JPH0258027B2 - - Google Patents
Info
- Publication number
- JPH0258027B2 JPH0258027B2 JP63062030A JP6203088A JPH0258027B2 JP H0258027 B2 JPH0258027 B2 JP H0258027B2 JP 63062030 A JP63062030 A JP 63062030A JP 6203088 A JP6203088 A JP 6203088A JP H0258027 B2 JPH0258027 B2 JP H0258027B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wire
- tip
- blotting
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 111
- 229910000679 solder Inorganic materials 0.000 claims description 110
- 238000005476 soldering Methods 0.000 claims description 87
- 230000002950 deficient Effects 0.000 claims description 56
- 229910052742 iron Inorganic materials 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 210000003371 toe Anatomy 0.000 description 2
- 208000019300 CLIPPERS Diseases 0.000 description 1
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
＜産業上の利用分野＞
この発明は再半田付け装置及びそれを用いた再
半田付け方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resoldering device and a resoldering method using the same.
＜従来の技術＞
プリント基板上には電子部品（例えば、ICや
抵抗等）のピンが半田付けにより取付けられてい
る。そして、この半田付け作業は、作業員による
手作業や自動半田付け装置による機械作業により
行われているが、どうしても半田の不良個所がで
てしまう。<Prior Art> Pins of electronic components (eg, ICs, resistors, etc.) are attached to printed circuit boards by soldering. Although this soldering work is performed manually by a worker or mechanically by an automatic soldering device, defects in the solder inevitably occur.
従つて、この不良半田を除去して、正しい半田
をやり直す「再半田付け作業」を行う必要があ
る。このように再半田付け作業における不良半田
の除去は、従来いつたん不良半田を溶融させ、溶
融した不良半田をバキユームで吸引除去してい
た。 Therefore, it is necessary to remove this defective solder and perform a "re-soldering operation" in which the correct solder is applied again. Conventionally, defective solder in re-soldering work is removed by simply melting the defective solder and then sucking and removing the melted defective solder with a vacuum cleaner.
＜発明が解決しようとする課題＞
しかしながら、このような従来のバキユーム式
除去方法にあつては、溶融した不良半田が固化し
易いために、バキユーム機構中ですぐに固化して
詰まつてしまい、作業の信頼性及びメンテナンス
の面で問題があつた。<Problems to be Solved by the Invention> However, in such a conventional vacuum removal method, the molten defective solder easily solidifies, so it quickly solidifies and becomes clogged in the vacuum mechanism. There were problems with work reliability and maintenance.
また、不良半田を除去する装置と、正しい半田
を行う半田付け装置の、２つの装置を必要として
いた。 Furthermore, two devices were required: a device to remove defective solder and a soldering device to perform proper soldering.
この発明はこのような従来の技術に着目して為
されたものであり、１つの装置で再半田付けを確
実に行うことができる再半田付け装置及びそれを
用いた再半田付け方法を提供せんとするものであ
る。 The present invention has been made by focusing on such conventional technology, and aims to provide a re-soldering device that can reliably perform re-soldering with one device, and a re-soldering method using the same. That is.
＜課題を解決するための手段＞
この発明に係る再半田付け装置及びそれを用い
た再半田付け方法は、上記の目的を達成するため
に、溶融させた不良半田を、吸取りワイヤの毛管
現象を利用して除去する手段を利用している。<Means for Solving the Problems> In order to achieve the above object, the re-soldering device and the re-soldering method using the same according to the present invention collect molten defective solder using capillary action of a suction wire. They are using methods to use and remove them.
具体的には、この発明の再半田付け装置は、先
端にコテ先を有する半田コテ本体に、コテ先の先
端めがけて吸取りワイヤを供給自在で且つ供給し
た吸取りワイヤを切断する吸取りワイヤ用カツタ
ー機構を備えた吸取りワイヤ供給ユニツトと、コ
テ先の先端めがけて糸半田を供給自在な糸半田供
給ユニツトと、が一体的に組合わされているもの
である。 Specifically, the re-soldering device of the present invention includes a soldering iron body having a soldering iron tip at its tip, a blotting wire cutter mechanism that can freely supply a blotting wire toward the tip of the soldering iron tip, and that cuts the supplied blotting wire. A suction wire supply unit equipped with a soldering iron and a thread solder supply unit capable of freely supplying thread solder to the tip of the soldering iron tip are integrally combined.
