JPH0267949A - Soldered part checking apparatus - Google Patents
Soldered part checking apparatusInfo
- Publication number
- JPH0267949A JPH0267949A JP63220889A JP22088988A JPH0267949A JP H0267949 A JPH0267949 A JP H0267949A JP 63220889 A JP63220889 A JP 63220889A JP 22088988 A JP22088988 A JP 22088988A JP H0267949 A JPH0267949 A JP H0267949A
- Authority
- JP
- Japan
- Prior art keywords
- lights
- soldered
- stage
- signal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 25
- 238000007689 inspection Methods 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000013500 data storage Methods 0.000 claims description 6
- 230000007423 decrease Effects 0.000 abstract description 6
- 230000001788 irregular Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 9
- 239000000284 extract Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半田付検査装置、特に、プリント基板に半田付
されたチップ部品、８０Ｐ、ＱＦＰ等の表面実装部品の
半田付状態の検査に適用しうる半日付検査装置に関する
。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to a soldering inspection device, particularly to inspecting the soldering state of chip components soldered to a printed circuit board, surface mount components such as 80P, QFP, etc. This invention relates to a half-date inspection device that can be used.
従来の半田付検査装置は、第５図に示すようにＸＹステ
ージ部ｌと、ライト２と、■ＴＶカメラ３と、判定部１
１と、ＸＹステージ駆動部６と、表示装［７とを含んで
構成される。As shown in FIG. 5, the conventional soldering inspection device includes an XY stage part l, a light 2, a TV camera 3, and a determining part 1.
1, an XY stage drive section 6, and a display device [7].
ＸＹステージ部ｌはＸＹステージｌａと機構部１ｂから
なる。ＸＹステージ１ａはチップ部品１３゜１４が半田
付されたプリント基板１２を載置し、機構部１ｂに駆動
されて移動しプリント基板１２を位置決めする。ライト
２は照射光Ａをチップ部具
品の半田付部１６に照射する。反射して得られた反射光
ＢをＩＴＶカメラ３は入力して光電変換し、反射光Ｂの
光量に応じたアナログ画像信号ａを出力する。The XY stage section l consists of an XY stage la and a mechanism section 1b. The XY stage 1a places a printed circuit board 12 on which chip components 13 and 14 are soldered, and is driven by a mechanical section 1b to move and position the printed circuit board 12. The light 2 irradiates the soldering portion 16 of the chip component with irradiation light A. The ITV camera 3 inputs the reflected light B obtained by reflection, performs photoelectric conversion, and outputs an analog image signal a corresponding to the amount of the reflected light B.
判定部１１はアナログ画像信号ａを入力し、予め設定き
れた基準値と比較して良否を判定する。The determination unit 11 inputs the analog image signal a and compares it with a preset reference value to determine whether it is good or bad.
判定後は、ＸＹステージ駆動信号ｇがＸＹステージ駆動
部６に出力され、ＸＹステージ駆動部６はＸＹステージ
１ａを移動して次の検査位置へ位置決めする。また同時
に、表示装置７は判定の結果を出力する。After the determination, the XY stage drive signal g is output to the XY stage drive section 6, and the XY stage drive section 6 moves the XY stage 1a to position it to the next inspection position. At the same time, the display device 7 outputs the determination result.
次に、第６図を参照しながら動作を説明する。Next, the operation will be explained with reference to FIG.
チップ部品１３の電極１３ａはプリント基板１２のパラ
）１２ａに半田付されている。半田付部１６は図に示す
形状をしていて、照射光Ａを入射して反射光ＢをＩＴＶ
カメラ３へ反射する。ところが、この半田付部１６が不
良となって形状が大きく変化すると、反射光Ｂは図に示
す方向と異なる方向に反射して、高輝度な正反射光はＩ
ＴＶカメラ３に入射せず微弱な乱反射光のみが入力する
。従って、ＩＴＶカメラ３に入力する光量は低下する。The electrode 13a of the chip component 13 is soldered to the parallel plate 12a of the printed circuit board 12. The soldering part 16 has the shape shown in the figure, and receives the irradiation light A and sends the reflected light B to the ITV.
