JPH0282026U - - Google Patents

Info

Publication number
JPH0282026U
JPH0282026U JP16207888U JP16207888U JPH0282026U JP H0282026 U JPH0282026 U JP H0282026U JP 16207888 U JP16207888 U JP 16207888U JP 16207888 U JP16207888 U JP 16207888U JP H0282026 U JPH0282026 U JP H0282026U
Authority
JP
Japan
Prior art keywords
exposure
post
projection exposure
projection
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16207888U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16207888U priority Critical patent/JPH0282026U/ja
Publication of JPH0282026U publication Critical patent/JPH0282026U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の実施例1を示す装置構成図、
第2図は本考案の実施例2を示す装置構成図であ
る。 1……被処理ウエーハ、2……投影露光部、3
……焼きしめ部、4……ウエーハ搬送部、5……
ローダー側カセツト、6……レシーバー側カセツ
ト、7……ウエーハの動き、8……焼きしめ部内
ウエーハ搬送機構、9……排気ダクト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置の製造のフオトリン工程で用いられ
    る投影露光装置において、露光後ベーク処理を行
    う焼きしめ部を投影露光部に隣接して有し、露光
    処理終了時点から露光後ベーク処理開始までの時
    間を一定時間にして搬送し露光処理から露光後ベ
    ーク処理を連続して行うことを特徴とする投影露
    光装置。
JP16207888U 1988-12-14 1988-12-14 Pending JPH0282026U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16207888U JPH0282026U (ja) 1988-12-14 1988-12-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16207888U JPH0282026U (ja) 1988-12-14 1988-12-14

Publications (1)

Publication Number Publication Date
JPH0282026U true JPH0282026U (ja) 1990-06-25

Family

ID=31445582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16207888U Pending JPH0282026U (ja) 1988-12-14 1988-12-14

Country Status (1)

Country Link
JP (1) JPH0282026U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060115B2 (en) 2000-07-24 2006-06-13 Tokyo Electron Limited Substrate processing method, substrate processing apparatus and substrate carrying method
JP2008147315A (ja) * 2006-12-07 2008-06-26 Canon Inc 露光装置、露光・現像システム及びデバイス製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060115B2 (en) 2000-07-24 2006-06-13 Tokyo Electron Limited Substrate processing method, substrate processing apparatus and substrate carrying method
JP2008147315A (ja) * 2006-12-07 2008-06-26 Canon Inc 露光装置、露光・現像システム及びデバイス製造方法

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