Ａ、１２
Ｂのパターンで同時に印刷する。乾燥後基板の他の主面
にヒータ２３、ヒータ用電極２４Ａ。Such a gas sensor can be prepared by the method described below. Platinum paste was applied to the gas detection electrodes 12A, 12.
Print pattern B at the same time. After drying, a heater 23 and a heater electrode 24A are placed on the other main surface of the substrate.
２４Ｂ、ガス検出用バッド２１Ａ、２１Ｂを白金ペース
トラ用い、同一のパターンで同時に印刷する。スルーホ
ール１３Ａ、 １３Ｂの内壁にも白金ペーストが塗布さ
れる。乾燥後空気中において９００℃で焼きつけられる
。24B, gas detection pads 21A and 21B are simultaneously printed with the same pattern using platinum paste. Platinum paste is also applied to the inner walls of through holes 13A and 13B. After drying, it is baked at 900°C in air.
１〜５ｎの粒径の酸化スズと、パラジウムの微粉末と、
バインダとしてのコロイダルシリカと、セルロースとを
カルピトールに混合分散させた酸化スズペーストを感ガ
ス層１１のパターンで５０−厚に印刷し、乾燥後空気中
において７００℃で焼きつける。Tin oxide with a particle size of 1 to 5n, fine palladium powder,
A tin oxide paste in which colloidal silica as a binder and cellulose are mixed and dispersed in calpitol is printed to a thickness of 50 mm in the pattern of the gas-sensitive layer 11, and after drying is baked at 700° C. in air.
続いてリード１２２Ａ、２２Ｂをガス検出用バッド２１
＾、２１Ｂに、リード線２５＾、２５Ｂをヒータ用電極
２４Ａ 、 ２４Ｂに熱圧着により溶接する。Next, connect the leads 122A and 22B to the gas detection pad 21.
The lead wires 25^, 25B are welded to the heater electrodes 24A, 24B by thermocompression bonding.
第２図は得られたガスセンサの装着状態を示す斜視図で
ある。ガスセンサは絶縁性基材８４を貫通して埋込まれ
た金属製ピン８３Ａ、８３Ｂ、８３Ｇ、８３Ｄにヒータ
２３を上側にしてマウントされる。感ガス層が裏側にな
るので、感ガス層にごみが堆積することがなくセンサの
長期信頼性が確保される。FIG. 2 is a perspective view showing the installed state of the obtained gas sensor. The gas sensor is mounted on metal pins 83A, 83B, 83G, and 83D embedded through an insulating base material 84 with the heater 23 facing upward. Since the gas-sensitive layer is on the back side, no dust accumulates on the gas-sensitive layer, ensuring long-term reliability of the sensor.
第３図はこの発明の実施例に係るガスセンサの他の装着
状態を示す斜視図である。FIG. 3 is a perspective view showing another mounting state of the gas sensor according to the embodiment of the invention.
第４図はこの発明の異なる実施例に係るガスセンサを示
し、第４図ｔａｌは平面図、第４開山）は下面図である
。FIG. 4 shows a gas sensor according to a different embodiment of the present invention, and FIG. 4 (tal) is a plan view, and FIG.
第５図はこの発明のさらに異なる実施例に係るガスセン
サを示す平面図である。FIG. 5 is a plan view showing a gas sensor according to still another embodiment of the invention.
本発明によれば位置決め精度は±０．３ ｗｓでよく、
従来の±０．１ｆｉに比し緩やかになっている。According to the present invention, the positioning accuracy may be ±0.3 ws,
This is gentler than the conventional ±0.1fi.
この発明によれば基板と、その上に形成される感ガス層
、１対のガス検出用電極、１対のガス検出用パッド、ヒ
ータ、１対のヒータ用電極とを有し、酸化物半導体から
なる感ガス層と、この感ガス層が可燃性ガスと接触して
生ずる電気的抵抗の変化を検出するガス検出用電極とは
基板の同一主面上に設けられ、基板を所定温度に保持す
るヒータと、このヒータに加熱用の電圧を印加するとと
もにヒータ用リード線が接続されるヒータ用電極と、ガ
ス検出用リード線が接続されるガス検出用パッドとは基
板の他の同一主面上に形成され、前記ガス検出用パッド
は基板のスルーホールを介してガス検出用電極と電気的
に接続されるものであるので、ヒータと１対のヒータ用
電極と１対のガス検出用パッドとが一つのマスクパター
ンを用いて同時にパターン形成することができ感ガス層
とガス検出用電極についてのみマスクパターンの位置決
めを行えばよいので高精度の位置決めが不要となりガス
センサの製造が容易となる。According to this invention, the invention includes a substrate, a gas-sensitive layer formed thereon, a pair of gas detection electrodes, a pair of gas detection pads, a heater, and a pair of heater electrodes, and includes an oxide semiconductor. A gas-sensitive layer consisting of a gas-sensitive layer and a gas detection electrode that detects changes in electrical resistance caused when this gas-sensitive layer comes into contact with combustible gas are provided on the same main surface of the substrate, and the substrate is maintained at a predetermined temperature. The heater electrode to which a heating voltage is applied to the heater and to which the heater lead wire is connected, and the gas detection pad to which the gas detection lead wire is connected are located on the same main surface of the substrate. The gas detection pad is formed on the substrate and is electrically connected to the gas detection electrode through the through hole of the substrate. Since the mask pattern can be formed simultaneously using one mask pattern, and only the mask pattern needs to be positioned for the gas-sensitive layer and the gas detection electrode, high-precision positioning is not required, making it easy to manufacture the gas sensor.
第１図はこの発明の実施例に係るガスセンサを示し、第
１図（ａｌは平面図、第１図（ｂｌは下面図、第２図は
この発明の実施例に係るガスセンサの装着状態を示す斜
視図、第３図はこの発明の実施例に係るガスセンサの他
の装着状態を示す斜視図、第４図はこの発明の異なる実
施例に係るガスセンサを示し、第４図（ａ）は平面図、
第４開山）は下面図、第５図はこの発明のさらに異なる
実施例に係るガスセンサを示す平面図、第６図は従来の
ガスセンサを示す断面図、第７図は従来のガスセンサの
装着状態を示す平面図、第８図は従来の異なるガスセン
サを示し、第８図＋ｈｌは平面図、第８図（ｂｌは下面
図である。
１２Ａ、 １２Ｂ＋ガス検出用電極、１４ｊ１＆板、２
１Ａ。
２１Ｂ；ガス検出用パッド、２３：ヒータ、２４Ａ、
２４８：第１図
第２図
第５図
第６図
１ｇ７図FIG. 1 shows a gas sensor according to an embodiment of the present invention, and FIG. FIG. 3 is a perspective view showing another mounting state of the gas sensor according to the embodiment of the invention, FIG. 4 shows a gas sensor according to a different embodiment of the invention, and FIG. 4(a) is a plan view. ,
4) is a bottom view, FIG. 5 is a plan view showing a gas sensor according to another embodiment of the present invention, FIG. 6 is a sectional view showing a conventional gas sensor, and FIG. Fig. 8 shows a different conventional gas sensor, Fig. 8 + hl is a plan view, Fig. 8 (bl is a bottom view) 12A, 12B + gas detection electrode, 14j1 & plate, 2
1A. 21B; Gas detection pad, 23: Heater, 24A,
248: Figure 1 Figure 2 Figure 5 Figure 6 Figure 1g7
Claims (1)
検出用電極、１対のガス検出用パッド、ヒータ、１対の
ヒータ用電極とを有し、酸化物半導体からなる感ガス層
と、この感ガス層が可燃性ガスと接触して生ずる電気的
抵抗の変化を検出するガス検出用電極は基板の同一主面
上に設けられ、基板を所定温度に保持するヒータと、こ
のヒータに加熱用の電圧を印加するとともにヒータ用リ
ード線が接続されるヒータ用電極と、ガス検出用リード
線が接続されるガス検出用パッドとは基板の他の同一主
面上に形成され、前記ガス検出用パッドは基板のスルー
ホールを介してガス検出用電極と電気的に接続されるこ
とを特徴とするガスセンサ。1) A sensor made of an oxide semiconductor, comprising a substrate, a gas-sensitive layer formed on the substrate, a pair of gas-sensing electrodes, a pair of gas-sensing pads, a heater, and a pair of heater electrodes. A gas layer and a gas detection electrode for detecting a change in electrical resistance caused when the gas-sensitive layer comes into contact with a combustible gas are provided on the same main surface of the substrate, a heater for maintaining the substrate at a predetermined temperature, A heater electrode to which a heating voltage is applied to the heater and to which a heater lead wire is connected, and a gas detection pad to which a gas detection lead wire is connected are formed on the other main surface of the substrate. . A gas sensor, wherein the gas detection pad is electrically connected to a gas detection electrode via a through hole in a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1266853A JPH0786488B2 (en) | 1989-10-14 | 1989-10-14 | Gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1266853A JPH0786488B2 (en) | 1989-10-14 | 1989-10-14 | Gas sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03130654A true JPH03130654A (en) | 1991-06-04 |
| JPH0786488B2 JPH0786488B2 (en) | 1995-09-20 |
Family
ID=17436574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1266853A Expired - Fee Related JPH0786488B2 (en) | 1989-10-14 | 1989-10-14 | Gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0786488B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837886A (en) * | 1995-06-19 | 1998-11-17 | Figaro Engineering Inc. | Gas sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910079A (en) * | 1972-05-22 | 1974-01-29 | ||
| JPS6312757U (en) * | 1986-07-10 | 1988-01-27 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60104698A (en) * | 1983-11-09 | 1985-06-10 | 池永鉄工株式会社 | Edge body for dividign fruit, etc. |
-
1989
- 1989-10-14 JP JP1266853A patent/JPH0786488B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4910079A (en) * | 1972-05-22 | 1974-01-29 | ||
| JPS6312757U (en) * | 1986-07-10 | 1988-01-27 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837886A (en) * | 1995-06-19 | 1998-11-17 | Figaro Engineering Inc. | Gas sensor |
| DE19611964B4 (en) * | 1995-06-19 | 2009-01-22 | Figaro Engineering Inc., Minoo | gas sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0786488B2 (en) | 1995-09-20 |
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