JPH03101190A - Method of connecting printed wiring board - Google Patents
Method of connecting printed wiring boardInfo
- Publication number
- JPH03101190A JPH03101190A JP23689089A JP23689089A JPH03101190A JP H03101190 A JPH03101190 A JP H03101190A JP 23689089 A JP23689089 A JP 23689089A JP 23689089 A JP23689089 A JP 23689089A JP H03101190 A JPH03101190 A JP H03101190A
- Authority
- JP
- Japan
- Prior art keywords
- conductor patterns
- solder
- printed wiring
- wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 239000010410 layer Substances 0.000 claims description 13
- 239000011247 coating layer Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 abstract 13
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000000758 substrate Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 241000345998 Calamus manan Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は配線基板を相互に接続するプリント配線基板
の接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board connection method for interconnecting wiring boards.
プリント配線基板相互を電気的に接続する必要性はしば
しば生ずるが、この場合は接続部を形成する導電性配線
パターン上にあらかじめ半田を付着させておき、半田の
付着した配線パターン相互部
を重ね合せた後、火熱圧着して半田を溶融させて接続す
る方法が一般的におこなわれている。It is often necessary to electrically connect printed wiring boards to each other, but in this case, solder is applied in advance to the conductive wiring patterns that form the connection parts, and the parts of the wiring patterns with solder are overlapped. After that, the commonly used method is to heat-press and melt the solder to make the connection.
第４図（ａ）はこの−例を示すプリント配線基板の接続
部の断面を示すもので、図においてｌ。FIG. 4(a) shows a cross section of a connecting portion of a printed wiring board showing this example, and in the figure, 1.
２はプリント配線基板、３．４は配線パターンの接続部
、５は配線パターン上に付着させた半田であり、これら
のプリント配線基板１．２の配線パターン接続部３．４
を重ね合せて加熱圧着して接続していた。2 is a printed wiring board, 3.4 is a wiring pattern connection part, 5 is solder attached on the wiring pattern, and the wiring pattern connection part 3.4 of these printed wiring board 1.2.
They were overlapped and connected by heat and pressure bonding.
上記したような配線基板相互の接続においては、配線パ
ターン上に付着させた半田の量が多すぎると、第４図（
ｂ）に示すように隣接した配線パターンに向ってはみ出
した半田Ｓにより配線パターン間で短絡することがある
。このような余剰半田の流出による短絡の発生を検査す
るため、ランド間にギ・ヤツプマークを形成し、ギャッ
プマニ之が半田で覆すれたか否かを目視、多るいは、光
学的に検査することが提案されている（特開昭６０−２
６２４・８２号公報参照）。When connecting wiring boards to each other as described above, if too much solder is deposited on the wiring pattern, the problem shown in Fig. 4 (
As shown in b), solder S that protrudes toward adjacent wiring patterns may cause a short circuit between the wiring patterns. In order to check for the occurrence of short circuits due to the outflow of excess solder, gap marks are formed between the lands and visually, visually or optically inspected to see if the gap manifold has been covered by solder. has been proposed (Japanese Unexamined Patent Publication No. 60-2
(See Publication No. 624/82).
しかし、このような検査手段は余剰半田の流出を阻止す
るものではない。余剰半田の流出による配線パターン間
の短絡を肋ぐには配線パターン間の間隔を広くする以外
に適切な手段がな（、配線基板相互の接続の際の余剰半
田の流出対策は高密度のプリント配線基板の設計上の大
きな課題となっていた。However, such inspection means do not prevent excess solder from flowing out. In order to prevent short circuits between wiring patterns due to the leakage of excess solder, there is no other suitable method than widening the spacing between the wiring patterns. This was a major design challenge.
