JPH0310675Y2 - - Google Patents
Info
- Publication number
- JPH0310675Y2 JPH0310675Y2 JP8982584U JP8982584U JPH0310675Y2 JP H0310675 Y2 JPH0310675 Y2 JP H0310675Y2 JP 8982584 U JP8982584 U JP 8982584U JP 8982584 U JP8982584 U JP 8982584U JP H0310675 Y2 JPH0310675 Y2 JP H0310675Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- sockets
- burn
- socket
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 64
- 238000001514 detection method Methods 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
この考案は例えばIC（集積回路）等の複数個の
半導体の中から欠陥半導体を取り除く目的のため
に行なわれる半導体のバーンイン基板への挿入装
置の改良に関するものである。[Detailed description of the invention] [Technical field of the invention] This invention is a device for inserting semiconductors into burn-in boards, which is used for the purpose of removing defective semiconductors from a plurality of semiconductors such as ICs (integrated circuits). It is about improvement.
第１図は従来の半導体のバーンイン基板への挿
入装置を示す一部断面正面図である。図におい
て、１は例えばIC等の半導体、２はこの半導体
１を位置決め保持する保持部材２ａと半導体１の
挿入時に該半導体１を押圧する押圧部材２ｂとよ
りなる挿入体で、駆動装置（図示せず）によつて
Ａ，Ｂ矢方向の上下運動をするようになされてい
る。３は一端側に複数個のソケツト３ａ，３ｂ，
３ｃ……が半田付け等で結合されたバーンイン基
板で、駆動装置（図示せず）によつてＣ矢方向に
移動可能になされている。
FIG. 1 is a partially sectional front view showing a conventional device for inserting a semiconductor into a burn-in board. In the figure, 1 is a semiconductor such as an IC, and 2 is an insert body consisting of a holding member 2a that positions and holds the semiconductor 1, and a pressing member 2b that presses the semiconductor 1 when the semiconductor 1 is inserted. ), it is made to move up and down in the directions of arrows A and B. 3 has a plurality of sockets 3a, 3b,
3c... is a burn-in board connected by soldering or the like, and is movable in the direction of arrow C by a drive device (not shown).
一般に半導体１のバーンイン工程とは、電気的
接合を行なうためパターン化（図示せず）された
バーンイン基板３の一端側に主に半田付け等で結
合された複数個のソケツト３ａ，３ｂ，３ｃ……
内に半導体１がバーンイン基板３のパターンと電
気的導通可能な状態に挿入保持され、恒温下で電
気的衝撃を加えて半導体１を加速試験して欠陥半
導体１を取り除く目的のために行なわれるもので
ある。 Generally, the burn-in process for the semiconductor 1 involves forming a plurality of sockets 3a, 3b, 3c, . …
The semiconductor 1 is inserted and held in a state where it can be electrically connected to the pattern of the burn-in board 3, and the semiconductor 1 is acceleratedly tested by applying an electric shock at a constant temperature for the purpose of removing defective semiconductors 1. It is.
次にこのように構成されたものゝ動作について
説明する。保持部材２ａによつて位置決め保持さ
れた半導体１は挿入可能な位置で停止するバーン
イン基板３の例えばソケツト３ｂ上に駆動装置
（図示せず）によつてＢ矢方向に下降する挿入体
２と共に下方に移動し、Ｂ矢方向に所定寸法移動
した時に挿入体２の押圧部材２ｂが所定圧力で半
導体１を保持部材２ａより押出してソケツト３ｂ
上に挿入する。半導体１をソケツト３ｂ上に挿入
した後、保持部材２ａおよび押圧部材２ｂは駆動
装置によつて所定の位置までＡ矢の方向に上昇す
ると共に、次にソケツトに挿入する半導体１の供
給を受ける。また、バーンイン基板３は駆動装置
によつてＣ矢方向に移動して次の半導体１がソケ
ツト３ｃに挿入される位置に対応するようになさ
れる。このような動作を順次繰返すことによつて
複数個の半導体１のバーンイン工程を完了するこ
とになる。 Next, the operation of the device configured as described above will be explained. The semiconductor 1, which is positioned and held by the holding member 2a, is placed on, for example, a socket 3b of the burn-in board 3, which is stopped at a position where it can be inserted, and is moved downward with the inserter 2, which is lowered in the direction of the arrow B by a drive device (not shown). When the insert body 2 moves by a predetermined distance in the direction of the arrow B, the pressing member 2b of the insert body 2 pushes out the semiconductor 1 from the holding member 2a with a predetermined pressure, thereby releasing the semiconductor 1 into the socket 3b.
Insert above. After the semiconductor 1 is inserted into the socket 3b, the holding member 2a and the pressing member 2b are raised by the drive device to a predetermined position in the direction of arrow A, and are supplied with the semiconductor 1 to be inserted into the socket next. Further, the burn-in board 3 is moved by the drive device in the direction of arrow C to correspond to the position where the next semiconductor 1 is inserted into the socket 3c. By sequentially repeating such operations, the burn-in process for a plurality of semiconductors 1 is completed.
従来の半導体１のバーンイン基板３への挿入装
置は以上のように構成され、挿入体２に送り込ま
れてきた半導体１を無条件でバーンイン基板３の
ソケツト３ａ，３ｂ，３ｃ……に挿入するため
に、取り扱い時損傷あるいは破損したソケツト３
ａ，３ｂ，３ｃ……、即ちバーンイン基板３のパ
ターンと電気的導通のないもの、あるいは挿入す
れば半導体１に損傷を与えるようなソケツト３
ａ，３ｂ，３ｃ……にも半導体１を挿入していた
ために、正規のバーンイン試験を受けずに半導体
１が次の工程に流れたり、半導体１が損傷を受け
て不良品となつたりして半導体１の信頼性あるい
は経済性を阻害していた。更に上記のような半導
体１をバーンイン試験を受ける前に除去するため
にはソケツト３ａ，３ｂ，３ｃ……と半導体１と
バーンイン基板３のパターンとの電気的チェック
を各１個宛にしなければならぬために、これまた
作業性を著しく阻害すると共に膨大な作業時間を
費すという欠点があつた。 The conventional device for inserting the semiconductor 1 into the burn-in board 3 is constructed as described above, and is used to unconditionally insert the semiconductor 1 fed into the inserter 2 into the sockets 3a, 3b, 3c, . . . of the burn-in board 3. If the socket 3 is damaged or damaged during handling,
a, 3b, 3c... That is, sockets 3 that have no electrical continuity with the pattern of the burn-in board 3, or that would damage the semiconductor 1 if inserted.
Because semiconductor 1 was also inserted in a, 3b, 3c, etc., semiconductor 1 was sent to the next process without undergoing a regular burn-in test, or semiconductor 1 was damaged and became a defective product. This hindered the reliability or economic efficiency of semiconductor 1. Furthermore, in order to remove the semiconductor 1 as described above before undergoing a burn-in test, it is necessary to conduct an electrical check on each of the sockets 3a, 3b, 3c, . . . and the patterns of the semiconductor 1 and the burn-in board 3. This also has the drawback of significantly impeding work efficiency and requiring a huge amount of work time.
〔考案の概要）
この考案はこのような欠点を解消しようとして
なされたもので、バーンイン基板の複数個のソケ
ツトの中の不良ソケツトに被検出部材を装着する
と共に、半導体を複数個のソケツトに夫々挿入す
る前に移動可能な検出体で複数個のソケツトの被
検出部材の有無を検出し、被検出部材が装着され
ないソケツトのみに半導体を挿入することにより
半導体の損傷を防止すると共に、半導体の信頼
性、挿入作業の作業性および経済性が大幅に向上
する半導体のバーンイン基板への挿入装置を提案
するものである。[Summary of the invention] This invention was made in an attempt to eliminate these drawbacks, and in addition to mounting a member to be detected into a defective socket among the plurality of sockets of a burn-in board, it also attaches a semiconductor to each of the plurality of sockets. Before insertion, a movable detection body detects the presence or absence of the detected member in multiple sockets, and by inserting the semiconductor only into sockets where no detected member is installed, damage to the semiconductor can be prevented, and the reliability of the semiconductor can be improved. The present invention proposes an apparatus for inserting a semiconductor into a burn-in board, which greatly improves the workability and economic efficiency of the insertion work.
