JPH03128938U - - Google Patents
Info
- Publication number
- JPH03128938U JPH03128938U JP1990038157U JP3815790U JPH03128938U JP H03128938 U JPH03128938 U JP H03128938U JP 1990038157 U JP1990038157 U JP 1990038157U JP 3815790 U JP3815790 U JP 3815790U JP H03128938 U JPH03128938 U JP H03128938U
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminals
- electrode terminal
- electrode
- protrusion
- bonding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Description
第１図Ａ，Ｂ〜第３図は本考案に係る電極端子
の接合構造の一実施例を示す図であり、第１図Ａ
は液晶表示パネルの要部平面図、第１図Ｂは液晶
表示パネルの側面図、第２図ＡはＴＡＢフイルム
基板およびＴＡＢ電極端子の平面図、第２図Ｂは
ＴＡＢフイルム基板およびＴＡＢ電極端子の側面
図、第３図は接続用の電極端子部分を示す縦断面
図、第４図および第５図は従来の電極端子の接合
構造を示す図であり、第４図は接合構造の平面図
、第５図は接合部の縦断面図である。
１……液晶表示パネル、３ａ，３ｂ……透明ガ
ラス基板、４……電極端子、８……絶縁性接着剤
、１１……半導体ユニツト、１２……ＴＡＢ電極
端子、１２ａ……ＴＡＢ電極、１２ｂ……ＴＡＢ
電極突起部。
1A, B to 3 are diagrams showing an embodiment of the bonding structure of the electrode terminal according to the present invention, and FIG.
1B is a side view of the liquid crystal display panel, FIG. 2A is a plan view of the TAB film substrate and TAB electrode terminal, and FIG. 2B is a plan view of the TAB film substrate and TAB electrode terminal. FIG. 3 is a longitudinal cross-sectional view showing the electrode terminal portion for connection, FIGS. 4 and 5 are views showing the bonding structure of a conventional electrode terminal, and FIG. 4 is a plan view of the bonding structure. , FIG. 5 is a longitudinal sectional view of the joint. DESCRIPTION OF SYMBOLS 1...Liquid crystal display panel, 3a, 3b...Transparent glass substrate, 4...Electrode terminal, 8...Insulating adhesive, 11...Semiconductor unit, 12...TAB electrode terminal, 12a...TAB electrode, 12b ...TAB
Electrode protrusion.
Claims (1)
て接触させ、該電極端子の周囲に絶縁性接着剤を
介在させて接合する電極端子の接合構造において
、 前記基板に形成された電極端子のうち、少なく
とも一方の電極端子は対向する他方の電極端子側
に突出する突起部を有し、該突起部を介して対向
する電極端子間が導通されるとともに、該突起部
の周囲に絶縁性接着剤が介在するように構成され
たことを特徴とする電極端子の接合構造。[Claims for Utility Model Registration] An electrode terminal bonding structure in which electrode terminals formed on a pair of substrates are brought into contact with each other facing each other, and bonded with an insulating adhesive interposed around the electrode terminals, comprising: Among the electrode terminals formed on the electrode terminals, at least one of the electrode terminals has a protrusion that protrudes toward the other opposing electrode terminal, and conduction is established between the opposing electrode terminals via the protrusion, and the protrusion A bonding structure for an electrode terminal, characterized in that an insulating adhesive is interposed around the electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038157U JPH03128938U (en) | 1990-04-10 | 1990-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990038157U JPH03128938U (en) | 1990-04-10 | 1990-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03128938U true JPH03128938U (en) | 1991-12-25 |
Family
ID=31545911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990038157U Pending JPH03128938U (en) | 1990-04-10 | 1990-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03128938U (en) |
-
1990
- 1990-04-10 JP JP1990038157U patent/JPH03128938U/ja active Pending
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