この発明は上記課題を解決するものであって、表面に半
田層を有する配線パターン相互を対向して重畳し、加熱
加圧して前記半田層を溶融して配線パターン相互を半田
接続するプリント配線基板の接続方法において、配線パ
ターン部分を除いて配線パターンよりも***した絶縁性
被覆層からなるダムをプリント配線基板上に設けて、接
続すべき配線パターン相互を対向して重畳したとき配線
パターンに沿った空隙を形成せしめ、配線パターン、上
の半田を溶融させたとき余剰の溶融半田を前記空隙に沿
って配線パターン上を流動せしめることを特徴とするも
のである。This invention solves the above problem, and is a printed wiring board in which wiring patterns having solder layers on their surfaces are stacked facing each other, heated and pressed to melt the solder layer, and connect the wiring patterns to each other by soldering. In this connection method, a dam consisting of an insulating coating layer that is raised above the wiring pattern is provided on the printed wiring board except for the wiring pattern part, and when the wiring patterns to be connected are stacked facing each other, the dam is formed along the wiring pattern. The method is characterized in that a gap is formed, and when the solder on the wiring pattern is melted, excess molten solder is made to flow over the wiring pattern along the gap.
この発明によるプリント配線基板の接続方法においては
、プリント配線基板上に配線パターン部分を除いて配線
パターンよりも***した絶縁性被覆層からなるダムが設
けられており、配線パターン相互を対向して重畳したと
き、配線パターンの長手方向に沿って空隙が形成される
。加熱により配線パターン上に付着した半田層を溶融し
たとき、余剰の溶融半田は空隙内を配線パターン籐←←
餅に沿って流動し、隣接する配線パターンに向って流動
しない。したがって配線パターン間が半田により短絡す
るおそれがない。In the printed wiring board connection method according to the present invention, a dam made of an insulating coating layer is provided on the printed wiring board except for the wiring pattern portion and is raised higher than the wiring pattern, and the wiring patterns are stacked facing each other. At this time, voids are formed along the longitudinal direction of the wiring pattern. When the solder layer adhered to the wiring pattern is melted by heating, the excess molten solder flows through the gap between the wiring pattern rattan ←←
It flows along the rice cake and does not flow towards the adjacent wiring pattern. Therefore, there is no risk of short-circuiting between wiring patterns due to solder.
以下、この発明の実施例について説明する。 Examples of the present invention will be described below.
第１図はこの発明のプリント配線基板の接続方法を実施
するに適したプリント配線基板ｉｏの接続部の断面図で
ある。１１は光透過性をもつ基板、１２は配線パターン
、１５は半田層、１４は光照射処理により硬化した光硬
化性樹脂の被覆層で形成されたダムであり、配線パター
ン１２以外の部分を被覆している。そして、ダム１４は
配線パターン１２の表面、および配線パターン１２上に
付着している半田層１５の表面よりも***しており、半
田１５が隣接する配線パターン１２に流出することを阻
止する。FIG. 1 is a sectional view of a connecting portion of a printed wiring board io suitable for implementing the printed wiring board connecting method of the present invention. Reference numeral 11 indicates a light-transmitting substrate, 12 indicates a wiring pattern, 15 indicates a solder layer, and 14 indicates a dam formed of a coating layer of photocurable resin cured by light irradiation treatment, which covers the parts other than the interconnection pattern 12. are doing. The dam 14 is raised above the surface of the wiring pattern 12 and the surface of the solder layer 15 attached to the wiring pattern 12, and prevents the solder 15 from flowing into the adjacent wiring pattern 12.