Reflects to camera 3. However, if this soldered part 16 becomes defective and its shape changes significantly, the reflected light B will be reflected in a direction different from that shown in the figure, and the high-intensity specularly reflected light will become I.
The light does not enter the TV camera 3, and only weak diffusely reflected light enters the TV camera 3. Therefore, the amount of light input to the ITV camera 3 decreases.
このように、■ＴＶカメラ３に入力する反射光Ｂの光景
は半田付部１６の形状に応じて増減した対応関係を有し
ていて、この反射光Ｂの光量を予め設定した基準値と比
較して半田付部１６の良否を検査している。In this way, the scene of the reflected light B input to the TV camera 3 has a correspondence relationship that increases or decreases depending on the shape of the soldering part 16, and the amount of reflected light B is compared with a preset reference value. The soldered portion 16 is inspected for quality.
しかしながら、半田付部の良品の形状はチップ部品の電
極やプリント基板のバットの形状１．および半田付の条
件によって各種に変化し、高輝度な正反射光をＩＴＶカ
メラに入力するにはそれらの半田付部の形状に対応した
照射光の適正な角度があシ、同一のプリント基板にハン
ダ付された多種類のチップ部品の半田付部を検査するに
は、ライトの照射する角度をその次びに調整する必要が
あった。また、同じチップ部品の半田付部であっても良
品として許容する形状の変化が大きい場合がちシ、その
場合、反射光Ｂの方向が変化してＩＴ■カメラに入力す
る光量の変化が大きく、良否の判定基準値を予め下げて
設定する必要があって、そのため、乱反射光であっても
良品と判定したりすることがあり検査精度の低下はまぬ
がれ得なかった。すなわち、従来の半田付検査装置は、
生産性が低く信頼性も低いという問題があった。However, the shape of a good soldered part is the shape of the electrode of a chip component or the butt of a printed circuit board. It varies depending on the soldering conditions, and in order to input high-intensity specularly reflected light into the ITV camera, the appropriate angle of the irradiation light that corresponds to the shape of the soldering part is required. In order to inspect the soldered parts of various types of soldered chip components, it was necessary to adjust the illumination angle of the light each time. In addition, even if the soldered part of the same chip component is soldered, there are often large changes in the shape that are accepted as non-defective products, in which case the direction of reflected light B changes and the amount of light input to the IT camera changes significantly. It is necessary to lower and set the standard value for determining pass/fail in advance, and as a result, even diffusely reflected light may be determined to be a non-defective product, resulting in an unavoidable drop in inspection accuracy. In other words, conventional soldering inspection equipment
There were problems with low productivity and low reliability.
上述した従来の半田付検査装置は１個のライトで半田付
部を照射する構造となっているので、プリント基板に半
田付された多種類のチップ部品の各種の形状の半田付部
を検査するのに長時間を要して生産性が低く、！！な、
精度が悪くて検査の信頼性も低いという欠点があった。The conventional soldering inspection equipment described above has a structure in which a single light illuminates the soldered parts, so it can inspect soldered parts of various shapes of various types of chip components soldered to printed circuit boards. It takes a long time and productivity is low! ! What?
The disadvantage was that the accuracy and reliability of the test were low.
