JPH0270406A - Die heating and cooling temperature control device - Google Patents
Die heating and cooling temperature control deviceInfo
- Publication number
- JPH0270406A JPH0270406A JP22232788A JP22232788A JPH0270406A JP H0270406 A JPH0270406 A JP H0270406A JP 22232788 A JP22232788 A JP 22232788A JP 22232788 A JP22232788 A JP 22232788A JP H0270406 A JPH0270406 A JP H0270406A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat medium
- cavity
- control device
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 30
- 238000001816 cooling Methods 0.000 title claims description 26
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 17
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005429 filling process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プラスチック成形用の複数のキャビティを有
する金をの加熱冷却温度制御装置に係り、特に金型内の
温度を精密に制御し、各キャビティ間での温度差を小さ
くするのに好適な金型加熱冷却温度制御装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a heating and cooling temperature control device for gold having a plurality of cavities for plastic molding. The present invention relates to a mold heating/cooling temperature control device suitable for reducing temperature differences between cavities.
生産性の向上を目的とした多数個取りの金型成形におい
ては、キャビティ間の金型温度を均一化することが、成
形品バラツキの低減には必須の条件である。In multi-cavity mold molding aimed at improving productivity, uniform mold temperature between cavities is an essential condition for reducing molded product variations.
また、プラスチック成形品、例えばプラスチックレンズ
は、厚肉部と薄肉部との肉厚比が太きくしかも高精度及
び低内部歪が要求される。Furthermore, plastic molded products, such as plastic lenses, have a large thickness ratio between thick and thin parts, and are also required to have high precision and low internal distortion.
このため、樹脂の充填工程においては、金型温度を高温
に保持し、溶融樹脂の流動抵抗を低減することにより、
配向歪の発生を防止する必要がある。Therefore, in the resin filling process, the mold temperature is maintained at a high temperature to reduce the flow resistance of the molten resin.
It is necessary to prevent the occurrence of orientation strain.
さらに、賦形工程においては、金型温度を徐冷し、冷却
固化の均一化を図り、成形歪の発生を防止することが必
要である。Furthermore, in the shaping process, it is necessary to slowly cool the mold temperature to ensure uniform cooling and solidification and to prevent molding distortion.
従来の加熱冷却に用いる金型温度制御装置は、例えば特
開昭５８−２１５５０９号公報に記載されているように
、高温媒体タンクと低温媒体タンクと。A conventional mold temperature control device used for heating and cooling includes a high-temperature medium tank and a low-temperature medium tank, as described in, for example, Japanese Unexamined Patent Publication No. 58-215509.
各々の圧送ポンプ及び上記熱媒体を選択するための開閉
弁とで構成されており、熱媒体を選択することにより、
金型内の加熱冷却の制御を行っている。It is composed of each pressure pump and an on-off valve for selecting the heat medium, and by selecting the heat medium,
Controls heating and cooling inside the mold.
また、多数個取り成形において、各キャビティの温度を
均一化する金型構造として、例えば特開昭５９−３９５
１０号公報に記載されているように、熱媒体流路を連通
して、梯子状通路としたものがある。In addition, in multi-cavity molding, as a mold structure that equalizes the temperature of each cavity, for example, Japanese Patent Application Laid-Open No. 59-395
As described in Japanese Patent No. 10, there is a device in which the heat medium flow path is connected to form a ladder-like path.
第７図は従来の金型加熱冷却温度制御装置の説明図であ
って、（α）は系統図であり、１は高温タンク、２は低
温タンクで、高温タンク１には温度調節手段としてのヒ
ータ３及び温度センサ４、圧送ポンプ５、供給側開閉弁
６、帰還側開閉弁７を設け、低温タンク２には温度調節
手段としての冷却器８及び温度センサ９、圧送ポンプ１
０、供給側開閉弁１１、帰還側開閉弁１２を設けである
。FIG. 7 is an explanatory diagram of a conventional mold heating/cooling temperature control device, in which (α) is a system diagram, 1 is a high temperature tank, 2 is a low temperature tank, and the high temperature tank 1 has a temperature control means. A heater 3, a temperature sensor 4, a pressure pump 5, a supply side on-off valve 6, and a return side on-off valve 7 are provided.
0, a supply side on-off valve 11 and a return side on-off valve 12 are provided.
金型１３内には、２つのキャビティ１４．１５があり、
各々熱媒体流路１６．１７が配しである。Inside the mold 13 there are two cavities 14.15,
Heat medium flow paths 16 and 17 are arranged in each case.