次に、プリント配線基板の作成法について説明する。ま
ず、光透過性のある材料からなる基板１１に配線パター
ン１２を形成するが、これは公知の方法によって形成す
る。第２図（ａ）は配線パターン１２の形成された基板
１１の断面を示す。ついで、第２図（ｂ）に示すように
、配線パターン１２の設けられた基板１１の表面に光硬
化性樹脂層１３を形成する。光硬化・性樹脂層１３は光
硬化性樹脂をフィルムに形成したものを貼着して形成し
てもよく、また、樹脂塗料を塗布乾燥させて形成しても
よい。樹脂フィルムを用いるときは均一な厚みの層を容
易に形成できる。なお、光硬化性樹脂は電気絶縁性のあ
る公知の樹脂であり、紫外線照射により硬化するもので
あればよく、また光硬化性樹脂は、紫外線のばか可視光
その他の放射線の照射により硬化するものであってもよ
い。Next, a method for manufacturing a printed wiring board will be explained. First, the wiring pattern 12 is formed on the substrate 11 made of a light-transmissive material by a known method. FIG. 2(a) shows a cross section of the substrate 11 on which the wiring pattern 12 is formed. Next, as shown in FIG. 2(b), a photocurable resin layer 13 is formed on the surface of the substrate 11 on which the wiring pattern 12 is provided. The photocurable resin layer 13 may be formed by pasting a photocurable resin film, or may be formed by applying and drying a resin paint. When using a resin film, a layer of uniform thickness can be easily formed. Note that the photocurable resin is a known electrically insulating resin that can be cured by irradiation with ultraviolet rays. It may be.
次に、第２図（ｃ）に示すように、基板１１の裏面、即
ち配線パターン１２の設けられていない側から紫外線を
照射し、光硬化性樹脂層１３を硬化させる。このとき、
配線パターン１２によって、この部分に照射された紫外
線は反射して光硬化性樹脂１３に到達しないから樹脂１
３は硬化せず、配線パターン１２の無い部分の樹脂１３
のみが選択的に硬化され、第２図（ｄ）に示す状態のも
のとなる。Next, as shown in FIG. 2(c), ultraviolet rays are irradiated from the back side of the substrate 11, that is, the side where the wiring pattern 12 is not provided, to harden the photocurable resin layer 13. At this time,
Because the wiring pattern 12 reflects the ultraviolet rays irradiated to this part and does not reach the photocurable resin 13, the resin 1
3 is the resin 13 that is not cured and has no wiring pattern 12.
Only that part is selectively cured, resulting in the state shown in FIG. 2(d).
光照射処理後、未硬化の光硬化性樹脂を水、あるいは適
当な溶剤で除去すると、第２図（ｅ）に示すように、配
線パターン１２が露出し、配線パターン１２以外の部分
には十分な厚みを有する光硬化した樹脂が残り、これが
ダム１４を形成する。このあと、配線パターン１２表面
に半田ペーストを塗布するなどして半田層１５を形成し
て第１図に示すプリント配線基板１０が完成する。After the light irradiation treatment, when the uncured photocurable resin is removed with water or an appropriate solvent, the wiring pattern 12 is exposed as shown in FIG. A photocured resin having a thickness of about 100 mL remains, and this forms the dam 14. Thereafter, a solder layer 15 is formed by applying a solder paste to the surface of the wiring pattern 12, and the printed wiring board 10 shown in FIG. 1 is completed.
次に、本発明のプリント配線基板相互の接続方法を説明
する。Next, a method of interconnecting printed wiring boards according to the present invention will be explained.
第３図は接続方法を説明する図であり、１０は先に説明
した製作方法で製作したプリント配線基板、２０は通常
・のプリント配線基板で配線パターン部２２が基板２１
表面に突出している。これらの両基板１０．２０を第３
図（ａ）＋’ （ｂ）に示すように配線パターン１２
．２２を向い合せにして重ね合せ、加熱圧着すると第３
図（Ｃ）に示すように半田１５が溶融して両配線パター
ン１２゜２２が接続され□る。このとき、余剰半田があ
ってもダム１４によって形成された空隙内を配線パター
ンに沿って流動し、隣接する配線パターンに流出するこ
とが阻止され、隣接する配線パターン相互の間で短絡す
ることがない。FIG. 3 is a diagram explaining the connection method, in which 10 is a printed wiring board manufactured by the manufacturing method described above, 20 is a normal printed wiring board, and the wiring pattern portion 22 is connected to the board 21.
protruding from the surface. Both of these substrates 10 and 20 are
As shown in Figure (a) +' (b), the wiring pattern 12
．． 22 facing each other and heat and press them together to form the third
As shown in Figure (C), the solder 15 melts and both wiring patterns 12 and 22 are connected. At this time, even if there is surplus solder, it flows along the wiring pattern within the gap formed by the dam 14, and is prevented from flowing out to the adjacent wiring pattern, thereby preventing short circuits between adjacent wiring patterns. do not have.
