JPH0269948A - Apparatus for mounting of electronic component - Google Patents

Apparatus for mounting of electronic component

Info

Publication number
JPH0269948A
JPH0269948A JP63221726A JP22172688A JPH0269948A JP H0269948 A JPH0269948 A JP H0269948A JP 63221726 A JP63221726 A JP 63221726A JP 22172688 A JP22172688 A JP 22172688A JP H0269948 A JPH0269948 A JP H0269948A
Authority
JP
Japan
Prior art keywords
bond
squeegee
tray
liquid level
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63221726A
Other languages
Japanese (ja)
Other versions
JPH0779112B2 (en
Inventor
Yasuto Onizuka
安登 鬼塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63221726A priority Critical patent/JPH0779112B2/en
Publication of JPH0269948A publication Critical patent/JPH0269948A/en
Publication of JPH0779112B2 publication Critical patent/JPH0779112B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To automatically supply bond from a bond supply unit to a bond tray when a liquid surface is lowered by monitoring the height of the liquid surface level smoothed by a squeegee at the downstream side from the squeegee by a liquid surface level detector. CONSTITUTION:An electronic component fed from a tray 10 by the sub feeding head 1 of an apparatus for mounting of the electronic component is fed to a substage 5, and the fed component is fed and placed onto a board in which a mounting head 2 is positioned on a mount 5. Bond 23 provided in a bond supplying unit 7 is collected by a transfer head 3 by a transfer pin 12 and transferred to the board. The bond tray 21 of the unit 7 is horizontally rotated by a motor 24 to smooth the liquid surface of the bond 23 stored on the tray 21 by a squeegee 26. A liquid surface level detector 32 is provided at the front from the squeegee 26 with respect to the rotating direction of the tray 21 and at the rear of the contact point of the pin 12 of the head 2, and the bond 23 is supplied from a bond supply unit 35 to the tray 21 by the liquid surface level decrease signal of the detector 32.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は電子部品実装装置に係り、殊にボンド供給装置
の構造に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus, and particularly to the structure of a bond supply apparatus.

（従来の技術） 電子部品実装装置として、電子部品供給部の電子部品を
サブステージに移送するサブ移送ヘッドと、サブステー
ジにおいて位置ずれの補正や観察がなされた電子部品を
マウント部に位置決めされた基板に移送搭載するマウン
トヘッドと、ボンド供給装置に備えられたボンドを上記
基板に転写する転写ヘッドとを備え、これらの３つのヘ
ッドを同時に横方向に往復移動させながら、電子部品の
位置ずれ補正、基板への電子部品の実装、及び基板への
ボンド塗布を一連の作業として行うようにしたものが知
られている（特開昭６１−２６４７９３号公報）。この
種ボンド供給装置は、銀ペーストのようなボンドが貯溜
されたボンド皿を備えており、転写へ・ノドによるボン
ドの採取量を等量にするために、ボンド皿をモータによ
り水平回転させながら、ボンドの液面をスキージにより
平滑しており、平滑された液面に転写ヘッドの転写ピン
の下端部を突入させてボンドをこの下端部に付着させ、
付着したボンドを基板に移送して転写するようになって
いる。(Prior art) An electronic component mounting device includes a sub-transfer head that transfers electronic components from an electronic component supply section to a substage, and a sub-transfer head that transfers electronic components from an electronic component supply section to a substage, and a mount section that positions the electronic components whose positional deviations have been corrected and observed on the substage. It is equipped with a mount head that transfers and mounts onto the substrate, and a transfer head that transfers the bond provided in the bond supply device to the substrate, and while these three heads are moved back and forth in the lateral direction at the same time, it is possible to correct misalignment of electronic components. There is known a device in which mounting electronic components on a board and applying bond to the board are performed as a series of operations (Japanese Patent Laid-Open No. 61-264793). This type of bond supply device is equipped with a bond tray in which a bond such as silver paste is stored, and in order to equalize the amount of bond to be transferred and to be collected by the gutter, the bond tray is horizontally rotated by a motor. , the liquid surface of the bond is smoothed with a squeegee, the lower end of the transfer pin of the transfer head is inserted into the smoothed liquid surface and the bond is attached to this lower end,
The attached bond is transferred and transferred to the substrate.

（発明が解決しようとする課題） ところで、ボンド皿に貯溜されたボンドの量が少くなっ
て液面が低下すると、スキージの下端部は液面に当らな
くなって液面の平滑はできなくなり、液面は凹凸のある
荒れた液面となる。(Problem to be Solved by the Invention) By the way, when the amount of bond stored in the bond tray decreases and the liquid level drops, the lower end of the squeegee no longer touches the liquid surface, making it impossible to smooth the liquid surface. The liquid surface will be uneven and rough.

