JPH0310538U - - Google Patents
Info
- Publication number
- JPH0310538U JPH0310538U JP1989068993U JP6899389U JPH0310538U JP H0310538 U JPH0310538 U JP H0310538U JP 1989068993 U JP1989068993 U JP 1989068993U JP 6899389 U JP6899389 U JP 6899389U JP H0310538 U JPH0310538 U JP H0310538U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- shaft
- movable body
- forming punch
- adjustment mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図〜第３図はこの考案のリード成形装置を
示し、第１図はフオーミングポンチの落ち込み量
を調整する前の状態を示す図、第２図はリードの
落ち込み量を測定して誤差を求める状態を示す図
、第３図は落ち込み量の誤差を調整した状態を示
す図、第４図は従来のリード成形装置を示す図で
ある。
４……リード、７……移動体、９……シヤフト
、１０……フオーミングポンチ、１１……スプリ
ング、１２……圧力シリンダ、２０……リード成
形装置、２１……微調整機構。
Figures 1 to 3 show the lead forming device of this invention. Figure 1 shows the state before adjusting the amount of depression of the forming punch, and Figure 2 shows the error caused by measuring the amount of depression of the lead. FIG. 3 is a diagram showing a state in which the error in the drop amount is adjusted, and FIG. 4 is a diagram showing a conventional lead forming apparatus. 4... Lead, 7... Moving body, 9... Shaft, 10... Forming punch, 11... Spring, 12... Pressure cylinder, 20... Lead forming device, 21... Fine adjustment mechanism.
Claims (1)
スプリングを介して移動体に上下動可能に保持す
るとともに、この移動体に前記シヤフトの上方へ
の移動を圧力で抑える圧力シリンダを設け、前記
移動体を下方へ移動させて前記フオーミングポン
チをリード上に落し込むことにより、前記リード
を折曲するリード成形装置において、 前記シヤフトに前記フオーミングポンチの落ち
込み量を微調整する微調整機構を設けたことを特
徴とするリード成形装置。[Claims for Utility Model Registration] A shaft having a forming punch at its lower end is held in a movable body via a spring so as to be movable up and down, and the movable body is provided with a pressure cylinder that uses pressure to suppress upward movement of the shaft. A lead forming device that bends the lead by moving the movable body downward and dropping the forming punch onto the lead, wherein the shaft is provided with a fine adjustment mechanism for finely adjusting the depression amount of the forming punch. A lead forming device characterized by being equipped with an adjustment mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068993U JPH0310538U (en) | 1989-06-15 | 1989-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989068993U JPH0310538U (en) | 1989-06-15 | 1989-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310538U true JPH0310538U (en) | 1991-01-31 |
Family
ID=31603917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989068993U Pending JPH0310538U (en) | 1989-06-15 | 1989-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310538U (en) |
-
1989
- 1989-06-15 JP JP1989068993U patent/JPH0310538U/ja active Pending
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