また、２９．！１０は熱媒体の供給圧力を一定とするた
めのＩＪ ＩＪ−７弁、３１，３２，５５．３４は流動
方向を制御するための逆上弁である。Also, 29. ! 10 is an IJ IJ-7 valve for keeping the supply pressure of the heat medium constant; 31, 32, 55, and 34 are reverse valves for controlling the flow direction.
同図（ｈ）は制御概念図であって、２６は制御装置であ
り、温度センサ４，９の出力によりヒータ３、冷却器８
を制御することで、高温タンク１及び低温タンク２内の
熱媒体を所定の温度に制御し、成形機２７の動作と同期
して開閉弁６，７，１１．１２及び流量制御弁２４．２
５を制御している。FIG. 6(h) is a conceptual control diagram, in which 26 is a control device, and the heater 3 and cooler 8 are controlled by the outputs of the temperature sensors 4 and 9.
By controlling the heat medium in the high temperature tank 1 and the low temperature tank 2 to a predetermined temperature, the on-off valves 6, 7, 11.12 and the flow rate control valve 24.2 are activated in synchronization with the operation of the molding machine 27.
5 is controlled.
上記従来技術においては、金型の加熱冷却におけるキャ
ビティ間での温度差の点については配慮されておらず、
キャビティ間の成形品寸法バラツキを生じ、成形品歩留
りが大幅に低下した。The above conventional technology does not take into consideration the temperature difference between cavities during heating and cooling of the mold.
The molded product dimensions varied between cavities, and the yield of molded products decreased significantly.
上記キャビティ間の温度差を防止するためにはキャビテ
イ毎に配設された通路を流れる熱媒体の流量と温度を測
定制御することが有効である。In order to prevent the temperature difference between the cavities, it is effective to measure and control the flow rate and temperature of the heat medium flowing through the passages provided in each cavity.
しかし、高温、例えば２００℃以上の熱媒体の流量を測
定する装置は非常に高価であり、多くのキャビティの流
量を測定制御することができない。However, a device for measuring the flow rate of a heat medium at a high temperature, for example, 200° C. or higher, is very expensive and cannot measure and control the flow rate of many cavities.
本発明は、光学性能の優れたプラスチックレンズを多数
個取りにより、高能率、安価で成形できるプラスチック
成形用の金型加熱冷却温度制御装置を提供することを目
的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a mold heating/cooling temperature control device for plastic molding which can be molded with high efficiency and at low cost by molding a large number of plastic lenses with excellent optical performance.
上記目的は、金型温度調節機から各キャビティへの熱媒
体の供給路又は各キャビティから金型温度調節機への帰
還路に設けた流量制御弁及び供給路に設けたヒータを、
金型の熱媒体流路の入口及び出口に設けた熱媒体の温度
を測定するセンサにより制御することにより達成される
。The above purpose is to control the flow rate control valve provided in the supply path of the heat medium from the mold temperature controller to each cavity or the return path from each cavity to the mold temperature controller, and the heater provided in the supply path.
This is achieved by controlling the temperature of the heat medium provided at the inlet and outlet of the heat medium flow path of the mold using sensors that measure the temperature of the heat medium.
本発明は、金型の各キャビティに流入する熱媒体の温度
と流量に着眼したものであり、特に各キャビティを流れ
る熱媒体の流量と各キャビティの入口と出口側とにおけ
る熱媒体の温度差に着眼したものである。The present invention focuses on the temperature and flow rate of the heat medium flowing into each cavity of a mold, and particularly the flow rate of the heat medium flowing through each cavity and the temperature difference between the inlet and outlet sides of each cavity. This is what I focused on.
各キャビティの熱媒体流路の入口側の微調ヒータは、上
記入口側の温度センサの出力で制御され流入する熱媒体
の温度を一致させるように駆動される。The fine adjustment heater on the inlet side of the heat medium flow path of each cavity is controlled by the output of the temperature sensor on the inlet side and is driven to match the temperature of the heat medium flowing into the cavity.
また、各キャビテイ毎に設けた流量制御弁は、各キャビ
ティの熱媒体流路の出口側の温度センサの出力で制御さ
れ、入口側と出口側とのセンサの出力の差又は出口側の
センサの出力を一致させるように駆動される。In addition, the flow rate control valve provided for each cavity is controlled by the output of the temperature sensor on the outlet side of the heat medium flow path of each cavity, and is controlled by the output of the temperature sensor on the outlet side of the inlet side and the outlet side. Driven to match outputs.
以上の結果、各キャビティの熱媒体流路に流入する熱媒
体の温度と流量を一致させることができる。As a result of the above, it is possible to match the temperature and flow rate of the heat medium flowing into the heat medium flow path of each cavity.
それにより、各キャビティの温度が一致し、中ヤビティ
間の成形品寸法のバラツキを防止し、成形品歩留りの向
上を図ることができる。Thereby, the temperature of each cavity becomes the same, it is possible to prevent variations in the dimensions of the molded product between the cavities, and to improve the yield of the molded product.
以下、本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明による金型加熱冷却温度制御装置の一実
施例の説明図であって、第７図と同じ符号は同じものを
示す。FIG. 1 is an explanatory diagram of an embodiment of the mold heating/cooling temperature control device according to the present invention, and the same reference numerals as in FIG. 7 indicate the same parts.
同図（α）は系統図であり、各々の熱媒体流路１６゜１
７には、入口側に微調ヒータ１Ｂ、１９ 、温度センサ
２０．２１ 、出口側に温度センサ２２，２３を設けで
ある。Figure (α) is a system diagram, in which each heat medium flow path 16°1
7 is provided with fine adjustment heaters 1B, 19 and temperature sensors 20, 21 on the inlet side, and temperature sensors 22, 23 on the outlet side.
同図（ｂ）は制御概念図であって、２６は制御装置であ
り、温度センサ４，９の出力によりヒータ３、冷却器８
を制御することで、高温タンク１及び低温タンク２内の
熱媒体を所定の温度に制御し、温度センサ２０ 、２１
の出力によりヒータ１８．１９を制御し温度センサ２２
、２３の出力により流量制御弁２４．２５を制御し、
成形機２７の動作と同期して開閉弁６，７゜１１．１２
及び流量制御弁２４ 、２５を制御している。FIG. 2(b) is a conceptual control diagram, in which 26 is a control device, and the heater 3 and cooler 8 are controlled by the outputs of the temperature sensors 4 and 9.
The heat medium in the high temperature tank 1 and the low temperature tank 2 is controlled to a predetermined temperature by controlling the temperature sensors 20 and 21.
The heaters 18 and 19 are controlled by the output of the temperature sensor 22.
, 23 controls the flow rate control valves 24, 25,
In synchronization with the operation of the molding machine 27, the on-off valves 6, 7°11.12
and controls the flow rate control valves 24 and 25.
ここで、第２図に示したような金型温度パターンを得る
ための第１図の動作を以下に示す。Here, the operation shown in FIG. 1 to obtain the mold temperature pattern as shown in FIG. 2 will be described below.
第２図は時間に対する金型温度変化パターンと各開閉弁
及び流量制御弁の動作の説明図であって、２８は例えば
キャビティ１４の金凰温度である。FIG. 2 is an explanatory diagram of the mold temperature change pattern with respect to time and the operation of each on-off valve and flow rate control valve, and 28 is, for example, the temperature of the cavity 14.
金型温度パターンは時間間隔αの間、温度Ｔ、からｒｔ
ｔで加熱し、時間間隔すの間、温度Ｔ！に保持し、次
に時間間隔Ｃの間、温度Ｔ、からＴ、まで冷却し、時間
間隔ｄの間、温度Ｔ、に保持する設定となっている。The mold temperature pattern is during the time interval α, from temperature T to rt
t, and during a time interval, the temperature T! It is then set to be cooled from temperature T to T during a time interval C, and then held at temperature T during a time interval d.
そこで、高温タンク１内の熱媒体温度をＴ！と比較して
充分高い温度に、低温タンク２内の熱媒体温度をＴ、と
比較して充分低い温度に制御装置２６により設定制御す
る。Therefore, the temperature of the heat medium in the high temperature tank 1 is set to T! The temperature of the heat medium in the low temperature tank 2 is set and controlled by the control device 26 to a temperature that is sufficiently high compared to T, and the temperature of the heat medium in the low temperature tank 2 is set to a temperature that is sufficiently low compared to T.
ここで、時間間隔αの閣は、開閉弁６．７を開、開閉弁
１１．１２を閉、流量制御弁２４．２５を大流量とし、
高温タンク内の熱媒体を大量に熱媒体流路１６゜１７に
流し、キャビティ１４．１５を加熱する。Here, for the time interval α, the on-off valve 6.7 is opened, the on-off valve 11.12 is closed, the flow rate control valve 24.25 is set to a large flow rate,
A large amount of the heat medium in the high temperature tank is flowed into the heat medium flow paths 16 and 17 to heat the cavities 14 and 15.
次に、時間間隔にの間は、開閉弁６，７，１１．１２は
時間間隔αと同様とし、流量制御弁２４．２５を小流量
とすることにより、キャビティ１４．１５を温度Ｔ。Next, during the time interval, the on-off valves 6, 7, 11.12 are the same as in the time interval α, and the flow rate control valve 24.25 is set to a small flow rate, so that the temperature of the cavity 14.15 is maintained at T.
に保持する。次に、時間間隔Ｃの間は、開閉弁６゜７を
閉、開閉弁１１．１２開、流量制御弁２４．２５を大流
量とし、低温タンク２内の熱媒体を大量に熱媒体流路１
６ｇ１７に流し、キャビティ１４．１５を冷却する。to hold. Next, during the time interval C, the on-off valves 6. 1
6g 17 and cool the cavity 14.15.
次に、本発明の目的であるキャビティ間の温度バラツキ
低減のための微調ヒータ１８，１９ 、流量制御弁２４
，２５ 、温度センサ２０．２１．２２．２５の動作を
説明する。Next, the fine adjustment heaters 18, 19 and the flow control valve 24 are used to reduce temperature variations between cavities, which is an object of the present invention.
, 25, the operation of the temperature sensor 20.21.22.25 will be explained.
ここで、第７図に示したような従来の金型熱冷却温度制
御装置により温調を行った場合には、第３図に示すよう
な加熱又は冷却速度の差δ１又はδ、′や金型温度の差
δ、が発生する。ここで、２８゜２８′は例えばキャビ
ティ１４．１５の温度である。これらの差が発生する原
因は、キャビティ１４．１５の熱媒体流路１（Ｓ、１７
に流入する熱媒体の温度と流量の差である。Here, when the temperature is controlled by a conventional mold thermal cooling temperature control device as shown in FIG. A difference δ in mold temperature occurs. Here, 28°28' is, for example, the temperature of the cavity 14.15. The cause of these differences is the heating medium flow path 1 (S, 17
It is the difference between the temperature and flow rate of the heat medium flowing into the
ここで、流入する熱媒体の温度を制御するため各キャビ
ティ１４．１５の熱媒体流路１（Ｓ、１７に流入する熱
媒体の温度を温度センサ２０ 、２１で測定し、微調ヒ
ータ１８，１９を駆動制御する構造とした。Here, in order to control the temperature of the heat medium flowing in, the temperature of the heat medium flowing into the heat medium flow path 1 (S, 17) of each cavity 14, 15 is measured by the temperature sensors 20, 21, and the fine adjustment heaters 18, 19 The structure was designed to drive and control the
本実施例では、加熱、保持、冷却の各工程において、流
入熱媒体温度の低い方を、例えば温度センサ２０の出力
を基準温度として決め、この基準温度側のキャビティ、
例えば１４側の微調ヒータ１８の出力な零、他のキャビ
ティ、例えば１５側の微調ヒータ１９の出力を基準温度
からの流入熱媒体温度、例えば温度センサ２１の出力の
差に比例させて制御した。In this embodiment, in each of the heating, holding, and cooling steps, the lower inflow heat medium temperature, for example, the output of the temperature sensor 20, is determined as the reference temperature, and the cavity on the reference temperature side,
For example, the output of the fine adjustment heater 18 on the 14th side is zero, and the output of other cavities, such as the fine adjustment heater 19 on the 15th side, is controlled in proportion to the difference in inflow heat medium temperature from the reference temperature, such as the output of the temperature sensor 21.
この基準温度からの温度差と微調ヒータ出力を第４図に
示す。なお、他の制御方法として、第４図にカッコ内数
値として示したように、基準温度となるキャビティを一
定とし、このキャビティの微調ヒータの出力を定格出力
の５０％とし、他のキャビティの微調ヒータの出力をこ
の基準温度からの差に比例させる方法がある。FIG. 4 shows the temperature difference from this reference temperature and the fine adjustment heater output. As another control method, as shown in the figures in parentheses in Figure 4, the cavity serving as the reference temperature is kept constant, the output of the fine adjustment heater of this cavity is set to 50% of the rated output, and the fine adjustment of other cavities is set to 50% of the rated output. There is a method of making the output of the heater proportional to the difference from this reference temperature.
