JPH0260944A - Molding resin composition - Google Patents
Molding resin compositionInfo
- Publication number
- JPH0260944A JPH0260944A JP63213407A JP21340788A JPH0260944A JP H0260944 A JPH0260944 A JP H0260944A JP 63213407 A JP63213407 A JP 63213407A JP 21340788 A JP21340788 A JP 21340788A JP H0260944 A JPH0260944 A JP H0260944A
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- alumina
- resin composition
- alumina particles
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 20
- 239000011342 resin composition Substances 0.000 title claims abstract description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000002344 surface layer Substances 0.000 claims abstract description 7
- 239000008187 granular material Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000011236 particulate material Substances 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 5
- 229910002026 crystalline silica Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）発明の目的
［産業上の利用分野］
本発明は、成形用樹脂組成物に関し、特に高熱伝導性の
成形用樹脂組成物に関する。Detailed Description of the Invention (a) Object of the Invention [Field of Industrial Application] The present invention relates to a molding resin composition, and particularly to a molding resin composition with high thermal conductivity.
［従来技術とその問題点］
最近、半導体素子の高集積化や高速動作あるいは高電流
処理の要求に対応して、高電力を消費する半導体素子が
増大してきた。その結果素子が発熱し、素子の動作の安
定性、井命特性が低下し、半導体として使用に耐えない
という問題が生じてきた。[Prior art and its problems] Recently, in response to demands for higher integration, higher speed operation, or higher current processing of semiconductor devices, the number of semiconductor devices consuming high power has increased. As a result, the device generates heat, resulting in a decrease in the operational stability and performance characteristics of the device, resulting in a problem that the device cannot be used as a semiconductor.
従来、この問題に対してはヒートシンクや放熱板の設置
で対応してきたが十分でなく、高電力を消費する半導体
素子を封止する樹脂組成物自身の熱伝導性の向上が要求
されるようになってきた。Conventionally, this problem has been dealt with by installing heat sinks and heat sinks, but this is not sufficient, and there is now a need to improve the thermal conductivity of the resin composition itself that encapsulates semiconductor elements that consume high power. It has become.
現在使用されている高熱伝導性の成形用樹脂組成物は、
充填材として、一般に用いられる溶融シリカの代わりに
、結晶シリカを用いたものがほとんどである。しかし、
この方法は充填比率を高めることにより熱伝導性は向上
するが、成形時の流動性を低下させるため、この両特性
のバランスから見て熱伝導性には限りがあり、５．０Ｘ
１０−３ｃａ ｌ／ｃ１１−ｓｅｃ℃が上限であるとい
う問題がある。The high thermal conductivity molding resin compositions currently in use are:
In most cases, crystalline silica is used as a filler instead of the commonly used fused silica. but,
This method improves thermal conductivity by increasing the filling ratio, but it reduces fluidity during molding, so there is a limit to the thermal conductivity from the balance of these two characteristics.
There is a problem in that the upper limit is 10-3 cal/c11-sec°C.
また、充填材としてのアルミナは、結晶シリカに比し熱
伝導率が高く、この点においては有望な機能を有するも
のの、成形特金型の摩耗が極めて激しいという致命的な
欠陥を有しているため、実用化に到っていない。In addition, alumina as a filler has higher thermal conductivity than crystalline silica, and although it has promising functions in this respect, it has a fatal flaw in that it causes extremely severe wear of the special mold. Therefore, it has not been put into practical use.
（ロ）発明の構成
［問題点を解決するための手段］
この発明は、従来技術では得られなかった高熱伝導性で
かつ金型の摩耗を低減させた成形用樹脂組成物を提供す
るものである。即ちアルミナの粒子表層を、アルミナよ
り硬度が低くかつ熱伝導性の良い窒化アルミニウムに改
質したアルミナの粒状物を充填材として使用することに
より、従来の結晶シリカを使用した成形用樹脂組成物と
同様の成形時の流動性、低応力歪み性を有しつつ、熱伝
導性を大幅に向上させると共に成形金型の摩耗を低減さ
せることを見い出したものである。(B) Structure of the Invention [Means for Solving the Problems] The present invention provides a molding resin composition that has high thermal conductivity and reduces mold wear, which was not possible with the prior art. be. In other words, by using as a filler alumina granules in which the surface layer of alumina particles has been modified to aluminum nitride, which has lower hardness and better thermal conductivity than alumina, it is possible to create a molding resin composition that uses conventional crystalline silica. It has been discovered that while having similar fluidity and low stress distortion properties during molding, it significantly improves thermal conductivity and reduces molding die wear.