また、この発明の再半田付け方法は、前記再半
田付け装置を用いて、
(イ) 吸取りワイヤ供給ユニツトから吸取りワイヤ
を一定量送り出し、該吸取りワイヤをプリント
基板の不良半田の上に載せる工程
(ロ) 吸取りワイヤの不良半田に対応する部分へ半
田コテ本体のコテ先を押付ける工程
(ハ) 糸半田供給ユニツトから糸半田をコテ先めが
けて少量送り出し、コテ先を押付けている部分
の吸取りワイヤに溶融ハンダを施す工程
(ニ) 少量の溶融半田とコテ先の熱により不良半田
を加熱して溶融させ、該溶融した不良半田を吸
取りワイヤによる毛管現象を利用して吸取り除
去する工程
(ホ) プリント基板の不良半田が除去された部位に
コテ先を押付ける工程
(ヘ) 糸半田供給ユニツトから糸半田をコテ先めが
けて一定量送り出し、コテ先を押付けている部
位に再ハンダ付け用の溶融ハンダを施す工程
……の各工程を行うものである。 Further, the re-soldering method of the present invention uses the re-soldering device, and includes the steps of (a) sending out a certain amount of blotting wire from the blotting wire supply unit and placing the blotting wire on the defective solder on the printed circuit board ( (b) The process of pressing the soldering iron tip of the soldering iron body against the part of the blotting wire that corresponds to the defective solder (c) A small amount of thread solder is sent out from the thread solder supply unit toward the soldering iron tip, and the blotting wire is pressed against the part where the soldering iron tip is pressed. A process of applying molten solder to the solder (d) A process of heating and melting the defective solder using a small amount of molten solder and the heat of the iron tip, and removing the molten defective solder by blotting it off using capillary action with a blotting wire (e) The process of pressing the soldering iron tip onto the area from which defective solder has been removed from the printed circuit board (f) A fixed amount of thread solder is sent from the thread solder supply unit toward the iron tip, and the soldering iron tip is applied to the area where the soldering iron tip is being pressed to melt it for re-soldering. The process of applying soldering... is performed.
＜作 用＞
不良半田に吸取りワイヤを押当てた後、該吸取
りワイヤに少量の溶融半田を施しつつ、前記不良
半田に半田コテなどにより加熱処理を施せば、該
不良半田は溶融し、溶融と同時に毛管現象により
吸取りワイヤへ吸取られていく。溶融した不良半
田は表面張力が大きく、確実且つ完全に吸取りワ
イヤへ吸い取られていく。また、吸取りワイヤに
は少量の溶融半田が施されるので、この少量の溶
融半田が誘引用の「よび水」となり、吸取りワイ
ヤの伝熱効率が高まつて、加熱がそのまま不良半
田に伝えられることとなり、不良半田が溶融し易
くなると共に、溶融した不良半田が吸取りワイヤ
に吸収されやすくなる。<Function> After pressing a blotting wire against the defective solder, if a small amount of molten solder is applied to the blotting wire and heat treatment is applied to the defective solder using a soldering iron or the like, the defective solder will be melted and the melted solder will be removed. At the same time, it is sucked up to the suction wire by capillary action. The melted defective solder has a large surface tension and is reliably and completely sucked up by the suction wire. In addition, since a small amount of molten solder is applied to the blotting wire, this small amount of molten solder acts as "water" for attraction, increasing the heat transfer efficiency of the blotting wire, and allowing the heat to be directly transmitted to the defective solder. Therefore, the defective solder is easily melted, and the molten defective solder is also easily absorbed by the blotting wire.
しかも、糸半田供給ユニツトで、吸取りワイヤ
に対する少量（誘引用）の溶融半田供給と、不良
半田を除去した部位に対する再半田付け用の溶融
半田供給、の両方を兼用して行うことができるの
で、従来不良半田除去用装置と半田付け装置の２
つの装置を要していた再半田付け作業を、この発
明では１つの装置で行うことができる。 Moreover, the thread solder supply unit can both supply a small amount of molten solder (for attraction) to the suction wire and supply molten solder for re-soldering to the part from which defective solder has been removed. Conventional equipment for removing defective solder and soldering equipment 2
According to the present invention, re-soldering work that previously required two devices can be performed with one device.
