JPH0294693A - Printed wiring board having coaxial through-hole - Google Patents
Printed wiring board having coaxial through-holeInfo
- Publication number
- JPH0294693A JPH0294693A JP24694188A JP24694188A JPH0294693A JP H0294693 A JPH0294693 A JP H0294693A JP 24694188 A JP24694188 A JP 24694188A JP 24694188 A JP24694188 A JP 24694188A JP H0294693 A JPH0294693 A JP H0294693A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- coaxial
- printed wiring
- characteristic impedance
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はプリント配線板に設けられろスルーホール、さ
らに詳しく云えば高周波特性の改善を考慮したスルーホ
ールに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a through hole provided in a printed wiring board, and more specifically, to a through hole designed to improve high frequency characteristics.
（従来の技術〉
高周波信号を伝送するプリント配線板では、信号配線パ
ターンをストリップライン化あるいはマイクロストリッ
プライン化して高周波特性の劣化を防止している。(Prior Art) In printed wiring boards that transmit high frequency signals, signal wiring patterns are formed into strip lines or microstrip lines to prevent deterioration of high frequency characteristics.
（発明が鵡決しようとする課題］
しかしながらプリント配線板の異なる層間の信号配線パ
ターンを相互接続するためのスルーホール（メツキ貫通
孔）には、何んら高周波特性の設計が施されていなかっ
た。(Problem to be solved by the invention) However, the through holes (metallic through holes) for interconnecting the signal wiring patterns between different layers of the printed wiring board were not designed with any high frequency characteristics. .
そのため、伝送信号速度が上昇すると、スルーホール部
が伝送信号波形を劣化させ、高品質な伝送が困難である
という欠点があった。Therefore, when the transmission signal speed increases, the through-hole portion degrades the transmission signal waveform, making high-quality transmission difficult.
この従来の欠点を図面によって説明する。This conventional drawback will be explained with reference to the drawings.
第４図は従来のスルーホールを施こしたプリント配線板
の斜視図である。FIG. 4 is a perspective view of a conventional printed wiring board provided with through holes.
プリント配線板６の中間層に接地層５が設けられている
。信号配線パターン４１および４２は一定厚の絶縁層７
１と７２１−介して配置されている。A ground layer 5 is provided as an intermediate layer of the printed wiring board 6. The signal wiring patterns 41 and 42 are made of an insulating layer 7 with a constant thickness.
1 and 721-.
よって、信号配線パターン４１および４２はストリップ
ライン化されており、その特性インピーダンスは規定さ
れる。Therefore, the signal wiring patterns 41 and 42 are formed into strip lines, and the characteristic impedance thereof is defined.
一万、スルーホール３は単に中空な導体であるので、イ
ンダクテイプな素子と見なされる。これらの信号配線パ
ターン４１．４２およびスルーホール３は第５図の分布
定数等価回路で表わ丁ことができる。However, since the through hole 3 is simply a hollow conductor, it is considered an inductive element. These signal wiring patterns 41, 42 and through holes 3 can be represented by a distributed constant equivalent circuit shown in FIG.
この等価回路は、特性インピーダンスＺｏｋＶする信号
配線パターン４１の等価回路６１．インダクタンスＬｉ
有するスルーホール３０等価回路６３および等性インピ
ーダンスＺｏ１に有する信号配線パターン４２０等価回
路６２が縦続接続されたものである。This equivalent circuit is an equivalent circuit 61. of the signal wiring pattern 41 having a characteristic impedance ZokV. Inductance Li
The equivalent circuit 63 of the through hole 30 and the equivalent circuit 62 of the signal wiring pattern 420 of the equal impedance Zo1 are connected in cascade.
このような回路では、スルーホール３のインダクタンス
Ｌと信号配線パターン４１．４２の特性インピーダンス
Ｚｏとのインピーダンス不要分ｔこよ夕、高周波特性を
良好に保つことができない。したがって、高速度なディ
ジタル信号波形を劣化させ、高品質伝送が期待できない
。In such a circuit, good high frequency characteristics cannot be maintained due to the unnecessary impedance t between the inductance L of the through hole 3 and the characteristic impedance Zo of the signal wiring patterns 41 and 42. Therefore, high-speed digital signal waveforms are degraded, and high-quality transmission cannot be expected.
本発明の目的は上記欠点を除去し友、高周波特性の優れ
たスルーホールを有するプリント配線板全提供すること
にある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a printed wiring board having through holes with excellent high frequency characteristics.
