JPH03123318U - - Google Patents
Info
- Publication number
- JPH03123318U JPH03123318U JP3209190U JP3209190U JPH03123318U JP H03123318 U JPH03123318 U JP H03123318U JP 3209190 U JP3209190 U JP 3209190U JP 3209190 U JP3209190 U JP 3209190U JP H03123318 U JPH03123318 U JP H03123318U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- signal electrode
- printed
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係る複合電子部品
の構成図、第２図及び第３図は第１図に示す複合
電子部品の組立て工程説明図、第４図は第１図に
示す複合電子部品の完成状態を示す説明図、第５
図及び第６図は従来の複合電子部品の構成図であ
る。
１……複合電子部品、３……プリント基板、５
……外部接続端子、６……樹脂部材、２０……イ
ンダクタンス素子、３０……コンデンサ素子、４
０……電極部、ＩＣ……集積回路チツプ。
Figure 1 is a configuration diagram of a composite electronic component according to an embodiment of the present invention, Figures 2 and 3 are illustrations of the assembly process of the composite electronic component shown in Figure 1, and Figure 4 is shown in Figure 1. Explanatory diagram showing the completed state of the composite electronic component, No. 5
FIG. 6 is a configuration diagram of a conventional composite electronic component. 1...Composite electronic component, 3...Printed circuit board, 5
...External connection terminal, 6...Resin member, 20...Inductance element, 30...Capacitor element, 4
0...Electrode part, IC...Integrated circuit chip.
Claims (1)
にインダクタンス素子、コンデンサ素子および集
積回路チツプとを実装し、前記プリント基板の端
部に少なくとも一つの信号電極を形成してなる複
合電子部品において、 前記信号電極と前記プリント基板の外側に配列
された外部接続端子とをワイヤーボンデイングに
より接続したことを特徴とする複合電子部品。[Claims for Utility Model Registration] An inductance element, a capacitor element, and an integrated circuit chip are mounted on a printed circuit board on which a predetermined circuit pattern is printed, and at least one signal electrode is formed at the end of the printed circuit board. A composite electronic component, wherein the signal electrode and external connection terminals arranged on the outside of the printed circuit board are connected by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3209190U JPH03123318U (en) | 1990-03-28 | 1990-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3209190U JPH03123318U (en) | 1990-03-28 | 1990-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03123318U true JPH03123318U (en) | 1991-12-16 |
Family
ID=31534964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3209190U Pending JPH03123318U (en) | 1990-03-28 | 1990-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03123318U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010530622A (en) * | 2007-06-21 | 2010-09-09 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electrical components |
-
1990
- 1990-03-28 JP JP3209190U patent/JPH03123318U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010530622A (en) * | 2007-06-21 | 2010-09-09 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electrical components |