JPH0290522A - Wafer handling device for cleaning wafer - Google Patents

Abstract

PURPOSE:To obtain a high cleaning effect, to cut down the time of dipping, and to reduce the flow rate of a cleaning fluid by a method wherein a large number of wafers are held in a line maintaining space in forward and backward directions in an almost exposed condition by the four-point contact using a part of guide arms and a pair of chuck arms. CONSTITUTION:In order to grab up a wafer from an auxiliary means 13, a pair of chuck arms 12a and 12b are opened maximum by moving them in separating direction, the chuck arms and guide arms are lowered, and the pair of guide arms 11a and 11b are brought close to the upper surface of the left and right supporting walls A and B of the auxiliary means. Then, a pusher 14 is lifted up and erected in the auxiliary means 13, all the arranged wafers are pushed up, and when they are placed in the supporting grooves 11 and 11 opposing to the guide arms, the twin guide arms and the chuck arms begin to rise at the same speed as the rising speed of the pusher 14. Then, when the pusher pushed up almost whole of the wafers and its rising is stopped, the rising of the twin guide arms and the chuck arms is also stopped, the chucks 12a and 12b are shifted to approaching direction, And the right and left side edges of the wafer lower than the largest diameter part are inserted into and pinched by the supporting grooves 12 and 12. Then, the pusher is lowered and returned to its original condition, and the wafers are grabbed up above the auxiliary means by the guide arms and the chuck arms.

Description

【発明の詳細な説明】 〈産業上の利用分野） この発明は多数枚の半導体のウェハを前後方向に所定の
間隙を保って一列に把持し、洗浄工程から乾繰工程に搬
送すると共に、洗Ｍ＋王程てはシ１降して液槽に浸漬す
るためのウェハ洗浄用のウェハハントリンク装置に関す
る。[Detailed Description of the Invention] (Industrial Application Field) This invention grips a large number of semiconductor wafers in a line with a predetermined gap in the front and back direction, transports them from a cleaning process to a drying process, and The present invention relates to a wafer hunt link device for cleaning wafers which is lowered and immersed in a liquid bath.

〈従来の技術〉 ：ｆＳ８．９図に示すように、直η支持部ｌと、その下
に連接した下り坂の傾斜支持部２と、該傾斜支持部の下
に連接した脚部３からなる左右二つの支持壁ＡとＢを連
結部材４により対向状に連結し、上記各直立支持部ｌの
ヒ端から傾斜支持部２の下端にかけてウェハの一枚宛の
両側縁を受入れる相対向した対の支持溝５を各支持壁Ａ
とＢに前後方向に間隙を保って設けたプラスチック製の
キャリアを使用し、多数枚のキ＼・リアＣを−・枚宛、
上記相対向した対の支持溝５に入れると共に、左右の傾
斜支持部２，２１１に受は市めて前後方向に一列に☆二
て並べ、このキャリアなシ１降操作可能な一対のチャッ
クで左右から挟み、液槽に浸漬して洗ｆ′ＩＩを行うこ
とを本特許出願人は実願昭６２−１３０１２８で提案し
た。<Prior art>: As shown in Fig. fS8.9, it consists of a straight η support part l, a downhill inclined support part 2 connected below it, and a leg part 3 connected below the inclined support part. The two left and right support walls A and B are connected in a facing manner by a connecting member 4, and an opposing pair is formed from the upper end of each upright support part l to the lower end of the inclined support part 2 to receive both side edges of one wafer. The support groove 5 of each support wall A
Using a plastic carrier provided with a gap in the front and back direction between and
In addition to inserting the supports into the opposed pairs of support grooves 5, the supports are placed on the left and right inclined support parts 2, 211 and arranged in a line in the front and back direction, and the carrier is fitted with a pair of chucks that can be lowered. The applicant of the present patent proposed in Utility Model Application No. 130128/1988 that washing f'II is performed by sandwiching the material from the left and right sides and immersing it in a liquid bath.

〈発明が解決しようとする課題〉 Ｌ記先行提案ではウェハと、ウェハな前後方向に立て並
べているキャリアとを一緒に液槽に浸漬して洗浄を行う
ので、槽内の液はウェハに付着している汚染物質以外に
、キャリアに付着している汚染物質でも汚されるため汚
れるのかＩ−＜、洗浄液の交換を頻繁に要する。又、キ
ャリアかウェハの四方を囲んているため液かウェハに接
触して流れにくい。このため、均一な洗浄か困難であっ
た。また、洗浄効果を高めるためには液中の浸漬時間を
長くしなければならず、又、大流星の洗浄液を必要とし
た。<Problems to be Solved by the Invention> In the prior proposal described in L, the wafer and the carriers arranged vertically in the front-to-back direction of the wafer are immersed together in a liquid tank for cleaning, so the liquid in the tank does not adhere to the wafer. In addition to the contaminants attached to the carrier, the carrier is also contaminated by contaminants, so the cleaning solution must be replaced frequently. Also, since the carrier or wafer is surrounded on all sides, the liquid comes into contact with the wafer and is difficult to flow. For this reason, it was difficult to achieve uniform cleaning. In addition, in order to improve the cleaning effect, the immersion time in the liquid had to be increased, and a large meteor cleaning liquid was required.

