JPH03126003A - Structure of fixing part for optical parts - Google Patents
Structure of fixing part for optical partsInfo
- Publication number
- JPH03126003A JPH03126003A JP26387789A JP26387789A JPH03126003A JP H03126003 A JPH03126003 A JP H03126003A JP 26387789 A JP26387789 A JP 26387789A JP 26387789 A JP26387789 A JP 26387789A JP H03126003 A JPH03126003 A JP H03126003A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- fixing
- optical component
- solder
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 64
- 239000000853 adhesive Substances 0.000 claims abstract description 40
- 230000001070 adhesive effect Effects 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010931 gold Substances 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 10
- 239000002952 polymeric resin Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 238000007747 plating Methods 0.000 abstract description 6
- 239000013307 optical fiber Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、光学部品の組立てに用いられる光学部品固定
部構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an optical component fixing part structure used for assembling optical components.
（従来の技術）
光ファイバ等を使用した光通信の普及に伴って、そこで
使用される光学部品に対しては、高精・変化が求められ
ている。各光学部品の組立にも高精度化が求められてお
り、従来から光学部品の組立に関するいくつかの提案が
なされている。その組立の高精度化の一つとして光学部
品を接着固定して組立る際に余分な組立用接着剤を接着
固定をする部分から逃す方法が考えられている。(Prior Art) With the spread of optical communications using optical fibers, etc., high precision and variety are required of the optical components used therein. High precision is also required for the assembly of each optical component, and several proposals regarding the assembly of optical components have been made in the past. As one way to improve the precision of the assembly, a method has been considered that, when assembling optical components by adhesively fixing them, excess assembly adhesive is released from the part to be adhesively fixed.
余分な接着剤を接着固定する部分から逃してやることで
、一定の厚みで光学部品を接着固定でき、光学部品の組
立精度を高めることができる。By letting excess adhesive escape from the part to be adhesively fixed, optical components can be adhesively fixed with a constant thickness, and the assembly precision of optical components can be improved.
第４図は、余分な接着剤を光学部品を接着固定する部分
から逃す従来の光学部品固定部構造の断面図である。第
４図で、４０と４１は光学部品で、例えば、４０は発光
素子ユニット、４１は基板である。４２は光学部品４０
と光学部品４１とを接着固定させる接着剤であり、ρＪ
えば高分子樹脂や半田等が用いられる。このような構成
で、光学部品４０を第４図の上方から押し付けることに
よって、固定に不要な余分な接着剤４３．４４は、光学
部品４０．４１が接着固定される部分から押し出される
。これにより不要な接着剤を接着固定部分から逃がして
いる。FIG. 4 is a cross-sectional view of a conventional optical component fixing part structure that releases excess adhesive from a portion where an optical component is adhesively fixed. In FIG. 4, 40 and 41 are optical components, for example, 40 is a light emitting element unit, and 41 is a substrate. 42 is an optical component 40
and the optical component 41, and ρJ
For example, polymer resin, solder, etc. are used. With this configuration, by pressing the optical component 40 from above in FIG. 4, excess adhesive 43, 44 unnecessary for fixing is pushed out from the portion where the optical component 40, 41 is adhesively fixed. This allows unnecessary adhesive to escape from the adhesively fixed portion.
また、第５図のような溝４５．４６を設けた固定部では
、光学部品４０を第５図の上方から押し付けることによ
って、余分な接着剤４３．４４が溝４５．４６に流入さ
れて接着固定部から接着剤を逃がしている。Furthermore, in the fixing part provided with grooves 45, 46 as shown in FIG. 5, by pressing the optical component 40 from above in FIG. Adhesive is escaping from the fixed part.
第５図の場合、不要な接着剤は溝に流入されているので
、光学部品を接着固定する部分へ再侵入しかしながら上
述した第４図及び第５図の様な従来例には、以下に示す
様な欠点があった。In the case of Fig. 5, the unnecessary adhesive has flowed into the groove, so it re-enters the part where the optical component is adhesively fixed. However, in the conventional example shown in Figs. 4 and 5 mentioned above, There were various shortcomings.
