JPH0262903A - Method and device for measuring hole internal surface - Google Patents
Method and device for measuring hole internal surfaceInfo
- Publication number
- JPH0262903A JPH0262903A JP21453288A JP21453288A JPH0262903A JP H0262903 A JPH0262903 A JP H0262903A JP 21453288 A JP21453288 A JP 21453288A JP 21453288 A JP21453288 A JP 21453288A JP H0262903 A JPH0262903 A JP H0262903A
- Authority
- JP
- Japan
- Prior art keywords
- optical system
- hole
- optical axis
- focusing
- measured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 170
- 238000006073 displacement reaction Methods 0.000 claims abstract description 12
- 238000003384 imaging method Methods 0.000 claims description 15
- 238000004364 calculation method Methods 0.000 claims description 12
- 230000004907 flux Effects 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 2
- 238000005259 measurement Methods 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000004441 surface measurement Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011326 mechanical measurement Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、非破壊非接触で孔内面の同心環状凹凸部の
径や位置を測定する孔内面測定方法及びその装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hole inner surface measuring method and apparatus for measuring the diameter and position of concentric annular irregularities on the inner surface of a hole in a non-destructive and non-contact manner.
従来、比較的小径の孔内面に設けた溝部や絞り部等の同
心環状凹凸部の径や基準面からの距離等を測定するには
、各種の機械的な測長器を孔内部に挿入し孔内面に接触
させて測定する方法がとられていた。Conventionally, in order to measure the diameter and distance from a reference surface of concentric annular irregularities such as grooves and constrictions provided on the inner surface of a relatively small-diameter hole, various mechanical length measuring devices have been inserted into the hole. The method used was to make measurements by contacting the inner surface of the hole.
しかしながら、このような従来の孔内面の測定方法及び
その装置では、測長器を孔内面に接触させなければなら
ないので、ワークが柔軟な材質の場合には孔内面を変形
させたり損傷させたりするおそれがあった。However, in such conventional methods and devices for measuring the inner surface of a hole, the length measuring instrument must be brought into contact with the inner surface of the hole, which may deform or damage the inner surface of the hole if the workpiece is made of a flexible material. There was a risk.
また、孔内面と測長器との接触面を完全な線又は点にす
ることは不可能であるので、測定精度を上げることがで
きず、さらに副長器を挿入することができない小径の孔
内面を測定することはできなかった。In addition, it is impossible to make the contact surface between the inner surface of the hole and the length measuring device into a perfect line or point, so it is impossible to improve measurement accuracy, and furthermore, the inner surface of the hole has a small diameter, making it impossible to insert the length measuring device. could not be measured.
この発明は、このような従来の問題点を解決し、非破壊
、非接触で測定可能な孔内面測定方法及びその装置を提
供することを目的とする。An object of the present invention is to solve such conventional problems and provide a method and apparatus for measuring the inner surface of a hole that can be measured non-destructively and non-contact.
上記の目的を達成するため、この発明による孔内面測定
方法は、基準位置から光軸方向に変位して常時合焦状態
に保持される合焦光学系の光軸上に、基準位置から所定
の間隔を置いて光軸と45度の角度で反射光学系を斜設
し、この反射光学系を被測定物の孔内に挿入し、この孔
の中心線を上記光軸と一致させて反射光学系と被測定物
とを光軸方向に相対移動させ、その相対移動量及び合焦
光学系の基準位置からの変位量から、孔内面の同心環状
凹凸部の基準面からの距離及びその位置での内径を求め
るものである。In order to achieve the above object, the borehole inner surface measurement method according to the present invention provides a method for measuring the inner surface of a hole from a reference position to a predetermined position on the optical axis of a focusing optical system that is displaced from a reference position in the optical axis direction and is always maintained in a focused state. A reflective optical system is installed diagonally at an angle of 45 degrees with the optical axis at intervals, and this reflective optical system is inserted into a hole in the object to be measured, and the center line of this hole is aligned with the optical axis. The system and the object to be measured are moved relative to each other in the optical axis direction, and from the amount of relative movement and the amount of displacement from the reference position of the focusing optical system, the distance from the reference surface of the concentric annular unevenness on the inner surface of the hole and its position are determined. This is to find the inner diameter of.
上記の測定方法において1合焦光学系の光軸に被測定物
の孔中心線を平行させて反射光学系を上記孔内に挿入し
、両者の相対移動の各移動点で反射光学系を上記光軸の
周りに例えば120度ずつ回転させて各回転位置におけ
る合焦光学系の基準位置からの変位量から上記孔内面の
同心環状凹凸部の内径を求めることも可能である。In the above measurement method, the reflective optical system is inserted into the hole with the hole center line of the object to be measured parallel to the optical axis of the focusing optical system, and the reflective optical system is inserted into the hole at each point of relative movement between the two. It is also possible to rotate the focusing optical system by, for example, 120 degrees around the optical axis and determine the inner diameter of the concentric annular uneven portion on the inner surface of the hole from the amount of displacement from the reference position of the focusing optical system at each rotational position.
また、この発明による孔内面測定装置は上記の方法を実
施するための装置であって、基準位置から光軸方向に変
位可能な合焦光学系と、この合焦。Further, the hole inner surface measuring device according to the present invention is a device for implementing the above method, and includes a focusing optical system that can be displaced in the optical axis direction from a reference position, and a focusing optical system that can be displaced from a reference position in the optical axis direction.
光学系を常時合焦状態に保つように変位させる制御手段
と、被測定物の測定すべき孔内を挿通可能であり、上記
合焦光学系の光軸上に上記基準位置から所定の間隔を置
いて45度の角度で斜交する反射光学系と、被測定物又
は反射光学系を光軸方向に移動させる移動手段とを設け
たものである。A control means for displacing the optical system so as to keep it in focus at all times, and a control means that can be inserted into the hole to be measured in the object to be measured, and a control means that is disposed at a predetermined distance from the reference position on the optical axis of the focusing optical system. This system is provided with reflective optical systems that intersect obliquely at an angle of 45 degrees, and a moving means that moves the object to be measured or the reflective optical system in the optical axis direction.
そして、合焦光学系としては、被測定面にパターン像を
投影する投影光学系と、投影されたパターン像を結像さ
せる撮像光学系と、この撮像光学系通過光を互いに異な
る光路長を有する2光束に分割する2分割プリズムと、
上記撮像光学系の焦点面近傍に配設され上記2光束を受
光し得る一対のイメージセンサと、これらのイメージセ
ンサからの出゛力信号を演算処理する演算部と、この演
算部による演算結果を表示する表示部から構成するのが
好ましい。The focusing optical system includes a projection optical system that projects a pattern image onto the surface to be measured, an imaging optical system that forms the projected pattern image, and a focusing optical system that allows light passing through the imaging optical system to have different optical path lengths. A two-split prism that splits into two beams,
A pair of image sensors disposed near the focal plane of the imaging optical system and capable of receiving the two light fluxes, a calculation unit that processes output signals from these image sensors, and a calculation result of the calculation unit. It is preferable that the display unit includes a display unit for displaying information.
上記のように構成した孔内面測定装置の反射光学系を被
測定物の孔内部に挿入し、基準位置にセットした合焦光
学系の光軸を孔の中心線に一致させた状態で合焦光学系
を作動状態にすると、制御手段が働いて合焦光学系の光
軸を通り反射光学系により直角に向きを変えて孔内面に
達するまでの距離に応じて合焦光学系が基準位置から光
軸方向に合焦位置まで変位する。Insert the reflective optical system of the hole inner surface measurement device configured as above into the hole of the object to be measured, and focus with the optical axis of the focusing optical system set at the reference position aligned with the center line of the hole. When the optical system is activated, the control means operates to move the focusing optical system from the reference position according to the distance it passes through the optical axis of the focusing optical system, changes direction at right angles by the reflective optical system, and reaches the inner surface of the hole. Displaces in the optical axis direction to the in-focus position.
この変位量により、合焦光学系から被測定物の基準面の
孔内面までの距離を知って孔の半径を求めることができ
る。From this amount of displacement, it is possible to determine the radius of the hole by knowing the distance from the focusing optical system to the inner surface of the hole on the reference surface of the object to be measured.
この状態で、測定装置と被測定物とを光軸方向に相対移
動させると、孔径が基準面の孔径と等しい場合には、合
焦光学系はその位置で合焦状態に保たれているので、合
焦光学系と反射光学系との間隔は当初のままである。In this state, when the measurement device and the object to be measured are moved relative to each other in the optical axis direction, if the hole diameter is equal to the hole diameter of the reference surface, the focusing optical system will be kept in focus at that position. , the distance between the focusing optical system and the reflective optical system remains as it was originally.
次に、孔内面の同心環状凹凸部が反射光学系によって反
射された反射光軸に対向すると1合焦光学系から孔内面
までの距離が変化するので、合焦光学系は合焦位置まで
光軸方向に前後に変位し、その変位方向から凹凸の別を
、変位量から凹凸部の深さや高さをそれぞれ知ることが
でき、また測定装置と被測定物の相対変位量から凹凸部
の基準面からの距離を知ることができる。Next, when the concentric annular unevenness on the inner surface of the hole opposes the reflected optical axis reflected by the reflective optical system, the distance from the first focusing optical system to the inner surface of the hole changes, so the focusing optical system emits light up to the in-focus position. It is displaced back and forth in the axial direction, and the type of unevenness can be determined from the direction of displacement, the depth and height of the uneven part can be determined from the amount of displacement, and the standard of the uneven part can be determined from the amount of relative displacement between the measuring device and the object to be measured. You can know the distance from the surface.
また、この測定装置を用いて合焦光学系の光軸と被測定
物の孔中心線とを平行させた状態で反射光学系を例えば
120度ずつ回転させて3回孔内面までの距離を測定す
れば、3種の異なった距離を得ることができ、これらの
値から孔径を求めることもできる。In addition, using this measuring device, the distance to the inner surface of the hole was measured three times by rotating the reflective optical system by, for example, 120 degrees while keeping the optical axis of the focusing optical system parallel to the hole center line of the object to be measured. Then, three different distances can be obtained, and the pore diameter can also be determined from these values.