（課題ｔ−解決するための手段〉
＊記目的を達成するためｌこ本発明ｌこよる同軸形スル
ーホールを有するプリント配線板はスルーホールと、前
記スルーホールの中心軸と同軸な円筒形外部導体とから
なる同軸形スルーホールを有している。(Problem t - Means for Solving) *In order to achieve the above object, the present invention provides a printed wiring board having a coaxial through hole, which has a through hole and a cylindrical outer surface coaxial with the central axis of the through hole. It has a coaxial through hole made of a conductor.
（実 施例］
以下１図ＷＪｔ参照して本発明をさらに詳しく説明する
。(Example) The present invention will be described in more detail below with reference to Figure 1 WJt.
第１図は本発明による同軸形スルーホールを有するプリ
ント配線板の一実施例で、一部破断して示した斜視図で
ある。第２図は第１図の配線パターン、スルーホールの
等価回路である。FIG. 1 is a partially cutaway perspective view of an embodiment of a printed wiring board having coaxial through holes according to the present invention. FIG. 2 is an equivalent circuit of the wiring pattern and through holes shown in FIG. 1.
第１図基こおいて、信号配線パターン４および１４は接
地層１５から一定距離離れて配置されたストリップライ
ンであり１その相互接続はスルーホール３によって行な
われて込る。In FIG. 1, the signal wiring patterns 4 and 14 are strip lines arranged at a certain distance from the ground layer 15, and their interconnections are made by through holes 3.
スルーホール３＃ｉ、一定厚の絶縁層８を挟んでスルー
ホール３の中心軸７と同軸な円筒形外部導体２によって
囲まれて論る。The through hole 3 #i will be discussed surrounded by a cylindrical outer conductor 2 coaxial with the central axis 7 of the through hole 3 with an insulating layer 8 of a constant thickness in between.
円筒形外部導体２は接地層１５と電気的に接続され、接
地電位が供給される。したがって、スルーホール３と円
筒形外部導体２とで同軸形スルーホールｌが構成される
。同軸形スルーホールｌの特性インピーダンスは絶縁層
８の厚さを適切に選択することにより１ストリツプライ
ンの特性インピーダンスＺ、と同一にすることができる
。The cylindrical outer conductor 2 is electrically connected to the ground layer 15 and supplied with a ground potential. Therefore, the through hole 3 and the cylindrical outer conductor 2 constitute a coaxial through hole l. The characteristic impedance of the coaxial through hole l can be made equal to the characteristic impedance Z of one stripline by appropriately selecting the thickness of the insulating layer 8.
第２図は第１図の信号配線パターンおよび同軸形スルー
ホールの等価回路である。FIG. 2 is an equivalent circuit of the signal wiring pattern and coaxial through-hole shown in FIG. 1.
信号配線パターン４．１４および同軸形スルーホールｌ
は特性インピーダンスＺＯをもつ信号配線パターン等価
回路１１．１３および特性インピーダンスＺｏｔ−もつ
同軸形スルーホール等価回路１２で衆わされる。Signal wiring pattern 4.14 and coaxial through hole l
is combined with a signal wiring pattern equivalent circuit 11.13 having a characteristic impedance ZO and a coaxial through-hole equivalent circuit 12 having a characteristic impedance Zot-.
このような回路によＶ、各線路の特性インピーダンスを
整合させることができるので、良好な高周波特性を達成
できる。By using such a circuit, V and the characteristic impedance of each line can be matched, so that good high frequency characteristics can be achieved.
第３図は同軸形スルーホール１の製作方法を説明する九
めの図である。FIG. 3 is the ninth diagram illustrating the method of manufacturing the coaxial through-hole 1.
第３図（ａ）から（ｆ）までは製作工程を示す図である
。FIGS. 3(a) to 3(f) are diagrams showing the manufacturing process.
まず、第３図（ａｌに示すように、接地層１５の中間層
を有するプリント基板９を用意する。First, as shown in FIG. 3 (al), a printed circuit board 9 having an intermediate layer of a ground layer 15 is prepared.
次ｌこ、この基板の所定の位置に円孔全あけ、さらＩこ
メツ中を施こし１円筒形外部導体２を第３図（ｂ）のよ
うに作成する。このとき、接地層１５と円筒形外部導体
２とはメツキにより電気的接続がなされる。Next, a circular hole is completely drilled at a predetermined position in this substrate, and a cylindrical outer conductor 2 is formed by drilling the inside of the hole as shown in FIG. 3(b). At this time, the ground layer 15 and the cylindrical outer conductor 2 are electrically connected by plating.