本発明の半田付検査装置は部品が半田付されたプリント
基板を載置するＸＹステージと前記ＸＹステージを駆動
して位置決めする機構部からなるＸＹステージ部と、照
射光を互に異なる角度で照射する複数のライトと、前記
照射光が前記部品の半田付部に照射されて反射した反射
光を入力して得られた画像を光電変換してアナログ画像
信号を出力するＩＴＶカメラと、前記アナログ画像信号
をＡＤ変換してディジタル画像信号を出力しＡＤ変換が
終了するとＡＤ変換終了信号を出力するＡＤ変換回路と
前記ディジタル画像信号を入力して前記画像から前記半
田付部の画像のみを抽出したマスク画像信号を出力する
マスク回路と前記マスク画像信号を加算して加算値信号
を出力する加算回路と前記加算値信号を予め設定された
基準値と比較して良否を判定する判定回路からなる判定
部と、前記判定部による判定の結果を出力する表示装置
と、前記プリント基板に半田付された各々の部品の半田
付部に対応して複数の前記ライトのうちの点灯すべきラ
イトと前記ＸＹステージの位置決め位置をそれぞれ検査
データとして記憶した検査データ記憶回路と前記ＡＤ変
換終了信号を入力して前記検査データに基づいて複数の
前記ライトのうちの点灯するライトを指定する点灯信号
と前記ＸＹステージの位置決め位置を指令するＸＹステ
ージ駆動信号をそれぞれ出力する制御回路と前記点灯信
号を入力して複数の前記ライトのうちの指定されたライ
トを点灯する照明駆動回路からなる制御部と、前記ＸＹ
ステージ駆動信号を入力して前記機構部を駆動して前記
ＸＹステージを位置決めするＸＹステージ駆動部を含ん
で構成される。The soldering inspection apparatus of the present invention includes an XY stage section that includes an XY stage on which a printed circuit board with soldered components is placed, and a mechanism section that drives and positions the XY stage, and irradiates the irradiation light at different angles. an ITV camera that outputs an analog image signal by photoelectrically converting an image obtained by inputting reflected light that is reflected when the irradiation light is irradiated onto a soldered part of the component; An AD conversion circuit that converts a signal into an AD signal, outputs a digital image signal, and outputs an AD conversion completion signal when the AD conversion is completed; and a mask that inputs the digital image signal and extracts only the image of the soldering part from the image. A determination unit that includes a mask circuit that outputs an image signal, an addition circuit that adds the mask image signal and outputs an added value signal, and a determination circuit that compares the added value signal with a preset reference value to determine quality. a display device that outputs the result of the determination by the determination section; a light to be turned on among the plurality of lights corresponding to the soldered portion of each component soldered to the printed circuit board; and the XY stage. A test data storage circuit that stores the positioning positions of the XY stage as test data, a lighting signal that inputs the AD conversion end signal and designates which light to turn on among the plurality of lights based on the test data, and the XY stage. a control section that includes a control circuit that outputs an XY stage drive signal that commands a positioning position, and a lighting drive circuit that inputs the lighting signal and lights a specified light among the plurality of lights;
The apparatus includes an XY stage drive section that inputs a stage drive signal, drives the mechanism section, and positions the XY stage.
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing one embodiment of the present invention.
第１図に示す半田付検査装置は、ＸＹステージ部１と、
ライト２ａ〜２ｄと、ＩＴＶカメラ３と、判定部４と、
制御部５と、ＸＹステージ駆動部６と、表示装置７とを
含んで構成される。The soldering inspection device shown in FIG. 1 includes an XY stage section 1,
Lights 2a to 2d, ITV camera 3, and determination unit 4,
It is configured to include a control section 5, an XY stage drive section 6, and a display device 7.
ＸＹステージ部１は、ＸＹステージｌａと機構部１ｂか
らなる。ＸＹステージｌａは、チップ部品１３．１４が
半田付されたプリント基板１２を載置し、機構部１ｂに
よυ駆動されて移動しプリント基板１２を位置決めする
。ライト２ａ、２ｂ。The XY stage section 1 consists of an XY stage la and a mechanism section 1b. The XY stage la places the printed circuit board 12 on which the chip components 13 and 14 are soldered, and moves by being driven by the mechanical section 1b to position the printed circuit board 12. Lights 2a, 2b.
２ｃ、２ｄは互に異なる角度に配設されて、各々異なる
角度からチップ部品１３のハンダ付部１６に照・射光を
照射する。図ではライ）２ｄから照射された照射光Ａが
半田付部１６に照射され、反射し九反射光ＢがＩＴＶカ
メラ３に入射している。2c and 2d are disposed at different angles, and irradiate the soldering portion 16 of the chip component 13 with light from different angles. In the figure, irradiation light A irradiated from line 2d is irradiated onto the soldering portion 16, and reflected light B enters the ITV camera 3.
ＩＴＶカメラ３は入力した反射光Ｂを光電変換し、反射
光Ｂの入力し良画像の光量に応じたアナログ画像信号ａ
を出力する。The ITV camera 3 photoelectrically converts the input reflected light B, and generates an analog image signal a corresponding to the amount of input reflected light B and a good image.
Output.
判定部４はＡＤ変換回路４ａと、マスク回路４ｂと、加
算回路４Ｃと、判定回路４ｄとからなる。The determination section 4 includes an AD conversion circuit 4a, a mask circuit 4b, an addition circuit 4C, and a determination circuit 4d.
ＡＤ変換回路４ａはアナログ画像信号ａを多値階調のデ
ィジタル画像信号すに変換してマスク回路４ｂに出力す
る。マスク回路４ｂは、入力された反射光Ｂの中で半田
付部１６以外の部分からの反射光を除くために、ディジ
タル画像信号すのうちからハンダ付部１６の画像を抽出
し、それ以外の画像を最も暗い零値にしてマスク画像信
号Ｃを出力する。加算回路４Ｃはマスク画像信号Ｃの総
和を計算して加算偽信号ｄを出力する。判定回路４ｄは
、この加算値信号ｄを予め設定された基準値と比較して
良否を判定する。このようにして、判定部４はハンダ付
部１６からの反射光量を算定して基準値と比較して良否
を検査している。The AD conversion circuit 4a converts the analog image signal a into a multi-level gradation digital image signal and outputs it to the mask circuit 4b. The mask circuit 4b extracts the image of the soldering part 16 from among the digital image signals in order to remove the reflected light from parts other than the soldering part 16 from the input reflected light B, and extracts the image of the soldering part 16 from the digital image signal. A mask image signal C is output with the image set to the darkest zero value. The adder circuit 4C calculates the sum of the mask image signals C and outputs an added false signal d. The judgment circuit 4d compares the added value signal d with a preset reference value to judge whether it is good or bad. In this way, the determining section 4 calculates the amount of reflected light from the soldering section 16 and compares it with a reference value to inspect the quality.
表示装置７はプリンター、ＣＲＴあるいはインクプロジ
ェクタ−等からなり、判定の結果を表示したり、半田付
部に良否に応じてインクドツトしたシする。The display device 7 consists of a printer, CRT, ink projector, etc., and displays the results of the determination and emits ink dots on the soldered portions depending on whether the soldering parts are good or bad.
制御部５は検査データ記憶回路８と、制御回路９と、照
明駆動回路１０からなる。検査データ記憶回路８は、検
査対象のチップ部品に応じて点灯すべきライトとＸＹス
テージの位置決め位置を検査データとして記憶している
。制御回路９は、ＡＤ変換回路４ａからＡＤ変換の終了
時に出力されたＡＤ変変換終了信号上受けて、検査デー
タ記憶回路８の検査データに基づいて照明駆動回路１゜
に点灯すべきライトを指示する点灯信号ｆを出力すると
ともに、ＸＹステージ駆動部６にＸＹステージ駆動信号
ｇを出力する。照明駆動回路１０は点灯信号ｆを受けて
ライト２ａ 、 ２ｂ 、 ２ｃ 、 ２ｄのいずれか
を点灯する。The control section 5 includes an inspection data storage circuit 8, a control circuit 9, and a lighting drive circuit 10. The inspection data storage circuit 8 stores, as inspection data, the light to be turned on and the positioning position of the XY stage according to the chip component to be inspected. The control circuit 9 receives the AD conversion completion signal output from the AD conversion circuit 4a at the end of AD conversion, and instructs the illumination drive circuit 1° which light to turn on based on the inspection data in the inspection data storage circuit 8. At the same time, it outputs an XY stage drive signal g to the XY stage drive section 6. The lighting drive circuit 10 receives the lighting signal f and lights any one of the lights 2a, 2b, 2c, and 2d.
ＸＹステージ駆動部６は、ＸＹステージ駆動信号ｇを受
けて機構部１ｂを駆動してＸＹステージ１ａ１を位置決
めする。The XY stage drive section 6 receives the XY stage drive signal g and drives the mechanism section 1b to position the XY stage 1a1.
次に、第２図〜第４図を参照しながら動作を説明する。Next, the operation will be explained with reference to FIGS. 2 to 4.
第２図の場合は、チップ部品１３の電極１３ａがプリン
ト基板１２のバッド１２ａに半田付されている。半田付
部１６は図に示す形状をしていて、ライ）２ｄからの照
射光Ａを入射して反射光ＢをＩＴＶカメラ３に反射して
いる。この半田付部１６が不良となって形状が変化する
と、反射光Ｂは図に示す方向と異なる方向に反射して、
高輝度な正反射光はＩＴＶカメ２３には入射せず微弱な
乱反射光のみが入射して光量が低下するので不良と判定
される。In the case of FIG. 2, the electrode 13a of the chip component 13 is soldered to the pad 12a of the printed circuit board 12. The soldering part 16 has the shape shown in the figure, and receives the irradiation light A from the lie 2d and reflects the reflected light B to the ITV camera 3. If this soldered part 16 becomes defective and changes its shape, the reflected light B will be reflected in a direction different from that shown in the figure.
The high-intensity specularly reflected light does not enter the ITV camera 23, but only the weak diffusely reflected light enters the ITV camera 23, and the amount of light decreases, so it is determined to be defective.
第３図の場合は、チップ部品１４の電極１４ａがプリン
ト基板１２のパッド１２ｂに半田付されている。半田付
部１７は図に示す形状をしていて、ライ）２ａからの照
射光Ｃを入射して反射光りをＩＴＶカメラ３に反射して
いる。この半田付部１７が不良となって形状が変化する
と、反射光りは図に示す方向と異なる方向に反射して、
高輝度な正反射光はＩＴＶカメラ３には入射せず微弱な
乱反射光のみが入射して光量が低下するので不良と判定
される。In the case of FIG. 3, the electrode 14a of the chip component 14 is soldered to the pad 12b of the printed circuit board 12. The soldering part 17 has the shape shown in the figure, and receives the irradiation light C from the wire 2a and reflects the reflected light to the ITV camera 3. If this soldered part 17 becomes defective and changes its shape, the reflected light will be reflected in a direction different from that shown in the figure.
The high-intensity specularly reflected light does not enter the ITV camera 3, but only the weak diffusely reflected light enters the ITV camera 3, and the amount of light decreases, so it is determined to be defective.
第４図は、チップ部品１５の電極１５ａがプリント基板
１２のパッド１２ｃに半田付でれていて、この半田付部
１８が良品として許容する形状の変化が大きい場合で、
ライト２ｂと２Ｃを点灯して図示の角度から照射光Ｅと
ｒ′をそれぞれ照射している。２個のライトを点灯して
いるため、半田付部１８の形状が良品の範囲で変化して
も、いずれかの照射光による高輝度な正反射光が反射光
ＧとなってＩＴＶカメラ３に入射するので、良否の判定
基準値は低く設定する必要がなく、検査の精度は高く維
持できる。なお、２個のライトを同時に点灯しても照射
光の互の角度を適正に調整すれば過度な乱反射光による
精度の低下は防止できる。FIG. 4 shows a case where the electrode 15a of the chip component 15 is soldered to the pad 12c of the printed circuit board 12, and the soldered portion 18 has a large change in shape that is acceptable as a non-defective product.
Lights 2b and 2C are turned on to emit irradiation lights E and r' from the angles shown, respectively. Since two lights are turned on, even if the shape of the soldered part 18 changes within the range of a non-defective product, the high-intensity specularly reflected light from either of the irradiated lights becomes reflected light G and is not reflected by the ITV camera 3. Since the light is incident, there is no need to set a low standard value for determining pass/fail, and inspection accuracy can be maintained at a high level. Note that even if two lights are turned on at the same time, if the mutual angles of the irradiated lights are properly adjusted, a decrease in accuracy due to excessively diffusely reflected light can be prevented.