次に、熱媒体の流量を制御するために各キャビティ１４
．１５の熱媒体流路１６．１７に流入する熱媒体の温度
を温度センサ２０，２１ 、流出する熱媒体の温度を温
度センサ２２，２３で測定し、流入と流出とでの温度差
により流量制御弁２４．２５を駆動制御する構造とした
。Next, each cavity 14 is used to control the flow rate of the heating medium.
．． The temperature of the heat medium flowing into the heat medium flow paths 16 and 15 of No. 15 is measured by temperature sensors 20 and 21, and the temperature of the heat medium flowing out is measured by temperature sensors 22 and 23, and the flow rate is controlled based on the temperature difference between the inflow and outflow. The structure is such that the valves 24 and 25 are driven and controlled.
ここで、第５図に入口と出口との熱媒体の温度差と熱媒
体流量の関係を示す。温度差は入口側熱媒体を基準とし
た場合で、５７は冷却器、３８は加熱及び保持時である
。Here, FIG. 5 shows the relationship between the temperature difference of the heat medium between the inlet and the outlet and the flow rate of the heat medium. The temperature difference is based on the inlet side heat medium, 57 is the cooler, and 38 is during heating and holding.
そこで、加熱工程においては、熱媒体温度差の絶対値の
小さなキャビティ、例えば１４を基準とし他のキャビテ
ィ、例えば１５の流量制御弁２５を流量の小さくなる方
向に微調し、熱媒体温度差を基準キャビティと一致する
ように制御する。Therefore, in the heating process, the flow rate control valve 25 of other cavities, such as 15, is finely adjusted in the direction of decreasing the flow rate, using the cavity with a small absolute value of the heat medium temperature difference, for example, 14, as a reference, and Control to match the cavity.
保持工程においては、熱媒体温度差の絶対値の大きなキ
ャビティ、例えば１４を基準とし、他のキャビティ、例
えば１５の流量制御弁２５を流量の大きくなる方向に微
調し、熱媒体温度を基準キャビティと一致するように制
御する。In the holding step, the cavity with a large absolute value of the heat medium temperature difference, for example 14, is used as a reference, and the flow rate control valve 25 of other cavities, for example 15, is finely adjusted in the direction of increasing the flow rate, so that the heat medium temperature is set to the reference cavity. Control to match.
また、冷却工程においては、熱媒体温度差の絶対値の小
さなキャビティ、例えば１４を基準とし、他のキャビテ
ィ、例えば１５の流量制御弁２５を流量の小さくなる方
向に微調し、熱媒体温度差を基準キャビティと一致する
ように制御する。In addition, in the cooling process, the cavity with a small absolute value of the heat medium temperature difference, for example 14, is used as a reference, and the flow rate control valve 25 of the other cavities, for example 15, is finely adjusted in the direction of decreasing the flow rate to reduce the heat medium temperature difference. Control to match the reference cavity.
以上の例では、加熱及び冷却においては流量大側、保持
工程では流量小側であり、流量制御弁の制御範囲の両端
で行った場合である。In the above example, the heating and cooling processes are performed on the high flow rate side, and the holding process is performed on the low flow rate side, at both ends of the control range of the flow rate control valve.
しかし、流量制御弁の制御範囲に充分余裕がある場合に
は、あるキャビティの熱媒体温度差の絶対値を基準とし
、他のキャビティの熱媒体温度差の絶対値が基準より大
きい場合には流量を小さく小さい場合には流量を大きく
し、熱媒体温度差を基準キャビティと一致するように制
御すればよい。However, if there is sufficient margin in the control range of the flow control valve, the absolute value of the heat medium temperature difference in a certain cavity is used as the standard, and if the absolute value of the heat medium temperature difference in other cavities is larger than the standard, the flow rate is If it is small, the flow rate may be increased and the heat medium temperature difference may be controlled to match that of the reference cavity.
なお、前記微調ヒータ１８，１９の制御により流入する
熱媒体の温度が各キャビティ１４．１５間で一致してい
れば、流量制御弁２４ 、２５を微調するために、入口
出口の熱媒体温度差の代わりに出口側熱媒体温度を用い
てもよい。In addition, if the temperature of the heat medium flowing into each cavity 14, 15 is the same by controlling the fine adjustment heaters 18, 19, in order to finely adjust the flow rate control valves 24, 25, the temperature difference of the heat medium at the inlet and outlet is adjusted. The outlet side heat medium temperature may be used instead of .
