JPH029446U - - Google Patents

Info

Publication number
JPH029446U
JPH029446U JP8767288U JP8767288U JPH029446U JP H029446 U JPH029446 U JP H029446U JP 8767288 U JP8767288 U JP 8767288U JP 8767288 U JP8767288 U JP 8767288U JP H029446 U JPH029446 U JP H029446U
Authority
JP
Japan
Prior art keywords
lead
punch
forming device
die
metal tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8767288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8767288U priority Critical patent/JPH029446U/ja
Publication of JPH029446U publication Critical patent/JPH029446U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Bending Of Plates, Rods, And Pipes (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例にかかるリード成形
装置の斜視図、第2図イからハはそれぞれ同実施
例のリード成形装置の動作説明をする概略側面図
、第3図は従来のリード成形装置の一部拡大側面
図である。 2……リード、3……ダイ、5……パンチ、5
a,5b……リード成形面、6……金属テープ。
Fig. 1 is a perspective view of a lead forming device according to an embodiment of the present invention, Fig. 2 A to C are schematic side views explaining the operation of the lead forming device of the same embodiment, and Fig. 3 is a conventional lead FIG. 2 is a partially enlarged side view of the molding device. 2...Lead, 3...Die, 5...Punch, 5
a, 5b...Lead forming surface, 6...Metal tape.

Claims (1)

【実用新案登録請求の範囲】 ダイ上に位置決め固定されたリードをパンチに
て押圧し折曲成形するリード成形装置において、 上記リードとパンチ間に金属テープを配置した
ことを特徴とするリード成形装置。
[Claims for Utility Model Registration] A lead forming device that presses and bends a lead positioned and fixed on a die with a punch, characterized in that a metal tape is disposed between the lead and the punch. .
JP8767288U 1988-06-30 1988-06-30 Pending JPH029446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8767288U JPH029446U (en) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8767288U JPH029446U (en) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH029446U true JPH029446U (en) 1990-01-22

Family

ID=31312273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8767288U Pending JPH029446U (en) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH029446U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102228U (en) * 1975-02-15 1976-08-17
JPS51102227U (en) * 1975-02-15 1976-08-17
JPS51102229U (en) * 1975-02-15 1976-08-17
JPS5313524A (en) * 1976-07-23 1978-02-07 Koyo Kikai Sangiyou Kk Single cloth plate scaffold

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102228U (en) * 1975-02-15 1976-08-17
JPS51102227U (en) * 1975-02-15 1976-08-17
JPS51102229U (en) * 1975-02-15 1976-08-17
JPS5524273Y2 (en) * 1975-02-15 1980-06-10
JPS5524274Y2 (en) * 1975-02-15 1980-06-10
JPS5544111Y2 (en) * 1975-02-15 1980-10-16
JPS5313524A (en) * 1976-07-23 1978-02-07 Koyo Kikai Sangiyou Kk Single cloth plate scaffold
JPS5536788B2 (en) * 1976-07-23 1980-09-24

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