JPH0276845U - - Google Patents

Info

Publication number
JPH0276845U
JPH0276845U JP15670388U JP15670388U JPH0276845U JP H0276845 U JPH0276845 U JP H0276845U JP 15670388 U JP15670388 U JP 15670388U JP 15670388 U JP15670388 U JP 15670388U JP H0276845 U JPH0276845 U JP H0276845U
Authority
JP
Japan
Prior art keywords
locking
semiconductor element
chassis
inner edge
flat part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15670388U
Other languages
Japanese (ja)
Other versions
JPH0621252Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15670388U priority Critical patent/JPH0621252Y2/en
Publication of JPH0276845U publication Critical patent/JPH0276845U/ja
Application granted granted Critical
Publication of JPH0621252Y2 publication Critical patent/JPH0621252Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案実施例の斜視図、第2図aは本
考案による半導体素子の取付状態を示す正面図、
bはそのA−A断面図である。 1:プリント配線基板、2:シヤーシ、4,4
a:係止穴、5,5a:棚板、10:固定金具、
11:平坦部、12〜12b:当接片、13,1
3a:係止片、14,14a:係止突起、15〜
15d:固定片、20〜20d:半導体素子、2
1:端子、22:絶縁板。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2a is a front view showing the mounting state of a semiconductor element according to the present invention,
b is its AA cross-sectional view. 1: Printed wiring board, 2: Chassis, 4,4
a: Locking hole, 5, 5a: Shelf board, 10: Fixing metal fittings,
11: Flat part, 12-12b: Contact piece, 13,1
3a: Locking piece, 14, 14a: Locking protrusion, 15~
15d: Fixed piece, 20-20d: Semiconductor element, 2
1: Terminal, 22: Insulating plate.

Claims (1)

【実用新案登録請求の範囲】 下縁から内側に延出された棚板を有する少なく
とも1個の係止穴を有し、半導体素子の端子が固
定されたプリント配線基板に固定され、絶縁板を
介して前記半導体素子の背面が当接される熱伝導
の良好な材料からなるシヤーシと、 平坦部と、該平坦部の内側縁部からこれと直交
して立設された複数の当接片と、前記平坦部の内
側縁部から内側に延出されたのち折返されその上
面に係止突起を有し前記シヤーシの係止穴に挿入
される係止片と、前記平坦部の外側縁部から前記
当接片と反対方向に延出されかつ内側に傾斜して
折曲げられた複数の固定片とをばね材によつて形
成した固定金具とを備えたことを特徴とする半導
体素子の取付装置。
[Claims for Utility Model Registration] The invention has at least one locking hole with a shelf extending inward from the lower edge, is fixed to a printed wiring board to which terminals of a semiconductor element are fixed, and has an insulating plate. a chassis made of a material with good thermal conductivity, with which the back surface of the semiconductor element is abutted; a flat part; and a plurality of contact pieces erected perpendicularly from the inner edge of the flat part; , a locking piece that extends inward from the inner edge of the flat portion, is folded back, has a locking protrusion on its upper surface, and is inserted into the locking hole of the chassis; A semiconductor device mounting device comprising: a fixing metal fitting made of a spring material, and a plurality of fixing pieces extending in a direction opposite to the contact piece and bent inwardly. .
JP15670388U 1988-12-02 1988-12-02 Semiconductor element mounting device Expired - Lifetime JPH0621252Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15670388U JPH0621252Y2 (en) 1988-12-02 1988-12-02 Semiconductor element mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15670388U JPH0621252Y2 (en) 1988-12-02 1988-12-02 Semiconductor element mounting device

Publications (2)

Publication Number Publication Date
JPH0276845U true JPH0276845U (en) 1990-06-13
JPH0621252Y2 JPH0621252Y2 (en) 1994-06-01

Family

ID=31435480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15670388U Expired - Lifetime JPH0621252Y2 (en) 1988-12-02 1988-12-02 Semiconductor element mounting device

Country Status (1)

Country Link
JP (1) JPH0621252Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004086501A1 (en) * 2003-03-25 2004-10-07 Toshiba Carrier Corporation Heat radiator
WO2019139305A1 (en) * 2018-01-10 2019-07-18 엘지이노텍 주식회사 Converter
CN115513073A (en) * 2022-11-23 2022-12-23 季华实验室 Power device heat dissipation structure and assembly method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4323305B2 (en) 2003-12-25 2009-09-02 アイシン精機株式会社 Fixing device
US20230232718A1 (en) * 2020-06-15 2023-07-20 Lg Innotek Co., Ltd. Thermoelectric module and power generation apparatus including the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004086501A1 (en) * 2003-03-25 2004-10-07 Toshiba Carrier Corporation Heat radiator
CN100373600C (en) * 2003-03-25 2008-03-05 东芝开利株式会社 Heat radiator
WO2019139305A1 (en) * 2018-01-10 2019-07-18 엘지이노텍 주식회사 Converter
CN115513073A (en) * 2022-11-23 2022-12-23 季华实验室 Power device heat dissipation structure and assembly method thereof
CN115513073B (en) * 2022-11-23 2023-03-07 季华实验室 Power device heat dissipation structure and assembly method thereof

Also Published As

Publication number Publication date
JPH0621252Y2 (en) 1994-06-01

Similar Documents

Publication Publication Date Title
JP2501638Y2 (en) Shield board for PCB mounting
JPH0276845U (en)
JPS6214675U (en)
JPH02119623U (en)
JPH0352965U (en)
JPH0482887U (en)
JPH0315483U (en)
JPH0330379U (en)
JPH0298674U (en)
JPS63131162U (en)
JPH01108968U (en)
JPS6322756U (en)
JPH0392363U (en)
JPH0218272U (en)
JPS6391183U (en)
JPS6344474U (en)
JPS6454268U (en)
JPH02138466U (en)
JPH0252471U (en)
JPH0459068U (en)
JPH01139497U (en)
JPH0431218U (en)
JPH0265353U (en)
JPH03104961U (en)
JPH02110371U (en)