〈課題を解決するためのｆ段〉 そこで本発ＩＪｊはキャリアごとウェハを液に浸漬する
のではなく、ウェハたけを前後方向に立て孤へた状態に
把持して洗浄を行うようにしたのであって、ウェハ洗浄
用のウェハハンドリング装置として、相対向した一対の
前後方向に延びるガイド腕と、上記ガイド腕の対の下方
で、該ガイド腕と平行に前後方向に延びる相対向した一
対のチャック腕とを備え、上記ガイド腕の対に相対向し
た面に、前後方向に所定の間隙を保って洗浄すべきウェ
ハの両側縁を受入れる多数対の支持溝を有し、Ｌ記チャ
ック腕の対は、ガイド腕の対の間隔の中央線に関して相
互に同憂：宛接近、離反方向に移動ｕ（能であると共に
、」―記ガイ１〜腕の対と、チャック腕の対はＬド方向
と、左右方向に一体とし°（往復動可能であることを特
徴とする。<Step F to solve the problem> Therefore, in the IJJ of this invention, instead of immersing the wafer together with the carrier in a liquid, cleaning is performed by holding the wafer in an isolated state standing upright in the front and back direction. A wafer handling device for cleaning wafers includes a pair of opposed guide arms extending in the front-rear direction, and a pair of opposed chuck arms extending in the front-rear direction parallel to the guide arms below the pair of guide arms. and a plurality of pairs of support grooves for receiving both side edges of the wafer to be cleaned while maintaining a predetermined gap in the front and back direction on the surface facing opposite to the pair of guide arms, the pair of chuck arms indicated by L are provided with: , the pair of guide arms and the pair of chuck arms are mutually similar with respect to the center line of the spacing: moving toward and away from each other (with respect to the center line). , integrated in the left and right direction (characterized by the ability to reciprocate).

尚、チャック腕の対にもガイド腕と同様、相対向した而
にウェハの支持溝を設けて置くと、ウェハかずれず、掴
み、１−げ、桔み卸しか容易となるため好ましい。It is preferable to provide the pair of chuck arms with wafer support grooves facing each other in the same manner as the guide arms, since this prevents the wafer from slipping and makes it easier to grip, pick up, and unload the wafer.

又、液に浸漬し”Ｃ引上げた際、ウェハから垂れる液の
水切りを良ｔＩＩにし、転帰時間を短縮するため、ガイ
ド腕の対と、チャック腕の対は＋１ｆ−Ｌす。Further, when the wafer is immersed in liquid and pulled up, the pair of guide arms and the pair of chuck arms are set at +1f-L in order to drain the liquid dripping from the wafer in a good time and shorten the turnaround time.

又は曲下り方向に一体として傾動ＩＩｒ能にすることか
好ましい。Alternatively, it is preferable to integrally enable the tilting function in the downward direction of the curve.

更に、ウェハは直径のサイズか異なった数種類のものが
あるので、どのサイズの直径のウェハでも把持すること
がてきるようにするためガイド腕の対はその間隔の中央
線に関して相〃に接近、離反方向に移動可能にすること
か好ましい。Additionally, since wafers come in several different sizes of diameter, the pairs of guide arms should be close together with respect to the centerline of their spacing, so that wafers of any size diameter can be gripped. It is preferable to make it movable in the direction of separation.

〈実　施　例〉 第１．２図において、１１ａとｌｌｂは一対の前後方向
に延びる相対向したガイ１〜腕、１２ａと＋２ｂはＬ記
ガイド腕の対の下方て、該ガイド腕と平行に前後方向に
延びる一対のチャック腕である。上記ガイド腕とチャッ
ク腕は石英の細い丸棒（例えば直径１２ｍｍ　）とし、
１耐蝕性とする。<Example of implementation> In Fig. 1.2, 11a and llb are a pair of opposing guide arms extending in the front-rear direction, and 12a and +2b are below the pair of guide arms indicated by L and parallel to the guide arms. They are a pair of chuck arms that extend in the front and back direction. The guide arm and chuck arm are thin round rods made of quartz (for example, 12 mm in diameter).
1 Corrosion resistance.

−１−記ガイド腕の対１１ａと、ｕｂ及びチャック腕の
対１２ａと＋２ｂは相対向した面に、前後方向に所定の
間隙を保った多数対の支持溝ＩＩ、　ＩＩと１２゜１２
を同じ位置に有する。支持溝１１の対と、１２の対は洗
浄すべきウェハの一枚宛の左右の側縁を受入れるための
もので、ガイド腕の対かチャック腕の対よりも上のレベ
ルに位置するため、ガイド腕の対の支持溝ＩＩ、　Ｉｔ
がウェハの最大径部の両側縁を受入れたとき、チャック
腕の対の支持？ＩＷ１２．１２はそれよりも幅か狭い下
方の両側縁を受入れることになる（第２図）。尚、ガイ
ド腕とチャック腕の上下方向のレベル差は：ｌＯｍ＋＋
＋程度てよい。-1- The pair of guide arms 11a and the pair of ub and chuck arms 12a and +2b have multiple pairs of support grooves II, II and 12°12 on opposing surfaces with a predetermined gap maintained in the front and rear direction.
in the same position. The pair of support grooves 11 and 12 are for receiving the left and right side edges of one wafer to be cleaned, and are located at a level higher than the pair of guide arms or the pair of chuck arms. Support groove II of the pair of guide arms, It
When the chuck arms receive both sides of the maximum diameter of the wafer, the support of the pair of chuck arms? IW12.12 will accept a wider or narrower lower side edge (Figure 2). The vertical level difference between the guide arm and chuck arm is: lOm++
＋ degree is good.

そして、チャック腕の対＋２ａ　、　１２ｂは、ガイ１
へ腕の対＋１ａ　、　ｌｌｂの左右方向の間隔の中央線
ＣＬに関して相ｌｒに同１．１宛、第１図の矢印ａのよ
うに接近、離反方向に移動１１丁能てあり、又、ガイド
腕の対＋１ａ　、　ｌｌｂと、チャック腕の対１２ａ。And the chuck arm pair +2a, 12b is Guy 1
With respect to the center line CL of the left-right distance between the pair of arms +1a and llb, 11 arms are capable of moving toward and away from the pair of arms as indicated by arrow a in Fig. Arm pair +1a, llb and chuck arm pair 12a.

＋２ｂは上下方向と、左右方向に一体として往復動可能
である。+2b can reciprocate as a unit in the vertical direction and the horizontal direction.

チャフ腕の対を接近、離反方向に移動させるための装置
及び、ガイド腕の対と、チャック腕の対を一体として上
下方向及び左右方向に往復動させる装置は後述する。A device for moving the pair of chaff arms toward and away from each other, and a device for reciprocating the pair of guide arms and the pair of chuck arms integrally in the vertical and horizontal directions will be described later.

尚、対のガイド腕１１ａ　、　Ｉｌｂと、チャック腕１
２ａ　、　１２ｂはこの実に例ては前後に一体の−１−
向き延長部を有し、その各」二端は支持ロットＩＩ’１
１’、１２’　　１２’に固定しである。この各支持ロ
ットは、ガイド腕やチ（・ツク腕の石英丸棒より直径か
少し太いステンレスの細い鋼管の外に石英管を嵌せて包
み、耐蝕性にしである。In addition, the pair of guide arms 11a and Ilb and the chuck arm 1
2a and 12b are integral -1- at the front and back of this fruit, for example.
oriented extensions, each of whose two ends are connected to a support rod II'1.
1', 12' fixed at 12'. Each support rod is made of a thin stainless steel tube that is slightly thicker in diameter than the quartz round rod of the guide arm or tip arm, and is wrapped with a quartz tube fitted around the outside to make it corrosion resistant.

対のガイド腕と、チャック腕で、前後方向に間隙を保ち
、−・列に）′／、て並べた状ｆｌ；に多数枚のウェハ
を掴み」：げたり積み卸したりするには前述したキャリ
アと同様な補助共！３を用い、その各支持壁ＡとＢの対
の支持溝５，５の１ｔ１後方向の間隔は対のガイド腕と
チャック腕にある支持ｆ＋ＷＩ！、＋２に一致させて置
き、補助具１３に多数枚のウェハを支持１＋ｊｆｆ５．
５により　−列にケて並べる。A pair of guide arms and a chuck arm are used to hold a large number of wafers arranged in rows with a gap in the front-rear direction, and to pick up and unload a large number of wafers as described above. Assistance similar to a career! 3 is used, and the distance in the rearward direction of 1t1 between the support grooves 5, 5 of each support wall A and B pair is the support f+WI! in the pair of guide arm and chuck arm. , +2, and support a large number of wafers on the auxiliary tool 13 1+jff5.
According to 5, arrange them in -rows.

そして、この補助Ｊｔ１３を、」二面にｙ１降可能なフ
ッシャ１４を備えた台１５１１に位置決めして置き、補
助工↓１３の対の支持溝５と、カイト腕１１ａ　。Then, this auxiliary Jt13 is positioned and placed on a stand 1511 equipped with a hooker 14 that can be lowered by Y1 on two sides, and the pair of support grooves 5 of the auxiliary Jt13 and the kite arm 11a are placed.

ｌ１ｌ）の対の支持溝ＩＩ、　Ｉ＋を１−ドカ向に揃え
る。Align the pair of support grooves II and I+ of l1l) in the 1-position direction.

尚、ブツシャ１４は台１５内のビスｌ〜ンシリンタ、モ
ータ等の駆動て補助具の左右の支持壁Ａ、Ｂの間隔の内
部を昇降する。The pusher 14 is moved up and down within the space between the left and right support walls A and B of the auxiliary tool by driving screws 1, cylinders, motors, etc. in the stand 15.

掴みにげろには、第１図に示すように対のチャック腕１
２ａ　、　１２ｂを離反方向に移動させて最大に開き、
チャック腕及びガイド腕の対を降下させ、ガイド腕の対
＋１ａ　、　ｌｌｂを補助具の左右の支持壁Ａ、Ｂの１
−面に近接させる。尚、ガイド腕の対の対向間隔は補助
具の左右の支持壁Ａ、Ｈの間隔に大体等しいものとする
。The gripper has a pair of chuck arms 1 as shown in Figure 1.
2a and 12b are moved in the direction of separation and opened to the maximum,
Lower the pair of chuck arms and guide arms, and attach the pair of guide arms +1a and llb to the left and right support walls A and B of the auxiliary tool.
- close to the surface. The distance between the pair of guide arms is approximately equal to the distance between the left and right support walls A and H of the auxiliary tool.

それからフックｙ１４を上昇させて補助具内に立て並べ
られているウェハの全部を押し−１；げ、その左右力向
の最大直ｆ￥部か？Ｉｊ　ＩＩＩＪ共のＩ：　ｕ’ｉｉ
から１−に出て対のガイド腕の対向した支持溝ＩＩ、　
Ｉ＋に入ったら（第１図）、ブツシャ１４のＬ’ｒｌ速
瓜と回速で対のガイド腕と、チャック腕に上）１を開始
させる。Then, raise the hook Y14 and push all of the wafers lined up in the auxiliary tool to find the maximum straight part of the left and right force direction. Ij IIIJ: u'ii
opposing support grooves II of the pair of guide arms extending from 1-;
When it enters I+ (Fig. 1), the pair of guide arms and the chuck arm are started 1) at the L'rl speed of the pusher 14 and the rotation speed.