そして、合焦光学系として、被測定面にパターン像を投
影し、その投影像を光軸方向に位置をずらせて配設した
一対のイメージセンサ上に結像させ、これらのイメージ
センサからの出力信号を演算処理して被測定面までの距
離を測定する装置を用いるようにすれば、極めて高精度
の測定が可能になる。Then, as a focusing optical system, a pattern image is projected onto the surface to be measured, and the projected image is focused on a pair of image sensors arranged at different positions in the optical axis direction, and the output from these image sensors is By using a device that processes signals to measure the distance to the surface to be measured, extremely high precision measurement becomes possible.
以下、添付図面を参照してこの発明の詳細な説明する。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
第1図はこの発明の一実施例を示すものである。FIG. 1 shows an embodiment of the present invention.
コの字状の移動台1の下腕1aに微動台2を例えばアリ
とアリ溝等により上下に摺動自在に装着し、この微動台
2にラック歯2aを形成し、このラック歯2aを下腕1
aに回動自在に装着したピニオン3に歯合させ、ピニオ
ン3をステップモータ4によって回動させることにより
微動台2を上下に微動させるようにし、この微動台2に
合焦光学装置5を光軸Qを垂直にして固設している。A fine movement table 2 is attached to the lower arm 1a of the U-shaped moving table 1 so as to be able to slide up and down, for example, using dovetails and dovetail grooves, and this fine movement table 2 is formed with rack teeth 2a. lower arm 1
A is engaged with a pinion 3 rotatably attached to the pinion 3, and the pinion 3 is rotated by a step motor 4 to slightly move the fine movement table 2 up and down. It is fixed with the axis Q vertical.
移動台1の上腕1bにはプローブ6を移動台1の内部に
設けたステップモータ(図示しない)により回動自在に
装着し、その回転軸を合焦光学系5の光軸Qに一致させ
、プローブ6の下面に反射光学系7を固設してその反射
面7aを光軸悲に対して45度傾斜させ、この反射面7
aにより垂直な光軸Ωを水平な反射光軸Q′に90度折
曲げている。A probe 6 is rotatably attached to the upper arm 1b of the movable base 1 by a step motor (not shown) provided inside the movable base 1, and its axis of rotation is aligned with the optical axis Q of the focusing optical system 5. A reflective optical system 7 is fixed to the lower surface of the probe 6, and its reflective surface 7a is inclined at 45 degrees with respect to the optical axis.
The vertical optical axis Ω is bent by 90 degrees to the horizontal reflective optical axis Q' by a.
そして、このように構成した移動台1をL字状の固定台
8に上下に摺動自在に装着し、移動台1の側面に形成し
たラック歯1cを固定台8に回動自在に装着したピニオ
ン9に歯合させ、ピニオン9をステップモータ10によ
って回動させることにより移動台1を上下に移動させる
ようにしている。Then, the movable base 1 configured as described above was attached to the L-shaped fixed base 8 so as to be slidable up and down, and the rack teeth 1c formed on the side surface of the movable base 1 were attached to the fixed base 8 so as to be freely rotatable. The movable table 1 is moved up and down by meshing with a pinion 9 and rotating the pinion 9 by a step motor 10.
なお、図中11は合焦光学系5の出力信号を演算する演
算部、12は演算部11の演算結果を表示する表示部、
13は演算部11の出力信号に応じてステップモータ4
の回動を制御する制御部である。In the figure, 11 is a calculation unit that calculates the output signal of the focusing optical system 5, 12 is a display unit that displays the calculation results of the calculation unit 11,
13 is a step motor 4 according to the output signal of the calculation section 11.
This is a control unit that controls the rotation of the
ここで用いる合焦光学系5はいかなる形式のものでも差
し支えないが、測定しようとする孔内面が滑らかな曲面
である点を考慮すると、パターン投影形のものが望まし
い。The focusing optical system 5 used here may be of any type, but in view of the fact that the inner surface of the hole to be measured is a smooth curved surface, a pattern projection type is preferable.
第2図(a)はこのような合焦光学系の光路を示すもの
であり、51は光源、52はコンデンサレンズ、55は
パターン板、54は投影レンズ。FIG. 2(a) shows the optical path of such a focusing optical system, where 51 is a light source, 52 is a condenser lens, 55 is a pattern plate, and 54 is a projection lens.
55はハーフミラ−256は投影兼撮像レンズ。55 is a half mirror, and 256 is a projection/imaging lens.
57は撮像レンズ、58は2分割プリズム、59は撮像
光学系の焦点面近傍に配設されたラインセンサ等のイメ
ージセンサである。57 is an imaging lens, 58 is a two-split prism, and 59 is an image sensor such as a line sensor disposed near the focal plane of the imaging optical system.
光源51から発する光線はコンデサレンズ52で平行光
となってパターン板53を照射する。パターン板53に
形成されているパターンは投影レンズ54を通り、ハー
フミラ−55で90度光路を変え投影兼撮像レンズ56
を通って被測定面Sに拡大投影される。The light beam emitted from the light source 51 is turned into parallel light by the condenser lens 52 and illuminates the pattern plate 53. The pattern formed on the pattern plate 53 passes through a projection lens 54, changes its optical path by 90 degrees with a half mirror 55, and passes through a projection/imaging lens 56.
