JPH03100439U - - Google Patents
Info
- Publication number
- JPH03100439U JPH03100439U JP232990U JP232990U JPH03100439U JP H03100439 U JPH03100439 U JP H03100439U JP 232990 U JP232990 U JP 232990U JP 232990 U JP232990 U JP 232990U JP H03100439 U JPH03100439 U JP H03100439U
- Authority
- JP
- Japan
- Prior art keywords
- heat storage
- storage layer
- heat
- printing head
- thermal printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005338 heat storage Methods 0.000 claims description 3
- 238000007651 thermal printing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第1図はこの考案の第1実施例のサーマル印字
ヘツドの要部拡大断面図、第2図は第2実施例の
サーマル印字ヘツドの要部拡大断面図である。
1……シリコン基板、2,20……発熱素子、
5,23……蓄熱層、6,24……発熱抵抗体、
10……薄膜絶縁層。
FIG. 1 is an enlarged sectional view of a main part of a thermal printing head according to a first embodiment of this invention, and FIG. 2 is an enlarged sectional view of a main part of a thermal printing head according to a second embodiment of this invention. 1... Silicon substrate, 2, 20... Heat generating element,
5, 23... Heat storage layer, 6, 24... Heat generating resistor,
10... Thin film insulating layer.
Claims (1)
熱性の有機材料からなる蓄熱層を形成し、この蓄
熱層上に発熱抵抗体を形成したことを特徴とする
サーマル印字ヘツド。 A thermal printing head characterized in that a heat storage layer made of a heat-resistant organic material is formed directly on a substrate or with a thin film insulating layer interposed therebetween, and a heating resistor is formed on the heat storage layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP232990U JPH03100439U (en) | 1990-01-17 | 1990-01-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP232990U JPH03100439U (en) | 1990-01-17 | 1990-01-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03100439U true JPH03100439U (en) | 1991-10-21 |
Family
ID=31506206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP232990U Pending JPH03100439U (en) | 1990-01-17 | 1990-01-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03100439U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052361A (en) * | 2008-08-29 | 2010-03-11 | Canon Inc | Thermal head and thermal printer |
JP2010052362A (en) * | 2008-08-29 | 2010-03-11 | Canon Inc | Thermal head and thermal printer |
-
1990
- 1990-01-17 JP JP232990U patent/JPH03100439U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052361A (en) * | 2008-08-29 | 2010-03-11 | Canon Inc | Thermal head and thermal printer |
JP2010052362A (en) * | 2008-08-29 | 2010-03-11 | Canon Inc | Thermal head and thermal printer |