該樹脂組成物は、樹脂、充填材を必須成分とし必要に応
じて硬化剤、硬化促進剤、着色剤、離型剤等が用いられ
る。樹脂としては一般的にはエポキシ樹脂を挙げること
ができるが、必ずしも限定されるものではなく該用途の
機能を果たすことのできる樹脂、例えば熱硬化性樹脂と
してシリコン樹脂、シリコン変性エポキシ樹脂、また熱
可塑性樹脂としてはポリフェニレンオキサイド樹脂、ポ
リフェニレンサルファイド樹脂、ボエチレンテレフタレ
ート樹脂等を使用することが出来る。しかし電子部品、
半導体封止用としてはクレゾールノボラック型エポキシ
樹脂やシリコン変性エポキシ樹脂等が、耐湿性、耐熱性
、密封性等の諸点を勘案した場合望ましい樹脂といえる
。The resin composition contains a resin and a filler as essential components, and a curing agent, a curing accelerator, a coloring agent, a mold release agent, etc. are used as necessary. Generally, epoxy resins can be mentioned as resins, but they are not necessarily limited to resins that can fulfill the function of the purpose, such as silicone resins, silicone-modified epoxy resins as thermosetting resins, and thermosetting resins. As the plastic resin, polyphenylene oxide resin, polyphenylene sulfide resin, boethylene terephthalate resin, etc. can be used. However, electronic components
For semiconductor encapsulation, cresol novolac type epoxy resins, silicone-modified epoxy resins, and the like are desirable resins in consideration of various points such as moisture resistance, heat resistance, and sealability.
充填材として、火焔溶融により瞬間的に溶融処理をして
、角の取れた丸味を帯びたアルミナ粒子の表層を更に窒
化アルミニウムに改質したアルミナ粒子を使用する。必
要に応じて、溶融シリカ、結晶シリカ等、従来からの充
填材を併用しても良い。As the filler, alumina particles are used which are instantaneously melted by flame melting to further modify the surface layer of rounded alumina particles into aluminum nitride. If necessary, conventional fillers such as fused silica and crystalline silica may be used in combination.
［作用］
熱伝導率の高いアルミナを用いることにより成形用樹脂
の熱伝導性が高め、られ、かつ、丸味を帯びたアルミナ
粒子の表層を、アルミナより硬度が低く熱伝導性の良い
窒化アルミニウムに改質したため、金型の摩耗性が低減
されるのである。[Function] By using alumina with high thermal conductivity, the thermal conductivity of the molding resin is increased, and the surface layer of the rounded alumina particles is replaced with aluminum nitride, which has lower hardness and better thermal conductivity than alumina. Because of the modification, the abrasion of the mold is reduced.
［実施例］
クレゾールノボラック型エポキシ樹脂に充填材として、
従来仕様の溶融シリカを配合した成形用樹脂組成物を比
較ＩＭＩ、結晶シリカを配合した成形用樹脂組成物を比
較例２、アルミナを配合した成形用樹脂組成物を比較例
３とする。また、本発明を適用した窒化アルミニウム表
面処理アルミナを配合した成形用樹脂組成物を実施例１
、本発明を適用した窒化アルミニウム表面処理アルミナ
と溶融シリカを２＝１に混合した充填材を配合した成形
用樹脂組成物を実施例２とする。[Example] As a filler in cresol novolac type epoxy resin,
Comparative IMI is a molding resin composition containing conventional fused silica, Comparative Example 2 is a molding resin composition containing crystalline silica, and Comparative Example 3 is a molding resin composition containing alumina. In addition, a molding resin composition containing aluminum nitride surface-treated alumina to which the present invention is applied was prepared in Example 1.