＜実施例＞
以下、この発明の好適な実施例を図面に基づい
て説明する。<Example> Hereinafter, a preferred example of the present invention will be described based on the drawings.
第１図〜第３図ａ，ｂ，ｃはこの発明の一実施
例である手動用再半田付け装置を示す図である。
この手動用再半田付け装置１は、ピストル形状の
半田コテ本体２と、吸取りワイヤ３を供給自在な
吸取りワイヤ供給ユニツト４、及び糸半田供給ユ
ニツト７とから主に構成されている。 FIGS. 1 to 3 a, b, and c are diagrams showing a manual resoldering device which is an embodiment of the present invention.
This manual resoldering device 1 mainly comprises a pistol-shaped soldering iron main body 2, a suction wire supply unit 4 capable of supplying a suction wire 3, and a thread solder supply unit 7.
半田コテ本体２は、上部にヒータ部５を有して
おり、該ヒータ部５の先端には曲折形状のコテ先
６が設けられている。また、このヒータ部５を固
定している糸半田供給ユニツト７の先端には前記
コテ先６の先端めがけて延びているガイド筒８が
取付けられている。ヒータ部５の後部にはフラツ
クス入り糸半田９を巻付けた巻取ロール１０が配
されており、該糸半田９を糸半田供給ユニツト７
の内部を通し、一対の送出しローラ１１に挟持し
た状態で、前記ガイド筒８の先端から供給できる
ようになつている。 The soldering iron main body 2 has a heater section 5 at the top, and a curved iron tip 6 is provided at the tip of the heater section 5. Further, a guide tube 8 extending toward the tip of the soldering iron tip 6 is attached to the tip of the thread solder supply unit 7 to which the heater section 5 is fixed. A take-up roll 10 on which flux-cored solder wire 9 is wound is disposed at the rear of the heater section 5, and the solder wire 9 is transferred to the solder wire supply unit 7.
The guide tube 8 can be fed from the tip thereof through the inside of the guide tube 8 while being held between a pair of delivery rollers 11 .
一方、糸半田供給ユニツト７の下端部には、吸
取りワイヤ供給ユニツト４が一体的に設けられて
いる。この吸取りワイヤ供給ユニツト４の下部に
は、細い鋼線を編んだ帯状の吸取りワイヤ３を巻
付けた巻取ロール１２が配されており、該吸取り
ワイヤ３を吸取りワイヤ供給ユニツト４の内部を
通し、一対の送出しローラ１３に挟持した状態
で、先端に突出形成したガイド筒１４から前記糸
半田９と同様に、コテ先６の先端めがけて供給で
きるようになつている。尚、糸半田供給ユニツト
７には、図面上分かりづらいが２つのスイツチボ
タン１５が並列に配置してあり、このスイツチボ
タン１５を押すことにより、糸半田９および吸取
りワイヤ３を一定量供給できるようになつてい
る。また、ヒタ部５のコテ先６は糸半田供給ユニ
ツト７端部にある電源コード１６を電源に接続し
た時点で加熱するるようになつている。 On the other hand, a suction wire supply unit 4 is integrally provided at the lower end of the thread solder supply unit 7. At the bottom of the blotting wire supply unit 4, a winding roll 12 is arranged, around which a band-shaped blotting wire 3 made of braided thin steel wire is wound. , while being held between a pair of delivery rollers 13, it can be supplied to the tip of the soldering iron tip 6 from a guide cylinder 14 formed protruding from the tip, similarly to the thread solder 9. Although it is difficult to see in the drawing, two switch buttons 15 are arranged in parallel on the solder wire supply unit 7, and by pressing the switch buttons 15, a fixed amount of the solder wire 9 and the suction wire 3 can be supplied. It's getting old. Further, the soldering iron tip 6 of the lid portion 5 is heated when the power cord 16 at the end of the thread solder supply unit 7 is connected to a power source.