上述したように、本装置は複数個のライトを適切に点灯
させることによって、ＸＹステージに載置されたプリン
ト基板の半田付された多種類のチップ部品の半田付部を
逐次自動的に検査できて検査の精度も高い。As mentioned above, this device can sequentially and automatically inspect the soldered parts of various types of chip components soldered on a printed circuit board placed on an XY stage by appropriately lighting multiple lights. The accuracy of the test is also high.
なお、上述の実施例では４個のライトを配設した例で説
明したが、ライトはその他の個数であっても良く、また
、検査する対象の部品は、実施例で述べたチップ部品に
限定するものではなく、他の種々の部品の半田付部の検
査に適用して良いことは言うまでもない。In addition, although the above-mentioned embodiment is explained using an example in which four lights are arranged, other numbers of lights may be used, and the parts to be inspected are limited to the chip parts described in the embodiment. Needless to say, the present invention is not limited to the inspection of soldered parts of various other parts.
本発明の半田付検査装置は、１個のライトを設ける代シ
に複数個のライトを配設することによシ、互に異なる角
度からの照射光やそれらの照射光を合成し九照射光を得
ることができるので、プリント基板に半田付された多種
類のチップ部品の各種の形状の半田付部の検査を高速で
、しかも、高精度で行うことができ、生産性と信頼性の
向上をはかることができるという効果がある。The soldering inspection device of the present invention has a plurality of lights arranged in place of a single light, thereby combining the irradiated lights from different angles and the nine irradiated lights. As a result, the soldered parts of various shapes of various types of chip parts soldered to printed circuit boards can be inspected at high speed and with high accuracy, improving productivity and reliability. It has the effect of being able to measure.
第１図は本発明の一実例を示すブロック図、第２図〜第
４図は第１図に示す実施例の一使用例を示す部分拡大側
面図、第５図は従来の一例を示すプロ、り図、第６図は
第５図に示す従来例の使用例を示す部分拡大側面図であ
る。
１・・・・・・ＸＹステージ部、ｌａ・・・・・・ＸＹ
ステージ、１ｂ・・・・・・機構部、２，２ａ、２ｂ、
２ｃ、２ｄ・・・・・・ライト、３・・・・・・ＩＴＶ
カメラ、４．１１・・・・・・判定部、４ａ・・・・・
・ＡＤ変換回路、４ｂ・・・・・・マスク回路、４ｃ・
・・・・・加算回路、４ｄ・・・・・・判定回路、５・
・・制御部、６・・・・・・ＸＹステージ駆動部、７・
・・・・・表示装置、８・・・・・・検査データ記憶回
路、９・・・・・・制御回路、１０・・・・・・照明駆
動回路、１２・・・・・・プリント基板、１２ａ、１２
ｂ、１２Ｃ−・・−パッド、１３゜１４．１５・旧・・
チップ部品、１３ａ 、１４ａ 。
１５ ａ ＝電極、１６，１７．１８−°−°半日付部
、Ａ、Ｃ，Ｅ、Ｆ・・・・・・照射光、Ｂ、Ｄ、Ｇ・・
・・・・反射光、
ａ・、・・・・・アナログ画像信号、ｂ・・・・・・デ
ィジタル画像信号、Ｃ・・・・・・マスク画像信号、ｄ
・・・・・・加算値信号、ｅ・・・・・・ＡＤ変換終了
信号、ｆ・・・・・・点灯信号、ｇ・・・・・・ＸＹス
テージ駆動信号。
代理人 弁理士 内 原 晋
第６聞FIG. 1 is a block diagram showing an example of the present invention, FIGS. 2 to 4 are partially enlarged side views showing an example of the use of the embodiment shown in FIG. 1, and FIG. FIG. 6 is a partially enlarged side view showing an example of use of the conventional example shown in FIG. 1...XY stage section, la...XY
Stage, 1b... Mechanism section, 2, 2a, 2b,
2c, 2d...Light, 3...ITV
Camera, 4.11... Judgment unit, 4a...
