JPH0294690A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0294690A JPH0294690A JP63247751A JP24775188A JPH0294690A JP H0294690 A JPH0294690 A JP H0294690A JP 63247751 A JP63247751 A JP 63247751A JP 24775188 A JP24775188 A JP 24775188A JP H0294690 A JPH0294690 A JP H0294690A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- patterns
- deviation
- wiring board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000007650 screen-printing Methods 0.000 claims abstract description 14
- 238000007639 printing Methods 0.000 claims abstract description 3
- 238000004080 punching Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000006073 displacement reaction Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Control Of Position Or Direction (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はスクリーン印刷により形成された複数列の配線
パターンを有する印刷配線基板に関し、特に円弧状パタ
ーンを有する配線回路パターンのパターンずれの検出に
有効な印刷配線基板番こ関する。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a printed wiring board having a plurality of rows of wiring patterns formed by screen printing, and in particular to detecting pattern displacement of a wiring circuit pattern having an arcuate pattern. Contains a valid printed wiring board number.
［従来の技術］
一般に、例えばスクリーン印刷によって印刷配線基板を
製造するには、表裏面の複数列の回路パターンを印刷し
、回路パターン以外の不必要部の銅をエツチングにより
除去し、次にレジスト層からなるマスクパターンを印刷
し、プレス抜き用の基準孔を形成し、プレス抜きを行な
って複数の印刷配線基板を得るようにしている。[Prior Art] Generally, in order to manufacture a printed wiring board by screen printing, for example, multiple rows of circuit patterns are printed on the front and back surfaces, copper in unnecessary areas other than the circuit patterns is removed by etching, and then resist is etched. A mask pattern consisting of layers is printed, reference holes for press punching are formed, and press punching is performed to obtain a plurality of printed wiring boards.
この種のスクリーン印刷方式を用いて印刷配線基板を製
造するものはスクリーンの伸縮が配線パターンの寸法、
精度に影響するという問題がある。When manufacturing printed wiring boards using this type of screen printing method, the expansion and contraction of the screen is the size of the wiring pattern.
There is a problem in that it affects accuracy.
［発明が解決しようとする課Ｍ］
このようにスクリーン印刷方式を用いた場合、スクリー
ンは温度や湿度の関係で伸縮し易いとともに、１つのス
クリーンで使用する回数が多くなるとスクリーンが伸長
してしまうなめ、特に１つのスクリーンに複数列の配線
パターンを有し、このスクリーンを用いて、印刷配線基
板に円弧状パターンを有する配線回路パターンを複数配
設するものにおいては、製品の円弧中心に対し前記円弧
状パターンがずれ易い。[Problem M to be solved by the invention] When using the screen printing method in this way, the screen tends to expand and contract due to temperature and humidity, and the screen expands when one screen is used many times. In particular, when one screen has multiple rows of wiring patterns, and this screen is used to arrange multiple wiring circuit patterns having circular arc patterns on a printed wiring board, the The arc pattern tends to shift.
従来、スクリーンの伸長によるパターンのずれは作業員
の目視により検査し、パターンのずれが大きい場合に新
しいスクリーンと交換するようにしている。しかし、パ
ターンのずれを正確に判別する手段がないためスクリー
ンの交換時期を逸し、パターンのずれが許容範囲を超え
ても伸長したスクリーンを使用しつづけることが多く、
大量の不良品が発生するという問題があった。Conventionally, a worker visually inspects the pattern for deviation due to screen elongation, and if the pattern deviation is large, the screen is replaced with a new one. However, because there is no way to accurately determine the pattern deviation, the timing for replacing the screen is often missed, and the stretched screen is often continued to be used even if the pattern deviation exceeds the allowable range.
There was a problem in that a large number of defective products were produced.
そこで本発明は円弧状パターンのずれを簡単に判別でき
る安定した印刷配線基板を提供することを目的とする。Therefore, an object of the present invention is to provide a stable printed wiring board in which displacement of an arcuate pattern can be easily determined.