更に、吸取りワイヤ供給ユニツト４には、吸取
りワイヤ用カター機構５０が付設されいる。すな
わち、刃先５１をガイド筒１４の先端に臨ませた
状態で固定されている爪切り状のカツター本体５
２と、該カツター本体５２の段部５３にやじり状
ピストン５４を押付けることにより刃先５１を閉
じさせるシリンダ５５とが設けられている。 Furthermore, the blotting wire supply unit 4 is provided with a blotting wire cutter mechanism 50. That is, the nail clipper-shaped cutter body 5 is fixed with the cutting edge 51 facing the tip of the guide tube 14.
2, and a cylinder 55 that closes the cutting edge 51 by pressing a beveled piston 54 against the stepped portion 53 of the cutter body 52.
次に、この手動用再半田付け装置１の使用方法
を説明する〔第３図ａ，ｂ，ｃ参照〕。 Next, a method of using this manual resoldering device 1 will be explained (see FIGS. 3a, b, and c).
１７はプリント基板で、電子部品であるIC１
８のピン１９を他面側に突起させた状態で半田付
けしている。このピン１９を固定している半田は
図面に表れないが隣接するピンとブリツジ（半田
と半田がつながつてしまう現象）を起こした不良
半田２０である。そして、この不良半田２０上に
糸半田供給ユニツト７より供給した吸取りワイヤ
３をのせる。そして、この吸取りワイヤ３上に手
動用再半田付け装置１のコテ先６を押当てると同
時に、コテ先６めがけて糸半田９を各々送り出す
〔第３図ａ参照〕。そうすることにより、糸半田９
は少しだけコテ先６にて溶融され吸取りワイヤ３
に吸収される。不良半田２０にはコテ先６からの
熱が吸取りワイヤ３を介して伝達されるのですぐ
に溶融する。溶融した不良半田２０は毛管現象に
より吸取りワイヤ３に吸収される〔第３図ｂ参
照〕。吸取りワイヤ３にて溶融の不良半田２０が
吸収された後には何も残らない。そして、図示せ
ぬ吸取りワイヤ用カツター機構５０のスイツチを
押し、やじり状ピストン５４を突出させて、刃先
５１を閉じ、不良半田２０を吸収した吸取りワイ
ヤ３の先端部分を切断し〔第３図ｃ参照〕、新し
い吸取りワイヤ３の先端部にて次の除去作業を行
うことができる。 17 is a printed circuit board, which is an electronic component IC1
The pin 19 of No. 8 is soldered with the pin 19 protruding from the other side. Although the solder fixing this pin 19 is not shown in the drawing, it is defective solder 20 that has caused bridging (a phenomenon in which solder and solder are connected) with an adjacent pin. Then, the suction wire 3 supplied from the thread solder supply unit 7 is placed on this defective solder 20. Then, the soldering iron tip 6 of the manual resoldering device 1 is pressed onto the suction wire 3, and at the same time, the thread solder 9 is sent out toward the soldering iron tip 6 (see FIG. 3a). By doing so, the thread solder 9
is slightly melted at the iron tip 6 and the suction wire 3
be absorbed into. The heat from the soldering iron tip 6 is transmitted to the defective solder 20 via the suction wire 3, so that the defective solder 20 melts immediately. The melted defective solder 20 is absorbed by the suction wire 3 by capillary action (see FIG. 3b). After the poorly melted solder 20 is absorbed by the suction wire 3, nothing remains. Then, the switch of the blotting wire cutter mechanism 50 (not shown) is pressed to project the barrel-shaped piston 54, close the cutting edge 51, and cut the tip of the blotting wire 3 that has absorbed the defective solder 20 [Fig. 3c] ], the next removal operation can be performed with the tip of a new blotting wire 3.
そして、この実施例に係る手動用再半田付け装
置１は、上記の如き不良半田２０の除去を行うだ
けでなく、不良半田２０の除去を行つた後に、あ
らためて正確な半田付けができる。すなわち、コ
テ先６をピン１９に押当て、糸半田９だけを供給
することにより、ピン１９の半田付けを行うこと
ができる。従つて、不良半田２０が発生した場合
は、この手動用再半田付け装置１により、不良半
田２０を除去すると共に半田付けのやり直し（即
ち、再半田付け作業）も行うことができる。 The manual resoldering device 1 according to this embodiment not only removes the defective solder 20 as described above, but also performs accurate soldering again after removing the defective solder 20. That is, the pin 19 can be soldered by pressing the soldering iron tip 6 against the pin 19 and supplying only the thread solder 9. Therefore, when defective solder 20 occurs, the manual resoldering device 1 can remove the defective solder 20 and also perform resoldering (that is, resoldering work).