, and is enlarged and projected onto the surface S to be measured.
被測定面Sの投影像は、投影兼撮像レンズ56゜ハーフ
ミラ−55,撮像レンズ57を通って2分割プリズム5
8のハーフミラ−而58aで2分割され、一部はそのま
ま直進してイメージセンサ59の図で左半部59aに達
し、残部はハーフミラ−面58a及びプリズム面58b
で90度すっ折曲げられた後イメージセンサ59の図で
右半部59bに達する。The projected image of the surface to be measured S passes through a projection/imaging lens 56° half mirror 55 and an imaging lens 57, and then passes through a two-split prism 5.
The half mirror 58a of No. 8 is divided into two parts, and one part continues straight and reaches the left half 59a in the image sensor 59, and the remaining part is a half mirror surface 58a and a prism surface 58b.
After being bent completely by 90 degrees, it reaches the right half 59b of the image sensor 59 in the figure.
した・かって、イメージセンサ59の左半部59a、右
半部59bの像を比較することにより前ピン、後ピン及
び合焦の各状態を知ることができる。Therefore, by comparing the images of the left half 59a and the right half 59b of the image sensor 59, the front focus, rear focus, and in-focus states can be known.
再び第1図に戻って、このような合焦光学系5を有する
測定装置のプローブ6を台板14上に固定した被測定物
20の測定しようとする孔21の内部に挿入し得る位置
とし、ステップモータ10により移動台1を垂直方向に
能動して、反射光学系7の反射面7aによって90度折
曲げられた反射光軸Q′が被測定物20の基準面20a
と同一高さになるようにする(第3図(a)参照)。Returning again to FIG. 1, the probe 6 of the measuring device having such a focusing optical system 5 is set at a position where it can be inserted into the hole 21 to be measured in the object to be measured 20 fixed on the base plate 14. , the step motor 10 actively moves the movable table 1 in the vertical direction, so that the reflected optical axis Q' bent by 90 degrees by the reflective surface 7a of the reflective optical system 7 is aligned with the reference surface 20a of the object to be measured 20.
(see Figure 3(a)).
この状態における移動台1の固定台8に対する関係位置
を移動台1の起動位置とし1反射光軸Q′が孔中径部2
1aの点S1で交わるようにして合焦光学系5を作動状
態にする。The relative position of the movable base 1 with respect to the fixed base 8 in this state is the starting position of the movable base 1, and the reflected optical axis Q' is the center diameter part of the hole 2
1a and intersect at point S1, and the focusing optical system 5 is put into operation.
これにより中経部21aに第2図に示すパターン板53
のパターンが投影光学系により投影され、その投影像が
撮像光学系及び2分割プリズム58によりイメージセン
サ59の左半部59a及び右半部59bに撮像される。As a result, the pattern plate 53 shown in FIG.
is projected by the projection optical system, and its projected image is captured by the imaging optical system and the two-split prism 58 on the left half 59a and right half 59b of the image sensor 59.
ここで、イメージセンサ59の左半部59a及び右半部
59bを一対のラインセンサとすると、左半部59aと
右半部59bに達する撮像光線は2分割プリズム5日の
基線長dだけ光路長が異なっているので、パターン板5
3のパターンが例えばピンホールであると仮定すると、
第2図(b)に示すようにその結像点A、Bは一般にイ
メージセンサ59の面59cの前後に位置する。Here, if the left half 59a and right half 59b of the image sensor 59 are a pair of line sensors, the imaging light beam reaching the left half 59a and the right half 59b has an optical path length equal to the base line length d of the two-split prism 5. are different, so pattern board 5
Assuming that pattern 3 is a pinhole, for example,
As shown in FIG. 2(b), the imaging points A and B are generally located before and after the surface 59c of the image sensor 59.
この時、それぞれのイメージセンサ59a。At this time, each image sensor 59a.
59bの各モジュールAi、Biの受光量は例えば第4
図に示すようになり、その合計光量は同じである。The amount of light received by each module Ai and Bi of 59b is, for example, the fourth
As shown in the figure, the total amount of light is the same.
いま、隣接する各モジュールAi、Ax+ 1 ;B
i、Bi+1の出力をそれぞれPai、Pa11 ;
pbi、Pbi+1 とし、これらの総和をPA、PB
とすると、
PA=Σ Pa1−Pai4−1
pB=Σ1Pbi−Pbi+1
となり、PA−PBが合焦度を示す値となる。Now, each adjacent module Ai, Ax+ 1 ;B
The outputs of i and Bi+1 are respectively Pai and Pa11;
pbi, Pbi+1, and the sum of these is PA, PB
Then, PA=Σ Pa1-Pai4-1 pB=Σ1Pbi-Pbi+1, where PA-PB is a value indicating the degree of focus.
