JPH03124643U - - Google Patents

Info

Publication number
JPH03124643U
JPH03124643U JP3288190U JP3288190U JPH03124643U JP H03124643 U JPH03124643 U JP H03124643U JP 3288190 U JP3288190 U JP 3288190U JP 3288190 U JP3288190 U JP 3288190U JP H03124643 U JPH03124643 U JP H03124643U
Authority
JP
Japan
Prior art keywords
insulating film
chip
flexible substrate
wiring
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3288190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3288190U priority Critical patent/JPH03124643U/ja
Publication of JPH03124643U publication Critical patent/JPH03124643U/ja
Pending legal-status Critical Current

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  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるICユニツ
トの構造を示す平面図、第2図はその断面図であ
る。 1…絶縁性フイルム、11…開口、2…ICチ
ツプ、4…配線リード、5…端子、6…接続部、
7…金属箔。
FIG. 1 is a plan view showing the structure of an IC unit according to an embodiment of the invention, and FIG. 2 is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Insulating film, 11... Opening, 2... IC chip, 4... Wiring lead, 5... Terminal, 6... Connection part,
7...Metal foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性フイルムの中央部にICチツプを挿入す
る開口が設けられると共に、該絶縁性フイルムの
表面にはICチツプに接続する配線リードがパタ
ーン形成されているフレキシブル基板において、
該フレキシブル基板の絶縁性フイルムの裏面で、
少なくとも配線リードの端子が複数集められ整列
する接続部部分には、金属箔が被着されているこ
とを特徴とするICユニツト。
A flexible substrate in which an opening for inserting an IC chip is provided in the center of an insulating film, and wiring leads connected to the IC chip are patterned on the surface of the insulating film,
On the back side of the insulating film of the flexible substrate,
An IC unit characterized in that at least a connecting portion where a plurality of wiring lead terminals are gathered and aligned is coated with metal foil.
JP3288190U 1990-03-30 1990-03-30 Pending JPH03124643U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3288190U JPH03124643U (en) 1990-03-30 1990-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3288190U JPH03124643U (en) 1990-03-30 1990-03-30

Publications (1)

Publication Number Publication Date
JPH03124643U true JPH03124643U (en) 1991-12-17

Family

ID=31536126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3288190U Pending JPH03124643U (en) 1990-03-30 1990-03-30

Country Status (1)

Country Link
JP (1) JPH03124643U (en)

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