JPH0279026U - - Google Patents
Info
- Publication number
- JPH0279026U JPH0279026U JP15897788U JP15897788U JPH0279026U JP H0279026 U JPH0279026 U JP H0279026U JP 15897788 U JP15897788 U JP 15897788U JP 15897788 U JP15897788 U JP 15897788U JP H0279026 U JPH0279026 U JP H0279026U
- Authority
- JP
- Japan
- Prior art keywords
- equipment
- supply means
- resist
- transporting
- clean room
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 238000001020 plasma etching Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Description
図は、本考案の半導体製造装置の一実施例を示
す図である。
１Ａ……供給部、１Ｂ……取り出し部、２……
半導体ウエーハ、３……レジスト硬化処理室、４
……プラズマエツチング処理室、Ｖ１，Ｖ２……
搬送コンベア、Ｖ３……搬送ベルト、Ａ１，Ａ２
……出し入れアーム。
The figure shows an embodiment of the semiconductor manufacturing apparatus of the present invention. 1A... Supply section, 1B... Take-out section, 2...
Semiconductor wafer, 3...Resist hardening processing chamber, 4
……Plasma etching processing chamber, V 1 , V 2 ……
Conveyor conveyor, V 3 ... Conveyor belt, A 1 , A 2
...Put-in/take-out arm.
Claims (1)
チング処理する半導体製造装置において、 同一クリーンルーム内にレジスト硬化処理装置
とエツチング装置を隣接して設け、このレジスト
硬化処理装置とエツチング処理装置の前方に前記
半導体ウエーハを前記各処理室に搬出入する第１
及び第２の供給手段を設け、この第１及び第２の
供給手段間に前記レジスト硬化処理された前記半
導体ウエーハを前記第２の供給手段に搬送する搬
送手段を設けたことを特徴とする半導体製造装置
。[Claims for Utility Model Registration] In semiconductor manufacturing equipment that etches resist-hardened semiconductor wafers, a resist hardening equipment and an etching equipment are installed adjacent to each other in the same clean room, and the resist hardening equipment and the etching equipment are provided adjacently in the same clean room. A first section for transporting the semiconductor wafers into and out of each of the processing chambers in front of the
and a second supply means, and a transport means for transporting the semiconductor wafer subjected to the resist hardening treatment to the second supply means is provided between the first and second supply means. Manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15897788U JPH0279026U (en) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15897788U JPH0279026U (en) | 1988-12-08 | 1988-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279026U true JPH0279026U (en) | 1990-06-18 |
Family
ID=31439782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15897788U Pending JPH0279026U (en) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279026U (en) |
-
1988
- 1988-12-08 JP JP15897788U patent/JPH0279026U/ja active Pending
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