次−こ、円筒形外部導体２の中空部にエポキシ等の絶縁
体が詰められ、熱加工され、第３図（Ｃ）のように、絶
縁層８が形成される。Next, the hollow portion of the cylindrical outer conductor 2 is filled with an insulator such as epoxy, and heat processed to form an insulating layer 8 as shown in FIG. 3(C).
次に、第３図（ｄ）に示すようにプリント基板９の両面
に、銅張基板９３と９６ｔ−各々接着する。Next, as shown in FIG. 3(d), copper-clad substrates 93 and 96t are bonded to both sides of the printed circuit board 9, respectively.
次いで第３図（ｅ）に示すように、信号配線パターン４
と１４ｔ−エツチングｌこより形成する。Next, as shown in FIG. 3(e), a signal wiring pattern 4 is formed.
and 14t-etching.
さらに１円筒形外部導体２の中心にスルーホール３′ｔ
−設け、第３図（ｆ）のような同軸形スルーホール１が
完成する。Furthermore, a through hole 3't is provided at the center of the cylindrical outer conductor 2.
- The coaxial through hole 1 as shown in FIG. 3(f) is completed.
（発明の効果Ｊ
以上、説明し友ように本発明は、スルーホールを同軸化
構造にすることにより、プリント配線板内の全ての信号
伝送路の特性インピーダンスを容易に整合させることが
できるので、高周波特性の優れ念仏送路ｋＶするプリン
ト配線板を提供できる。(Effect of the Invention J As explained above, the present invention makes it possible to easily match the characteristic impedance of all signal transmission paths in a printed wiring board by making the through-holes have a coaxial structure. It is possible to provide a printed wiring board with excellent high frequency characteristics and a nembutsu transmission path kV.
第１図は本発明による同軸形スルーホールが施こされた
プリント配線板の一実施例を示す一部破断斜視図、第２
図は本発明の同軸形スルーホールおよびプリント配線パ
ターンの等価回路図、第３図は本発明にかかるプリント
配線板の製作工程図、第４図は従来のスルーホールが施
こされ几プリント配線板の斜視図、第５図は従来のスル
ーホールおよびプリント配線パターンの等価回路図であ
る。
１・・・同軸形スルーホール
２・・・円筒形外部導体 ３・・・スルーホール４．
１４，４１．４２・・・信号配線パターン５．１５・・
・接地層
６．９−・・プリント配線板 ７・・・中心軸８・・
・絶縁層
特許出願人 日本電気株式会社
代理人 弁理士 井 ノ ロ 壽才３図
（ａｌ
１５（埠四１
３（スＩＬ−本−１し）
託
２４図
２５国FIG. 1 is a partially cutaway perspective view showing an embodiment of a printed wiring board provided with coaxial through holes according to the present invention, and FIG.
The figure is an equivalent circuit diagram of the coaxial through hole and printed wiring pattern of the present invention, Figure 3 is a manufacturing process diagram of the printed wiring board according to the present invention, and Figure 4 is a printed wiring board with conventional through holes. FIG. 5 is an equivalent circuit diagram of a conventional through hole and printed wiring pattern. 1... Coaxial through hole 2... Cylindrical external conductor 3... Through hole 4.
14,41.42...Signal wiring pattern 5.15...