かくなると、転写ピンによる採取量にばらつきを生じる
ので、ボンドの液面が低下したならば、ボンド皿にボン
ドを補給せねばならない。従来、かかるボンドの補給は
、作業者がボンド皿に貯溜されたボンドの量を監視する
ことにより行われていたため、単に面倒であるだけでな
く、監視忘れにより液面が荒れると、ボンドの塗布量に
狂いを生じる問題があった。In this case, the amount collected by the transfer pins varies, so if the liquid level of the bond drops, the bond dish must be replenished with bond. Conventionally, such bond replenishment was carried out by the operator monitoring the amount of bond stored in the bond pan, which was not only troublesome, but also caused the need to replenish the bond if the liquid level became rough due to forgetting to monitor. There was a problem with the quantity being inconsistent.

したがって本発明は、ボンド皿に貯溜されたボンドが減
少したならば、自動的にこれを検出してボンド補給を行
える手段を備えた電子部品実装装置を提供することを目
的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component mounting apparatus that is equipped with a means for automatically detecting a decrease in the amount of bond stored in a bond tray and replenishing the amount of bond.

（課題を解決するための手段） このために本発明は、この種電子部品実装装置において
、モータに駆動されて水平回転するボンド皿と、このボ
ンド皿に貯溜されたボンドの液面を平滑するスキージと
、ボンド皿の回転方向に関してこのスキージよりも前方
であって、かつ転写ヘッドの転写ピンの着地点よりも後
方に設けられたボンドの液面検出器と、この液面検出器
から発せられた液面低下信号により、ボンド皿にボンド
を供給するボンド供給部とからボンド供給装置を構成し
ている。(Means for Solving the Problems) For this purpose, the present invention provides an electronic component mounting apparatus of this type with a bond plate that is driven by a motor and rotates horizontally, and a bond plate that smooths the liquid level of the bond stored in the bond plate. A squeegee, a bond liquid level detector provided in front of the squeegee in the rotational direction of the bond plate and behind the landing point of the transfer pin of the transfer head, and the liquid level detector emitted from the bond plate. A bond supply device includes a bond supply section that supplies bond to a bond tray in response to a liquid level drop signal.

（作用） 上記構成によれば、スキージよりも下流側において、ス
キージにより平滑された液面の高さが液面検出器により
監視され、液面が低下したならば、ボンド供給部からボ
ンド皿にボンドが自動補給される。(Function) According to the above configuration, on the downstream side of the squeegee, the height of the liquid level smoothed by the squeegee is monitored by the liquid level detector, and if the liquid level drops, the bond is transferred from the bond supply section to the bond tray. Bond is automatically replenished.

（実施例） 次に、図面を参照しながら本発明の詳細な説明する。(Example) Next, the present invention will be described in detail with reference to the drawings.

第１図は電子部品実装装置の斜視図であって、この装置
は、サブ移送ヘッド１．マウントヘッド２．転写ヘッド
３の３つのヘッドを備えている。各ヘッド１〜３は、複
数のノズルを装備したマルチヘッドであり、電子部品の
大きさに対応して、ノズルを選択的に使用する。４，５
゜６．７は、各ヘッド１〜３の下方に設けられた電子部
品の供給部、サブステージ、マウント部。FIG. 1 is a perspective view of an electronic component mounting apparatus, which includes a sub-transfer head 1. Mount head 2. It has three heads: a transfer head 3. Each of the heads 1 to 3 is a multi-head equipped with a plurality of nozzles, and the nozzles are selectively used depending on the size of the electronic component. 4,5
6.7 is an electronic component supply section, a substage, and a mount section provided below each of the heads 1 to 3.

ボンド供給部である。供給部４は、ターンテーブル８と
、このターンテーブル８に装着された支持板９から成っ
ており、支持板９には電子部品が並設されたウェハー１
０が装備されている。This is the bond supply section. The supply unit 4 consists of a turntable 8 and a support plate 9 attached to the turntable 8. The support plate 9 has a wafer 1 on which electronic components are arranged side by side.
0 is equipped.

１１はウェハー１０上の電子部品をピンにより突き上げ
るグイエジェクタである。Reference numeral 11 denotes a gouie ejector that pushes up electronic components on the wafer 10 with pins.

サブステージ５は、サブ移送ヘッド１によりトレイ１０
から移送された電子部品のｘｙθ方向の位置ずれを、位
置ずれ補正部材（図示せず）により機械的に補正するス
テージである。The sub-stage 5 transfers the tray 10 by the sub-transfer head 1.
This is a stage that mechanically corrects the positional deviation in the xyθ directions of the electronic component transferred from the stage using a positional deviation correction member (not shown).

マウント部６は、テーブル移動装置１３．１４や、クラ
ンプ部材１５等から成り、コンヘヤ１６により移送され
る基板１７を位置決めし、Ｘｙ力方向移動させる。１９
はマウント部６の上方に配設されたカメラであり、基板
１７の印刷パターンの位置ずれを観察する。３つのヘッ
ド１〜３は、図示しない駆動手段により横方向に往復移
動し、サブ移送ヘッド１はウェハー１０の電子部品をサ
ブステージ５に移送し、マウントヘッド２はサブステー
ジ５で位置補正された電子部品を基板１７に移送し、ま
た転写ヘッド３はボンド皿２１のボンドを基板１７に転
写する。The mount section 6 is composed of table moving devices 13, 14, clamp members 15, etc., and positions the substrate 17 transferred by the conveyor 16, and moves it in the X and Y force directions. 19
is a camera disposed above the mount section 6, which observes the positional deviation of the printed pattern on the substrate 17. The three heads 1 to 3 are laterally reciprocated by driving means (not shown), the sub-transfer head 1 transfers the electronic components of the wafer 10 to the sub-stage 5, and the position of the mount head 2 is corrected on the sub-stage 5. The electronic component is transferred to the substrate 17, and the transfer head 3 transfers the bond on the bond plate 21 to the substrate 17.

第２図はボンド供給装置７の詳細を示すものであって、
２０は支持台であり、その上面にボンド皿２１が置かれ
ている。このボンド皿２１は円板状であって、円周方向
にボンド２３を貯溜する溝部２２が環状に凹設されてい
る。２４は支持台２０の下部に設けられたモータであっ
て、ボンド皿２１を水平回転させる。２６はスキージで
あって、その下端部は上記溝部２２に挿入されており、
ボンド皿２１が水平回転することにより、ボンド２３の
液面を平滑する。２７はスキージ２６の保持杆であって
、支持部２８に支持されている。２９はマイクロメータ
であって、スキージ２６の高さを管理する。FIG. 2 shows details of the bond supply device 7,
Reference numeral 20 denotes a support stand, on which a bonding plate 21 is placed. The bond plate 21 is disc-shaped, and has an annular groove 22 recessed in the circumferential direction for storing the bond 23. Reference numeral 24 denotes a motor provided at the bottom of the support base 20, which horizontally rotates the bonding plate 21. 26 is a squeegee, the lower end of which is inserted into the groove 22;
By horizontally rotating the bond plate 21, the liquid surface of the bond 23 is smoothed. Reference numeral 27 denotes a holding rod for the squeegee 26, which is supported by a support portion 28. A micrometer 29 controls the height of the squeegee 26.

３２は液面検出器であって、支持台２０に立設された支
持部材３３に取り付けられている。Reference numeral 32 denotes a liquid level detector, which is attached to a support member 33 erected on the support stand 20.

液面検出器としては、例えば赤外線センサーを備えたも
のが採用される。ａは上記転写ヘッド３の転写ピンの着
地点であって、この液面検出器３２は、ボンド皿２１の
回転方向Ｎに関して、スキージ２６よりも前方であって
、かつ転写ピンの着地点ａよりも後方に設けられており
、スキージ２６により平滑された液面が転写ピンにより
荒らされる前に、その高さを検出する。３５はボンドが
貯溜されたシリンジ、３６は支持台２０に立設された支
持部材、３７はコンプレッサ、３８はチューブであり、
シリンジ３５にエアを圧送すると、その下端部のニード
ル３９からボンドが吐出されるものであり、シリンジ３
５やコンプレッサ３７は、ボンド供給部を構成している
。シリンジ３５は、上記着地点ａとスキージ２６の間に
あり、ニードル３９から吐出されて盛り上った液面を、
転写ピン２により採取する前に、スキージ２６により平
滑する。As the liquid level detector, for example, one equipped with an infrared sensor is employed. a is the landing point of the transfer pin of the transfer head 3, and this liquid level detector 32 is located ahead of the squeegee 26 with respect to the rotational direction N of the bond plate 21 and from the landing point a of the transfer pin. is also provided at the rear, and detects the height of the liquid level smoothed by the squeegee 26 before it is roughened by the transfer pins. 35 is a syringe in which bond is stored, 36 is a support member erected on the support stand 20, 37 is a compressor, 38 is a tube,
When air is forced into the syringe 35, the bond is discharged from the needle 39 at the lower end of the syringe 35.
5 and the compressor 37 constitute a bond supply section. The syringe 35 is located between the above-mentioned landing point a and the squeegee 26, and the syringe 35 is located between the landing point a and the squeegee 26, and the syringe 35 pumps the liquid level which has risen due to being discharged from the needle 39.
Before collecting with the transfer pin 2, it is smoothed with a squeegee 26.