そして、ブツシャかウェハのは望全体を補助具の二面か
ら−Ｌに押し」−げて上Ｓ１を停止したとき、対のガイ
ド腕とチャック腕の−Ｌ昇も停め、チャック腕１２ａ　
、　１２ｂを接近方向に移動させ、その対の支持溝１２
．１２にウェハの最大Ｐ￥部よりも下の左右側縁を入れ
て挟む（第２図）。それからブツシャを下降させて元の
状ｆｒｉ’；に戻し、こうして対のガイド腕とチャック
腕て補助具の１−、方にウェハを掴み一１二げる。この
ように対のガイド腕とチャック腕はフッシャ１４と同速
度で上昇しなからブツシャにより押し−Ｌげられるウェ
ハを掴むのて、その際にウェハを傷付けることかない。When the pusher or the entire wafer is pushed to -L from the two sides of the auxiliary tool and the upper S1 is stopped, the pair of guide arms and chuck arms are also stopped -L, and the chuck arm 12a is stopped.
, 12b in the approaching direction, and the pair of support grooves 12
．． 12, insert the left and right side edges of the wafer below the maximum P\ portion and sandwich it (Fig. 2). Then, the pusher is lowered to return to its original state, and the pair of guide arms and chuck arms grasp the wafer on the 1st and 1st sides of the auxiliary tool and lift it up. In this way, the pair of guide arm and chuck arm do not rise at the same speed as the busher 14, so that they can grip the wafer pushed down by the busher without damaging the wafer.

又、多数枚のウェハは最大径部の両側縁を対のガ・イド
腕の対向り、た支持溝ＩＩ、　Ｉ＋に入れ、それよりも
幅が狭い下方の両側縁を対のチャック腕の対向した支持
溝１２．１２に入れてチ＼・ツタ腕で挟まれるため前後
方向に所定の間隙を保９て一列に保持される。従って、
第４１４に示すようにその後、対０）カイト腕とチ＼・
・ツク腕を台１５の隣にある水洗槽１１ｉの１．力に一
体に横移動させ、そこて一体にｙ１隆させることにより
ウェハを水洗槽Ｉ６に浸漬して引け（第３図）、史に、
その隣りの薬液洗槽１７．１：に横移動させて’ｙｌ砕
し、次にその隣りの水洗槽１８−１−に横移動させて昇
降し、かくして洗浄を行うことかてきる。そして、最終
の水洗槽１８から引］−けたらその隣りの積み卸し室１
９に横移動して積み卸しを行う。この実施例では積み卸
し室１９の底には前述の台１５と回様なブツシャ１４’
伺きの台５′かあり、その台１５′１−に回しギ、＼・
リア形の補助、１４１：ｌか位置決めして置いである。In addition, a large number of wafers should be placed in support grooves II and I+ with both edges of the maximum diameter facing the pair of guide arms, and with the lower side edges narrower than the support grooves facing each other with the pair of chuck arms. Since it is inserted into the support groove 12.12 and sandwiched between the arms, it is held in a line with a predetermined gap maintained in the front and back direction. Therefore,
After that, as shown in No. 414, vs. 0) kite arm and chi\・
・Place the pick arm in 1 of the washing tank 11i next to the stand 15. The wafer is immersed in the washing tank I6 by moving the wafer horizontally and raising the y1 (Fig. 3).
It can be moved laterally to the adjacent chemical washing tank 17.1 for crushing, and then moved laterally to the adjacent water washing tank 18-1 and raised and lowered, thereby cleaning. Then, the loading and unloading room 1 next to the final washing tank 18 is removed.
Move laterally to 9 and perform loading and unloading. In this embodiment, the bottom of the loading/unloading room 19 is provided with the aforementioned platform 15 and a rotary button 14'.
There is a waiting stand 5', and there is a turning gear on that stand 15'1-.
Rear type auxiliary, 141:l is positioned and placed.

ウェハな台！５′」−の補助具１ｕｌｌ：に植み卸ずに
は＋ｉｉｊ述の掴み１−け操作とは逆にブ・ソシャ！４
′　を最−１゜シ１させて置き、対のガイド腕と、チャ
ック腕の一体−ド降てウェハの下縁がブツシャ＋４’の
−Ｌ面に当接したときに、その下降を停め、それからチ
ャック腕の対を離反方向に移動させ、次いてブツシャ１
４′及び対のガイド腕とチャック腕を回速て一緒に下降
させ、ガイド腕か補助共の左右支持壁の−１−面に近接
したら対のガイド腕とチャック腕の下降を停め、その後
はブツシャ１４′の下降でウェハを補助具１３の支持溝
の対て前後方向に一列に立て並べて収容するのである。A wafer table! 5'" - without planting the auxiliary tool 1ull:, contrary to the grasping and 1-key operation described in +iiij! 4
' is set at the maximum -1 degree, and when the lower edge of the lower edge of the wafer lowered by the pair of guide arms and the chuck arm comes into contact with the -L surface of the pusher +4', the lowering is stopped. Then, move the pair of chuck arms in the direction of separation, and then
4' and the pair of guide arms and chuck arms are rotated and lowered together, and when they approach the -1- plane of the left and right support walls of either the guide arm or the auxiliary, the pair of guide arms and chuck arm stop descending, and then By lowering the busher 14', the wafers are housed in a line in the support groove of the auxiliary tool 13 in the front-rear direction.

