JPH0310488B2 - - Google Patents
Info
- Publication number
- JPH0310488B2 JPH0310488B2 JP60274362A JP27436285A JPH0310488B2 JP H0310488 B2 JPH0310488 B2 JP H0310488B2 JP 60274362 A JP60274362 A JP 60274362A JP 27436285 A JP27436285 A JP 27436285A JP H0310488 B2 JPH0310488 B2 JP H0310488B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cavity
- resin
- gap
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 74
- 239000011347 resin Substances 0.000 claims description 74
- 238000000465 moulding Methods 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 4
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 239000006261 foam material Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000013011 mating Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、熱硬化性樹脂の成形に使用される
熱硬化性樹脂成形金型に関し、特に、互いに閉じ
られてキヤビテイを形成する第一型と第二型とを
備え前記キヤビテイに注入された液状の熱硬化性
樹脂が前記第一型と第二型との間から型外へ漏出
することを防止する熱硬化性樹脂成形金型に係わ
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a thermosetting resin molding die used for molding a thermosetting resin, and in particular, a first mold that is closed together to form a cavity. and a second mold, and which prevents liquid thermosetting resin injected into the cavity from leaking out of the mold from between the first mold and the second mold. .
不飽和ポリエステル、エポキシ樹脂、フエノー
ル樹脂等の熱硬化性樹脂の成形に使用される熱硬
化性樹脂成形金型は、一般に、互いに閉じられて
キヤビテイを形成する第一型と第二型とを備えて
いる。この種の成形金型においては、キヤビテイ
に注入された熱硬化性樹脂が、第一型と第二型と
との間から漏出することを防止するために、従
来、種々の態様でシールが行われている。
Thermosetting resin molding molds used for molding thermosetting resins such as unsaturated polyester, epoxy resins, and phenolic resins generally include a first mold and a second mold that are closed together to form a cavity. ing. Conventionally, in this type of molding mold, sealing has been performed in various ways to prevent the thermosetting resin injected into the cavity from leaking from between the first mold and the second mold. It is being said.
例えば、第一型と第二型とのキヤビテイの周辺
の合わせ面に、空気は逃がすが樹脂の漏出は防止
する隙間を形成することが行われており、また、
ガラス繊維等の繊維基材で樹脂を強化するFRP
レジンインジエクシヨン成形においては、第一型
と第二型との間に挟む繊維基材をキヤビテイより
も大きいものとするとともに、両型の合わせ面間
に環状にゴムあるいは金属のピンチ部材を配設
し、繊維基材のピンチ部材によつて局部的に強く
圧縮された部分がシール機能を果たすようにする
ことが行われている。さらに、キヤビテイの周囲
をＯリング等によつてシールし、真空ポンプ等に
より型内の空気を抜いた後に樹脂を注入してＯリ
ングにより樹脂の漏出を防止することも行われて
いる。 For example, gaps are formed on the mating surfaces around the cavities of the first mold and the second mold to allow air to escape but prevent resin from leaking.
FRP that strengthens resin with fiber base materials such as glass fiber
In resin injection molding, the fiber base material sandwiched between the first mold and the second mold is larger than the cavity, and a rubber or metal pinch member is arranged in an annular shape between the mating surfaces of both molds. The fiber base material is provided so that the portion of the fiber base material that is locally strongly compressed by the pinch member performs a sealing function. Furthermore, the circumference of the cavity is sealed with an O-ring or the like, and after the air inside the mold is removed using a vacuum pump or the like, resin is injected and the O-ring is used to prevent the resin from leaking.
しかし、第一および第二のシール機構によれ
ば、樹脂の注入圧を高くしたり、粘度の低い樹脂
を使用した場合には樹脂の漏出を完全には防止で
きないため、成形に当たつては粘度の高い樹脂を
使用するか、樹脂の注入圧を低くせざるを得ず、
成形サイクルを短縮することが困難である上、樹
脂の漏出により、キヤビテイに充填されるべき樹
脂の量が不足し、成形品に欠損が生じたり、ま
た、型外に漏出した樹脂を除去するために掃除を
行わなければならず、作業工数が増加するという
問題があつた。
However, according to the first and second seal mechanisms, resin leakage cannot be completely prevented when the resin injection pressure is increased or when a resin with low viscosity is used, so it is difficult to prevent resin from leaking during molding. You have no choice but to use a resin with high viscosity or lower the resin injection pressure.