本実施例において、高温タンク及び低温タンクの温度を
各々１９５℃、５０°Ｃ１各キヤビテイでの最大流量２
ｊ／分、余塵最高温度１７０°Ｃ１最低温度８０℃とし
たとき、従来は加熱速度δ１＃２°Ｃ／分、金型温度δ
β１．５℃発生していたものを、本発明による金型加熱
冷却温度制御装置を用いることにより、δ、＃０．５℃
、δ！ ＃ＣＬ ５℃とすることができた。その結果、
従来のキャビティ間成形品寸法バラツキ１０μｍを３μ
隅以下とすることができ、成形歩留りの向上を図ること
ができた。In this example, the temperature of the high-temperature tank and the low-temperature tank was set to 195°C and 50°C, respectively.1 The maximum flow rate in each cavity was 2.
j/min, maximum residual dust temperature 170°C, minimum temperature 80°C, conventional heating rate δ1#2°C/min, mold temperature δ
By using the mold heating/cooling temperature control device according to the present invention, the temperature that had been generated at β1.5°C was changed to δ, #0.5°C.
, δ! #CL The temperature could be set at 5°C. the result,
The conventional molded product size variation between cavities of 10μm has been reduced to 3μm.
It was possible to reduce the thickness to less than the corner, thereby improving the molding yield.
第６図は本発明による金型加熱冷却温度制御装置の他の
実施例の説明図であって、（α）は系統図、（ｈ）は制
御概念図であり、第１図と同じ符号は同じ機能を有し、
同図（、）の３５は記憶部であり、ある特定のキャビテ
ィ、例えば１４の温度センサ２０ 、２２の出力、又は
キャビティ間での出力の平均値を１サイクル間記憶し、
かつこれをサイクルと同期して出力できる構造となって
いる。FIG. 6 is an explanatory diagram of another embodiment of the mold heating/cooling temperature control device according to the present invention, (α) is a system diagram, (h) is a control conceptual diagram, and the same symbols as in FIG. 1 are have the same functionality,
Reference numeral 35 in the same figure ( ) is a storage unit, which stores the outputs of a certain specific cavity, for example, the 14 temperature sensors 20 and 22, or the average value of the outputs among the cavities for one cycle;
And it has a structure that can output this in synchronization with the cycle.
同図（α）において、初期においては、前記第１の実施
例と同様に、温度センサ２０，２１，２２．２３により
微調ヒータ１８，１９及び流量制御弁２４．２５を制御
し各キャビティ間での流入温度の差及び流出温度の差を
小さくするよう制御を行う。In the same figure (α), in the initial stage, the fine adjustment heaters 18, 19 and the flow rate control valves 24, 25 are controlled by the temperature sensors 20, 21, 22, 23 between each cavity, as in the first embodiment. Control is performed to reduce the difference in inflow temperature and the difference in outflow temperature.
そこで、所望の余塵温度パターンが得られ、かつキャビ
ティ間の温度差が充分小さくなったときに、外部からの
信号を入力し、１サイクル間の特定のキャビティ、例え
ば１４の温度センサ２０，２２の出力、又はキャビティ
間の出力の平均値、即ち温度センサ２０ 、２１の出力
の平均と温度センサ２２．２３の出力の平均を同図（ｂ
）の記憶装置３５により記憶する。Therefore, when the desired residual dust temperature pattern is obtained and the temperature difference between the cavities is sufficiently small, an external signal is input and a specific cavity for one cycle, for example, 14 temperature sensors 20, 22 , or the average value of the outputs between the cavities, that is, the average of the outputs of temperature sensors 20 and 21 and the average of the outputs of temperature sensors 22 and 23.
) is stored in the storage device 35.
次回からのサイクルは、前記記憶装置３５に記憶した温
度センサの出力をサイクルと同期して再度出力し、これ
を温度センサ２０，２１，２２．２３の基準値として、
微調ヒータ１８，１９及び流量制御弁２４．２５を駆動
制御する。その結果、キャビティ間の温度のバラツキを
小さくし、かつブイタル間の温度のバラツキを小さくす
ることができ、成形品寸法バラツキを小さくし、成形歩
留りを向上することができる。In the next cycle, the output of the temperature sensor stored in the storage device 35 is outputted again in synchronization with the cycle, and this is used as the reference value of the temperature sensors 20, 21, 22, and 23.
Drive control of fine adjustment heaters 18, 19 and flow rate control valves 24,25. As a result, it is possible to reduce variations in temperature between cavities and between cavities, reduce variations in temperature between cavities, reduce variations in molded product dimensions, and improve molding yield.