［課題を解決するための手段］
本発明はスクリーン印刷により印刷配線基板に円弧状パ
ターンを有する配線回路パターンを複数配列し、この各
配線回路パターンに対応する製品領域の外周縁および前
記円弧状パターンの中央部をプレス抜き加工によって切
断する印刷配線基板において、前記配線回路パターンの
スクリーン印刷時にプレス抜き位置の基準を定めるため
の基準パターンを前記印刷配線基板に設けるとともに、
各配線回路パターンにおける各製品領域の内側または外
側に印刷パターンずれの許容範囲の良否を判別するずれ
検出パターンを前記円弧状パターンの少なくとも１つの
仮想中心線に沿い、かつ前記円弧状パターンと同心位置
に複数印刷して構成される。[Means for Solving the Problems] The present invention arranges a plurality of wiring circuit patterns each having an arcuate pattern on a printed wiring board by screen printing, and the outer periphery of a product area corresponding to each wiring circuit pattern and the arcuate pattern. In a printed wiring board whose center portion is cut by press punching, a reference pattern is provided on the printed wiring board for determining a standard for a press punching position during screen printing of the wiring circuit pattern, and
A deviation detection pattern for determining whether the permissible range of printed pattern deviation is acceptable is placed inside or outside of each product area in each wiring circuit pattern at a position along at least one virtual center line of the arcuate pattern and concentric with the arcuate pattern. Consists of multiple prints.
［作 用］
上記構成によって、プレス抜き後前記ずれ検出パターン
から得られる仮想中心線上における円弧状切断部とずれ
検出パターンとの間隔を測定し印刷パターンずれの許容
範囲の良否を判別する。[Function] With the above configuration, the distance between the arc-shaped cut portion and the deviation detection pattern on the virtual center line obtained from the deviation detection pattern after press punching is measured, and it is determined whether or not the permissible range of the printed pattern deviation is acceptable.
［実施例］ 以下、本発明の実施例を添付図面を参照して説明する。[Example] Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図乃至第５図はモータの制御回路用の印刷配線基板
を示しており、１は印刷配線基板であり、この基板１の
表面には第３図に示すように、第１図で示す円弧状パタ
ーンを２Ｂを有する配線パターン２が複数印刷され、裏
面には第２図で示す円弧状パターン２Ｃを有する配線パ
ターン２Ａが前記配線パターン２に対応して複数印刷さ
れている。３，３Ａは一点鎖線で示した切断ラインであ
り、この切断ライン３，３Ａ内が製品領域である。４は
配線パターン２の円弧中心および三方に印刷されたプレ
ス抜き用基準孔の基準パターンであり、この基準パター
ン４部分を穿孔して基準孔４Ａを形成するものである。1 to 5 show printed wiring boards for motor control circuits, 1 is a printed wiring board, and as shown in FIG. A plurality of wiring patterns 2 having circular arc patterns 2B are printed, and a plurality of wiring patterns 2A having circular arc patterns 2C shown in FIG. 2 are printed on the back surface corresponding to the wiring patterns 2. 3 and 3A are cutting lines indicated by dashed lines, and the area within these cutting lines 3 and 3A is the product area. Reference numeral 4 denotes a reference pattern of reference holes for press punching printed on the center of the arc and on three sides of the wiring pattern 2, and the reference hole 4A is formed by drilling portions of this reference pattern 4.