Not only is it difficult to shorten the molding cycle, resin leakage may result in an insufficient amount of resin to be filled into the cavity, resulting in defects in the molded product, and it is necessary to remove the resin that has leaked out of the mold. There was a problem in that the cleaning had to be done every day, which increased the number of man-hours.
第三のシール機構によれば、注入圧を高くした
り、粘度の低い樹脂を使用しても樹脂が漏出する
ことはないのであるが、キヤビテイ内の空気抜き
に要する時間分成形サイクルが長くなり、また、
空気が完全に抜け切らず、キヤビテイの隅に溜ま
つた場合にはやはり成形品に欠損が生ずる問題が
あつた。 According to the third sealing mechanism, the resin will not leak even if the injection pressure is increased or a resin with low viscosity is used, but the molding cycle will be longer due to the time required to bleed air from the cavity. Also,
If the air does not escape completely and accumulates in the corners of the cavity, there is still a problem in that the molded product is damaged.
本発明は、上記の問題を解決することを目的と
する。 The present invention aims to solve the above problems.
この目的を達成するため、本発明の熱硬化性樹
脂成形金型は、互いに閉じられてキヤビテイを形
成する第一型と第二型とを備え前記キヤビテイに
注入された液状の熱硬化性樹脂が前記第一型と第
二型との間から型外へ漏出することを防止する熱
硬化性樹脂成形金型であつて、前記第一型と第二
型との間に、熱硬化性樹脂成形金型に形成された
キヤビテイと型外を連通する隙間を前記キヤビテ
イの全周にわたつて設け、この隙間に通気性を有
する多孔質弾性体を前記キヤビテイの全周にわた
つて設け、前記第一型と第二型との間の隙間を構
成する環状の各面のうち少なくとも一方の面の全
周にわたつてその面を前記キヤビテイの温度より
も高い温度に加熱するよう構成された加熱体を埋
設したことを特徴とする。
To achieve this object, the thermosetting resin molding die of the present invention includes a first mold and a second mold that are closed to each other to form a cavity, and a liquid thermosetting resin injected into the cavity is provided. A thermosetting resin molding die that prevents leakage from between the first mold and the second mold to the outside of the mold, the thermosetting resin molding die being arranged between the first mold and the second mold. A gap communicating between a cavity formed in the mold and the outside of the mold is provided around the entire circumference of the cavity, a porous elastic body having air permeability is provided in this gap around the entire circumference of the cavity, and the first A heating element configured to heat at least one of the annular surfaces constituting the gap between the mold and the second mold to a temperature higher than the temperature of the cavity over the entire circumference of the surface. It is characterized by being buried.
本発明によれば、樹脂の注入にともなつてキヤ
ビテイ内の空気がその周囲に設けられた隙間およ
びこの隙間に設けられた多孔質弾性体を通つて良
好に排出され、その後、樹脂が隙間内および多孔
質弾性体内に流入するが、キヤビテイよりも高い
温度に加熱された隙間の面によつて急速に加熱さ
れることにより、多孔質弾性体より型外へ出る前
に硬化し、第一型と第二型との間の隙間を完全に
塞いで次に流れてくる樹脂の漏出を防止するシー
ル材として機能することとなる。
According to the present invention, as the resin is injected, the air in the cavity is effectively discharged through the gap provided around the cavity and the porous elastic body provided in the gap, and then the resin is poured into the gap. Flows into the porous elastic body, but is rapidly heated by the surface of the gap that is heated to a higher temperature than the cavity, so it hardens before it leaves the mold from the porous elastic body, and the first mold It functions as a sealing material that completely closes the gap between the mold and the second mold and prevents the resin that will flow next from leaking out.
多孔質弾性体は空気の流通には十分な通気性を
備えているため、樹脂によつて押し出される空気
の排出が妨げられることはないのであり、この多
孔質弾性体によつて抵抗を与えられることによ
り、樹脂の流れが遅くなるので、樹脂の注入圧を
高くしても、また、粘度の低い樹脂を使用して
も、樹脂が確実にこの多孔質弾性体内で硬化する
ので、樹脂の漏出が完全に防止できる。 The porous elastic material has sufficient air permeability for air circulation, so the discharge of the air pushed out by the resin is not hindered, and this porous elastic material provides resistance. This slows down the resin flow, so even if the resin injection pressure is high or a resin with low viscosity is used, the resin will definitely harden within this porous elastic body, preventing resin leakage. can be completely prevented.