第４図の例では、不要接着剤４３．４４の光学部品の接
着固定部分への再侵入及び光学部品４０゜立での粘度に
劣化が生していた。第５図の例では、２つの光学部品は
、高分子樹脂、半田等の接着剤を介して位置決め固定さ
れているために、光学部品の組立精度に限界があり、満
足な組立精度を得ることは困難であった。特に高精度化
が要求される例えば単一モード光ファイバ用の光学部品
にあっては、接着剤の厚みを１μｍ程度の精度で固定す
ることが要求されるが、第５図の固定部構造ではそれは
困難であった。In the example shown in FIG. 4, unnecessary adhesives 43 and 44 re-entered the adhesively fixed portion of the optical component and the viscosity of the optical component deteriorated when the optical component was stood at 40 degrees. In the example shown in Figure 5, the two optical components are positioned and fixed through adhesives such as polymer resin and solder, so there is a limit to the assembly accuracy of the optical components, and it is difficult to obtain satisfactory assembly accuracy. was difficult. Particularly in the case of optical components for single mode optical fibers, which require particularly high precision, it is necessary to fix the thickness of the adhesive with an accuracy of about 1 μm, but the fixing part structure shown in Fig. 5 It was difficult.
（発明が解決しようとする課題）
上述した様に、従来の光学部品固定部構造では、高分子
樹脂、半田等の接着剤を介して光学部品の位置決め固定
がされていたために、高精度な組立固定が困難であった
。(Problems to be Solved by the Invention) As mentioned above, in the conventional optical component fixing structure, optical components are positioned and fixed through adhesives such as polymer resin and solder, which makes it difficult to assemble with high precision. Fixation was difficult.
本発明は、上記の事情に鑑みてなされたもので、高精度
に光学部品を接着固定する光学部品固定部構造を提供す
ることを目的としている。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical component fixing part structure that adhesively fixes optical components with high precision.
［発明の構成］
（課題を解決するための手段）
上記目的を達成するために本発明の光学部品固定部構造
では、高分子樹脂、半田等の接着剤によって光学部品か
接着固定された光学部品固定部構造において、前記光学
部品は、その固定部で接着剤を介さない部分により位置
決めされ、固定されていることを第１の特徴とし、互い
に接着固定される前記光学部品の少くとも一方の光学部
品の固定部の固定面には、前記接着剤が流入する溝が形
成されていることを第２の特徴とし、前記接着剤を介さ
ずに光学部品が位置決め固定される部分より離れた前記
固定部の固定面に金メッキを施すことを第３の特徴とす
る。[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the optical component fixing part structure of the present invention provides an optical component that is adhesively fixed with an adhesive such as a polymer resin or solder. In the fixing part structure, the first feature is that the optical components are positioned and fixed by a portion of the fixing part that does not involve an adhesive, and at least one of the optical components that are adhesively fixed to each other A second feature is that the fixing surface of the fixing part of the component is formed with a groove into which the adhesive flows, and the fixing part is located away from the part where the optical component is positioned and fixed without using the adhesive. The third feature is that the fixing surface of the part is plated with gold.
（作用）
本発明の第１の特徴の構成の場合、互いに接着固定する
光学部品の固定部に接着剤を介さずに互いを固定する部
分を設け、ここで光学部品は接着剤を介さず位置決め固
定される。第２の特徴の構成の場合、少くとも一方の光
学部品の固定部に設けられた溝に、余分な接着剤が流入
されるため光学部品の組立精度が向上される。また、第
３の特徴のＦＭ成の場合固定面に金メッキが施された部
分は、接着剤特に半田がつきやすくなり、半田を介さず
位置決め固定する部分から離れた部分に金メッキを施す
ことにより、位置決め固定する固定面に半田が侵入され
ず、組立精度が向上される。(Function) In the case of the configuration according to the first feature of the present invention, the fixing portions of optical components to be adhesively fixed to each other are provided with portions for fixing each other without using an adhesive, and here the optical components are positioned without using an adhesive. Fixed. In the case of the configuration of the second feature, the assembly precision of the optical components is improved because excess adhesive is flowed into the groove provided in the fixing portion of at least one of the optical components. In addition, in the case of the third feature of FM configuration, the part where the fixing surface is gold plated is easily attached to adhesives, especially solder, so by applying gold plating to the part away from the part to be positioned and fixed without using solder, Solder does not invade the fixing surface for positioning and fixing, improving assembly accuracy.