第３図は動作を理解しやすいように描かれた展開図であ
り、次にこの図を参照しながら、動作を説明する。FIG. 3 is a developed diagram drawn to facilitate understanding of the operation, and the operation will be explained next with reference to this figure.

転写ヘッド３はボンド皿２１の上方に到来し、転写ピン
１２が昇降することにより、その下端部にボンドを付着
させて採取し、基板１７に移送して転写する。この種ボ
ンドの粘性は一般にかなり高いため、採取後には凹部Ａ
が生じるが、この凹部Ａは、ボンド皿２１が回転するこ
とにより、スキージ２６により平滑される。The transfer head 3 arrives above the bond plate 21, and as the transfer pin 12 moves up and down, the bond is deposited on the lower end thereof, collected, transferred to the substrate 17, and transferred. Since the viscosity of this type of bond is generally quite high, the recess A
However, this recess A is smoothed by the squeegee 26 as the bond plate 21 rotates.

さて、転写ピン１２により繰り返しボンドを採取してい
ると、ボンド２３は次第に減少し、その液面は低下する
。液面がスキージ２６の下端部よりも低下すると、スキ
ージ２６による液面の平滑はできなくなり、液面は荒れ
たままとなって転写ピン１２による採取量にばらつきが
生じ、最悪の場合、まった（採取されないこととなる。Now, as the bond is repeatedly sampled by the transfer pin 12, the bond 23 gradually decreases and its liquid level lowers. When the liquid level falls below the lower end of the squeegee 26, the liquid level cannot be smoothed by the squeegee 26, and the liquid level remains rough, causing variations in the amount collected by the transfer pins 12, and in the worst case, (It will not be collected.

そこで、スキージ２６による平滑直後において、液面検
出器３２によりボンドの平たんな液面を監視し、液面が
限界以下に低下したならば、これから液面低下信号を発
してコンプレッサ３７を駆動し、シリンジ３５にエアを
送る。するとエア圧によりボンドはニードル３９から吐
出されて、ボンド皿２１に補給される。Therefore, immediately after smoothing with the squeegee 26, the liquid level detector 32 monitors the flat liquid level of the bond, and if the liquid level drops below the limit, a liquid level drop signal is issued to drive the compressor 37. , sends air to the syringe 35. Then, the bond is discharged from the needle 39 by air pressure and replenished into the bond tray 21.

なおこの実施例では、シリンジ３５は、回転方向Ｎに関
してスキージ２６の手前側に設けているが、シリンジ３
５の設置位置は、任意に設定することが可能である。す
なわち、液面検出器３２と同様にスキージ２６の前方に
設けてもよく、この場合、シリンジ３５によりボンドを
補給したならば、上記各ヘッド１〜３の運転を一時的に
停止させ、その間にボンド皿２１を水平回転させて、盛
り上った液面を平滑したうえで、運転を再開すればよい
。In this embodiment, the syringe 35 is provided on the front side of the squeegee 26 with respect to the rotation direction N.
The installation position of 5 can be set arbitrarily. That is, like the liquid level detector 32, it may be provided in front of the squeegee 26. In this case, once the bond is replenished with the syringe 35, the operation of each of the heads 1 to 3 is temporarily stopped, and the The bonding plate 21 may be rotated horizontally to smooth the raised liquid surface, and then the operation may be restarted.

（発明の効果） 以上説明したように本発明は、この種電子部品実装装置
において、ボンド供給装置を、モータに駆動されて水平
回転するボンド皿と、このボンド皿に貯溜されたボンド
の液面を平滑するスキージと、ボンド皿の回転方向に関
してこのスキージよりも前方であって、かつ転写ヘッド
の転写ピンの着地点よりも後方に設けられたボンドの液
面検出器と、この液面検出器から発せられた液面低下信
号により、ボンド皿にボンドを供給するボンド供給部と
から構成しているので、ボンド皿のボンドが減少したな
らば、自動的にボンドを補給し、かつスキージにより液
面を平滑にして、平滑な液面から常に所定量のボンドを
転写ピンにより採取することができる。(Effects of the Invention) As described above, the present invention provides an electronic component mounting apparatus of this type in which the bond supply device is connected to a bond plate which is driven by a motor and rotates horizontally, and a liquid level of the bond stored in the bond plate. a bond liquid level detector provided in front of the squeegee with respect to the rotational direction of the bond plate and behind the landing point of the transfer pin of the transfer head; and this liquid level detector. This system consists of a bond supply section that supplies bond to the bond pan in response to a liquid level drop signal emitted from the bond pan.If the bond in the bond pan decreases, it automatically replenishes the bond and uses a squeegee to remove the liquid. By making the surface smooth, it is possible to always collect a predetermined amount of bond from the smooth liquid surface using the transfer pin.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の実施例を示すものであって、第１図は電子
部品実装装置の斜視図、第２図はボンド供給装置の斜視
図、第３図はボンド供給装置の展開図である。 １・・・サブ移送ヘッド ２・・・マウントヘッド ３・・・転写へ・７ド ７・・・ボンド供給装置 １２・・・転写ピン ２１・・・ボンド皿 ２３・・・ボンド ２４・・・モータ ２６・・・スキージ ３２・・・液面検出器 ３５．３７・・・ボンド供給部 ａ・・・着地点The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a perspective view of a bond supply device, and FIG. 3 is a developed view of the bond supply device. 1...Sub transfer head 2...Mount head 3...To transfer 7D7...Bond supply device 12...Transfer pin 21...Bond plate 23...Bond 24... Motor 26... Squeegee 32... Liquid level detector 35.37... Bond supply section a... Landing point

Claims (1)

【特許請求の範囲】[Claims] 電子部品供給部の電子部品をサブステージに移送するサ
ブ移送ヘッドと、サブステージの電子部品をマウント部
に位置決めされた基板に移送搭載するマウントヘッドと
、ボンド供給装置に備えられたボンドを転写ピンにより
採取して上記基板に転写する転写ヘッドとを備えた電子
部品実装装置において、上記ボンド供給装置が、モータ
に駆動されて水平回転するボンド皿と、このボンド皿に
貯溜されたボンドの液面を平滑するスキージと、ボンド
皿の回転方向に関してこのスキージよりも前方であって
、かつ上記転写ヘッドの転写ピンの着地点よりも後方に
設けられたボンドの液面検出器と、この液面検出器から
発せられた液面低下信号により、上記ボンド皿にボンド
を供給するボンド供給部とから成ることを特徴とする電
子部品実装装置。A sub-transfer head that transfers electronic components from the electronic component supply section to the sub-stage, a mount head that transfers and mounts the electronic components from the sub-stage onto a board positioned in the mount section, and a bond transfer pin provided in the bond supply device. In the electronic component mounting apparatus, the bond supply device includes a bond plate which is driven by a motor to rotate horizontally, and a liquid level of the bond stored in the bond plate. a bond liquid level detector provided in front of the squeegee in the rotational direction of the bond plate and behind the landing point of the transfer pin of the transfer head; An electronic component mounting apparatus comprising: a bond supply section that supplies bond to the bond tray in response to a liquid level drop signal emitted from the device.
JP63221726A 1988-09-05 1988-09-05 Electronic component mounting device Expired - Fee Related JPH0779112B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63221726A JPH0779112B2 (en) 1988-09-05 1988-09-05 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63221726A JPH0779112B2 (en) 1988-09-05 1988-09-05 Electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH0269948A true JPH0269948A (en) 1990-03-08
JPH0779112B2 JPH0779112B2 (en) 1995-08-23

Family

ID=16771296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63221726A Expired - Fee Related JPH0779112B2 (en) 1988-09-05 1988-09-05 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JPH0779112B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05281186A (en) * 1992-03-30 1993-10-29 Shimadzu Corp Combustion exhaust gas measuring device
US20100083491A1 (en) * 2008-10-06 2010-04-08 Panasonic Corporation Electonic component mounting apparatus
JP2010245372A (en) * 2009-04-08 2010-10-28 Panasonic Corp Electronic component-mounting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05281186A (en) * 1992-03-30 1993-10-29 Shimadzu Corp Combustion exhaust gas measuring device
US20100083491A1 (en) * 2008-10-06 2010-04-08 Panasonic Corporation Electonic component mounting apparatus
JP2010092954A (en) * 2008-10-06 2010-04-22 Panasonic Corp Electronic component mounting apparatus
JP2010245372A (en) * 2009-04-08 2010-10-28 Panasonic Corp Electronic component-mounting device

Also Published As

Publication number Publication date
JPH0779112B2 (en) 1995-08-23

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