以下、本発明の実施例を図面に基づいて詳細に
説明する。
Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図に示すのは、本実施例に係わる熱硬化性
樹脂成形金型であり、この成形金型はエポキシ樹
脂をガラス繊維等で強化した製品の成形に利用さ
れる。図において１０は第一型としての上型、１
２は第二型としての下型であり、これら上型１０
および下型１２は共に、キヤビテイ１４を形成す
るバツクアツプ部１６，１８の背面に固定された
補助板２０，２２とを備えている。 What is shown in FIG. 1 is a thermosetting resin molding die according to this embodiment, and this molding die is used for molding a product made of epoxy resin reinforced with glass fiber or the like. In the figure, 10 is the upper mold as the first mold, 1
2 is a lower mold as a second mold, and these upper molds 10
Both of the lower mold 12 include auxiliary plates 20 and 22 fixed to the back surfaces of the backup parts 16 and 18 forming the cavity 14.
上型１０のバツクアツプ部１６には、キヤビテ
イ１４を構成するキヤビテイ面２４およびその周
囲の環状面２６に沿つて複数本のパイプ２８が互
いに並行に埋設される一方、バツクアツプ部１８
には、キヤビテイ１４を構成するキヤビテイ面３
０に沿つてのみ複数本のパイプ３２が互いに並行
に埋設されており、それらのパイプ２８，３２に
オイルが流されることにより、キヤビテイ面２
４，３０が130℃に加熱されるようになつている。
また、上型１０には、上下方向に延びる樹脂注入
穴３４が形成されており、成形時には、この樹脂
注入穴３４にミキサ３６を介して樹脂供給装置
（図示せず）に接続された注入ガン４０が挿入さ
れ、上型１０の樹脂注入孔４２からキヤビテイ１
４に樹脂が注入されるようになつている。 A plurality of pipes 28 are buried in parallel to each other in the back-up portion 16 of the upper mold 10 along the cavity surface 24 constituting the cavity 14 and the annular surface 26 around the cavity surface 24 .
, the cavity surface 3 constituting the cavity 14
A plurality of pipes 32 are buried parallel to each other only along
4,30 is heated to 130℃.
Further, a resin injection hole 34 extending in the vertical direction is formed in the upper mold 10, and during molding, an injection gun is connected to the resin injection hole 34 via a mixer 36 to a resin supply device (not shown). 40 is inserted into the cavity 1 from the resin injection hole 42 of the upper mold 10.
4, the resin is injected.
バツクアツプ部１８のキヤビテイ面３０の周囲
には、第１図および第２図に示すように、全周に
わたり、断熱材４４を介してブロツク４８が固定
されている。ブロツク４８は、外側の端面が下型
１２の側面とちようど一致するとともに、その上
端部がキヤビテイ面３０から突出した状態となる
ように配設されている。また、ブロツク４８の上
端面５０には図示しない複数のスペーサが適度の
間隔で載置されており、上型１０と下型１２とが
閉じられたとき、上端面５０と上型１０の環状面
２６との間に、厚さが0.2mmであつて、一端がキ
ヤビテイ１４に開口し、他端が型外に開口する隙
間５２が形成されるようになつている。 As shown in FIGS. 1 and 2, a block 48 is fixed around the cavity surface 30 of the backup section 18 over the entire circumference with a heat insulating material 44 interposed therebetween. The block 48 is arranged so that its outer end surface exactly matches the side surface of the lower mold 12 and its upper end protrudes from the cavity surface 30. Furthermore, a plurality of spacers (not shown) are placed on the upper end surface 50 of the block 48 at appropriate intervals, so that when the upper mold 10 and the lower mold 12 are closed, the upper end surface 50 and the annular surface of the upper mold 10 26, a gap 52 is formed with a thickness of 0.2 mm, one end of which opens into the cavity 14, and the other end of which opens outside the mold.
前記ブロツク４８内には、加熱体としてのプレ
ートヒータ５４が埋設されており、このプレート
ヒータ５４は、図示しない温度調節器によつてブ
ロツク４８の前記上端面５０を250℃に加熱し得
るようにされている。 A plate heater 54 as a heating body is embedded in the block 48, and the plate heater 54 is heated to 250° C. by a temperature controller (not shown). has been done.
前記隙間５２には、多孔質弾性体としての厚さ
５mmの軟質ウレタンフオーム材６０を挟み込んで
いる。この軟質ウレタンフオーム材６０は、多孔
性のものであり、空気の排出を許容しつつ、隙間
５２を流れる樹脂に抵抗を与えることができる。
したがつて、樹脂の流動速度が遅くなり、移動距
離に対する温度上昇率が大きくなるため、樹脂が
完全に硬化するまでに要する移動距離が短くて済
み、ブロツク４８の幅、すなわち、キヤビテイ２
４側の端から外側の端に至る長さを短くすること
ができ、本実施例においては150mmとしている。 A soft urethane foam material 60 with a thickness of 5 mm is sandwiched in the gap 52 as a porous elastic body. This soft urethane foam material 60 is porous and can provide resistance to the resin flowing through the gap 52 while allowing air to be discharged.
Therefore, the flow rate of the resin becomes slower and the rate of temperature rise with respect to the moving distance increases, so the moving distance required for the resin to completely harden is shortened, and the width of the block 48, that is, the cavity 2
The length from the fourth side end to the outer end can be shortened, and in this embodiment, it is 150 mm.
以上のように構成された成形金型による樹脂成
形時には、樹脂供給装置から供給された液状の熱
硬化性樹脂、硬化剤等がミキサ３６において混合
された、注入ガン４０から樹脂注入孔４２を経て
キヤビテイ１４内に注入され、予めキヤビテイ１
４内にセツトされた繊維基材の隙間を埋めるとと
もにキヤビテイ１４内の空気を排除しながら流
れ、隙間５２内に流入する。隙間５２内に流入し
た樹脂は、軟質ウレタンフオーム材６０内へ入り
込み、成形金型の外側に向かつて流れるのである
が、この際、250℃に加熱された上端面５０によ
つて加熱されることにより急速に硬化し、30Kg／
cm2程度の圧力で注入された場合であつても、軟質
ウレタンフオーム材６０から出るまでの間に完全
に硬化してこの軟質ウレタンフオーム材６０内の
孔を隙間なく閉塞することとなるのであり、それ
によつて上型１０と下型１２と間からの樹脂の漏
出が防止されることとなる。なお、軟質ウレタン
フオーム材６０より内側の隙間５２で硬化した樹
脂は、バリとして成形品と共に成形金型から外し
た後、切除する。 During resin molding using the mold configured as described above, the liquid thermosetting resin, curing agent, etc. supplied from the resin supply device are mixed in the mixer 36, and are mixed in the mixer 36. It is injected into the cavity 14, and the cavity 1 is injected in advance.
It flows while filling the gap between the fiber base materials set in the cavity 14 and eliminating the air in the cavity 14, and flows into the gap 52. The resin that has flowed into the gap 52 enters the soft urethane foam material 60 and flows toward the outside of the mold, but at this time, it is heated by the upper end surface 50 heated to 250°C. hardens rapidly and weighs 30Kg/
Even if it is injected at a pressure of about cm 2 , it will completely harden before it comes out of the soft urethane foam material 60 and close the pores in the soft urethane foam material 60 without any gaps. This prevents resin from leaking between the upper mold 10 and the lower mold 12. Note that the resin hardened in the gap 52 inside the soft urethane foam material 60 is removed as a burr from the mold together with the molded product, and then cut off.