（実施例）
以下、図面を参照して本発明の実施例について詳細に説
明する。(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は、本発明の第１の実施例を示す図で、光学部品
の固定部の断面を示す。１０．１１は光学部品、１２は
、光学部品１１に形成された満てあり、光学部品１０と
光学部品１１が溝１２内の接着剤、例えば半田１３を介
して接着固定されている。１４．１５は半［１１３を介
さない位置決め用の固定面で光学部品１０の高さ方向の
位置決めがなされる。第１図の様な構成では、接着剤を
介さない部分で位置決めがなされているため接着剤の厚
みで光学部品］０の高さ方向の位置が変動することなく
安定な特性を示す光学部品を実現することかできる。ま
た、第５図の様な従来例と比較して接着強度が大きいと
いう特長も有している。FIG. 1 is a diagram showing a first embodiment of the present invention, and shows a cross section of a fixing part of an optical component. Reference numerals 10 and 11 designate an optical component, and 12 designates a plate formed on the optical component 11. The optical component 10 and the optical component 11 are adhesively fixed to each other via an adhesive such as solder 13 in the groove 12. Reference numerals 14 and 15 denote fixing surfaces for positioning without intervening the half [113], and the optical component 10 is positioned in the height direction. In the configuration shown in Figure 1, positioning is done without using adhesive, so the thickness of the adhesive allows the optical component to exhibit stable characteristics without fluctuations in its position in the height direction. It is possible to make it happen. It also has the advantage of greater adhesive strength than the conventional example shown in FIG.
即ち、半田１３が硬化するときには収縮がおこり半田内
部に引っ張り応力が生じるため接着強度が向上する。こ
の強度は、半田の厚みが大きい程向上する。That is, when the solder 13 hardens, shrinkage occurs and tensile stress is generated inside the solder, so that the adhesive strength is improved. This strength improves as the thickness of the solder increases.
次に第２の実施例について説明する。第２図は、第２の
実施例の構成を示す断面図であり、第１図と同一部分に
は同一符号を付し、詳しい説明は省略する。第２図では
、光学部品１０には溝２０゜光学部品１１には、溝２１
．２２が設けられている。この溝２１．２２は、固定に
余分な接着剤を逃すためのもので、余分な接着剤がこの
溝２１゜２２に流入される。従って、従来のように不要
な接着剤が固定面に再浸入されず、さらに半田を介さな
い而で位置決め固定がなされているため、組立精度が向
上する。Next, a second embodiment will be described. FIG. 2 is a cross-sectional view showing the configuration of the second embodiment, and the same parts as in FIG. In FIG. 2, the optical component 10 has a groove 20°, the optical component 11 has a groove 21
．． 22 are provided. These grooves 21 and 22 are for releasing excess adhesive during fixing, and the excess adhesive flows into these grooves 21 and 22. Therefore, unnecessary adhesive is not re-infiltrated into the fixing surface as in the prior art, and positioning and fixing is performed without using solder, improving assembly accuracy.
次に第３の実施例を説明する。第３図は、第３の実施例
の構成を示す断面図で、第２図と同一部分には、同一符
号を付し、詳しい説明は省略する。Next, a third embodiment will be described. FIG. 3 is a cross-sectional view showing the configuration of the third embodiment, and the same parts as in FIG. 2 are designated by the same reference numerals, and detailed description thereof will be omitted.
第３図で、第２図と異なる点は、溝及び固定面に金メッ
キを施した点である。第３図のように金メッキ３０を施
すことにより、金メッキ３０を施した部分は、半田がつ
きやすくなる。光学部品を位置決め固定する１４．１５
の固定面と離したところに金メッキを施せば、位置決め
用固定面１４゜１５の部分に半田は侵入されにくくなる
。従って、より精度の高い位置決めが可能となる。The difference between FIG. 3 and FIG. 2 is that the groove and fixing surface are plated with gold. By applying gold plating 30 as shown in FIG. 3, the gold plating 30 can be easily soldered. 14.15 Positioning and fixing optical components
If gold plating is applied to the area away from the fixing surface, solder will be less likely to penetrate into the portions of the positioning fixing surfaces 14 and 15. Therefore, more accurate positioning is possible.
［発明の効果コ
以上詳述したように、本発明の光学部品固定部構造では
、互いに接着固定する光学部品は、接着剤を介さない部
分により位置決めされ、固定面には接着剤が流入される
溝が形成され、さらには固定面の接着剤を塗布する部分
に金メッキを施すことにより、光学部品の組立精度が従
来より向上する。[Effects of the Invention] As detailed above, in the structure of the optical component fixing part of the present invention, the optical components to be adhesively fixed to each other are positioned by a portion not using an adhesive, and the adhesive is flowed into the fixing surface. By forming the groove and further applying gold plating to the portion of the fixing surface where the adhesive is applied, the assembly precision of the optical component is improved compared to the conventional method.
