JPH0262747U - - Google Patents
Info
- Publication number
- JPH0262747U JPH0262747U JP14094688U JP14094688U JPH0262747U JP H0262747 U JPH0262747 U JP H0262747U JP 14094688 U JP14094688 U JP 14094688U JP 14094688 U JP14094688 U JP 14094688U JP H0262747 U JPH0262747 U JP H0262747U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin body
- receiving
- lead
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案請求項1記載の光結合装置の一
実施例を示す斜視図、第2図は同じくその要部斜
視図、第3図は同じく発光素子、受光素子をリー
ドフレームに搭載した状態を示す正面図、第4図
aは同じく発光素子、受光素子を一次モールドし
た状態を示す平面図、第4図bは同じくその正面
図、第5図aは同じく透光樹脂体を二次モールド
した状態を示す平面図、第5図bは同じくその正
面図、第6図は本考案請求項2記載の光結合装置
の第一実施例を示す斜視図、第7図は同じく発光
素子、受光素子をリードフレームに搭載した状態
を示す正面図、第8図aは同じく発光素子、受光
素子を一次モールドした状態を示す平面図、第8
図bは同じくその正面図、第9図aは同じく透光
樹脂体を二次モールドした状態を示す平面図、第
9図bは同じくその正面図、第10図は本考案請
求項2記載の光結合装置の第二実施例を示す斜視
図、第11図は従来の光結合装置の断面図、第1
2図は同じくその組立工程を示す図である。
10:リードフレーム、10a,10b,10
c:リード部、11…発光素子、12:受光素子
、13:発光側透光樹脂体、14:受光側透光樹
脂体、15:外装、16:導出部、17:コネク
タ。
FIG. 1 is a perspective view showing an embodiment of the optical coupling device according to claim 1 of the present invention, FIG. 2 is a perspective view of the main parts thereof, and FIG. 3 is a perspective view showing a light-emitting element and a light-receiving element mounted on a lead frame. Fig. 4a is a plan view showing the state in which the light-emitting element and light-receiving element are primary molded, Fig. 4b is the same front view, and Fig. 5a is the same as the secondary molding of the light-transmitting resin body. FIG. 5B is a plan view showing the molded state, FIG. FIG. 8a is a front view showing a state in which a light receiving element is mounted on a lead frame, and FIG.
FIG. 9b is a front view of the same, FIG. 9a is a plan view showing a state in which the translucent resin body is secondarily molded, FIG. 9b is a front view of the same, and FIG. FIG. 11 is a perspective view showing a second embodiment of the optical coupling device; FIG. 11 is a sectional view of a conventional optical coupling device;
FIG. 2 is a diagram similarly showing the assembly process. 10: Lead frame, 10a, 10b, 10
c: Lead portion, 11...Light emitting element, 12: Light receiving element, 13: Light transmitting resin body on the light emitting side, 14: Transparent resin body on the light receiving side, 15: Exterior, 16: Leading out portion, 17: Connector.
Claims (1)
受光素子と、前記発光素子と被覆形成して成る発
光側透光樹脂体と、前記受光素子を被覆形成して
成る受光側透光樹脂体と、前記発光側透光樹脂体
と受光側透光樹脂体とを一体的に被覆形成して成
る非透光性外装とを備え、該外装に、前記リード
フレームのリード部を導出する導出部が形成され
、該導出部と外部との入出力を行うコネクタとの
接続部が樹脂封止されたことを特徴とする光結合
装置。 2 リードフレームに搭載された発光素子および
受光素子と、前記発光素子と被覆形成して成る発
光側透光樹脂体と、前記受光素子を被覆形成して
成る受光側透光樹脂体と、前記発光側透光樹脂体
と受光側透光樹脂体とを一体的に被覆形成して成
る非透光性外装とを備え、前記リードフレームの
リード部が、外部との入出力を行うコネクタのピ
ンとして利用され、前記外装とコネクタとが一体
成形されたことを特徴とする光結合装置。[Claims for Utility Model Registration] 1. A light-emitting element and a light-receiving element mounted on a lead frame, a light-emitting side light-transmitting resin body formed by covering the light-emitting element, and a light-receiving side formed by covering the light-receiving element. A light-transmitting resin body, and a non-light-transmitting exterior formed by integrally covering the light-emitting side transparent resin body and the light-receiving side transparent resin body, and the lead portion of the lead frame is attached to the exterior. 1. An optical coupling device characterized in that a lead-out portion is formed, and a connecting portion between the lead-out portion and a connector that performs input/output with the outside is sealed with a resin. 2. A light-emitting element and a light-receiving element mounted on a lead frame, a light-emitting-side transparent resin body formed by coating the light-emitting element, a light-receiving-side transparent resin body forming a coating over the light-receiving element, and the light-emitting element and the light-receiving element. A non-light-transmitting exterior is formed by integrally covering a side light-transmitting resin body and a light-receiving side light-transmitting resin body, and the lead portion of the lead frame serves as a pin of a connector for inputting and outputting external data. 1. An optical coupling device characterized in that the exterior casing and the connector are integrally molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988140946U JPH0745967Y2 (en) | 1988-10-27 | 1988-10-27 | Optical coupling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988140946U JPH0745967Y2 (en) | 1988-10-27 | 1988-10-27 | Optical coupling device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0262747U true JPH0262747U (en) | 1990-05-10 |
JPH0745967Y2 JPH0745967Y2 (en) | 1995-10-18 |
Family
ID=31405573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988140946U Expired - Fee Related JPH0745967Y2 (en) | 1988-10-27 | 1988-10-27 | Optical coupling device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0745967Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001326113A (en) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | Electronic component lead frame for mounting the same |
JP2008172183A (en) * | 2007-01-15 | 2008-07-24 | Yiguang Electronic Ind Co Ltd | Photo interrupter and its manufacturing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149177A (en) * | 1985-12-23 | 1987-07-03 | Sharp Corp | Manufacture optocoupler with connector |
-
1988
- 1988-10-27 JP JP1988140946U patent/JPH0745967Y2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62149177A (en) * | 1985-12-23 | 1987-07-03 | Sharp Corp | Manufacture optocoupler with connector |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001326113A (en) * | 2000-05-15 | 2001-11-22 | Oizumi Seisakusho:Kk | Electronic component lead frame for mounting the same |
JP2008172183A (en) * | 2007-01-15 | 2008-07-24 | Yiguang Electronic Ind Co Ltd | Photo interrupter and its manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0745967Y2 (en) | 1995-10-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |