JPH0263653A - Mold powder for continuous casting of copper and copper alloy - Google Patents
Mold powder for continuous casting of copper and copper alloyInfo
- Publication number
- JPH0263653A JPH0263653A JP6187488A JP6187488A JPH0263653A JP H0263653 A JPH0263653 A JP H0263653A JP 6187488 A JP6187488 A JP 6187488A JP 6187488 A JP6187488 A JP 6187488A JP H0263653 A JPH0263653 A JP H0263653A
- Authority
- JP
- Japan
- Prior art keywords
- mold powder
- copper
- continuous casting
- powder
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 38
- 238000009749 continuous casting Methods 0.000 title claims abstract description 13
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 8
- 239000010949 copper Substances 0.000 title claims abstract description 8
- 229910021538 borax Inorganic materials 0.000 claims abstract description 5
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004328 sodium tetraborate Substances 0.000 claims abstract description 5
- 235000010339 sodium tetraborate Nutrition 0.000 claims abstract description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Substances [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 5
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 3
- 239000001632 sodium acetate Substances 0.000 claims description 3
- 235000017281 sodium acetate Nutrition 0.000 claims description 3
- 230000008018 melting Effects 0.000 abstract description 19
- 238000002844 melting Methods 0.000 abstract description 19
- 239000002184 metal Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 238000006243 chemical reaction Methods 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 abstract description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 235000017550 sodium carbonate Nutrition 0.000 description 3
- GXCLVBGFBYZDAG-UHFFFAOYSA-N N-[2-(1H-indol-3-yl)ethyl]-N-methylprop-2-en-1-amine Chemical compound CN(CCC1=CNC2=C1C=CC=C2)CC=C GXCLVBGFBYZDAG-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 150000003388 sodium compounds Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Continuous Casting (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は銅および銅合金、特に高温脆化しゃすい合金元
素を含む銅合金の連続鋳造に用いるモールドパウダーに
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a molding powder used for continuous casting of copper and copper alloys, particularly copper alloys containing alloy elements that are brittle at high temperatures.
［従来の技術］
銅および銅合金を両端開放の鋳型を用いて連続鋳造する
に当っては、溶湯金属の適正な凝固や鋳塊と鋳型との粘
着防止について配慮する必要かある。[Prior Art] When continuously casting copper and copper alloys using a mold with both ends open, it is necessary to take into consideration proper solidification of the molten metal and prevention of adhesion between the ingot and the mold.
そのため、従来■溶湯の保温、断熱、■凝固した鋳片と
鋳型間の潤滑なとを目的としてモルトパウダーが使用さ
れている。For this reason, malt powder has traditionally been used for the following purposes: 1) keeping the molten metal warm and insulating; and 2) providing lubrication between the solidified slab and the mold.
このモールドパウダーの使用に当っては、その溶解速度
を制御する必要かある。すなわち、溶解速度が早すぎる
と添加したモールドパウダは添加と同時に液体状態とな
り、溶湯の保温効果が著しく低下する。When using this molding powder, it is necessary to control its dissolution rate. That is, if the dissolution rate is too fast, the added mold powder becomes liquid at the same time as it is added, and the heat retention effect of the molten metal is significantly reduced.
一方、近年、連続鋳造の高速化に伴い、連続鋳造用モー
ルドパウダーには、非常に低粘度のものが要求されてい
る。一般に粘度はモールドパウダーの融点か低いほど低
下する。したがって、高速連続鋳造用モールドパウダー
は、一般に低融点のものが使用される。ところが、モー
ルドパウダーの融点を下げると溶解速度か大きくなり、
このようなモールドパウダーを鋳型内へ添加すると添加
と同時に液体状態となり、保温効果か著しく低下する。On the other hand, in recent years, as continuous casting speeds have increased, mold powders for continuous casting are required to have extremely low viscosity. Generally, the viscosity decreases as the melting point of the mold powder decreases. Therefore, mold powder for high-speed continuous casting generally has a low melting point. However, lowering the melting point of mold powder increases the dissolution rate,
When such molding powder is added into the mold, it becomes liquid at the same time as it is added, and the heat retention effect is significantly reduced.
そこで、高速連続鋳造用には、低融点でありながら、溶
解速度は遅いという矛盾した性質をもったモールドパウ
ダーが必要となる。Therefore, for high-speed continuous casting, a molding powder with contradictory properties such as a low melting point but a slow dissolution rate is required.
モールドパウダーの溶解速度を遅らせる手法としては、
モールドパウダーに炭素粉末を添加することが公知であ
る。この手法は、モールドパウダーへ添加した炭素粉末
か、溶湯からモルトパウダーへの熱伝達を遅らせる作用
を利用したものである。As a method to slow down the dissolution rate of mold powder,
It is known to add carbon powder to mold powder. This method utilizes carbon powder added to the mold powder, or the effect of slowing heat transfer from the molten metal to the malt powder.