従って、積み卸しの場合もウェハに傷を付けることかな
い。Therefore, the wafers are not damaged during loading and unloading.

フッシャ１４．１４’　と、対のガイド腕の間でのウェ
ハの受は渡しを確実にするためブツシャの−１，而にも
支持溝ｌｌや１２と回し前後方向の間隙を保った支持溝
を１没け、ウェハのド縁部を入れるようにするとよい。To ensure the transfer of the wafer between the busher 14, 14' and the pair of guide arms, use support grooves 14, 14 and 12 of the busher to maintain a gap in the longitudinal direction. It is best to submerge the wafer once and insert the edge of the wafer.

尚、ブ・ンシャ１４．１４’は１１行に１１１１後方向
に延びる２未完で構成しであるが、中央に一本あるだけ
でもよい。Incidentally, the button 14, 14' is composed of 11 rows of 1111 and 2 unfinished lines extending backward, but it may be sufficient to have only one line in the center.

そして、ウェハを積み卸した対のガイド腕と、チャック
腕はＩ（み−Ｌげるための補助具を置く台１５−ヒに横
移動させて戻し、次のウニへ群の洗浄を繰返して行う。Then, the pair of guide arms and the chuck arm that loaded and unloaded the wafers are moved laterally back to the table 15-A on which the auxiliary tools for loading and unloading the wafers are placed, and the group cleaning is repeated for the next group of sea urchins. conduct.

さて、対のガイド腕とチャック腕を一体として左右方向
に往復移動させるため、＋”ｈｉ述の台１５を有する室
の壁と、禎み卸し室１９の壁の間には第４図に示すよう
に横行用のねじ軸２０と、ガイド杆２１が木モに渡設し
てあり、上記ガイド杆２１に誘導されて横行する横行台
２２のナツト２３に上記ねじ軸２０を螺合する。従ろて
、横行用のねし軸２０をモータＭ１なとて正逆に回転す
ることにより横行台２２は左又は右に水平に移動する。Now, in order to reciprocate the pair of guide arms and chuck arms in the left-right direction as a unit, there is a space between the wall of the chamber containing the table 15 mentioned above and the wall of the unloading chamber 19 as shown in FIG. As shown, a screw shaft 20 for traversing and a guide rod 21 are provided across the wooden frame, and the screw shaft 20 is screwed into a nut 23 of a traverse table 22 that is guided by the guide rod 21 and traverses. By rotating the traversing shaft 20 in forward and reverse directions using the motor M1, the traversing table 22 is horizontally moved to the left or right.

上記横行台２２は前面に上下方向に細長い中空の支柱２
４を固定し、この支柱２４の前面には対のガイド腕と、
チャック腕を一体として昇降させるための昇降台２５を
上下方向に可動に取付けている。支柱２４は第６図に示
すように前面に昇降台を上下方向にガイドする鳩尾溝か
らなるガイド２６と、中空な内部に垂直に設けられた昇
降用のねじ軸２７を有し、昇降台２５は上記ガイド２６
に滑合した係合部２８と、支柱の内部に突入し、ねし軸
２７に螺合したナツト２９を備えている（第５図）。従
って、ねし軸２７をモータＭ２なとて正逆に回転するこ
とにより昇降台２５は支柱２４の前面に沿って上又はド
に移動する。The above-mentioned transverse table 22 has a vertically elongated hollow column 2 on the front side.
4 is fixed, and a pair of guide arms are attached to the front of this support 24,
A lifting platform 25 for raising and lowering the chuck arm as a unit is attached to be movable in the vertical direction. As shown in FIG. 6, the column 24 has a dovetail groove guide 26 on the front surface that guides the lifting platform in the vertical direction, and a screw shaft 27 for lifting vertically provided inside the hollow interior. is the above guide 26
It is provided with an engaging portion 28 that is slidably engaged with the column, and a nut 29 that protrudes into the interior of the support column and is screwed onto the threaded shaft 27 (Fig. 5). Therefore, by rotating the screw shaft 27 in forward and reverse directions using the motor M2, the lifting platform 25 moves upward or downward along the front surface of the support column 24.

前述した対のガイド腕と、チャック腕を取付けた支持口
・ンドの対ｔｔ’　、　＋ｔ’　と、＋２’　、　＋２
’の後端は、この昇降台２５に取付けてもよいが、この
実施例ではウェハを液槽に浸漬したり、侵漬後に引上げ
る際、対のガイド腕とチャック腕を水平にして置くより
は第７図に示すように前」ニリ又は前丁りに傾け、ウェ
ハの全体を垂直に対し揃って前傾姿勢又は後傾姿勢にし
て置くほうが、ウェハの損傷が少ないとか、液の水切り
かよい等の利点かあるので、この実施例では昇降台２５
の前面に水平な枢軸３０′で揺動可能に設けた支持板３
０に前記支持ロッドの対１１’　、　１１’　と１２’
　、　１２’の後端を取付けである。The aforementioned pair of guide arms and the pair of support ports/ends to which the chuck arms are attached tt', +t', +2', +2
' The rear end of the wafer may be attached to this lifting table 25, but in this embodiment, when the wafer is immersed in a liquid bath or pulled up after immersion, it is preferable to keep the paired guide arm and chuck arm horizontally. As shown in Figure 7, it is better to tilt the wafer forward or backward, and to place the entire wafer in a forward or backward tilted position with respect to the vertical direction. In this embodiment, the lifting platform 25 has advantages such as
A support plate 3 swingably provided on the front surface of the
0 to the pairs of support rods 11', 11' and 12'
, the rear end of 12' is attached.