ここで、
PA−PB=O合焦
P A −P B > O前ピン
PA−PB<O後ピン
の状態をそれぞれ示しているので、この値(PA−PB
)を演算部11で演算し、その結果に応じて非合焦時に
は制御部13を通じてステップモータ4を所要方向に所
要角度回動させてPA−PB=Oになるまで合焦光学装
置5を変位させる。Here, PA-PB=O focus PA-PB > O front pin PA-PB < O rear focus, so this value (PA-PB
) is calculated by the calculation unit 11, and according to the result, when the focus is out of focus, the step motor 4 is rotated by the required angle in the required direction through the control unit 13, and the focusing optical device 5 is displaced until PA-PB=O. let
合焦光学系5の基準位置からの変位量により。Based on the amount of displacement of the focusing optical system 5 from the reference position.
合焦光学系5の所定位置から反射光学系7を経て孔内面
21の点S1までの距離が演算部11で演算され、この
値から光軸Qから孔内面21aの点Slまでの距離D1
が求められる。The distance from the predetermined position of the focusing optical system 5 to the point S1 on the inner surface of the hole 21 via the reflective optical system 7 is calculated in the calculation section 11, and from this value the distance D1 from the optical axis Q to the point S1 on the inner surface of the hole 21a is calculated.
is required.
ここで、例えばプローブ6の外径を孔21の内径にほぼ
等しくしてプローブ6を孔21内に嵌入可能として孔2
1の中心線を合焦光学系5の光軸Qに一致させるように
すれば、この距離D1が孔内面21 、aの半径r1と
なり、その値が表示部12に表示される。Here, for example, the outer diameter of the probe 6 is made approximately equal to the inner diameter of the hole 21 so that the probe 6 can be inserted into the hole 21.
1 is made to coincide with the optical axis Q of the focusing optical system 5, this distance D1 becomes the radius r1 of the hole inner surface 21, a, and this value is displayed on the display section 12.
しかしながら、プローブ6を孔径に合わせて交換するの
は実際的でないので、被測定物20の孔21の中心線を
合焦光学系5の光軸Qに平行にし、反射光学系7を備え
たプローブ6を光軸Qの周りに120度ずつ回転させて
その停止位置でそれぞれ光軸Qから孔内面までの距離を
求めるようにすれば、公知の演算方法により孔内面21
aの半径r1を求めることができ、このようにして求め
られた半径r1が表示部12に表示される。However, since it is not practical to replace the probe 6 according to the hole diameter, the center line of the hole 21 of the object to be measured 20 is made parallel to the optical axis Q of the focusing optical system 5, and a probe equipped with a reflective optical system 7 is installed. 6 around the optical axis Q in 120 degree increments and the distance from the optical axis Q to the inner surface of the hole is calculated at each stop position.
The radius r1 of a can be determined, and the radius r1 thus determined is displayed on the display section 12.
次に、ステップモータ10により移動台1を下方に移動
させても反射光軸Q′が孔内面2ia内にあるときはP
A−PB=Oであって合焦光学系5と反射光学系7との
相対移動は生じない。Next, even if the moving table 1 is moved downward by the step motor 10, if the reflected optical axis Q' is within the hole inner surface 2ia, then P
Since A-PB=O, no relative movement occurs between the focusing optical system 5 and the reflective optical system 7.
移動台1が第3図(b)に示す位置になると、反射光軸
Qが円周溝21bの内面S2に達するので、PA−PB
の値が正又は負の方向に変化し、これに対応してステッ
プモータ4が所要方向に所要角度回動し、合焦位置にま
で変位させる。When the moving table 1 is at the position shown in FIG. 3(b), the reflected optical axis Q reaches the inner surface S2 of the circumferential groove 21b, so that PA-PB
The value of changes in the positive or negative direction, and in response to this, the step motor 4 rotates in the required direction by the required angle, and is displaced to the in-focus position.
この変位量から同様にして光軸0から点S2までの距離
D2を求めることができ、この場合もプローブ6を12
0度ずつ回転させて孔内面21bまでの距離を3回測定
することによりその半径r2を求めることができる。From this amount of displacement, the distance D2 from the optical axis 0 to the point S2 can be determined in the same way.
The radius r2 can be determined by rotating the hole by 0 degrees and measuring the distance to the hole inner surface 21b three times.
そして、PA−PBの値が0から変化する点における移
動台1の起動位置からの移動量から円周溝21bの軸方
向の深さzlを求めることができ、その深さZlが孔2
1bの半径r2と共に表示部12に表示される。Then, the axial depth zl of the circumferential groove 21b can be determined from the amount of movement of the moving table 1 from the starting position at the point where the value of PA-PB changes from 0, and the depth zl is
It is displayed on the display section 12 together with the radius r2 of 1b.
また、ステップモータ10により移動台1を下方に移動
させて第3図(c)に示す位置になると円周溝21bの
他の壁面までの深さzlを求めることができる。Further, when the moving table 1 is moved downward by the step motor 10 to the position shown in FIG. 3(c), the depth zl of the circumferential groove 21b to the other wall surface can be determined.
さらに、移動台1を第3図(d)、(e)に示す位置に
すると、絞り部21c、の半径r3及び基準面からの深
さZ3 、Z4をそれぞれ求めることができる。Further, when the movable table 1 is placed in the positions shown in FIGS. 3(d) and 3(e), the radius r3 and the depths Z3 and Z4 from the reference plane of the constricted portion 21c can be determined, respectively.