以上の実施例においては、プリント配線基板の配線パタ
ーン部分を除いた部分に絶縁性被覆層からなるダムを設
ける手段として、光硬化性樹脂による方法を示したが、
この他、印刷（例えばスクリーン印刷、オフセット印刷
、パッド印刷など）や、マスキング塗装などの手段によ
り配線パターン部分を除いた部分に絶縁性被覆層からな
るダムを形成することもできる。In the above embodiments, a method using a photocurable resin was shown as a means for providing a dam made of an insulating coating layer on a portion of the printed wiring board excluding the wiring pattern portion.
In addition, it is also possible to form a dam made of an insulating coating layer in a portion other than the wiring pattern portion by means of printing (for example, screen printing, offset printing, pad printing, etc.) or masking coating.
なお、ダムはプリント配線基板の一方に設けても、また
双方に設けてもよく、ダムの厚みは接続した状態（第３
図（ｃ）参照）において、双方の配線パターンの厚みの
合計か、それ以上とする。Note that the dam may be provided on one side of the printed wiring board or on both sides, and the thickness of the dam is the same as that of the connected state (the third
(see Figure (c)), the thickness should be the sum of the thicknesses of both wiring patterns or more.
また、接続すべき配線パターンの巾は一方が他方に対し
てやや狭（しておくと配線パターンの誤差や、接続作業
時の取扱い誤差があっても接続作業を円滑におこなうこ
とができる。Furthermore, if the width of the wiring patterns to be connected is made slightly narrower on one side than on the other, the connection work can be carried out smoothly even if there is an error in the wiring pattern or a handling error during the connection work.
以上説明したとおり、この発明によればプリント配線基
板を相互に接続するとき、配線パターン上に付着した半
田に余剰分があっても、絶縁性被覆層からなるダムで形
成された空隙内を配線パターン給侍÷奔今に沿って流動
し、隣接する配線パターンに向って流れることがなく、
配線パターン相互で短絡することがない。As explained above, according to the present invention, when interconnecting printed wiring boards, even if there is excess solder adhered to the wiring pattern, the wiring can be routed through the gap formed by the dam made of the insulating coating layer. It flows along the pattern wiring pattern and does not flow towards the adjacent wiring pattern.
No short circuit between wiring patterns.
これにより、付着させる半田の量を厳密に管理し、また
、加熱圧着条件を精密に制御するなどの作業管理を軽減
することができる。さらに、配線パターンの間隔を狭め
、高密度のプリント配線基板を作ることができる。This makes it possible to strictly control the amount of solder to be deposited and to reduce work management such as precisely controlling heat and pressure bonding conditions. Furthermore, the spacing between wiring patterns can be narrowed, making it possible to create a high-density printed wiring board.
