JPH0297955U - - Google Patents
Info
- Publication number
- JPH0297955U JPH0297955U JP366789U JP366789U JPH0297955U JP H0297955 U JPH0297955 U JP H0297955U JP 366789 U JP366789 U JP 366789U JP 366789 U JP366789 U JP 366789U JP H0297955 U JPH0297955 U JP H0297955U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- nozzle
- extending
- buffer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は、本考案にかかる噴流はんだ槽の略式
斜視図;第2図は、その噴流はんだ槽を溶融はん
だ収容槽内に配置したときの溶融はんだの流れを
示す略式断面図である。
1……噴流はんだ槽、2……ノズル板、3……
ノズル側板、4……ノズル、5……外方側板、6
……貯溜槽、7……開口部、8……摺動板、20
……緩衝部材、22……フツク、26……溶融は
んだ収容槽。
FIG. 1 is a schematic perspective view of a jet solder tank according to the present invention; FIG. 2 is a schematic cross-sectional view showing the flow of molten solder when the jet solder tank is placed in a molten solder storage tank. 1... Jet solder bath, 2... Nozzle plate, 3...
Nozzle side plate, 4... Nozzle, 5... Outer side plate, 6
...Storage tank, 7...Opening, 8...Sliding plate, 20
... Buffer member, 22 ... Hook, 26 ... Molten solder storage tank.
Claims (1)
用のノズルと、該ノズルの側方に延在するはんだ
貯溜槽とから成る噴流はんだ槽において、前記ノ
ズルの側方にあつて該はんだ貯溜槽の上方に緩衝
部材を設けたことを特徴とする噴流はんだ槽。 In a jet solder bath consisting of a solder jet nozzle having a nozzle opening extending in the longitudinal direction and a solder reservoir extending to the side of the nozzle, A jet soldering bath characterized by having a buffer member provided above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989003667U JPH0627255Y2 (en) | 1989-01-17 | 1989-01-17 | Jet solder bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989003667U JPH0627255Y2 (en) | 1989-01-17 | 1989-01-17 | Jet solder bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0297955U true JPH0297955U (en) | 1990-08-03 |
JPH0627255Y2 JPH0627255Y2 (en) | 1994-07-27 |
Family
ID=31205507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989003667U Expired - Lifetime JPH0627255Y2 (en) | 1989-01-17 | 1989-01-17 | Jet solder bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0627255Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007196241A (en) * | 2006-01-24 | 2007-08-09 | Mitsubishi Electric Corp | Soldering device |
CN110548952A (en) * | 2019-10-14 | 2019-12-10 | 深圳市劲拓自动化设备股份有限公司 | Welding device and selective wave soldering device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010434U (en) * | 1973-05-29 | 1975-02-03 | ||
JPS57111462U (en) * | 1980-12-24 | 1982-07-09 |
-
1989
- 1989-01-17 JP JP1989003667U patent/JPH0627255Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010434U (en) * | 1973-05-29 | 1975-02-03 | ||
JPS57111462U (en) * | 1980-12-24 | 1982-07-09 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007196241A (en) * | 2006-01-24 | 2007-08-09 | Mitsubishi Electric Corp | Soldering device |
JP4661609B2 (en) * | 2006-01-24 | 2011-03-30 | 三菱電機株式会社 | Soldering equipment |
CN110548952A (en) * | 2019-10-14 | 2019-12-10 | 深圳市劲拓自动化设备股份有限公司 | Welding device and selective wave soldering device |
Also Published As
Publication number | Publication date |
---|---|
JPH0627255Y2 (en) | 1994-07-27 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |