JPH0267695U - - Google Patents
Info
- Publication number
- JPH0267695U JPH0267695U JP14609388U JP14609388U JPH0267695U JP H0267695 U JPH0267695 U JP H0267695U JP 14609388 U JP14609388 U JP 14609388U JP 14609388 U JP14609388 U JP 14609388U JP H0267695 U JPH0267695 U JP H0267695U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- good thermal
- wiring board
- printed wiring
- core material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011162 core material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例による印刷配線板
を示す断面側面図、第２図はこの考案の他の実施
例を示す断面側面図、第３図〜第５図は柱材の他
の実施例を示す説明図、第６図は従来の印刷配線
板を示す断面側面図である。
図において、１は電子部品、２はリード部、３
はスルーホール部、４は絶縁部、５は芯材、６，
６ａ，６ｂ，６ｃは柱材、７は板材、８はフイン
、９は結合部、１０は平板継手を示す。なお、図
中、同一符号は同一、又は相当部分を示す。
Fig. 1 is a sectional side view showing a printed wiring board according to one embodiment of this invention, Fig. 2 is a sectional side view showing another embodiment of this invention, and Figs. FIG. 6, an explanatory diagram showing an embodiment, is a cross-sectional side view showing a conventional printed wiring board. In the figure, 1 is an electronic component, 2 is a lead part, and 3 is a lead part.
is the through-hole part, 4 is the insulating part, 5 is the core material, 6,
6a, 6b, and 6c are pillar materials, 7 is a plate material, 8 is a fin, 9 is a joint, and 10 is a flat plate joint. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
において、前記熱伝導性の良好な芯材と直結又は
間接的に結合した柱状の熱伝導性の良好な材料を
設けたことを特徴とする印刷配線板。 A printed wiring board having a core material made of a material with good thermal conductivity, characterized in that a columnar material with good thermal conductivity is directly or indirectly connected to the core material with good thermal conductivity. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609388U JPH0267695U (en) | 1988-11-08 | 1988-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609388U JPH0267695U (en) | 1988-11-08 | 1988-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267695U true JPH0267695U (en) | 1990-05-22 |
Family
ID=31415261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14609388U Pending JPH0267695U (en) | 1988-11-08 | 1988-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267695U (en) |
-
1988
- 1988-11-08 JP JP14609388U patent/JPH0267695U/ja active Pending
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