JPH03101185A - Pedestal for fixing component in non-contact form - Google Patents
Pedestal for fixing component in non-contact formInfo
- Publication number
- JPH03101185A JPH03101185A JP23565289A JP23565289A JPH03101185A JP H03101185 A JPH03101185 A JP H03101185A JP 23565289 A JP23565289 A JP 23565289A JP 23565289 A JP23565289 A JP 23565289A JP H03101185 A JPH03101185 A JP H03101185A
- Authority
- JP
- Japan
- Prior art keywords
- component
- pedestals
- pedestal
- floating
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は部品の左右に２本のリード線を有する部品とプ
リント配線板との間に介在させて部品を浮かし、かつ確
実に保持する、浮かし固定台座に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for suspending and securely holding a component by interposing it between a component having two lead wires on the left and right sides of the component and a printed wiring board. Regarding the floating fixed pedestal.
［従来の技術］
従来部品を浮かして、プリント配線板に半田付で固定す
る場合１部品とプリント配線板とを一定の間隔に保つた
めに、部品のリード線をプリント配線板の半田付用ラン
ドの手前で止まるようにフォーミングした後に、半田付
することにより部品を浮かして取付けていた。[Prior art] Conventionally, when floating a component and fixing it to a printed wiring board by soldering, in order to maintain a constant distance between each component and the printed wiring board, the lead wire of the component is connected to the soldering land of the printed wiring board. After forming the parts so that they stopped in front of the parts, the parts were mounted by soldering them in a floating position.
れる。It will be done.
［発明が解決しようとする課題］
従来技術の部品を浮かしてプリント配線板に半田付する
場合には、浮かすためのリード線フォーミング作業時間
と浮かし後の部品の保持の点について配慮されておらず
、プリントと配線板と一定の間隔を確保するために部品
のリード線をプリント配線板の半田付用ランドの手前で
止まるようにフォーミングする作業が必要となる。又プ
リント配線板に半田付後の安定が良くないため、外部か
らの力で容易に近接部品と接触するという問題があった
。[Problems to be Solved by the Invention] In the case of floating components and soldering them to a printed wiring board in the prior art, no consideration was given to the lead wire forming work time for floating and the retention of the components after floating. In order to ensure a certain distance between the printed wiring board and the printed wiring board, it is necessary to form the component lead wires so that they stop before the soldering land on the printed wiring board. Furthermore, since the soldering device is not stable after being soldered to a printed wiring board, there is a problem in that it easily comes into contact with nearby components due to external force.
本発明は部品のリード線をフォーミングしなくても浮か
して取付けることを目的としている。さらに、浮かして
取付けた部品が外部からの力により近接部品と接触する
のを防ぐことも目的としている。The object of the present invention is to allow the lead wires of components to be mounted floating without forming them. Another purpose is to prevent components mounted in a floating state from coming into contact with adjacent components due to external forces.
［課題を解決するための手段］
上記目的を達成するために、浮かしに必要な高ざの厚み
とリードの通過する穴を有する樹脂性の台座を部品を取
付ける時に左右のリードに装着したものである。[Means for solving the problem] In order to achieve the above purpose, a resin pedestal with a height necessary for floating and a hole through which the lead passes is attached to the left and right leads when installing the component. be.
また、浮かし取付は部品と近接部品の接触を防ぐために
、台座の上面を凹に成形したものである。In addition, in floating mounting, the upper surface of the pedestal is formed into a concave shape to prevent contact between parts and adjacent parts.
［作用］
台座を部品の左右リードの通過用穴に挿入すると台座の
厚みにより、浮かしに必要な高さを確保でき、また、部
品は台座の凹部によって、保持されるので、浮かし取付
けと保持ができる。[Function] When the pedestal is inserted into the passage hole of the left and right leads of the component, the thickness of the pedestal will ensure the necessary height for floating, and since the component is held by the recess of the pedestal, floating mounting and holding are possible. can.
［実施例］
以下、本発明の一実施例を第１図により説明する。第１
図は部品を浮かし取付、保持したものを示す斜視図であ
る。[Example] Hereinafter, an example of the present invention will be described with reference to FIG. 1st
The figure is a perspective view showing parts mounted and held in a floating manner.
第１図において、部品４の左右のり−ド５を台座２ケの
それぞれのリード通過用の穴２に挿入すると１台座に設
けである、部品を浮かすのに必要な高さに相当する厚み
１により、第２図のように部品リード５を浮かすために
フォーミング６して取付けるのと同等の状態となる。In Fig. 1, when the left and right guides 5 of the component 4 are inserted into the respective lead passing holes 2 of the two pedestals, the thickness 1 corresponding to the height required to float the component, which is provided on one pedestal, is This results in a state equivalent to mounting after forming 6 to float the component lead 5 as shown in FIG.
また、台座の上面の凹形状３は部品を保持するために設
けてあり、外部からの力が加わっても台座の角で耐える
ようになっている。Further, the concave shape 3 on the top surface of the pedestal is provided to hold parts, and even if external forces are applied, the corners of the pedestal can withstand it.
［発明の効果］
本発明は以上説明したように構成されているので以下に
記載されるような効果を奏する。[Effects of the Invention] Since the present invention is configured as described above, it produces the effects described below.
部品の両端のリードに台座を装着するだけでリード線を
フォーミングしなくても、部品を浮かして取付けること
ができる。By simply attaching a pedestal to the leads at both ends of the component, the component can be mounted floating without forming the lead wires.
また、台座上面の凹形状により、外部からの力により、
部品かたおれて、近接部品との接触を防ぐことができる
。In addition, due to the concave shape of the top surface of the pedestal, external forces can
The parts can be tilted to prevent contact with nearby parts.
第１図は本発明の一実施例の斜視図、第２図は従来の浮
かし取付けの側面図である。
符号の説明
１・・・浮かし高さに相当する厚み、
２・・・リード挿入用穴、
３−
３・・・部品保持用凹形状、
４・・・部品、
５・・・部品のリード。
４−FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a side view of a conventional floating installation. Explanation of the symbols 1...Thickness corresponding to floating height, 2...Hole for lead insertion, 3-3...Concave shape for holding components, 4...Component, 5...Lead of component. 4-
Claims (1)
持する凹形状を設けたことを特徴とする部品浮かし固定
台座。1. A component floating fixing pedestal characterized by having a thickness necessary for floating and mounting a component and a concave shape for holding the component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23565289A JPH03101185A (en) | 1989-09-13 | 1989-09-13 | Pedestal for fixing component in non-contact form |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23565289A JPH03101185A (en) | 1989-09-13 | 1989-09-13 | Pedestal for fixing component in non-contact form |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101185A true JPH03101185A (en) | 1991-04-25 |
Family
ID=16989189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23565289A Pending JPH03101185A (en) | 1989-09-13 | 1989-09-13 | Pedestal for fixing component in non-contact form |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101185A (en) |
-
1989
- 1989-09-13 JP JP23565289A patent/JPH03101185A/en active Pending
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