上記実施例においては、多孔質弾性体として、
軟質ウレタンフオーム材を使用したが、本発明は
これに限定されるものではなく、前記隙間５２に
は、ガラス繊維コンテイニユアスストランドマツ
ト等、多孔質弾性体である有機あるいは無機の繊
維基材等にメタキシリレンジアミン等の反応促進
剤を含浸させたものを挟んでもよく、そのように
すれば、樹脂の硬化が促進されて硬化時間は短く
て済み、ブロツク４８の幅を更に短く、例えば
120mmとすることができる。なお、隙間５２に軟
質ウレタンフオーム材６０が無い場合は、ブロツ
ク４８の幅は、キヤビテイ１４から隙間５２に流
入したエポキシ樹脂が、250℃の上端面５０によ
り加熱されつつキヤビテイ１４側の開口から外側
の開口まで移動する間に完全に硬化するのに十分
な長さにする必要があり、200mmと必要となる。 In the above embodiments, as the porous elastic body,
Although a soft urethane foam material is used, the present invention is not limited thereto, and the gap 52 may be made of a porous elastic organic or inorganic fiber base material such as glass fiber continuous strand mat. A material impregnated with a reaction accelerator such as metaxylylene diamine may be sandwiched between the blocks 48 and 48. In this case, the curing of the resin is accelerated and the curing time can be shortened.
Can be 120mm. Note that when the soft urethane foam material 60 is not present in the gap 52, the width of the block 48 is such that the epoxy resin flowing into the gap 52 from the cavity 14 is heated by the upper end surface 50 at 250° C. while being heated from the opening on the cavity 14 side to the outside. It needs to be long enough to fully cure while traveling to the opening, which is 200 mm.
また、上記実施例においては、いずれも加熱体
たるプレートヒータ５４が下型１２にのみ埋設さ
れていたが、上型１０に、あるいは、上型１０、
下型１２のいずれにも埋設するようにしてもよ
い。 Further, in the above embodiments, the plate heater 54 serving as a heating element was buried only in the lower mold 12, but it was buried in the upper mold 10 or in the upper mold 10,
It may be buried in any of the lower molds 12.
さらに、加熱体はプレートヒータ５４に限られ
ず、例えば、キヤビテイ１４を加熱するパイプの
うち、隙間５２を構成する面をキヤビテイ面より
も高い温度に加熱するようにすることも可能であ
る。その他、いちいち例示することはしないが、
本発明は当業者の知識に基づいて種々の変形、改
良を施した態様で実施することができる。 Furthermore, the heating body is not limited to the plate heater 54; for example, it is also possible to heat the surface of a pipe that heats the cavity 14 that forms the gap 52 to a higher temperature than the cavity surface. I won't give any other examples, but
The present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.
以上述べたように、本発明によれば、樹脂の注
入にともなつてキヤビテイ内の空気がその周囲に
設けられた隙間およびこの隙間に設けられた多孔
質弾性体を通つて良好に排出され、その後、樹脂
が隙間内および多孔質弾性体内に流入するが、キ
ヤビテイよりも高い温度に加熱された隙間の面に
よつて急速に加熱されることにより、多孔質弾性
体より型外へ出る前に硬化し、第一型と第二型と
の間の隙間を完全に塞ぐので、樹脂の注入圧を高
くしたり、粘度の低い樹脂を使用しても、多孔質
弾性体内において硬化された樹脂がシール機能を
果たすことにより、注入された樹脂が型外に漏出
する恐れはないのであり、成形サイクルを短縮す
ることができる、また、樹脂の漏出が防止される
ことにより、キヤビテイに充填すべき樹脂の量に
不足が生ずることがなく、完全な成形品が得られ
るとともに、型外に漏れた樹脂を除去する必要が
なく、作業工数を著しく低減し得る効果が得られ
る。
As described above, according to the present invention, as the resin is injected, the air inside the cavity is well discharged through the gap provided around the cavity and the porous elastic body provided in the gap, Thereafter, the resin flows into the gap and into the porous elastic body, but because it is rapidly heated by the surface of the gap that is heated to a higher temperature than the cavity, the resin flows out of the mold before leaving the porous elastic body. It hardens and completely closes the gap between the first mold and the second mold, so even if the resin injection pressure is high or a resin with low viscosity is used, the hardened resin inside the porous elastic body will remain intact. By fulfilling the sealing function, there is no risk of the injected resin leaking out of the mold, which can shorten the molding cycle.Also, by preventing resin leakage, the resin to be filled into the cavity can be reduced. There is no shortage of the amount of resin, a perfect molded product can be obtained, and there is no need to remove resin leaked outside the mold, resulting in a significant reduction in the number of work steps.