このように反射光学系7は合焦光学系5の光軸を90度
折曲げるだけでよく、その大きさは極めて小さくてすむ
ので、例えば孔径5〜20m、深さ50nnのように測
長器を挿入し得ない孔内面の測定も可能である。In this way, the reflective optical system 7 only needs to bend the optical axis of the focusing optical system 5 by 90 degrees, and its size can be extremely small. It is also possible to measure the inner surface of a hole where it is not possible to insert a hole.
実施例では合焦光学系5の投影拡大率β=20とすると
測定精度E=±2μm、β=50とするとε〈±1μm
を得ることができる。In the example, when the projection magnification of the focusing optical system 5 is β=20, the measurement accuracy E=±2 μm, and when β=50, ε<±1 μm
can be obtained.
なお、上記実施例においては、移動台1の移動方向を垂
直方向としたが、これを水平方向にすることも可能であ
る。In the above embodiment, the moving direction of the movable table 1 is vertical, but it is also possible to move the moving direction horizontally.
また、反射光学系7を移動させる代りに、第5側に模型
的に示すように反射光学系7を固定台60に固定して被
測定物20を光軸方向に移動させるようにしてもよく、
このようにすれば移動装置を簡略化することができる。Further, instead of moving the reflective optical system 7, the reflective optical system 7 may be fixed to a fixed base 60 and the object to be measured 20 may be moved in the optical axis direction, as schematically shown on the fifth side. ,
In this way, the mobile device can be simplified.
なおまた、この発明により測定し得る孔の径や長さは上
記の範囲に限るものでないことはいうまでもない。Furthermore, it goes without saying that the diameter and length of the pores that can be measured by the present invention are not limited to the above ranges.
以上述べたように、この発明による孔内面測定方法は、
合焦光学系の光軸上に間隔を置いて反射光学系を斜設し
、この反射光学系を被測定物の孔内に上記光軸と中心線
とを一致させて挿入し、両者を光軸方向に相対移動させ
、その相対移動量及び合焦光学系の変位量から孔内の凹
凸部の位置及び内径を測定するものであるので、非破壊
、非接触の測定方法で機械的な測定方法では達し45な
い極めて高精度の測定が可能になる。As described above, the method for measuring the inner surface of a hole according to the present invention is as follows:
A reflective optical system is obliquely installed at a distance on the optical axis of the focusing optical system, and this reflective optical system is inserted into the hole of the object to be measured with the optical axis and the center line aligned, and both are connected to each other with light. Mechanical measurement is performed using a non-destructive, non-contact measurement method, as the position and inner diameter of the uneven part inside the hole are measured by relative movement in the axial direction and from the amount of relative movement and the amount of displacement of the focusing optical system. This makes it possible to perform measurements with extremely high precision, which cannot be reached by conventional methods.
上記の測定方法において、被測定物の孔中心線を合焦光
学系の光軸に平行させるようにすれば、両者の軸線を一
致させる必要がなくなるので、測定時の被測定物のセツ
ティングが著しく容易になる。In the above measurement method, if the hole center line of the object to be measured is made parallel to the optical axis of the focusing optical system, there is no need to align the axes of the two, so the setting of the object to be measured during measurement becomes easier. becomes significantly easier.
また、この発明による孔内面測定装置は、常時合焦状態
に保たれる合焦光学系の光軸上に、間隔を置いて測定す
べき孔内を挿通可能な反射光学系を設け、この反射光学
系又は被測定物を光軸方向に移動させる移動手段を設け
るようにしたので。In addition, the hole inner surface measuring device according to the present invention is provided with a reflective optical system that can be inserted into the hole to be measured at intervals on the optical axis of the focusing optical system that is always kept in focus. A moving means for moving the optical system or the object to be measured in the optical axis direction is provided.
その構成を著しく簡略化することができる。Its configuration can be significantly simplified.
さらに、その反射光学系は極めて小さくてよいので、機
械的な測長器が挿入し得ない小径の孔内面の測定が可能
になる。Furthermore, since the reflective optical system can be extremely small, it is possible to measure the inner surface of a hole with a small diameter into which a mechanical length measuring device cannot be inserted.
そして、合焦光学系に被測定面にパターン像を投影し得
る投影光学系を設けるようにすれば、滑らかな曲面から
なる孔内面の測定を著しく容易にすることができる。If the focusing optical system is provided with a projection optical system capable of projecting a pattern image onto the surface to be measured, measurement of the inner surface of the hole consisting of a smooth curved surface can be significantly facilitated.
