JPH0288267U - - Google Patents
Info
- Publication number
- JPH0288267U JPH0288267U JP16879088U JP16879088U JPH0288267U JP H0288267 U JPH0288267 U JP H0288267U JP 16879088 U JP16879088 U JP 16879088U JP 16879088 U JP16879088 U JP 16879088U JP H0288267 U JPH0288267 U JP H0288267U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- sub
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例の印刷配線板の平面
図、第２図はその要部拡大図、第３図及び第４図
は第２、第３の実施例の各々の要部拡大図、第５
図ａ，ｂは従来の配線基板の平面図及び側面図、
第６図は従来の印刷配線板の要部拡大図、第７図
は他の従来の説明図である。
１……印刷配線板、２……導体パターン、３…
…半田ランド、３ａ……ランドパターン、４……
主スルーホール、５……副スルーホール、６……
外形線、７……重合部。
Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is an enlarged view of its main parts, and Figs. 3 and 4 are enlarged views of main parts of each of the second and third embodiments. Figure, 5th
Figures a and b are a plan view and a side view of a conventional wiring board,
FIG. 6 is an enlarged view of the main parts of a conventional printed wiring board, and FIG. 7 is an explanatory diagram of another conventional printed wiring board. 1...Printed wiring board, 2...Conductor pattern, 3...
...Solder land, 3a...Land pattern, 4...
Main through hole, 5... Sub-through hole, 6...
Outline, 7... Overlapping part.
Claims (1)
ーンを形成し、かつ外周部に外部接続用の半田ラ
ンドを有する印刷配線板において、 該半田ランド内に、主スルーホールと副スルー
ホールとから成る一対のスルーホールを設け、か
つ副スルーホール部が仕上がり外形線上に設けら
れていることを特徴とする印刷配線板。[Scope of Claim for Utility Model Registration] A printed wiring board in which a desired circuit pattern is formed on an insulating base material made of a laminate, and has a solder land for external connection on the outer periphery, A printed wiring board characterized in that a pair of through holes consisting of a through hole and a sub-through hole are provided, and the sub-through hole portion is provided on the finished outline line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16879088U JPH0737329Y2 (en) | 1988-12-27 | 1988-12-27 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16879088U JPH0737329Y2 (en) | 1988-12-27 | 1988-12-27 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0288267U true JPH0288267U (en) | 1990-07-12 |
| JPH0737329Y2 JPH0737329Y2 (en) | 1995-08-23 |
Family
ID=31458278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16879088U Expired - Lifetime JPH0737329Y2 (en) | 1988-12-27 | 1988-12-27 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737329Y2 (en) |
-
1988
- 1988-12-27 JP JP16879088U patent/JPH0737329Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0737329Y2 (en) | 1995-08-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |