JPH0282313U - - Google Patents
Info
- Publication number
- JPH0282313U JPH0282313U JP16288888U JP16288888U JPH0282313U JP H0282313 U JPH0282313 U JP H0282313U JP 16288888 U JP16288888 U JP 16288888U JP 16288888 U JP16288888 U JP 16288888U JP H0282313 U JPH0282313 U JP H0282313U
- Authority
- JP
- Japan
- Prior art keywords
- delay material
- matching layer
- flexible
- curved
- internal delay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
第１図は本考案センサの一実施例の構成を示す
断面図、第２図は本考案センサの表面デイレイ材
の異なる形状を示す外観図である。
１……表面デイレイ材、１ａ……曲面、２……
接着剤、３……整合層、４……接着剤、５……圧
電素子、６……絶縁材、７……電磁シールド材、
８……保護材、９……内部デイレイ材、１０……
本考案センサ。
FIG. 1 is a cross-sectional view showing the configuration of an embodiment of the sensor of the present invention, and FIG. 2 is an external view showing different shapes of the surface delay material of the sensor of the present invention. 1...Surface delay material, 1a...Curved surface, 2...
Adhesive, 3... Matching layer, 4... Adhesive, 5... Piezoelectric element, 6... Insulating material, 7... Electromagnetic shielding material,
8...Protective material, 9...Internal delay material, 10...
This invented sensor.
Claims (1)
合層３を設け、この整合層３に軟質の内部デイレ
イ材９を接合し、この内部デイレイ材９の表面に
、曲面１ａを有する可撓性の表面デイレイ材１を
接合せしめてなる主体用超音波センサ。 A matching layer 3 is provided on one surface of a flexible and curved piezoelectric element 5, a soft internal delay material 9 is bonded to this matching layer 3, and the surface of this internal delay material 9 has a curved surface 1a. An ultrasonic sensor for a main body formed by bonding a flexible surface delay material 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16288888U JPH0282313U (en) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16288888U JPH0282313U (en) | 1988-12-14 | 1988-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282313U true JPH0282313U (en) | 1990-06-26 |
Family
ID=31699599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16288888U Pending JPH0282313U (en) | 1988-12-14 | 1988-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282313U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002136515A (en) * | 2000-08-24 | 2002-05-14 | Seiko Instruments Inc | Ultrasonic sensor, manufacturing method for ultrasonic sensor, and ultrasonic diagnosing device using ultrasonic sensor |
-
1988
- 1988-12-14 JP JP16288888U patent/JPH0282313U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002136515A (en) * | 2000-08-24 | 2002-05-14 | Seiko Instruments Inc | Ultrasonic sensor, manufacturing method for ultrasonic sensor, and ultrasonic diagnosing device using ultrasonic sensor |