支持板３０と昇降台２５の間には、支持板３０を前に押
し垂直に対して傾ける小形のエアシリンダ３１と、該シ
リンダの非作動時に支持板を牽引して垂直に保つリター
ンバネ３２が設けである。Between the support plate 30 and the lifting platform 25, there is a small air cylinder 31 that pushes the support plate 30 forward and tilts it vertically, and a return spring 32 that pulls the support plate and keeps it vertical when the cylinder is not in operation. It is a provision.

支持板３０の前面には第４１．Ａに示すようにガイド杆
コ３を木ｆに設け、このガイド杆３３に対して支持ロフ
トの対１１’　、　１１’　と、　１２’　、　１２’
の後端を固着した取付片３４．３／Ｉと、：１５．　：
１５か取付けである。The front surface of the support plate 30 has a 41st. As shown in A, a guide rod 3 is provided on a tree f, and supporting loft pairs 11', 11' and 12', 12' are attached to this guide rod 33.
a mounting piece 34.3/I to which the rear end is fixed; and: 15. :
15 or installation.

そして、ガイド腕１１ａ　、　ｌｌｂ　、ひいては取付
片３４、３４の間隔の中央線ＣＬ」−に位置して支持板
３０にはモータて１逆に回転させられるピニオンＩか取
付けてあり、チャック腕１２ａ　、　１２ｂを取付けた
取付片３５．３５は上端に互いの方向に向かってラック
３７．３７を固定し、前記ピニオン３６に対して一方の
ラックは−Ｌから、他方のラックは下から夫々下から噛
合う。従って、ピニオン３６をモータＭ３により正逆に
回転することで、該ピニオンに上と下から噛合ったラッ
ク３７．３７により対のチャック腕＋２ａ　、　１２ｂ
はガイド杆３３て導かれ、ガイド腕の対の間隔の中央線
ＣＬに関し！ｆいに接近、離反方向に移動し、既に述べ
た様に前後方向に一列に立ち並んだウェハの全体を挟ん
だり、Ｓｔ、、たりする。A pinion I, which is rotated in the opposite direction by a motor, is attached to the support plate 30 at a center line CL'' between the guide arms 11a and 11b, and furthermore, between the mounting pieces 34 and 34. The mounting pieces 35, 35 to which 12b are attached fix racks 37, 37 toward each other at the upper end, and one rack is engaged from below with respect to the pinion 36, and the other rack is engaged from below. Fit. Therefore, by rotating the pinion 36 forward and backward by the motor M3, the pair of chuck arms +2a and 12b are rotated by the racks 37 and 37 that are engaged with the pinion from above and below.
is guided by the guide rod 33 and is related to the center line CL of the spacing between the pairs of guide arms! The wafers move toward each other and move away from each other, and as described above, they pinch the entire wafers that are lined up in a row in the front-rear direction.

前述した様にウェハは直径が４インチのもの、５インチ
のもの、６インチのもの等、数種類がある。そのどのウ
ェハをも挟めるようにするにはチャック腕＋２ａ　、　
＋２ｂの対を離反方向に移動させて最大に開いた場合、
その間隔か最大径のウェハよりも大になるように定めて
置けばよい。これに対してガイド腕１１ａ　、　ｌｌｂ
の対の間隔はウェハの直径が相違するごとに、その直径
に合わせて変化させることが必要である。これに対応す
るため、ガイド腕の対を取付けた取付片３４．３４をガ
イｌく杆３３沿いに移動可能とし、その間隔の中央線Ｃ
Ｌに関してこの取付片３４と３４を手動で接近１ｇＩ反
方向に移動させることにより間隔をウェハの直径に合わ
せ、例えば押ねして各取付片３４をガイド杆３３に対し
調節可能に固定してもよいが、この実施例ては第４図に
示すようにガイド杆３３の下方に、これとｆ行に右ねし
と左ねしを有するターンバックルコ８を軸支し、その看
ねしと左ねしの境３８′を中央線ＣＬに合わせ、一方の
取付片３４はナツト３４′てターンバックルの一方のね
じに螺合し、他方の取刺片は逆ねしのナツト３４゛　て
ターンバックルの他力のねしに螺合する。従って、ター
ンバックル３８をモータ閘、などでｉｌ：逆に回転する
と対のガイド腕１１ａ　、　Ｉｌｂもその間隔のｌｉｔ
史線ＣＬに関しガイド杆３３沿いに接近１ｇ１反方向に
移動し、間隔の広さをウェハの直径に合わせることかで
きる。As mentioned above, there are several types of wafers, including those with a diameter of 4 inches, 5 inches, and 6 inches. To be able to pinch any wafer, chuck arm +2a,
When the +2b pair is moved in the direction of separation and opened to the maximum,
It is sufficient to set the distance so that it is larger than the maximum diameter of the wafer. On the other hand, the guide arms 11a, llb
It is necessary to change the distance between the pairs of wafers depending on the diameter of the wafer. In order to cope with this, the mounting pieces 34 and 34 to which the pair of guide arms are attached are made movable along the rod 33, and the center line C of the interval between them is made movable.
The spacing can be adjusted to the diameter of the wafer by manually moving the mounting pieces 34 1gI in the opposite direction with respect to L, and each mounting piece 34 can be adjustably fixed to the guide rod 33 by, for example, pressing. However, in this embodiment, as shown in FIG. 4, below the guide rod 33, a turn buckle 8 having right-handed and left-handed screws is pivotally supported in the row f. Align the left-handed border 38' with the center line CL, screw one mounting piece 34 into one screw of the turnbuckle with the nut 34', and turn the other mounting piece with the reverse-handed nut 34'. Screw into the external thread of the buckle. Therefore, when the turnbuckle 38 is rotated in the opposite direction using a motor lock, etc., the pair of guide arms 11a and 11b also have the same distance.
With respect to the history line CL, it is possible to move in the opposite direction of approach 1g1 along the guide rod 33, and adjust the width of the interval to the diameter of the wafer.

