JPH0287531U - - Google Patents
Info
- Publication number
- JPH0287531U JPH0287531U JP16379388U JP16379388U JPH0287531U JP H0287531 U JPH0287531 U JP H0287531U JP 16379388 U JP16379388 U JP 16379388U JP 16379388 U JP16379388 U JP 16379388U JP H0287531 U JPH0287531 U JP H0287531U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punch
- die
- forming apparatus
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920001875 Ebonite Polymers 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Wire Processing (AREA)
Description
第１図は本考案の一実施例を示すリード成形装
置の斜視図、第２図イ，ロ及び第３図はそれぞれ
同実施例のリード成形装置を用いたリード成形を
示す説明図であり、第２図イと第２図ロはそれぞ
れリード成形前とリード成形後の正面図、第３図
はリード成形後の要部拡大図を示し、第４図は他
の実施例にかかるリード成形装置の要部拡大図、
第５図は従来のリード成形装置の斜視図、第６図
は従来のリード成形装置の正面図である。
２…樹脂モールドパツケージ、３…リード、４
…ダイ、９…リード押え、１０…パンチ。
FIG. 1 is a perspective view of a lead forming device showing an embodiment of the present invention, and FIGS. 2A, 2B, and 3 are explanatory diagrams showing lead forming using the lead forming device of the same embodiment, respectively. Figures 2A and 2B are front views before and after lead forming, respectively, Figure 3 is an enlarged view of the main parts after lead forming, and Figure 4 is a lead forming apparatus according to another embodiment. Enlarged view of the main parts of
FIG. 5 is a perspective view of a conventional lead forming device, and FIG. 6 is a front view of the conventional lead forming device. 2...Resin mold package, 3...Lead, 4
...Die, 9...Lead presser, 10...Punch.
Claims (1)
基部下面を支持するダイと、各リード基部上面を
押圧するリード押えと、該リード押えの外側に配
置され上下動自在して上記リードを押圧折曲する
パンチとを具備するリード成形装置において、 上記パンチの少なくともリード押圧部を硬質ゴ
ムにて構成したことを特徴とするリード成形装置
。[Claims for Utility Model Registration] A die that supports the lower surface of the base of the lead led out from the resin mold package, a lead holder that presses the upper surface of each lead base, and a die that is arranged outside the lead holder and is movable up and down to support the lead. A lead forming apparatus comprising: a punch for pressing and bending a lead forming apparatus, characterized in that at least a lead pressing part of the punch is made of hard rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16379388U JPH0287531U (en) | 1988-12-16 | 1988-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16379388U JPH0287531U (en) | 1988-12-16 | 1988-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287531U true JPH0287531U (en) | 1990-07-11 |
Family
ID=31448835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16379388U Pending JPH0287531U (en) | 1988-12-16 | 1988-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287531U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010120045A (en) * | 2008-11-19 | 2010-06-03 | Suncall Corp | Device for manufacturing press molded article and method for manufacturing the same |
-
1988
- 1988-12-16 JP JP16379388U patent/JPH0287531U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010120045A (en) * | 2008-11-19 | 2010-06-03 | Suncall Corp | Device for manufacturing press molded article and method for manufacturing the same |
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