JPH03120055U - - Google Patents
Info
- Publication number
- JPH03120055U JPH03120055U JP1990029921U JP2992190U JPH03120055U JP H03120055 U JPH03120055 U JP H03120055U JP 1990029921 U JP1990029921 U JP 1990029921U JP 2992190 U JP2992190 U JP 2992190U JP H03120055 U JPH03120055 U JP H03120055U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- package
- imaging
- imaging device
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案の一実施例に係る固体撮像素子
の図面であつて、ａは撮像チツプの正面図、ｂは
パツケージの背面図、ｃはｂのＡ−Ａ線断面図、
第２図はこの固体撮像素子をビデオカメラの画像
手振れ防止機構に用いた場合の概略的構成図、第
３図は従来の固体撮像素子の正面図である。
１００……固体撮像素子、１０……撮像チツプ
、１１……撮像面、１１１……（撮像面の）中心
、２０……パツケージ、２２……（パツケージの
）裏面、２３……突起。
FIG. 1 is a drawing of a solid-state imaging device according to an embodiment of the present invention, in which a is a front view of an imaging chip, b is a rear view of a package, c is a sectional view taken along line A-A of b,
FIG. 2 is a schematic configuration diagram when this solid-state imaging device is used in an image stabilization mechanism of a video camera, and FIG. 3 is a front view of the conventional solid-state imaging device. 100... Solid-state imaging device, 10... Imaging chip, 11... Imaging surface, 111... Center (of the imaging surface), 20... Package, 22... Back surface (of the package), 23... Protrusion.
Claims (1)
素子において、パツケージの裏面側であつて、か
つ撮像チツプの撮像面の中心に相当する部分には
多角錐状の突起が形成されていることを特徴とす
る固体撮像素子。 A solid-state imaging device comprising an imaging chip housed in a package, characterized in that a polygonal pyramidal protrusion is formed on the back side of the package and at a portion corresponding to the center of the imaging surface of the imaging chip. Solid-state image sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029921U JPH03120055U (en) | 1990-03-23 | 1990-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990029921U JPH03120055U (en) | 1990-03-23 | 1990-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120055U true JPH03120055U (en) | 1991-12-10 |
Family
ID=31532665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990029921U Pending JPH03120055U (en) | 1990-03-23 | 1990-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120055U (en) |
-
1990
- 1990-03-23 JP JP1990029921U patent/JPH03120055U/ja active Pending
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