第２図および第３図はこの考案の一実施例を示
すもので、第２図は半導体１をソケツト３ｂに挿
入前の被検出部材４の検出状態を示す一部断面正
面図、第３図は被検出部材４を検出後半導体１を
良品のソケツト３ｃに挿入した状態を示す一部断
面正面図である。図において、３ａ，３ｃは規格
内（良品）のソケツト、３ｂは規格外（不良品）
のソケツトで、底部に不良ソケツトであることが
検知される被検出部材４が装着されている。５は
複数個のソケツト３ａ，３ｂ，３ｃ……に被検出
部材４が装着されているか否かを検出する検出体
で、駆動装置（図示せず）によつて各ソケツト３
ａ，３ｂ，３ｃ……上をＤ矢の方向に移動して被
検出部材４の有無を検出する。その他の構成は従
来の半導体のバーンイン基板への挿入装置と同様
であるので説明を省略する。
2 and 3 show an embodiment of this invention, FIG. 2 is a partially sectional front view showing the detection state of the member to be detected 4 before the semiconductor 1 is inserted into the socket 3b, and FIG. 1 is a partially sectional front view showing a state in which the semiconductor 1 is inserted into a non-defective socket 3c after the detection target member 4 has been detected. In the figure, 3a and 3c are sockets that are within specifications (good products), and 3b is non-standard (defective products).
A detection target member 4 is attached to the bottom of the socket to detect that it is a defective socket. Reference numeral 5 denotes a detection body for detecting whether or not a member to be detected 4 is attached to a plurality of sockets 3a, 3b, 3c, . . .
a, 3b, 3c... are moved in the direction of arrow D to detect the presence or absence of the member to be detected 4. The rest of the configuration is the same as that of a conventional semiconductor inserting device into a burn-in board, so a description thereof will be omitted.
次にこのように構成されたものゝ動作について
説明する。保持部材２ａによつて位置決め保持さ
れた半導体１を備えた挿入体２が例えばソケツト
３ｂに半導体１が挿入可能な位置で停止するバー
ンイン基板３のソケツト３ｂに駆動装置によつて
Ｂ矢の方向に下降する前に、検出体５が駆動装置
によつてソケツト３ｂ上をＤ矢の方向に移動して
ソケツト３ｂ内の被検出部材４の有無を検出す
る。検出体５がソケツト３ｂ内の被検出部材４を
検出すると挿入体２は半導体１を保持した状態で
下降せず、バーンイン基板３のみが駆動装置によ
つてＣ矢の方向に移動して次のソケツト３ｃに半
導体１が挿入可能な位置にセツトされる。この状
態で再び検出体５が移動してソケツト３ｃ内の被
検出部材４の有無の検出を行ない、被検出部材４
が無いと判定すると検出体５が後退し、半導体１
を位置決め保持した挿入体２がソケツト３ｃ上に
所定寸法Ｂ矢の方向に下降して駆動装置によつて
押圧部材２ｂが所定圧力で半導体１を保持部材２
ａより押出しソケツト３ｃ上に挿入を行なう。半
導体１がソケツト３ｃ上に挿入完了後は挿入体２
および押圧部材２ｂは駆動装置によつてＡ矢の方
向の所定の位置まで上昇すると共に次にソケツト
に挿入する半導体１の供給を受ける。また、バー
ンイン基板３の駆動装置によつて次の半導体１が
次のソケツトに挿入される位置まで移動する。こ
のような動作を順次繰返して複数個の半導体１の
バーンイン基板３への挿入作業が行なわれること
になる。 Next, the operation of the device configured as described above will be explained. The inserter 2 with the semiconductor 1 positioned and held by the holding member 2a is inserted into the socket 3b of the burn-in board 3, which is stopped at a position where the semiconductor 1 can be inserted into the socket 3b, for example, in the direction of the arrow B by a drive device. Before descending, the detection body 5 is moved by the drive device in the direction of arrow D on the socket 3b to detect the presence or absence of the member to be detected 4 in the socket 3b. When the detection body 5 detects the detected member 4 in the socket 3b, the insert body 2 does not descend while holding the semiconductor 1, and only the burn-in board 3 is moved in the direction of arrow C by the drive device to the next position. The semiconductor 1 is set at a position where it can be inserted into the socket 3c. In this state, the detection body 5 moves again to detect the presence or absence of the detected member 4 in the socket 3c.
If it is determined that there is no detection object 5, the detection object 5 moves back and the semiconductor 1
The insert 2 holding the semiconductor 1 in position is lowered onto the socket 3c by a predetermined distance B in the direction of the arrow, and the driving device causes the pressing member 2b to press the semiconductor 1 with a predetermined pressure onto the holding member 2.