第1図はこの発明の一実施例を示す説明図、第2図(a
)、(b)はその合焦光学系の一例を示す光路図及びそ
の一部拡大図、
第3図(a)、(b)、(c)、(d)、(e)はその
ホク定過程を示す説明図、
第4図はイメージセンサの受光状態を例示する説明図、
第5図はこの発明の他の実施例を示す概略図である。
1・・・移動台 2・・・微動台5・・・合
焦光学系 6・・・プローブ7・・・反射光学系
8・・・固定台11・・・演算部 1
2・・・表示部13・・・制御部 20・・・
被測定物21・・・孔 53・・・パター
ン板58・・・2分割プリズム
59・・・イメージセンサFIG. 1 is an explanatory diagram showing one embodiment of the present invention, and FIG. 2 (a
), (b) are optical path diagrams and partially enlarged views showing an example of the focusing optical system, and Figures 3 (a), (b), (c), (d), and (e) are FIG. 4 is an explanatory diagram showing the process; FIG. 4 is an explanatory diagram illustrating the light receiving state of the image sensor; FIG. 5 is a schematic diagram showing another embodiment of the present invention. 1...Moving table 2...Fine movement table 5...Focusing optical system 6...Probe 7...Reflecting optical system 8...Fixed table 11...Calculating unit 1
2...Display section 13...Control section 20...
Object to be measured 21... Hole 53... Pattern plate 58... Two-part prism 59... Image sensor
Claims (1)
持される合焦光学系の光軸上に、上記基準位置から所定
の間隔を置いて光軸と45度の角度で反射光学系を斜設
し、該反射光学系を被測定物の孔内に挿入し、該孔の中
心線を上記光軸と一致させて上記合焦光学系と上記被測
定物とを上記光軸方向に相対移動させ、その相対移動量
及び上記合焦光学系の上記基準位置からの変位量から、
上記孔内面の同心環状凹凸部の基準面からの距離及びそ
の位置での内径を求めることを特徴とする孔内面測定方
法。 2 基準位置から光軸方向に変位して常時合焦状態に保
持される合焦光学系の光軸上に、上記基準位置から所定
の間隔を置いて光軸と45度の角度で反射光学系を斜設
し、該反射光学系を被測定物の孔内に挿入し、該孔の中
心線を上記光軸に平行させて上記合焦光学系と上記被測
定物とを上記光軸方向に相対移動させ、各移動位置で上
記反射光学系を上記光軸の周りを回転させて各回転位置
における上記合焦光学系の上記基準位置からの変位量か
ら、上記孔内面の同心環状凹凸部の内径を求めることを
特徴とする孔内面測定方法。 3 基準位置から光軸方向に変位可能な合焦光学系と、
該合焦光学系を常時合焦状態に保つように変位させる制
御手段と、被測定物の測定すべき孔内を挿通可能であり
、上記合焦光学系の光軸上に上記基準位置から所定の間
隔を置いて45度の角度で斜交する反射光学系と、上記
被測定物又は上記反射光学系を光軸方向に移動させる移
動手段とを設けたことを特徴とする孔内面測定装置。 4 合焦光学系が、被測定面にパターン像を投影する投
影光学系と、投影されたパターン像を結像させる撮像光
学系と、該撮像光学系通過光を互いに異なる光路長を有
する2光束に分割する2分割プリズムと、上記撮像光学
系の焦点面近傍に配設され上記2光束を受光し得る一対
のイメージセンサと、これらのイメージセンサからの出
力信号を演算処理する演算部と、該演算部による演算結
果を表示する表示部とからなる請求項3記載の孔内面測
定装置。[Scope of Claims] 1. On the optical axis of a focusing optical system that is displaced in the optical axis direction from a reference position and always maintained in a focused state, at a predetermined interval from the reference position and at an angle of 45 degrees with the optical axis. A reflective optical system is installed diagonally at an angle of is relatively moved in the optical axis direction, and from the amount of relative movement and the amount of displacement of the focusing optical system from the reference position,
A method for measuring the inner surface of a hole, characterized in that the distance from the reference plane of the concentric annular uneven portion on the inner surface of the hole and the inner diameter at that position are determined. 2. On the optical axis of the focusing optical system, which is displaced in the optical axis direction from the reference position and always maintained in a focused state, a reflective optical system is placed at a predetermined distance from the reference position and at an angle of 45 degrees with the optical axis. is installed obliquely, the reflective optical system is inserted into a hole of the object to be measured, and the center line of the hole is made parallel to the optical axis, so that the focusing optical system and the object to be measured are aligned in the direction of the optical axis. The reflecting optical system is rotated around the optical axis at each moving position, and the amount of displacement of the focusing optical system from the reference position at each rotating position is determined to determine the concentric annular unevenness on the inner surface of the hole. A method for measuring the inner surface of a hole, characterized by determining the inner diameter. 3 a focusing optical system that can be displaced from a reference position in the optical axis direction;
a control means for displacing the focusing optical system so as to keep it in focus at all times; A hole inner surface measuring device comprising reflective optical systems diagonally intersecting each other at an angle of 45 degrees with an interval of 45 degrees, and a moving means for moving the object to be measured or the reflective optical system in the optical axis direction. 4. The focusing optical system includes a projection optical system that projects a pattern image onto the surface to be measured, an imaging optical system that forms the projected pattern image, and two light beams having different optical path lengths that pass through the imaging optical system. a pair of image sensors disposed near the focal plane of the imaging optical system and capable of receiving the two light fluxes, a calculation section for processing output signals from these image sensors; 4. The hole inner surface measuring device according to claim 3, further comprising a display section for displaying calculation results by the calculation section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63214532A JP2771546B2 (en) | 1988-08-29 | 1988-08-29 | Hole inner surface measuring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63214532A JP2771546B2 (en) | 1988-08-29 | 1988-08-29 | Hole inner surface measuring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0262903A true JPH0262903A (en) | 1990-03-02 |