第１図は本発明を実施するに適したプリント配線基板の
断面図、第２図はプリント配線基板の製造工程を説明す
る断面図、第３図はプリント配線基板相互の接続状態を
説明する断面図、第４図は従来のプリント配線基板相互
の接続状態を説明する断面図である。
１：基板、１２：配線パターン、１３：光硬化性樹脂、
１４：ダム、１５：半田層。
法FIG. 1 is a cross-sectional view of a printed wiring board suitable for carrying out the present invention, FIG. 2 is a cross-sectional view explaining the manufacturing process of the printed wiring board, and FIG. 3 is a cross-sectional view explaining the state of connection between the printed wiring boards. 4 are cross-sectional views illustrating the state of connection between conventional printed wiring boards. 1: substrate, 12: wiring pattern, 13: photocurable resin,
14: Dam, 15: Solder layer. law
Claims (1)
畳し、加熱加圧して前記半田層を溶融して配線パターン
相互を半田接続するプリント配線基板の接続方法におい
て、 配線パターン部分を除いて配線パターンよりも***した
絶縁性被覆層からなるダムをプリント配線基板上に設け
て、接続すべき配線パターン相互を対向して重畳したと
き配線パターンに沿った空隙を形成せしめ、配線パター
ン上の半田を溶融させたとき余剰の溶融半田を前記空隙
に沿って配線パターンの上を流動せしめることを特徴と
するプリント配線基板の接続方法。[Scope of Claims] A method for connecting printed wiring boards, in which wiring patterns having solder layers on their surfaces are stacked facing each other, heated and pressurized to melt the solder layers, and solder-connect the wiring patterns to each other, the wiring patterns A dam made of an insulating coating layer that is raised above the wiring pattern except for the parts is provided on the printed wiring board, and when the wiring patterns to be connected are stacked facing each other, a gap is formed along the wiring pattern. A method for connecting printed wiring boards, characterized in that when solder on the pattern is melted, excess molten solder is made to flow over the wiring pattern along the gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23689089A JPH03101190A (en) | 1989-09-14 | 1989-09-14 | Method of connecting printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23689089A JPH03101190A (en) | 1989-09-14 | 1989-09-14 | Method of connecting printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101190A true JPH03101190A (en) | 1991-04-25 |
Family
ID=17007291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23689089A Pending JPH03101190A (en) | 1989-09-14 | 1989-09-14 | Method of connecting printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101190A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832195A (en) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | Connection structure of composite printed board |
| US6794580B2 (en) * | 2002-02-20 | 2004-09-21 | Molex Incorporated | Solder interconnections for flat circuits |
| JP2008205132A (en) * | 2007-02-19 | 2008-09-04 | Nec Corp | Printed wiring board, and solder connection structure and method between the structure and flexible printed board |
| JP2008210993A (en) * | 2007-02-26 | 2008-09-11 | Nec Corp | Printed wiring board and method of manufacturing the same |
| JP2011009335A (en) * | 2009-06-24 | 2011-01-13 | Fujitsu Ltd | Solder joint structure, electronic device using the same, and solder joint method |
| KR101010374B1 (en) * | 2003-05-19 | 2011-01-21 | 파나소닉 주식회사 | Electronic circuit connection structure and connection method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593294A (en) * | 1979-01-05 | 1980-07-15 | Matsushita Electric Ind Co Ltd | Reflow soldering method |
| JPS6112164A (en) * | 1984-06-27 | 1986-01-20 | Nec Corp | Telephone set with holding function |
-
1989
- 1989-09-14 JP JP23689089A patent/JPH03101190A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593294A (en) * | 1979-01-05 | 1980-07-15 | Matsushita Electric Ind Co Ltd | Reflow soldering method |
| JPS6112164A (en) * | 1984-06-27 | 1986-01-20 | Nec Corp | Telephone set with holding function |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0832195A (en) * | 1994-07-11 | 1996-02-02 | Nippondenso Co Ltd | Connection structure of composite printed board |
| US6794580B2 (en) * | 2002-02-20 | 2004-09-21 | Molex Incorporated | Solder interconnections for flat circuits |
| KR101010374B1 (en) * | 2003-05-19 | 2011-01-21 | 파나소닉 주식회사 | Electronic circuit connection structure and connection method thereof |
| JP2008205132A (en) * | 2007-02-19 | 2008-09-04 | Nec Corp | Printed wiring board, and solder connection structure and method between the structure and flexible printed board |
| JP2008210993A (en) * | 2007-02-26 | 2008-09-11 | Nec Corp | Printed wiring board and method of manufacturing the same |
| JP2011009335A (en) * | 2009-06-24 | 2011-01-13 | Fujitsu Ltd | Solder joint structure, electronic device using the same, and solder joint method |
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