Insert it onto the extrusion socket 3c from a. After the semiconductor 1 is inserted into the socket 3c, the inserter 2
The pressing member 2b is raised by the drive device to a predetermined position in the direction of arrow A, and receives the supply of the semiconductor 1 to be inserted into the socket next. Further, the burn-in board 3 is moved by the drive device to a position where the next semiconductor 1 is inserted into the next socket. By sequentially repeating such operations, a plurality of semiconductors 1 are inserted into the burn-in substrate 3.
なお、この実施例では半導体１を各１個宛バー
ンイン基板３に挿入するものについて説明した
が、この実施例に限定されるものではなく、複数
個の半導体１を同時にバーンイン基板３に挿入す
ることも可能である。 In this embodiment, one semiconductor 1 is inserted into the burn-in board 3, but the present invention is not limited to this embodiment, and a plurality of semiconductors 1 may be inserted into the burn-in board 3 at the same time. is also possible.
この考案は以上説明したように、バーンイン基
板の複数個のソケツトの中の不良ソケツトに被検
出部材を装着すると共に、半導体を複数個のソケ
ツトに夫々挿入する前に移動可能な検出体で複数
個のソケツトの被検出部材の有無を検出し、被検
出部材が装着されないソケツトのみに半導体を挿
入するようにしたので、半導体が挿入時に受ける
損傷が皆無となり、経済的で信頼性の高いバーン
イン試験が得られる半導体のバーンイン基板への
挿入装置を提供することができる効果がある。
As explained above, this device attaches the detected member to the defective socket among the plurality of sockets of the burn-in board, and also attaches the detected member to the defective socket among the plurality of sockets on the burn-in board. The presence or absence of the detected component in the sockets is detected, and the semiconductor is inserted only into the sockets where the detected component is not installed.Therefore, there is no damage to the semiconductor during insertion, and an economical and highly reliable burn-in test can be performed. There is an effect that it is possible to provide a device for inserting the obtained semiconductor into a burn-in board.
また本発明では、ソケツトと半導体（挿入体を
含む）との空間を小さくでき、装置がコンパクト
化し得るとともに、挿入体の上下動作寸法が小と
なり、上下動作精度が向上する。またソケツトと
挿入体との小さな空間に検出体を配置でき、確実
に被検出部材を検出できる。さらに、挿入直前の
ソケツトの良否を判断するため、停電時などのト
ラブルが生じた場合でも誤挿入などのトラブルを
減少し得るなどの多くのすぐれた効果を奏する。 Further, according to the present invention, the space between the socket and the semiconductor (including the insert) can be reduced, the device can be made more compact, and the vertical movement dimension of the insert can be reduced, improving the accuracy of the vertical movement. Furthermore, the detection object can be placed in a small space between the socket and the insert, and the member to be detected can be detected reliably. Furthermore, since the quality of the socket is judged immediately before insertion, it has many excellent effects, such as reducing troubles such as incorrect insertion even in the event of trouble such as a power outage.
第１図は従来の半導体のバーンイン基板への挿
入装置を示す一部断面正面図、第２図および第３
図はこの考案の一実施例を示すもので、第２図は
半導体をソケツトに挿入前の被検出部材の検出状
態を示す一部断面正面図、第３図は半導体を良品
のソケツトに挿入した状態を示す一部断面正面図
である。
図において、１は半導体、２は挿入体、３はバ
ーンイン基板、３ａ，３ｂ，３ｃは複数個のソケ
ツト、４は被検出部材、５は検出体である。尚、
図中同一符号は同一または相当部分を示す。
FIG. 1 is a partially sectional front view showing a conventional device for inserting a semiconductor into a burn-in board, and FIGS.
