JPH0259863U - - Google Patents
Info
- Publication number
- JPH0259863U JPH0259863U JP13765388U JP13765388U JPH0259863U JP H0259863 U JPH0259863 U JP H0259863U JP 13765388 U JP13765388 U JP 13765388U JP 13765388 U JP13765388 U JP 13765388U JP H0259863 U JPH0259863 U JP H0259863U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- contact
- solder
- iron tip
- brought
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例の構成図、第２図はそ
の動作説明図、第３図は半田付け不良の説明図で
ある。
図中、４はコテ先、６は糸半田、１０は支持機
構、２０は半田送り機構、３０はコントローラ、
４０は配線である。
FIG. 1 is a block diagram of an embodiment of the present invention, FIG. 2 is an explanatory diagram of its operation, and FIG. 3 is an explanatory diagram of defective soldering. In the figure, 4 is a soldering iron tip, 6 is a solder thread, 10 is a support mechanism, 20 is a solder feeding mechanism, 30 is a controller,
40 is wiring.
Claims (1)
先４を加熱および昇降させる支持機構１０を備え
、該糸半田６を該コテ先４に接触させて溶融し、
端子部の半田付けを行なう自動半田付け装置にお
いて、 該糸半田６を繰り出して該コテ先４に接触させ
る期間中の両者間の電気的導通時間を計測し、該
接触させる期間に対する電気的導通時間の割合に
より半田付け良／不良を判定する配線４０と制御
部３０を設けてなることを特徴とする自動半田付
け装置。[Claims for Utility Model Registration] A solder feeding mechanism 20 that feeds out a solder thread 6 and a support mechanism 10 that heats and raises and lowers the soldering iron tip 4 are provided, and the solder thread 6 is brought into contact with the soldering iron tip 4 and melted.
In an automatic soldering device that solders terminal parts, the electric conduction time between the two is measured during the period when the solder thread 6 is fed out and brought into contact with the iron tip 4, and the electric conduction time for the period of contact is measured. An automatic soldering device characterized by being provided with wiring 40 and a control section 30 for determining whether soldering is good or bad based on the ratio of soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765388U JPH0259863U (en) | 1988-10-21 | 1988-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13765388U JPH0259863U (en) | 1988-10-21 | 1988-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259863U true JPH0259863U (en) | 1990-05-01 |
Family
ID=31399270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13765388U Pending JPH0259863U (en) | 1988-10-21 | 1988-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259863U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010182907A (en) * | 2009-02-06 | 2010-08-19 | Japan Bonkote Co Ltd | Time management apparatus for manually soldering process |
| JP2018140432A (en) * | 2017-02-28 | 2018-09-13 | オムロン株式会社 | Work support apparatus, method, program, and tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423056A (en) * | 1977-07-22 | 1979-02-21 | Hitachi Ltd | Automatic soldering device |
-
1988
- 1988-10-21 JP JP13765388U patent/JPH0259863U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423056A (en) * | 1977-07-22 | 1979-02-21 | Hitachi Ltd | Automatic soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010182907A (en) * | 2009-02-06 | 2010-08-19 | Japan Bonkote Co Ltd | Time management apparatus for manually soldering process |
| JP2018140432A (en) * | 2017-02-28 | 2018-09-13 | オムロン株式会社 | Work support apparatus, method, program, and tool |
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