そして、モールドパウダーが鋳型内へ添加されると、モ
ールドパウダーの温度を上げるための熱源は溶湯のみで
あるから、溶湯からモールドパウダーへの熱伝達を遅ら
せる以外にはモールドパウダーの溶解速度を遅らせるこ
とは不可能であると考えられてきた。When the mold powder is added into the mold, the only heat source to raise the temperature of the mold powder is the molten metal, so the only way to slow down the melting rate of the mold powder is to slow down the heat transfer from the molten metal to the mold powder. was thought to be impossible.
［発明が解決しようとする課題］
本発明は、銅および銅合金の連続鋳造時に用いるモール
ドパウダーにおいて、従来溶解速度がはやいと考えられ
ていた融点か低いものでも、溶解速度の遅い材料を得よ
うとするものである。[Problems to be Solved by the Invention] The present invention aims to obtain a material with a slow dissolution rate even when the mold powder used in continuous casting of copper and copper alloys has a low melting point, which was conventionally thought to have a fast dissolution rate. That is.
又、炭素を添加するものは溶湯を汚染する恐れがあるか
、そのような恐れのない材料を得ようとするものである
。Moreover, there is a possibility that carbon is added to the molten metal, or the purpose is to obtain a material free from such a risk.
［課題を解決するための手段］
本発明は、従来、モールドパウダーの融点か低ければ溶
解速度が速いと考えられていたところを、融点が低いモ
ールドパウダーでも、熱の一部を吸熱反応によって吸熱
反応熱に変換させ、かつ生成した気体をモールドパウダ
ー層から大気中へ飛散させることによって熱を逃し、こ
れによってモールドパウダーの溶解速度を遅らせること
ができることを知見してなされたものである。[Means for Solving the Problems] Conventionally, it was thought that the lower the melting point of the mold powder, the faster the dissolution rate. However, the present invention is capable of absorbing part of the heat through an endothermic reaction even when the mold powder has a low melting point. This was done based on the knowledge that the heat can be released by converting it into reaction heat and scattering the generated gas from the mold powder layer into the atmosphere, thereby slowing down the dissolution rate of the mold powder.
すなわち、本発明はほう砂、無水ほう酸の１種以上を１
０〜９５重量％、ナトリウムの酢酸塩、重炭酸塩、炭酸
塩、水酸化物のうちの１種以上を５〜９０重量％よりな
る銅および銅合金連続鋳造用モールドパウダーである。That is, the present invention uses one or more of borax and boric anhydride.
This is a molding powder for continuous casting of copper and copper alloys, which contains 0 to 95% by weight and 5 to 90% by weight of one or more of sodium acetate, bicarbonate, carbonate, and hydroxide.
ほう砂、無水ほう酸は融点及び溶融状態のフラックス粘
度を調整する主祠料で、安価で取り扱いが容易であり溶
湯を汚染しない物質として好適であるか、１０重量％未
満ては融点調整能力か低下し、それに伴なってフラック
スの粘度か高くなって鋳塊の表面品質が劣化する。また
９５重量％を超えると溶解速度の望ましい範囲を逸脱し
て好ましくないので、これらほう砂、無水ほう酸の量は
１０〜９５重量％の範囲が良い。Borax and boric anhydride are the main abrasive materials that adjust the melting point and viscosity of the flux in the molten state.They are inexpensive, easy to handle, and are suitable as substances that do not contaminate the molten metal.If the amount is less than 10% by weight, the ability to adjust the melting point decreases. However, the viscosity of the flux increases and the surface quality of the ingot deteriorates. Moreover, if the amount exceeds 95% by weight, the dissolution rate will deviate from the desired range, which is not preferable, so the amount of borax and boric anhydride is preferably in the range of 10 to 95% by weight.
又、上記ナトリウムの化合物は高温で熱分解を引き起し
て凝集相と気体に分解する。例えば重炭酸すトリウムの
場合、高温では下記反応によって気体を発生する。In addition, the sodium compound causes thermal decomposition at high temperatures and decomposes into an aggregated phase and gas. For example, in the case of sodium bicarbonate, a gas is generated by the following reaction at high temperatures.