また、多孔質弾性体によつて抵抗が与えられる
ことにより樹脂の流れが遅くなるので、加熱温度
が同じである場合には、樹脂の移動距離に対する
温度上昇率が大きくなるため、樹脂が硬化するま
でに要する移動距離が短くて済み、加熱体、延い
ては隙間の樹脂移動方向の寸法を小さくして成形
金型が小型化し得るとともに、隙間に流入する樹
脂が少なくて済み、成形コストを低減し得る効果
が得られる。 In addition, the resistance provided by the porous elastic material slows down the flow of the resin, so if the heating temperature is the same, the rate of temperature rise relative to the distance traveled by the resin increases, causing the resin to harden. The moving distance required for this process is short, and by reducing the size of the heating element and the gap in the direction of resin movement, the mold can be made smaller, and less resin flows into the gap, reducing molding costs. You can get the desired effect.
第１図は本発明の一実施例である熱硬化性樹脂
成形金型を示す正面断面図、第２図は第１図の熱
硬化性樹脂成形金型のシール部を示す拡大断面図
である。
FIG. 1 is a front sectional view showing a thermosetting resin molding die according to an embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing a sealing part of the thermosetting resin molding die of FIG. 1. .
Claims (1)
型と第二型とを備え前記キヤビテイに注入された
液状の熱硬化性樹脂が前記第一型と第二型との間
から型外へ漏出することを防止する熱硬化性樹脂
成形金型であつて、前記第一型と第二型との間
に、熱硬化性樹脂成形金型に形成されたキヤビテ
イと型外を連通する隙間を前記キヤビテイの全周
にわたつて設け、この隙間に通気性を有する多孔
質弾性体を前記キヤビテイの全周にわたつて設
け、前記第一型と第二型との間の隙間を構成する
環状の各面のうち少なくとも一方の面の全周にわ
たつてその面を前記キヤビテイの温度よりも高い
温度に加熱するよう構成された加熱体を埋設した
ことを特徴とする熱硬化性樹脂成形金型。 ２ 前記通気性を有する多孔質弾性体が反応促進
剤を担持したものである特許請求の範囲第１項に
記載の熱硬化性樹脂成形金型。[Scope of Claims] 1. A first mold and a second mold that are closed to each other to form a cavity, and a liquid thermosetting resin injected into the cavity flows from between the first mold and the second mold. A thermosetting resin molding mold that prevents leakage outside the mold, wherein a cavity formed in the thermosetting resin molding mold and the outside of the mold are communicated between the first mold and the second mold. A gap is provided around the entire circumference of the cavity, and a porous elastic body having air permeability is provided in the gap around the entire circumference of the cavity, thereby forming a gap between the first mold and the second mold. Thermosetting resin molding, characterized in that a heating element configured to heat at least one of the annular surfaces to a temperature higher than the temperature of the cavity is embedded over the entire circumference of at least one of the annular surfaces. Mold. 2. The thermosetting resin molding die according to claim 1, wherein the porous elastic body having air permeability supports a reaction accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27436285A JPS62134223A (en) | 1985-12-07 | 1985-12-07 | Liquid resin sealing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27436285A JPS62134223A (en) | 1985-12-07 | 1985-12-07 | Liquid resin sealing mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62134223A JPS62134223A (en) | 1987-06-17 |
| JPH0310488B2 true JPH0310488B2 (en) | 1991-02-13 |
Family
ID=17540601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27436285A Granted JPS62134223A (en) | 1985-12-07 | 1985-12-07 | Liquid resin sealing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134223A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2259665A (en) * | 1991-09-17 | 1993-03-24 | Ford Motor Co | Moulding a reinforced plastics component |
| JP3820332B2 (en) * | 1999-11-17 | 2006-09-13 | 宇部興産機械株式会社 | Mold for in-mold coating molding and in-mold coating molding method |
| KR20020026948A (en) | 1999-07-27 | 2002-04-12 | 다이니폰 도료 가부시키가이샤 | Method of forming coating on inner surfaces of metal mold |
| FR2888526B1 (en) * | 2005-07-18 | 2009-01-23 | Inoplast Sa | MOLD AND METHOD FOR MOLDING THERMOSETTING MATERIALS |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4894859U (en) * | 1972-02-12 | 1973-11-12 |
-
1985
- 1985-12-07 JP JP27436285A patent/JPS62134223A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62134223A (en) | 1987-06-17 |
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| EXPY | Cancellation because of completion of term |