前述のモータ閘、で横行用ねし軸２０を一方向に回転し
、掴み」−げ位置ないし台１５１：の補助具１３から掴
みにげたウェハを隣りの水洗槽１６上に移動させること
、そこての浸漬、引りげの後に更に隣りの薬液洗槽１７
１−に移動させること、かくして順次に桔み卸し室１９
の台１５′−１−に移動させ、その後、ねし輔を逆方向
に回転して対のガイド腕と、チャック腕を掴みＦげ位置
に戻すことばロータリエンコーダ（図示せず）で精密に
制御てきる。同様にモータＭ２での正逆回転によりＲ降
用ねじ軸２７で対のガイド腕と、チャック腕を操作し、
台１５上の補助具からウェハな掴み上げたり、台１５′
１−の補助共にウェハを積み卸したり、各液槽にウェハ
を浸ン青して引ＪＡ−ｆることも、ロータリエンコーダ
など′て精密に制御することかてきる。更に、モータＭ
３でビニオン３６を回転して対のチャック腕１２ａ。The above-mentioned motor lock rotates the traversing shaft 20 in one direction, and moves the wafer picked up from the auxiliary tool 13 at the pick-up position or table 151 onto the adjacent washing tank 16. After the immersion and removal, the adjacent chemical cleaning tank 17
1-, thus sequentially moving to the unloading chamber 19.
Then, the screw is rotated in the opposite direction to grasp the pair of guide arms and the chuck arm and returned to the F position under precise control using a rotary encoder (not shown). I'll come. Similarly, the pair of guide arms and the chuck arm are operated by the R lowering screw shaft 27 by forward and reverse rotation by the motor M2,
You can pick up the wafer from the auxiliary tool on the table 15, or use the auxiliary tool on the table 15'
Loading and unloading of wafers and dipping and pulling wafers into each liquid tank can be precisely controlled using a rotary encoder or the like. Furthermore, motor M
3, rotate the pinion 36 to rotate the pair of chuck arms 12a.

＋２ｂを離反方向に最大に開き、次いてウェハの直径に
応し接近方向に移動させてウェハを挟むこと、又、モー
タＭ４でターンバックル３８を正逆に回転し、対のガイ
ド腕１１ａ　、　Ｉｌｂの間隔を、その中央線ＣＬに関
してウェハの直径に合わせることもロータリエンコーダ
などで精密に制御できる。+2b to the maximum in the separating direction, and then moving it in the approaching direction according to the diameter of the wafer to sandwich the wafer, and rotating the turnbuckle 38 in forward and reverse directions with the motor M4 to open the pair of guide arms 11a and Ilb. It is also possible to precisely control the distance between the center lines CL and the diameter of the wafer using a rotary encoder or the like.

そして、各液槽１６．１７．１８にウェハを浸漬して引
上げる間、或いは台＋５−Ｉｌの補助具からウェハを掴
みＬげたあと台１５′上の補助具に積み卸すまでの間、
バネ３２に抗しエアシリンダＪ１て支持板３０を垂直に
対して傾け（第７図）、これにより対のガイド腕とチャ
ック腕を前上り又は前下りに傾斜させ、掴んでいるウェ
ハの全体を強制的に垂直に対し同一方向に傾け、相互に
前後のウェハかＩｊいの方向に勝手に傾いて上縁同志か
ぶつかり合い、破損するのを防止できると共に、液槽か
ら引１−げろ際に各ウェハに付着した液を迅速に滴下し
て液槽に戻し、液の付着を少なくすると同時に、液槽か
らの液の持出しをＩｑ及防ぐことかできる。Then, while the wafer is immersed in each liquid tank 16, 17, 18 and pulled up, or after the wafer is grabbed from the auxiliary tool on table +5-Il and lifted up, it is unloaded onto the auxiliary device on table 15'.
The support plate 30 is tilted vertically by the air cylinder J1 against the spring 32 (FIG. 7), thereby tilting the pair of guide arms and chuck arms forwardly upward or downwardly, and the entire wafer being gripped is tilted. By forcibly tilting the wafers in the same direction with respect to the vertical, it is possible to prevent the front and rear wafers from tilting in the opposite direction and colliding with each other at their upper edges, causing damage. The liquid adhering to each wafer is quickly dropped and returned to the liquid tank, thereby reducing adhesion of the liquid and at the same time preventing the liquid from being carried out from the liquid tank.