５は基板１表面の製品領域外周辺の外側に間隔を設けて
複数印刷されたずれ検出パターン、５Ａは製品領域内周
辺の内側に間隔を設けて印刷されたずれ検出パターンで
あり、ずれ検出パターン５Ａは第４図に示すように相対
向する２つのずれ検出パターン５Ａの端部が前記円弧状
パターン２Ｂの仮想中心線Ｌ ＋、 Ｌ ２． Ｌ ３
に沿うように前記円弧状パターン２Ｂと同心円位置に印
刷され、ずれ検出パターン５は第５図に示すように相対
向する２つのずれ検出パターン５の端部が前記円弧状パ
ターン２Ｂの仮想中心線Ｌ４．Ｌ、、Ｌ６に沿うように
して前記円弧状パターン２Ｂと同心円位置に印刷されて
いる。６はレジスト層からなるマスクパターンの外周ラ
イン、６Ａはその内周ラインを示し、外周ライン６と内
周ライン６Ａ内に印刷されたマスクパターンによって配
線パターン２，２Ａおよび検出パターン５．５Ａが被覆
されている。Reference numeral 5 denotes a plurality of displacement detection patterns printed at intervals on the outside of the periphery outside the product area on the surface of the substrate 1, and 5A is a displacement detection pattern printed at intervals inside the periphery of the product area. 5A, as shown in FIG. 4, the ends of two mutually opposing deviation detection patterns 5A are aligned with the virtual center line L+, L2 of the arcuate pattern 2B. L 3
The deviation detection pattern 5 is printed at a concentric position with the arcuate pattern 2B so as to follow the arcuate pattern 2B, and as shown in FIG. L4. It is printed at a position concentric with the arcuate pattern 2B along lines L, , L6. Reference numeral 6 indicates the outer circumferential line of a mask pattern made of a resist layer, and 6A indicates its inner circumferential line. The wiring patterns 2, 2A and the detection pattern 5.5A are covered by the mask pattern printed within the outer circumferential line 6 and the inner circumferential line 6A. has been done.
そして、周知のスクリーン印刷法によって、基板１の表
面に円弧状パターン２Ｂを有する配線パターン２と基準
パターン４およびずれ検出パターン５．５Ａを同時に印
刷するとともに、基板１の裏面に円弧状パターン２Ｃを
有する配線パターン２Ａを印刷し、各配線パターン２，
２Ａおよびずれ検出パターン５゜５Ａをマスクパターン
により被覆し、前記基準パターン４部分を穿孔してプレ
ス抜き用基準孔４Ａを形成し、この基準孔４Ａを基準に
して各製品領域を同時に製品領域の外周縁および円弧状
パターン２Ｂ、２Ｃの中央を切断ライン３．３Ａからプ
レス抜きする。その後プレス抜きされた各印刷配線基板
ＩＡの相対向するずれ検出パターン５Ａによって得られ
る仮想中心線し、又はＬ２又はし１、あるいはずれ検出
パターン５によって得られる仮想中心線Ｌ４又はり、又
はＬ６に基づいて製品となる印刷配線基板ＩＡの良否を
判別する。Then, by a well-known screen printing method, the wiring pattern 2 having the arcuate pattern 2B, the reference pattern 4, and the deviation detection pattern 5.5A are simultaneously printed on the front surface of the substrate 1, and the arcuate pattern 2C is printed on the back surface of the substrate 1. Each wiring pattern 2A is printed, and each wiring pattern 2,
2A and the deviation detection pattern 5°5A are covered with a mask pattern, the reference pattern 4 portion is punched to form a reference hole 4A for press punching, and each product area is simultaneously formed using the reference hole 4A as a reference. The outer periphery and the center of the arcuate patterns 2B and 2C are press-cut from the cutting line 3.3A. Thereafter, the virtual center line obtained by the opposing displacement detection patterns 5A of each printed wiring board IA that has been pressed out, or L2 or 1, or the virtual center line L4 or L6 obtained by the displacement detection pattern 5. Based on this, the quality of the printed wiring board IA as a product is determined.
すなわち、前記仮想中心線り、、Ｌ、、Ｌ３．Ｌ４Ｌ％
、Ｌ６上における切断面７とずれ検出パターン５，５Ａ
との間隔寸法のずれが許容範囲より大きい場合、スクリ
ーンを新しいものに交換するようにしている。That is, the virtual center line L, , L3. L4L%
, cut plane 7 on L6 and deviation detection patterns 5, 5A
If the gap between the screen and the screen is larger than the allowable range, the screen is replaced with a new one.
このように上記実施例においては、スクリーン印刷によ
り印刷配線基［１に複数配列された各配線回路パターン
２における各製品領域の内側または外側に、ずれ検出パ
ターン５゜５Ａを円弧状パターン２Ｂの少なくとも１つ
の仮想中心線に沿い、かつ前記円弧状パターン２Ｂと同
心円位置に構成しているため、ずれ検出パターン５，５
Ａから得られる仮想中心線に沿った円弧状切断面７とず
れ検出パターン５，５Ａの間隔寸法を測定するだけでパ
ターンずれ状態が規格内か否かの判断を正確にかつ容易
に行うことができ、これによってスクリーンの交換時期
を逸することがない。As described above, in the above embodiment, the deviation detection pattern 5° 5A is placed inside or outside of each product area in each wiring circuit pattern 2 arranged in plurality on the printed circuit board [1] by screen printing at least in the arcuate pattern 2B. Since the displacement detection patterns 5, 5 are arranged along one virtual center line and concentrically with the arcuate pattern 2B,
It is possible to accurately and easily judge whether the pattern deviation state is within the standard by simply measuring the distance dimension between the arc-shaped cut surface 7 along the virtual center line obtained from A and the deviation detection patterns 5, 5A. This allows you to never miss the time to replace the screen.
なお、本発明は上記実施例に限定されるものではなく、
本発明の要旨の範囲内において種々の変形実施が可能で
ある。例えばずれ検出パターンは少なくとも１つの仮想
中心線に対応して２つ以上設ければよく、切断ライン３
Ａの内側に設けてもよい。Note that the present invention is not limited to the above embodiments,
Various modifications are possible within the scope of the invention. For example, two or more deviation detection patterns may be provided corresponding to at least one virtual center line, and two or more deviation detection patterns may be provided corresponding to at least one virtual center line.
It may be provided inside A.
［発明の効果］
本考案はスクリーン印刷により印刷配線基板に円弧状パ
ターンを有する配線回路パターンを複数配列し、この配
線回路パターンに対応する製品領域の外周縁及び前記円
弧状パターンの中央部をプレス抜き加工によって切断す
る印刷配線基板において、前記配線回路パターンのスク
リーン印刷時にプレス抜き位置の基準を定めるための基
準パターンを前記印刷配線基板に設けるとともに、各配
線回路パターンにおける各製品領域の内側または外側に
印刷パターンずれの許容範囲の良否を判別するずれ検出
パターンを前記円弧状パターンの少なくとも一つの仮想
中心線に沿い、がつ前記円弧状パターンと同心円位置に
複数印刷することにより、パターンのずれを正確に判別
することが可能な印刷配線基板を提供できる。[Effects of the Invention] The present invention arranges a plurality of wiring circuit patterns each having an arcuate pattern on a printed circuit board by screen printing, and presses the outer periphery of the product area corresponding to the wiring circuit pattern and the center part of the arcuate pattern. In a printed wiring board that is cut by punching, a reference pattern is provided on the printed wiring board for determining the reference position of the press punching position during screen printing of the wiring circuit pattern, and a reference pattern is provided on the printed wiring board to determine the reference pattern for the press punching position when screen printing the wiring circuit pattern. By printing a plurality of deviation detection patterns for determining the acceptability of the printed pattern deviation along at least one virtual center line of the arcuate pattern and at concentric positions with the arcuate pattern, pattern deviations can be detected. A printed wiring board that can be accurately identified can be provided.