The figure shows an example of this invention. Figure 2 is a partially sectional front view showing the state of detection of the detected member before the semiconductor is inserted into the socket, and Figure 3 is a front view showing the detection state of the detected member before the semiconductor is inserted into the socket. It is a partially sectional front view showing a state. In the figure, 1 is a semiconductor, 2 is an insert, 3 is a burn-in board, 3a, 3b, 3c are a plurality of sockets, 4 is a member to be detected, and 5 is a detection body. still,
The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
夫々挿入する挿入装置において、上記複数個のソ
ケツトに半導体の底面に対向して形成された凹部
を形成し、その中の不良ソケツトの凹部の底部に
被検出部材を装着してソケツトの上面から離間さ
せ、上記半導体を上記複数個のソケツトに夫々挿
入する前に上記ソケツトの直上でソケツトと半導
体との間に位置して移動可能な検出体で上記複数
個のソケツトの被検出部材の有無を検出し、被検
出部材が装着されないソケツトのみに上記半導体
を挿入するようにしたことを特徴とする半導体の
バーンイン基板への挿入装置。 In an insertion device for inserting a semiconductor into a plurality of sockets of a burn-in board, recesses are formed in the plurality of sockets to face the bottom surface of the semiconductor, and a detection target is formed at the bottom of the recess of a defective socket among the recesses. a plurality of movable detection bodies positioned directly above the sockets between the sockets and the semiconductors before the semiconductors are respectively inserted into the plurality of sockets by mounting the member and separating the semiconductors from the upper surface of the sockets; 1. An apparatus for inserting a semiconductor into a burn-in board, characterized in that the semiconductor is inserted into only sockets in which no detected member is mounted by detecting the presence or absence of a detected member in a socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8982584U JPS614432U (en) | 1984-06-14 | 1984-06-14 | Device for inserting semiconductors into burn-in boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8982584U JPS614432U (en) | 1984-06-14 | 1984-06-14 | Device for inserting semiconductors into burn-in boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS614432U JPS614432U (en) | 1986-01-11 |
| JPH0310675Y2 true JPH0310675Y2 (en) | 1991-03-15 |
Family
ID=30644269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8982584U Granted JPS614432U (en) | 1984-06-14 | 1984-06-14 | Device for inserting semiconductors into burn-in boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS614432U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9005971B2 (en) | 2005-04-22 | 2015-04-14 | Life Technologies Corporation | Gas spargers and related container systems |
| US9376655B2 (en) | 2011-09-29 | 2016-06-28 | Life Technologies Corporation | Filter systems for separating microcarriers from cell culture solutions |
-
1984
- 1984-06-14 JP JP8982584U patent/JPS614432U/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9005971B2 (en) | 2005-04-22 | 2015-04-14 | Life Technologies Corporation | Gas spargers and related container systems |
| US9259692B2 (en) | 2005-04-22 | 2016-02-16 | Life Technologies Corporation | Gas spargers and related container systems |
| US9475012B2 (en) | 2005-04-22 | 2016-10-25 | Life Technologies Corporation | Gas spargers and related container systems |
| US9376655B2 (en) | 2011-09-29 | 2016-06-28 | Life Technologies Corporation | Filter systems for separating microcarriers from cell culture solutions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS614432U (en) | 1986-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2162785A1 (en) | Method and apparatus for automatic loading and unloading of printed circuit boards on machines for electrical testing | |
| JP2004184415A (en) | Device for inspecting semiconductor package and inspection method using it | |
| JPH0310675Y2 (en) | ||
| JP2000346875A (en) | Probe card and ic testing device using it | |
| KR100305683B1 (en) | Burn-in board for bwrn-in test | |
| JP3224519B2 (en) | Wafer measuring jig, test head device and wafer measuring device | |
| JPH06281698A (en) | Ic automatic handling method | |
| JPS6166972A (en) | Inserting device for semiconductor device into substrate for burn-in | |
| JPH05322971A (en) | Ic inspection device | |
| JPH068512Y2 (en) | Contact pin automatic holding power check device | |
| JP3182755B2 (en) | IC handler | |
| JP2606442B2 (en) | Test jig for semiconductor equipment | |
| JPH056348B2 (en) | ||
| JPH051831Y2 (en) | ||
| JPS61290373A (en) | Method and instrument for aging | |
| KR20080084467A (en) | Test apparatus for wafer chip stack and method of testing the same | |
| CN117148116A (en) | Chip high-current testing device and testing method | |
| JPH0439949A (en) | Test jig for semiconductor device | |
| JPH0572268A (en) | Jig for characteristic inspection for tape bonding semiconductor device | |
| JPH0217520Y2 (en) | ||
| JP2977359B2 (en) | Testing equipment for electronic components | |
| JPH09307290A (en) | Electronic part inserting device | |
| JPS62299773A (en) | Inspection apparatus for printed circuit board conduction | |
| EP0292119A2 (en) | Floating crown for insertion-extraction head | |
| KR19980083854A (en) | Socket for testing COB type semiconductor chip package |