この実施例では支持板３０は枢軸３０′で］−縁を昇降
台２５に対し枢着されているためエアシリンダ３１の作
動て対のガイド腕とチＶツク腕は前上りに傾斜するか、
枢軸３０′でド縁をｙ１降台に枢着し、エアシリンダ３
１て支持板３０の−１一方を前に押し、対のカイト腕と
チャック腕を前下りに＃１斜させるようにしてもよい。In this embodiment, the support plate 30 is pivoted at its edge to the lifting platform 25 by a pivot 30', so that when the air cylinder 31 is actuated, the pair of guide arms and the chimney arm are tilted forward and upward.
Pivotally connect the door edge to the y1 descending platform with the pivot 30', and connect the air cylinder 3
1, one side of the support plate 30 may be pushed forward to tilt the pair of kite arms and chuck arms forward and downward.

更に、対のチャック腕を取引けた各取付片３５の途中に
、対のガイ１〜腕の間隔をウェハの直径の変化に対応し
て調節するだめのターンバックル３８を図示の如く摺動
１１丁能に貫通させることによりターンバックルを取付
）’Ｈ”３５．３５の接近、離反用のガイドに兼用でき
る。Furthermore, in the middle of each mounting piece 35 that connects the pair of chuck arms, there are 11 sliding turnbuckles 38 as shown in the figure for adjusting the distance between the pair of guys 1 and arms in response to changes in the diameter of the wafer. It can also be used as a guide for approaching and leaving a turnbuckle (by penetrating it)'H"35.35.

〈発明の効果〉 未発１９１によれば対のガイド腕と、対のチャック腕の
四点接触て、多数枚のウェハを殆ど露出状ＴＥて前後方
向に間隙を保って一列に把持し、液槽に浸漬して洗浄を
行う。従って、液はウェハに接触して良好に流れるため
、洗ｔ’ｔ＋効果は大で、浸漬時間は短縮し、［１つ洗
浄液の流量も少なくて済む。<Effects of the Invention> According to No. 191, a pair of guide arms and a pair of chuck arms are in contact at four points, and a large number of wafers are gripped in a line with a gap in the front and rear direction with almost exposed TE, and the liquid is Clean by immersing in a tank. Therefore, since the liquid contacts the wafer and flows well, the cleaning effect is large, the immersion time is shortened, and the flow rate of the cleaning liquid is also reduced.

更に、キャリアを液槽に浸漬しないのて、キＸ・リアに
よる液の汚染かない分、液の自効寿命か延び、経済的で
ある。Furthermore, since the carrier is not immersed in the liquid tank, the self-effective life of the liquid is extended since there is no contamination of the liquid by x-rea, which is economical.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図と第２図は本発明のハンＩ＜リンク装置の一実施
例によるウェハを掴み１裏ｆる順序を示す動作説明図、
第３図は同じくウェハを液槽に浸漬して引上げる動作説
明図、第４図は同上のハントリンク装置を使用した洗浄
装置の全体の概略図、第５図は第４図のハントリンク装
置の支持機構の側面図、第６図は第５図のＶｌ−ＶＩ線
での断面図、第７図はウェハを東直に対し傾けて液槽に
浸漬している状ｆＥの側面図、第８図は従来のウェハ洗
ｎ１用キャリアの斜視図、第９図は同上のキャリアにウ
ェハを立て並べた状ＩＥを示す断面図である。 図中、ｌｌａ　、　ｌｌｂはカイト腕、１１は対の支持
溝、！２ａ　、　１２はチャック腕、１２は対の支持溝
を示す。 第Ｃ図1 and 2 are operation explanatory diagrams showing the order in which a wafer is grabbed and turned back by an embodiment of the handle link device of the present invention;
Fig. 3 is an explanatory diagram of the operation of immersing a wafer in a liquid bath and pulling it up, Fig. 4 is a schematic diagram of the entire cleaning device using the same Hunt Link device as above, and Fig. 5 is the Hunt Link device of Fig. 4. 6 is a cross-sectional view taken along the line Vl-VI in FIG. FIG. 8 is a perspective view of a conventional carrier for wafer washing n1, and FIG. 9 is a cross-sectional view showing a state IE in which wafers are arranged vertically on the same carrier. In the figure, lla and llb are kite arms, 11 is a pair of support grooves, and ! 2a, 12 is a chuck arm, and 12 is a pair of support grooves. Figure C

Claims (1)

【特許請求の範囲】[Claims] 相対向した一対の前後方向に延びるガイド腕と、上記ガ
イド腕の対の下方で、該ガイド腕と平行に前後方向に延
びる相対向した一対のチャック腕とを備え、上記ガイド
腕の対は相対向した面に、前後方向に所定の間隙を保っ
て洗浄すべきウェハの両側縁を受入れる多数対の支持溝
を有し、上記チャック腕の対は、ガイド腕の対の間隔の
中央線に関して相互に同量宛接近、離反方向に移動可能
であると共に、上記ガイド腕の対と、チャック腕の対は
上下方向と、左右方向に一体として往復動可能であるこ
とを特徴とするウェハ洗浄用のウェハハンドリング装置
。A pair of opposing guide arms extending in the front-rear direction; and a pair of opposing chuck arms extending parallel to the guide arms in the front-rear direction below the pair of guide arms, and the pair of guide arms are opposite to each other. A plurality of pairs of support grooves are provided on opposing surfaces of the wafer to receive both side edges of the wafer to be cleaned with a predetermined gap in the front and back direction, and the pair of chuck arms are mutually disposed with respect to the center line of the gap between the pair of guide arms. A cleaning device for wafer cleaning, characterized in that the pair of guide arms and the pair of chuck arms can be reciprocated as a unit in the vertical and horizontal directions. Wafer handling equipment.