第１図乃至第５図は本発明の実施例を示し、第１図は基
板の表面に印刷されたパターンを示す正面図、第２図は
基板の裏面に印刷されたパターンを示す正面図、第３図
は複数列に印刷されたパターンを示す正面図、第４図は
プレス抜きされた印刷配線基板の正面図、第５図はプレ
ス抜き後のブランクの正面図である。
１・・・印刷配線基板
２．２Ａ・・・配線回路パターン
２Ｂ、２Ｃ・・・円弧状パターン
４・・・基準パターン
５．５Ａ・・・ずれ検出パターン
Ｌ Ｌ、 Ｌ ｘ
し５
Ｌ４．Ｌう
・・・仮想中心線
同
弁
理
士
薄
田
長
四
部
第
■
図
第２図
手続補正書
自
発
事件の表示
昭和６３年特許願第２４７７
５１号
２、発明の名称
印刷配線基板
３、補正をする者1 to 5 show embodiments of the present invention, FIG. 1 is a front view showing a pattern printed on the front surface of a substrate, FIG. 2 is a front view showing a pattern printed on the back surface of a substrate, FIG. 3 is a front view showing patterns printed in a plurality of rows, FIG. 4 is a front view of a printed wiring board that has been press-cut, and FIG. 5 is a front view of the blank after press-cut. 1...Printed wiring board 2.2A...Wiring circuit pattern 2B, 2C...Circular pattern 4...Reference pattern 5.5A...Displacement detection pattern L L, L x 5 L4. L...Virtual center line Same Patent Attorney Naga Susuda 4th Department ■ Figure 2 Procedural amendments Indication of voluntary case 1988 Patent Application No. 2477 No. 51 2 Name of invention Printed wiring board 3 Person making the amendment
Claims (1)
ーンを有する配線回路パターンを複数配列し、この各配
線回路パターンに対応する製品領域の外周縁および前記
円弧状パターンの中央部をプレス抜き加工によって切断
する印刷配線基板において、前記配線回路パターンのス
クリーン印刷時にプレス抜き位置の基準を定めるための
基準パターンを前記印刷配線基板に設けるとともに、各
配線回路パターンにおける各製品領域の内側または外側
に印刷パターンずれの許容範囲の良否を判別するずれ検
出パターンを前記円弧状パターンの少なくとも１つの仮
想中心線に沿い、かつ前記円弧状パターンと同心円位置
に複数印刷したことを特徴とする印刷配線基板。(1) A plurality of wiring circuit patterns each having an arcuate pattern are arranged on a printed wiring board by screen printing, and the outer periphery of the product area corresponding to each wiring circuit pattern and the center of the arcuate pattern are cut by press punching. In the printed wiring board, a reference pattern is provided on the printed wiring board to determine the reference position of the press punching position during screen printing of the wiring circuit pattern, and a printed wiring board is provided with a reference pattern to prevent printing pattern deviation inside or outside of each product area in each wiring circuit pattern. A printed wiring board, characterized in that a plurality of deviation detection patterns for determining the acceptability of an acceptable range are printed along at least one virtual center line of the arcuate pattern and at concentric positions with the arcuate pattern.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247751A JPH0294690A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board |
| DE68924943T DE68924943T2 (en) | 1988-08-31 | 1989-08-18 | Printed circuit board. |
| EP89308415A EP0357307B1 (en) | 1988-08-31 | 1989-08-18 | Printed-wiring board |
| AT89308415T ATE130997T1 (en) | 1988-08-31 | 1989-08-18 | PRINTED CIRCUIT BOARD. |
| CA000609575A CA1303240C (en) | 1988-08-31 | 1989-08-28 | Printed-wiring board |
| KR1019890012745A KR0158675B1 (en) | 1988-09-30 | 1989-09-04 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247751A JPH0294690A (en) | 1988-09-30 | 1988-09-30 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294690A true JPH0294690A (en) | 1990-04-05 |
Family
ID=17168123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63247751A Pending JPH0294690A (en) | 1988-08-31 | 1988-09-30 | Printed wiring board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0294690A (en) |
| KR (1) | KR0158675B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020078889A (en) * | 2001-04-11 | 2002-10-19 | 김치호 | Method to manufacture PCB for actuator in automobile |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60186088A (en) * | 1984-02-23 | 1985-09-21 | 松下電器産業株式会社 | Printed circuit board |
-
1988
- 1988-09-30 JP JP63247751A patent/JPH0294690A/en active Pending
-
1989
- 1989-09-04 KR KR1019890012745A patent/KR0158675B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60186088A (en) * | 1984-02-23 | 1985-09-21 | 松下電器産業株式会社 | Printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020078889A (en) * | 2001-04-11 | 2002-10-19 | 김치호 | Method to manufacture PCB for actuator in automobile |
Also Published As
| Publication number | Publication date |
|---|---|
| KR900005859A (en) | 1990-04-14 |
| KR0158675B1 (en) | 1998-12-15 |
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