JP2771546B2 JP2771546B2 (en) | 1998-07-02 |
Family
ID=16657290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63214532A Expired - Fee Related JP2771546B2 (en) | 1988-08-29 | 1988-08-29 | Hole inner surface measuring device |
Country Status (1)
Country | Link |
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JP (1) | JP2771546B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002131603A (en) * | 2000-10-26 | 2002-05-09 | Olympus Optical Co Ltd | Centering working machine for lens frame |
JP2008268122A (en) * | 2007-04-24 | 2008-11-06 | Mitaka Koki Co Ltd | Non-contact form measuring apparatus |
KR100956788B1 (en) * | 2008-02-21 | 2010-05-07 | (주)레이나 | Measurement method for cylinder oil groove automatism measurement system And oil groove automatism measurement system to car engine cylinder |
JP2012002573A (en) * | 2010-06-15 | 2012-01-05 | Mitaka Koki Co Ltd | Non-contact shape measuring apparatus |
KR101107302B1 (en) * | 2007-08-21 | 2012-01-20 | 대진하이텍(주) | System and method for measuring the inner diameter of ring gear |
CN102809874A (en) * | 2012-08-08 | 2012-12-05 | 吴江市博众精工科技有限公司 | Light supplementing device with reflector |
CN106918319A (en) * | 2017-03-21 | 2017-07-04 | 华侨大学 | A kind of roadbed pore size measurement apparatus and method |
CN111854604A (en) * | 2020-07-28 | 2020-10-30 | 西安中科微精光子制造科技有限公司 | Method and system for measuring shape and position parameters of air film hole by focusing laser beam |
WO2021256593A1 (en) * | 2020-06-19 | 2021-12-23 | 주식회사 윈텍오토메이션 | Improved inspection jig for inspecting inner wall of center holes of carbide inserts |
CN117961393A (en) * | 2024-04-01 | 2024-05-03 | 江苏威士智能装备有限公司 | Automatic welding device and working method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50159355A (en) * | 1974-06-12 | 1975-12-23 | ||
JPS51113754A (en) * | 1975-03-31 | 1976-10-07 | Mitsubishi Heavy Ind Ltd | Method for finding the center of ultra-large, spherical tanks |
JPS52107855A (en) * | 1976-03-05 | 1977-09-09 | Koito Mfg Co Ltd | Noncontact type position detector |
-
1988
- 1988-08-29 JP JP63214532A patent/JP2771546B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50159355A (en) * | 1974-06-12 | 1975-12-23 | ||
JPS51113754A (en) * | 1975-03-31 | 1976-10-07 | Mitsubishi Heavy Ind Ltd | Method for finding the center of ultra-large, spherical tanks |
JPS52107855A (en) * | 1976-03-05 | 1977-09-09 | Koito Mfg Co Ltd | Noncontact type position detector |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002131603A (en) * | 2000-10-26 | 2002-05-09 | Olympus Optical Co Ltd | Centering working machine for lens frame |
JP4574831B2 (en) * | 2000-10-26 | 2010-11-04 | オリンパス株式会社 | Lens frame centering machine |
JP2008268122A (en) * | 2007-04-24 | 2008-11-06 | Mitaka Koki Co Ltd | Non-contact form measuring apparatus |
KR101107302B1 (en) * | 2007-08-21 | 2012-01-20 | 대진하이텍(주) | System and method for measuring the inner diameter of ring gear |
KR100956788B1 (en) * | 2008-02-21 | 2010-05-07 | (주)레이나 | Measurement method for cylinder oil groove automatism measurement system And oil groove automatism measurement system to car engine cylinder |
JP2012002573A (en) * | 2010-06-15 | 2012-01-05 | Mitaka Koki Co Ltd | Non-contact shape measuring apparatus |
CN102809874A (en) * | 2012-08-08 | 2012-12-05 | 吴江市博众精工科技有限公司 | Light supplementing device with reflector |
CN106918319A (en) * | 2017-03-21 | 2017-07-04 | 华侨大学 | A kind of roadbed pore size measurement apparatus and method |
WO2021256593A1 (en) * | 2020-06-19 | 2021-12-23 | 주식회사 윈텍오토메이션 | Improved inspection jig for inspecting inner wall of center holes of carbide inserts |
CN111854604A (en) * | 2020-07-28 | 2020-10-30 | 西安中科微精光子制造科技有限公司 | Method and system for measuring shape and position parameters of air film hole by focusing laser beam |
CN111854604B (en) * | 2020-07-28 | 2022-03-22 | 西安中科微精光子制造科技有限公司 | Method and system for measuring shape and position parameters of air film hole by focusing laser beam |
CN117961393A (en) * | 2024-04-01 | 2024-05-03 | 江苏威士智能装备有限公司 | Automatic welding device and working method |
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