以上説明したように、本発明によれば、多数のキャビテ
ィ間の加熱冷却速度及び金墓温度の差を高価な流量計等
の装置を必要とせず、小さくすることができ、各キャビ
ティの成形品寸法の安定性が増し、成形歩留りの向上が
図られ、上記従来技術の欠点を除いて優れた機能の金型
加熱冷却温度制御装置を提供することができる。As explained above, according to the present invention, it is possible to reduce the difference in heating/cooling rate and gold grave temperature between a large number of cavities without the need for equipment such as an expensive flow meter, and the molded product in each cavity can be reduced. Dimensional stability is increased, molding yield is improved, and it is possible to provide a mold heating/cooling temperature control device with excellent functions while eliminating the drawbacks of the above-mentioned prior art.
第１図は本発明による金型加熱冷却温度制御装置の一実
施例の説明図、第２図は時間に対する金型温度変化パタ
ーンと各開閉弁及び流量制御弁の動作の説明図、第５図
は金型温度パターンの説明図、第４図は基準温度からの
温度差と微調ヒータ出力の関係の説明図、第５図は入口
と出口の熱媒体温度差と熱媒体流量の関係の説明図、第
６図は本発明による金型加熱冷却温度制御装置の他の実
施例の説明図、第７図は従来の金型加熱冷却温度制御装
置の説明図である。
１・・・・・・・・・・・・・・・・・・・・・・・・
・・・高温タンク２・・・・・・・・・・・・・・・・
・・・・・・・・・・・低温タンク６．７．１１．１２
・・・・・・開閉弁１３・・・・・・・・・・・・・・
・・・・・・・・・・金型１４．１５ ・・・・・・・
・・・・・・・・キャビティ１６．１７・・・・・・・
・・・・・・・・熱媒体流路１８．１９ ・・・・・・
・・・・・・・・・微調ヒータ２０．２１．２２．２３
・・・温度センサ２４．２５・・・・・・・・・・・・
・・・流量制御弁３５・・・・・・・・・・・・・・・
・・・・・・・・・記憶部１ 高ｊユタシク １４１５
午ヤごティ２０２１ ガー度でンサ
１つ金型
１６１３ 精文を周ヒータ
２４２５ 流量帝Ｊ＃ｐ弁
〒１図
〒２図
〒５図
〒４図
（Ｏ）
考Ｉ７温度りへらの温度差Ａ’Ｃ）
（＋１）
罰５図
八日と出口との？久奴４本温度差（・Ｃ）千６図
Ｃｂ）Fig. 1 is an explanatory diagram of an embodiment of the mold heating/cooling temperature control device according to the present invention, Fig. 2 is an explanatory diagram of the mold temperature change pattern with respect to time and the operation of each on-off valve and flow rate control valve, and Fig. 5 is an explanatory diagram of the mold temperature pattern, Fig. 4 is an explanatory diagram of the relationship between the temperature difference from the reference temperature and the fine adjustment heater output, and Fig. 5 is an explanatory diagram of the relationship between the heat medium temperature difference between the inlet and outlet and the heat medium flow rate. , FIG. 6 is an explanatory diagram of another embodiment of the mold heating/cooling temperature control device according to the present invention, and FIG. 7 is an explanatory diagram of a conventional mold heating/cooling temperature control device. 1・・・・・・・・・・・・・・・・・・・・・・・・
・・・High temperature tank 2・・・・・・・・・・・・・・・・・・
・・・・・・・・・・・・Cold tank 6.7.11.12
・・・・・・Opening/closing valve 13・・・・・・・・・・・・・・・
・・・・・・・・・Mold 14.15 ・・・・・・・・・
・・・・・・Cavity 16.17・・・・・・
...Heat medium flow path 18.19 ......
