JPH0297955U - - Google Patents

Info

Publication number
JPH0297955U
JPH0297955U JP366789U JP366789U JPH0297955U JP H0297955 U JPH0297955 U JP H0297955U JP 366789 U JP366789 U JP 366789U JP 366789 U JP366789 U JP 366789U JP H0297955 U JPH0297955 U JP H0297955U
Authority
JP
Japan
Prior art keywords
solder
jet
nozzle
extending
buffer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP366789U
Other languages
Japanese (ja)
Other versions
JPH0627255Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989003667U priority Critical patent/JPH0627255Y2/en
Publication of JPH0297955U publication Critical patent/JPH0297955U/ja
Application granted granted Critical
Publication of JPH0627255Y2 publication Critical patent/JPH0627255Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案にかかる噴流はんだ槽の略式
斜視図；第２図は、その噴流はんだ槽を溶融はん
だ収容槽内に配置したときの溶融はんだの流れを
示す略式断面図である。 １……噴流はんだ槽、２……ノズル板、３……
ノズル側板、４……ノズル、５……外方側板、６
……貯溜槽、７……開口部、８……摺動板、２０
……緩衝部材、２２……フツク、２６……溶融は
んだ収容槽。 FIG. 1 is a schematic perspective view of a jet solder tank according to the present invention; FIG. 2 is a schematic cross-sectional view showing the flow of molten solder when the jet solder tank is placed in a molten solder storage tank. 1... Jet solder bath, 2... Nozzle plate, 3...
Nozzle side plate, 4... Nozzle, 5... Outer side plate, 6
...Storage tank, 7...Opening, 8...Sliding plate, 20
... Buffer member, 22 ... Hook, 26 ... Molten solder storage tank.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 長手方向に伸びたノズル口を備えたはんだ噴流
用のノズルと、該ノズルの側方に延在するはんだ
貯溜槽とから成る噴流はんだ槽において、前記ノ
ズルの側方にあつて該はんだ貯溜槽の上方に緩衝
部材を設けたことを特徴とする噴流はんだ槽。 In a jet solder bath consisting of a solder jet nozzle having a nozzle opening extending in the longitudinal direction and a solder reservoir extending to the side of the nozzle, A jet soldering bath characterized by having a buffer member provided above.
JP1989003667U 1989-01-17 1989-01-17 Jet solder bath Expired - Lifetime JPH0627255Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989003667U JPH0627255Y2 (en) 1989-01-17 1989-01-17 Jet solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989003667U JPH0627255Y2 (en) 1989-01-17 1989-01-17 Jet solder bath

Publications (2)

Publication Number Publication Date
JPH0297955U true JPH0297955U (en) 1990-08-03
JPH0627255Y2 JPH0627255Y2 (en) 1994-07-27

Family

ID=31205507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989003667U Expired - Lifetime JPH0627255Y2 (en) 1989-01-17 1989-01-17 Jet solder bath

Country Status (1)

Country Link
JP (1) JPH0627255Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007196241A (en) * 2006-01-24 2007-08-09 Mitsubishi Electric Corp Soldering device
CN110548952A (en) * 2019-10-14 2019-12-10 深圳市劲拓自动化设备股份有限公司 Welding device and selective wave soldering device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010434U (en) * 1973-05-29 1975-02-03
JPS57111462U (en) * 1980-12-24 1982-07-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5010434U (en) * 1973-05-29 1975-02-03
JPS57111462U (en) * 1980-12-24 1982-07-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007196241A (en) * 2006-01-24 2007-08-09 Mitsubishi Electric Corp Soldering device
JP4661609B2 (en) * 2006-01-24 2011-03-30 三菱電機株式会社 Soldering equipment
CN110548952A (en) * 2019-10-14 2019-12-10 深圳市劲拓自动化设备股份有限公司 Welding device and selective wave soldering device

Also Published As

Publication number Publication date
JPH0627255Y2 (en) 1994-07-27

Similar Documents

Publication Publication Date Title
JPH0297955U (en)
JPH0378723U (en)
JPH044051U (en)
JPS6054543U (en) liquid container nozzle
JPS62159956U (en)
JPS6353392U (en)
JPS6334699U (en)
JPS6370348U (en)
JPH0168163U (en)
JPH046661U (en)
JPS61111662U (en)
JPS62169686U (en)
JPH0315654U (en)
JPS61205456U (en)
JPS63167875U (en)
JPS63144518U (en)
JPS6437796U (en)
JPS6318114U (en)
JPH034514U (en)
JPS6235661U (en)
JPH0293051U (en)
JPS6161052U (en)
JPS6156255U (en)
JPS6441533U (en)
JPS6182944U (en)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term