・AD conversion circuit, 4b...Mask circuit, 4c・
... Addition circuit, 4d ... Judgment circuit, 5.
...Control section, 6...XY stage drive section, 7.
... Display device, 8 ... Inspection data storage circuit, 9 ... Control circuit, 10 ... Lighting drive circuit, 12 ... Printed circuit board , 12a, 12
b, 12C-...-Pad, 13゜14.15・Old...
Chip parts, 13a, 14a. 15 a = electrode, 16, 17.18-°-° half-date part, A, C, E, F......irradiation light, B, D, G...
...Reflected light, a... Analog image signal, b... Digital image signal, C... Mask image signal, d
...Additional value signal, e...AD conversion end signal, f...Lighting signal, g...XY stage drive signal. Agent Patent Attorney Susumu Uchihara 6th hearing
Claims (1)
ジと前記ＸＹステージを駆動して位置決めする機構部か
らなるＸＹステージ部と、照射光を互に異なる角度で照
射する複数のライトと、前記照射光が前記部品の半田付
部に照射されて反射した反射光を入力して得られた画像
を光電変換してアナログ画像信号を出力するＩＴＶカメ
ラと、前記アナログ画像信号をＡＤ変換してディジタル
画像信号を出力しＡＤ変換が終了するとＡＤ変換終了信
号を出力するＡＤ変換回路と前記ディジタル画像信号を
入カして前記画像から前記半田付部の画像のみを抽出し
たマスク画像信号を出力するマスク回路と前記マスク画
像信号を加算して加算値信号を出力する加算回路と前記
加算値信号を予め設定された基準値と比較して良否を判
定する判定回路からなる判定部と、前記判定部による判
定の結果を出力する表示装置と、前記プリント基板に半
田付された各々の部品の半田付部に対応して複数の前記
ライトのうちの点灯すべきライトと前記ＸＹステージの
位置決め位置をそれぞれ検査データとして記憶した検査
データ記憶回路と前記ＡＤ変換終了信号を入力して前記
検査データに基づいて複数の前記ライトのうちの点灯す
るライトを指定する点灯信号と前記ＸＹステージの位置
決め位置を指令するＸＹステージ駆動信号をそれぞれ出
力する制御回路と前記点灯信号を入力して複数の前記ラ
イトのうちの指定されたライトを点灯する照明駆動回路
からなる制御部と、前記ＸＹステージ駆動信号を入力し
て前記機構部を駆動して前記ＸＹステージを位置決めす
るＸＹステージ駆動部とを含むことを特徴とする半田付
検査装置。An XY stage section includes an XY stage on which a printed circuit board with soldered components is placed, a mechanism section that drives and positions the XY stage, a plurality of lights that irradiate light at different angles, and a plurality of lights that emit irradiation light at different angles; An ITV camera that inputs reflected light that is irradiated onto the soldered portion of the component, photoelectrically converts the image obtained, and outputs an analog image signal; and an ITV camera that converts the analog image signal into an analog image signal and generates a digital image. an AD conversion circuit that outputs a signal and outputs an AD conversion end signal when AD conversion is completed; and a mask circuit that inputs the digital image signal and outputs a mask image signal obtained by extracting only the image of the soldering part from the image. and a determination unit including an addition circuit that adds the mask image signal and outputs an added value signal, and a determination circuit that compares the added value signal with a preset reference value to determine whether it is good or bad, and a determination by the determination unit. a display device that outputs the results of the test, and inspection data for the light to be turned on among the plurality of lights corresponding to the soldered part of each component soldered to the printed circuit board and the positioning position of the XY stage. an XY stage that inputs the inspection data storage circuit stored in the above data and the AD conversion end signal to command a lighting signal that specifies which light to turn on among the plurality of lights based on the inspection data, and a positioning position of the XY stage. a control section that includes a control circuit that outputs drive signals, a lighting drive circuit that inputs the lighting signal and lights a designated light among the plurality of lights; and a control section that inputs the XY stage drive signal and controls the mechanism. 1. A soldering inspection apparatus comprising: an XY stage drive section that positions the XY stage by driving the XY stage drive section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63220889A JPH0739996B2 (en) | 1988-09-02 | 1988-09-02 | Soldering inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63220889A JPH0739996B2 (en) | 1988-09-02 | 1988-09-02 | Soldering inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0267949A true JPH0267949A (en) | 1990-03-07 |
| JPH0739996B2 JPH0739996B2 (en) | 1995-05-01 |
Family
ID=16758122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63220889A Expired - Lifetime JPH0739996B2 (en) | 1988-09-02 | 1988-09-02 | Soldering inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739996B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449638A (en) * | 1994-06-06 | 1995-09-12 | United Microelectronics Corporation | Process on thickness control for silicon-on-insulator technology |
| US5484738A (en) * | 1992-06-17 | 1996-01-16 | International Business Machines Corporation | Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
| JPH09311020A (en) * | 1996-05-23 | 1997-12-02 | Nec Corp | Inspection apparatus for protruding part |
| US10774841B2 (en) | 2014-01-02 | 2020-09-15 | Samsung Electronics Co., Ltd. | Fan motor assembly and vacuum cleaner having the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5427222B2 (en) * | 2011-10-27 | 2014-02-26 | Ｗｉｔ株式会社 | Appearance inspection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
-
1988
- 1988-09-02 JP JP63220889A patent/JPH0739996B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61293657A (en) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | Method for inspecting soldering appearance |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484738A (en) * | 1992-06-17 | 1996-01-16 | International Business Machines Corporation | Method of forming silicon on oxide semiconductor device structure for BiCMOS integrated circuits |
| US5449638A (en) * | 1994-06-06 | 1995-09-12 | United Microelectronics Corporation | Process on thickness control for silicon-on-insulator technology |
| JPH09311020A (en) * | 1996-05-23 | 1997-12-02 | Nec Corp | Inspection apparatus for protruding part |
| US10774841B2 (en) | 2014-01-02 | 2020-09-15 | Samsung Electronics Co., Ltd. | Fan motor assembly and vacuum cleaner having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739996B2 (en) | 1995-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5245421A (en) | Apparatus for inspecting printed circuit boards with surface mounted components | |
| JPH02231510A (en) | Substrate inspection device | |
| US7664311B2 (en) | Component mounting board inspecting apparatus | |
| KR100281881B1 (en) | cream solder inspection apparatus and the method thereof | |
| EP0341806B1 (en) | Apparatus for inspecting circuit boards with surface mounted components | |
| JPS63265442A (en) | Appearance inspecting apparatus for semiconductor device | |
| JPH0267949A (en) | Soldered part checking apparatus | |
| JP3243385B2 (en) | Object shape inspection device | |
| JP2782759B2 (en) | Solder appearance inspection device | |
| JP3279121B2 (en) | Solder state output device and solder inspection system using the same | |
| JPH02213711A (en) | Parts inspecting device | |
| JPH02216408A (en) | Substrate inspection device | |
| JP3038107B2 (en) | Soldering inspection method | |
| JPH04104044A (en) | Apparatus for inspecting printed state of soldering paste | |
| JP2605971B2 (en) | Observation equipment | |
| JP2629798B2 (en) | Board inspection equipment | |
| JP2801657B2 (en) | Package inspection equipment with pins | |
| JPH10160426A (en) | Method and equipment for inspecting object to be inspected | |
| JPH10275885A (en) | Method and device for automatically checking positional data of j-lead | |
| JPH04212047A (en) | Soldering inspection device of printed circuit board | |
| JPH06174444A (en) | Soldered state inspection method for discrete type electronic component | |
| JP3061952B2 (en) | Soldering inspection equipment | |
| JP2002158437A (en) | Method and apparatus for removing solderless part of printed board | |
| JPH04140650A (en) | Apparatus for inspecting printed circuit board | |
| JPH05109858A (en) | Tab soldering inspecting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090501 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090501 Year of fee payment: 14 |