・Ground layer 6.9--Printed wiring board 7--Central axis 8--
・Insulating layer patent applicant NEC Co., Ltd. agent Patent attorney Inoro Jusai 3 figures (Al 15 (Bu4 1 3 (SIL-hon-1)) 24 figures 25 countries
Claims (1)
円筒形外部導体とからなる同軸形スルーホールを有する
プリント配線板。A printed wiring board having a coaxial through hole consisting of a through hole and a cylindrical outer conductor coaxial with the center axis of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24694188A JPH0294693A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board having coaxial through-hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24694188A JPH0294693A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board having coaxial through-hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294693A true JPH0294693A (en) | 1990-04-05 |
Family
ID=17156020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24694188A Pending JPH0294693A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board having coaxial through-hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294693A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113704A (en) * | 1990-09-03 | 1992-04-15 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| US5791911A (en) * | 1996-10-25 | 1998-08-11 | International Business Machines Corporation | Coaxial interconnect devices and methods of making the same |
| US5949030A (en) * | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
| US5955704A (en) * | 1996-11-21 | 1999-09-21 | Dell U.S.A., L.P. | Optimal PWA high density routing to minimize EMI substrate coupling in a computer system |
| WO2000033624A1 (en) * | 1998-12-02 | 2000-06-08 | Teradyne, Inc. | Printed circuit board and method for fabricating such board |
| WO2001048819A2 (en) * | 1999-12-28 | 2001-07-05 | Intel Corporation | Interconnect structure and method of fabrication therefor |
| WO2002058234A2 (en) * | 2001-01-16 | 2002-07-25 | Formfactor, Inc. | High frequency printed circuit board via |
| US6606014B2 (en) | 1999-02-25 | 2003-08-12 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
| US6617526B2 (en) * | 2001-04-23 | 2003-09-09 | Lockheed Martin Corporation | UHF ground interconnects |
| US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
| US6787710B2 (en) | 2001-05-29 | 2004-09-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
| US6828513B2 (en) * | 2002-04-30 | 2004-12-07 | Texas Instruments Incorporated | Electrical connector pad assembly for printed circuit board |
| US7411474B2 (en) | 2005-10-11 | 2008-08-12 | Andrew Corporation | Printed wiring board assembly with self-compensating ground via and current diverting cutout |
| US7999192B2 (en) | 2007-03-14 | 2011-08-16 | Amphenol Corporation | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards |
| JP2017199763A (en) * | 2016-04-26 | 2017-11-02 | 京セラ株式会社 | Printed wiring board and method of manufacturing the same |
-
1988
- 1988-09-30 JP JP24694188A patent/JPH0294693A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113704A (en) * | 1990-09-03 | 1992-04-15 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| US5791911A (en) * | 1996-10-25 | 1998-08-11 | International Business Machines Corporation | Coaxial interconnect devices and methods of making the same |
| US5955704A (en) * | 1996-11-21 | 1999-09-21 | Dell U.S.A., L.P. | Optimal PWA high density routing to minimize EMI substrate coupling in a computer system |
| US5949030A (en) * | 1997-11-14 | 1999-09-07 | International Business Machines Corporation | Vias and method for making the same in organic board and chip carriers |
| WO2000033624A1 (en) * | 1998-12-02 | 2000-06-08 | Teradyne, Inc. | Printed circuit board and method for fabricating such board |
| US6181219B1 (en) | 1998-12-02 | 2001-01-30 | Teradyne, Inc. | Printed circuit board and method for fabricating such board |
| US6606014B2 (en) | 1999-02-25 | 2003-08-12 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
| WO2001048819A3 (en) * | 1999-12-28 | 2002-03-07 | Intel Corp | Interconnect structure and method of fabrication therefor |
| WO2001048819A2 (en) * | 1999-12-28 | 2001-07-05 | Intel Corporation | Interconnect structure and method of fabrication therefor |
| WO2002058234A2 (en) * | 2001-01-16 | 2002-07-25 | Formfactor, Inc. | High frequency printed circuit board via |
| WO2002058234A3 (en) * | 2001-01-16 | 2002-10-24 | Formfactor Inc | High frequency printed circuit board via |
| KR100945401B1 (en) * | 2001-01-16 | 2010-03-04 | 폼팩터, 인크. | High frequency printed circuit board via |
| US6617526B2 (en) * | 2001-04-23 | 2003-09-09 | Lockheed Martin Corporation | UHF ground interconnects |
| US6787710B2 (en) | 2001-05-29 | 2004-09-07 | Mitsubishi Denki Kabushiki Kaisha | Wiring board and a method for manufacturing the wiring board |
| US7520054B2 (en) | 2002-02-22 | 2009-04-21 | Bridgewave Communications, Inc. | Process of manufacturing high frequency device packages |
| US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
| US6828513B2 (en) * | 2002-04-30 | 2004-12-07 | Texas Instruments Incorporated | Electrical connector pad assembly for printed circuit board |
| US7411474B2 (en) | 2005-10-11 | 2008-08-12 | Andrew Corporation | Printed wiring board assembly with self-compensating ground via and current diverting cutout |
| US7999192B2 (en) | 2007-03-14 | 2011-08-16 | Amphenol Corporation | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards |
| JP2017199763A (en) * | 2016-04-26 | 2017-11-02 | 京セラ株式会社 | Printed wiring board and method of manufacturing the same |
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