２（ＮａｌｌＣＯ３） ＝Ｎａ２０＋ ２ＣＯ２＋１１
２０そして、この分解反応が吸熱反応であるので、溶湯
からモールドパウダーへ伝達された熱の一部を吸熱反応
熱に変換させ、かつこの吸熱反応によって生成した気体
をモールドパウダー層から大気中へ逃散させることによ
って熱を逃し、これによってモールドパウダーの溶解速
度を遅らせることかできる。2(NallCO3) =Na20+ 2CO2+11
20 Since this decomposition reaction is an endothermic reaction, part of the heat transferred from the molten metal to the mold powder is converted into endothermic reaction heat, and the gas generated by this endothermic reaction is released from the mold powder layer into the atmosphere. This allows heat to escape, thereby slowing down the melting rate of the mold powder.
これらの化合物の添加量が５重量％未満ではモールドパ
ウダーの溶解速度を十分に遅らせる効果はない。又、９
０重量％を超えると吸熱反応が激しくなり、モールドパ
ウダーとして不安定な状態になる
これらの化合物の代表的なものを例示すれば下記のとお
りである。If the amount of these compounds added is less than 5% by weight, there is no effect of sufficiently slowing down the dissolution rate of the mold powder. Also, 9
If the content exceeds 0% by weight, the endothermic reaction becomes intense and the mold powder becomes unstable. Typical examples of these compounds are as follows.
酢酸塩・・・酢酸ナトリウム（ＮａＣＨ＋ ＣＯ２）重
炭酸塩・・・重炭酸ナトリウム（Ｎａ２ＣＯ３）炭酸塩
・・・炭酸ナトリウム（Ｎａ２ＣＯ３）水酸化塩・・・
水酸化ナトリウム（ＮａＯＩＩ）本発明では上記必須の
化合物の他に不可避化合物が混入していても差支えない
。Acetate...Sodium acetate (NaCH+ CO2) Bicarbonate...Sodium bicarbonate (Na2CO3) Carbonate...Sodium carbonate (Na2CO3) hydroxide...
Sodium hydroxide (NaOII) In the present invention, there is no problem even if unavoidable compounds are mixed in addition to the above-mentioned essential compounds.
［実施例］
以下、黄銅（２種、Ｃ２６８０）の連続鋳造について、
本発明の詳細な説明する。[Example] Below, regarding continuous casting of brass (class 2, C2680),
The present invention will be described in detail.
表１には黄銅連続鋳造用として用いるモールドパウダー
の組成並びに融点を示す。試料Ｎ。Table 1 shows the composition and melting point of mold powder used for continuous brass casting. Sample N.
１〜５は実施例、試料Ｎｏ、６．７は比較例を示す。1 to 5 are examples, sample No. 6.7 is a comparative example.
これらを黄銅の連続鋳造鋳型内へ添加し、その溶解速度
と鋳塊品質を表２に示す。These were added to a brass continuous casting mold, and the dissolution rate and ingot quality are shown in Table 2.
表２
上記表１、表２から明らかなように、実施例では溶解速
度が遅くなり、欠陥の少ない鋳塊か得られるのに対し、
比較例では溶解速度が速すぎて性状不良の鋳塊か得られ
る。Table 2 As is clear from Tables 1 and 2 above, the melting rate was slow in the example and an ingot with fewer defects was obtained, whereas
In the comparative example, the melting rate was too fast and an ingot with poor properties was obtained.
［発明の効果］
本発明のモールドパウダーは、溶湯を汚染することなく
、十分に溶解速度を遅らせることができ、形状は勿論の
こと、割れとかくぼみ等の表面欠陥のない鋳塊を連続的
に製造することが可能となる。[Effects of the Invention] The molding powder of the present invention can sufficiently slow down the melting rate without contaminating the molten metal, and can continuously produce ingots with no shape or surface defects such as cracks or depressions. It becomes possible to manufacture.
特許出願人 ］：１本鉱業株式会社 代理人 弁理士 小 松 秀 岳Patent applicant: Ippon Mining Co., Ltd. Agent Patent Attorney Hidetake Komatsu
Claims (1)
トリウムの酢酸塩、重炭酸塩、炭酸塩、水酸化物のうち
の１種以上を５〜９０重量％よりなることを特徴とする
銅および銅合金連続鋳造用モールドパウダー。It is characterized by comprising 10 to 95% by weight of one or more of borax and boric anhydride, and 5 to 90% by weight of one or more of sodium acetate, bicarbonate, carbonate, and hydroxide. Mold powder for continuous casting of copper and copper alloys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187488A JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187488A JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0263653A true JPH0263653A (en) | 1990-03-02 |
| JPH0468068B2 JPH0468068B2 (en) | 1992-10-30 |
Family
ID=13183713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6187488A Granted JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263653A (en) |
-
1988
- 1988-03-17 JP JP6187488A patent/JPH0263653A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0468068B2 (en) | 1992-10-30 |
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