JPH0258331U - - Google Patents
Info
- Publication number
- JPH0258331U JPH0258331U JP13832388U JP13832388U JPH0258331U JP H0258331 U JPH0258331 U JP H0258331U JP 13832388 U JP13832388 U JP 13832388U JP 13832388 U JP13832388 U JP 13832388U JP H0258331 U JPH0258331 U JP H0258331U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- removal device
- jig
- cooling
- wafer removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988138323U JPH071791Y2 (ja) | 1988-10-24 | 1988-10-24 | 半導体ウエハ取外装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988138323U JPH071791Y2 (ja) | 1988-10-24 | 1988-10-24 | 半導体ウエハ取外装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0258331U true JPH0258331U (es) | 1990-04-26 |
JPH071791Y2 JPH071791Y2 (ja) | 1995-01-18 |
Family
ID=31400553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988138323U Expired - Lifetime JPH071791Y2 (ja) | 1988-10-24 | 1988-10-24 | 半導体ウエハ取外装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH071791Y2 (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012081611A1 (ja) * | 2010-12-14 | 2012-06-21 | 住友ベークライト株式会社 | 基材の加工方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612735A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Peeling of monocrystalline wafer |
JPS56161340U (es) * | 1980-04-28 | 1981-12-01 |
-
1988
- 1988-10-24 JP JP1988138323U patent/JPH071791Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5612735A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Peeling of monocrystalline wafer |
JPS56161340U (es) * | 1980-04-28 | 1981-12-01 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012081611A1 (ja) * | 2010-12-14 | 2012-06-21 | 住友ベークライト株式会社 | 基材の加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH071791Y2 (ja) | 1995-01-18 |
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