......Fine adjustment heater 20.21.22.23
・・・Temperature sensor 24.25・・・・・・・・・・・・
・・・Flow rate control valve 35・・・・・・・・・・・・・・・
・・・・・・・・・Memory part 1 Takaj Utashiku 1415
Goyagoti 2021 Temperature difference in temperature 1613 Mold 1613 Heater 2425 Flow rate measurement J#p valve 1 Figure 2 Figure 5 Figure 4 (O) Consideration I7 Temperature difference A' C) (+1) Punishment 5 figure 8th and exit? Temperature difference between 4 Kunu (C) 1,600 figures Cb)
Claims (1)
的に供給するための複数の熱媒体タンクと、熱媒体の温
度調節手段と圧送ポンプと熱媒体を選択的に供給する開
閉弁とからなる金型加熱冷却温度制御装置において、複
数のキャビティに独立の熱媒体流路を配し、上記熱媒体
流路の入口側に微調ヒータと温度センサを、出口側に温
度センサを、入口側又は出口側に流量制御弁をそれぞれ
設け、各キャビティ間で入口側センサの出口及び出口側
センサの出力、又は出口側と入口側のセンサの出力との
差が同一となるように、上記微調ヒータ及び流量制御弁
を駆動する制御装置を設けたことを特徴とする金型加熱
冷却温度制御装置。 ２、請求項１において、入口側センサの出力及び出口側
センサの出力、又は出口側と入口側のセンサの出力との
差を設定値と一致させるように上記微調ヒータ及び流量
制御弁を駆動する制御装置を設けたことを特徴とする金
型加熱冷却温度制御装置。 ３、請求項１において、入口側センサ及び出口側センサ
の１サイクルの間の出力を記憶し、この出力値を設定値
として、以降のサイクルにおいて、入口側センサの出力
及び出口側センサの出力、又は出口側と入口側のセンサ
の出力との差を上記設定値と一致させるように、上記微
調ヒータ及び流量制御弁を駆動する制御装置を設けたこ
とを特徴とする金型加熱冷却温度制御装置。 ４、請求項１、２又は３において、上記開閉弁の動作と
成形機の動作を同期させるための制御装置を設けたこと
を特徴とする金型加熱冷却温度制御装置。[Claims] 1. A plurality of heat medium tanks for selectively supplying heat medium set at a plurality of temperatures to a molding die, a heat medium temperature adjustment means, a pressure pump, and a heat medium. In a mold heating/cooling temperature control device consisting of a selective supply on/off valve, independent heat medium flow paths are arranged in multiple cavities, and a fine adjustment heater and a temperature sensor are installed on the inlet side of the heat medium flow path, and on the outlet side of the heat medium flow path. A temperature sensor is installed on the side, and a flow control valve is installed on the inlet side or the outlet side, and the difference between the output of the inlet side sensor and the output of the outlet side sensor, or the difference between the output of the outlet side and the inlet side sensor is the same between each cavity. A mold heating/cooling temperature control device comprising a control device for driving the fine adjustment heater and the flow rate control valve. 2. In claim 1, the fine adjustment heater and the flow rate control valve are driven so that the difference between the output of the inlet side sensor and the output of the outlet side sensor, or the output of the outlet side and inlet side sensor, matches a set value. A mold heating/cooling temperature control device comprising a control device. 3. In claim 1, the output of the inlet side sensor and the outlet side sensor during one cycle is stored, and this output value is used as a set value, and in subsequent cycles, the output of the inlet side sensor and the output of the outlet side sensor, Or a mold heating and cooling temperature control device, comprising a control device that drives the fine adjustment heater and the flow rate control valve so that the difference between the outputs of the sensors on the outlet side and the inlet side matches the set value. . 4. The mold heating/cooling temperature control device according to claim 1, 2 or 3, further comprising a control device for synchronizing the operation of the on-off valve and the operation of the molding machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22232788A JPH0270406A (en) | 1988-09-07 | 1988-09-07 | Die heating and cooling temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22232788A JPH0270406A (en) | 1988-09-07 | 1988-09-07 | Die heating and cooling temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270406A true JPH0270406A (en) | 1990-03-09 |
Family
ID=16780615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22232788A Pending JPH0270406A (en) | 1988-09-07 | 1988-09-07 | Die heating and cooling temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270406A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003061955A1 (en) * | 2002-01-22 | 2003-07-31 | J.M. Huber Corporation A Corporation Of The State Of New Jersey | Modified high-temperature pressing apparatus |
| US9575306B2 (en) | 2013-05-06 | 2017-02-21 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Stereoscopic microscope |
-
1988
- 1988-09-07 JP JP22232788A patent/JPH0270406A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003061955A1 (en) * | 2002-01-22 | 2003-07-31 | J.M. Huber Corporation A Corporation Of The State Of New Jersey | Modified high-temperature pressing apparatus |
| US6983684B2 (en) * | 2002-01-22 | 2006-01-10 | Huber Engineered Woods Llc | Modified high-temperature pressing apparatus |
| US9575306B2 (en) | 2013-05-06 | 2017-02-21 | Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg | Stereoscopic microscope |
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