第１図は本発明の第１の実施例を示す図で、光学部品の
固定部の断面図、第２図は、第２の実施例の構成を示す
断面図、第３図は第３の実施例の構成を示す断面図、第
４図及び第５図は、従来の光学部品固定構造の断面図で
ある。FIG. 1 is a sectional view showing the first embodiment of the present invention, and FIG. 2 is a sectional view showing the structure of the second embodiment. FIGS. 4 and 5 are cross-sectional views showing the configuration of the embodiment, and are cross-sectional views of a conventional optical component fixing structure.
Claims (3)
接着固定された光学部品固定部構造において、前記光学
部品は、その固定部で接着剤を介さない部分により位置
決めされ、固定されていることを特徴とする光学部品固
定部構造。(1) In an optical component fixing part structure in which an optical component is adhesively fixed with an adhesive such as a polymer resin or solder, the optical component is positioned and fixed by a portion of the fixing part that does not involve the adhesive. An optical component fixing part structure characterized by:
方の光学部品の固定部の固定面には、前記接着剤が流入
する溝が形成されていることを特徴とする請求項１記載
の光学部品固定部構造。(2) The optical system according to claim 1, wherein a groove into which the adhesive flows is formed on a fixing surface of a fixing portion of at least one of the optical components that are adhesively fixed to each other. Parts fixing structure.
れる部分より離れた前記固定部の固定面に金メッキを施
すことを特徴とする請求項１または請求項２記載の光学
部品固定構造。(3) The optical component fixing structure according to claim 1 or 2, wherein a fixing surface of the fixing part that is remote from a portion where the optical component is positioned and fixed is plated with gold without using the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26387789A JPH03126003A (en) | 1989-10-12 | 1989-10-12 | Structure of fixing part for optical parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26387789A JPH03126003A (en) | 1989-10-12 | 1989-10-12 | Structure of fixing part for optical parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126003A true JPH03126003A (en) | 1991-05-29 |
Family
ID=17395482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26387789A Pending JPH03126003A (en) | 1989-10-12 | 1989-10-12 | Structure of fixing part for optical parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126003A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530819U (en) * | 1991-09-30 | 1993-04-23 | 京セラ株式会社 | Imaging device |
| JPH0590415U (en) * | 1992-05-25 | 1993-12-10 | 株式会社ケンウッド | Structure of lens holding member |
| DE4425636A1 (en) * | 1994-07-20 | 1996-02-15 | Daimler Benz Aerospace Ag | Optical component holder for e.g. laser crystal in integrated microsystem |
| DE102006050653A1 (en) * | 2006-10-24 | 2008-04-30 | Carl Zeiss Smt Ag | Method for connecting an optical element with a fitting on at least one connecting site used in semiconductor lithography comprises indirectly or directly positioning the element and the fitting during connection using a support element |
| US7660022B2 (en) | 2005-01-12 | 2010-02-09 | Seiko Epson Corporation | Electro-optical device, image printing apparatus, and method of manufacturing electro-optical device |
| JP2014013403A (en) * | 2007-11-19 | 2014-01-23 | Corning Inc | Glass-based laser ridges for adhesive confinement and related method |
-
1989
- 1989-10-12 JP JP26387789A patent/JPH03126003A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530819U (en) * | 1991-09-30 | 1993-04-23 | 京セラ株式会社 | Imaging device |
| JPH0590415U (en) * | 1992-05-25 | 1993-12-10 | 株式会社ケンウッド | Structure of lens holding member |
| DE4425636A1 (en) * | 1994-07-20 | 1996-02-15 | Daimler Benz Aerospace Ag | Optical component holder for e.g. laser crystal in integrated microsystem |
| DE4425636C2 (en) * | 1994-07-20 | 2001-10-18 | Daimlerchrysler Aerospace Ag | Setup with an optical component for integration into batch-processed three-dimensional microsystems |
| US7660022B2 (en) | 2005-01-12 | 2010-02-09 | Seiko Epson Corporation | Electro-optical device, image printing apparatus, and method of manufacturing electro-optical device |
| DE102006050653A1 (en) * | 2006-10-24 | 2008-04-30 | Carl Zeiss Smt Ag | Method for connecting an optical element with a fitting on at least one connecting site used in semiconductor lithography comprises indirectly or directly positioning the element and the fitting during connection using a support element |
| US8705006B2 (en) | 2006-10-24 | 2014-04-22 | Carl Zeiss Smt Gmbh | Method and device for connecting an optical element to a frame |
| US9604299B2 (en) | 2006-10-24 | 2017-03-28 | Carl Zeiss Smt Gmbh | Method and device for connecting an optical element to a frame |
| JP2014013403A (en) * | 2007-11-19 | 2014-01-23 | Corning Inc | Glass-based laser ridges for adhesive confinement and related method |
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