Example 2 is a molding resin composition containing a filler in which aluminum nitride surface treatment alumina and fused silica are mixed in a ratio of 2=1 to which the present invention is applied.
各成形用樹脂を用いて、成形性（スパイラルフロー）、
摩耗性、熱伝導率を、所定の測定法に従い測定した。表
にその結果を示す。Using each molding resin, moldability (spiral flow),
Abrasion properties and thermal conductivity were measured according to predetermined measurement methods. The results are shown in the table.
ここで、各特性の測定は、次に示す方法で行った。Here, each characteristic was measured by the following method.
スパイラルフロー：ＥＭＭＩ−１−６６に準拠摩耗性：
島津製作所性高化式フローテスターのノズル部をアルミ
ニウム製に変更し、
６０回測定した後の径の増加量（径１
ｍｍに対する増加をμｍで表示）
熱伝導率：シュレーダー法に準拠
以上の実施例及び比較例により、本発明による成形用樹
脂組成物は、熱伝導率が高く、かつ、摩耗性が低く、そ
して成形性も優れたものであることが判る。Spiral flow: Compliant with EMMI-1-66 Abrasion resistance:
The nozzle part of Shimadzu's high quality flow tester was changed to aluminum, and the amount of increase in diameter after 60 measurements (increase for a diameter of 1 mm is expressed in μm). Thermal conductivity: compliant with the Schroeder method or higher. The Examples and Comparative Examples show that the molding resin composition according to the present invention has high thermal conductivity, low abrasion resistance, and excellent moldability.
（ハ）発明の詳細
な説明したように本発明は従来のアルミナより硬度か低
く、かつ熱伝導性の良い、丸味を帯びた、表層を窒化ア
ルミニウムで改質したアルミナを用いるため、高熱伝導
性、低摩耗性、成形性、低応力歪み性にバランスの取れ
た成形用樹脂組成物を提供するものである。従って高熱
伝導性を必要とする電子部品封止用としての産業上の利
用価値は極めて大きいといえる。(c) Detailed description of the invention As described above, the present invention uses alumina that has a lower hardness than conventional alumina, has good thermal conductivity, is rounded, and has a surface modified with aluminum nitride, so it has high thermal conductivity. The present invention provides a molding resin composition that is well-balanced in low abrasion properties, moldability, and low stress distortion properties. Therefore, it can be said that it has extremely great industrial utility value for encapsulating electronic components that require high thermal conductivity.
Claims (1)
物を充填材として用いることを特徴とする成形用樹脂組
成物。A molding resin composition characterized in that a granular material in which the surface layer of alumina particles is modified to aluminum nitride is used as a filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63213407A JPH0260944A (en) | 1988-08-27 | 1988-08-27 | Molding resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63213407A JPH0260944A (en) | 1988-08-27 | 1988-08-27 | Molding resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260944A true JPH0260944A (en) | 1990-03-01 |
Family
ID=16638715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63213407A Pending JPH0260944A (en) | 1988-08-27 | 1988-08-27 | Molding resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260944A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040362A (en) * | 1997-06-20 | 2000-03-21 | Dow Corning Toray Silicone Co., Ltd. | Heat-conducting polymer composition |
| US6636470B1 (en) | 1997-08-12 | 2003-10-21 | Kabushiki Kaisha Kenwood | Disc loading mechanism of disc apparatus |
| US7923069B2 (en) | 2002-04-16 | 2011-04-12 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
-
1988
- 1988-08-27 JP JP63213407A patent/JPH0260944A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6040362A (en) * | 1997-06-20 | 2000-03-21 | Dow Corning Toray Silicone Co., Ltd. | Heat-conducting polymer composition |
| US6636470B1 (en) | 1997-08-12 | 2003-10-21 | Kabushiki Kaisha Kenwood | Disc loading mechanism of disc apparatus |
| US7923069B2 (en) | 2002-04-16 | 2011-04-12 | Applied Materials, Inc. | Multi-station deposition apparatus and method |
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