第４図〜第７図ａ，ｂ，ｃは、この発明の他の
実施例である自動再半田付け装置を示す図であ
る。尚、先の実施例と共通する部分については同
一の符号を付し、重複する説明は省略する。 4 to 7 a, b, and c are diagrams showing an automatic resoldering device according to another embodiment of the present invention. Note that the same reference numerals are given to parts common to the previous embodiment, and redundant explanation will be omitted.
この実施例に係る自動再半田付け装置２１は、
任意位置に移動自在で且つ回転自在なロボツトア
ームのヘツド２２に、吸取りワイヤ２３を掴んだ
ままプリント基板１７上でピン１９を固定してい
る不良半田２０に臨ませるセツトフインガーユニ
ツト２４と、該不良半田２０に加熱処理を施す半
田コテユニツト２５を組付けたものと、吸取りワ
イヤ供給装置（吸取りワイヤ供給ユニツト）３０
とを組み合わせたものである。そして、これらセ
ツトフインガーユニツト２４と半田コテユニツト
２５は、共にシリンダ２６，２７にてフインガー
部２８とコテ部（半田コテ本体）２９とを各々独
立に上下動可能で、且つプリント基板１７上の一
点（ピン１９）を中心にＶ字状に傾斜している。
また、吸取りワイヤ供給装置３０は、一定長さサ
イズの吸取りワイヤ２３を順次供給するものであ
り、プリント基板１７を固定したステージ３１の
側方に配置されている。 The automatic resoldering device 21 according to this embodiment includes:
A set finger unit 24 is attached to the head 22 of the robot arm, which is movable and rotatable to any position, and is placed so as to face the defective solder 20 fixing the pin 19 on the printed circuit board 17 while holding the suction wire 23. A soldering iron unit 25 that heats defective solder 20 is assembled, and a blotting wire supply device (blotting wire supply unit) 30.
It is a combination of The set finger unit 24 and the soldering iron unit 25 are both capable of vertically moving the finger portion 28 and the soldering iron portion (soldering iron body) 29 independently by means of cylinders 26 and 27, and are capable of vertically moving the finger portion 28 and the soldering iron portion (soldering iron body) 29, respectively, at one point on the printed circuit board 17. (pin 19) is inclined in a V-shape.
Further, the suction wire supply device 30 sequentially supplies suction wires 23 of a fixed length size, and is arranged on the side of the stage 31 on which the printed circuit board 17 is fixed.
更に、この自動再半田付け装置２１は図示せぬ
自動半田検査装置と電気的に接続されており、そ
の自動半田検査装置からの信号により、「不良」
と判断された不良半田２０の位置へ自動的に移
動・位置決めできるようになつている。 Furthermore, this automatic re-soldering device 21 is electrically connected to an automatic solder inspection device (not shown), and a signal from the automatic solder inspection device indicates whether the device is “defective” or not.
It is possible to automatically move and position the defective solder 20 to the position determined to be defective.
そして、前記セツトフインガーユニツト２４の
上下動自在なフインガー部２８には、軸３２中心
に爪先３３を開閉自在な左右一対の爪体３４が設
けてある。つまり、この爪体３４の上端部間にや
じり状ピストン３５の先端を差込めば爪先３３が
開き、抜けば爪先３３が一定の図示せぬスプリン
グの付勢力にて閉じるようになつている。従つ
て、この爪先３３間で一定長さサイズの吸取りワ
イヤ２３を挟持して掴むことができる。 The vertically movable finger portion 28 of the set finger unit 24 is provided with a pair of left and right claw bodies 34 that can freely open and close a toe 33 at the center of a shaft 32. That is, when the tip of the barrel-shaped piston 35 is inserted between the upper ends of the claw body 34, the claw 33 opens, and when it is removed, the claw 33 is closed by a certain biasing force of a spring (not shown). Therefore, the suction wire 23 of a certain length can be held and held between the toes 33.
前記半田コテユニツト２５のコテ部２９には先
端にコテ先３６が設けられていると共に、該コテ
先３６の先端めがけてフラツクス入りの糸半田９
を供給自在なガイド筒３７が設けられている。こ
のガイド筒３７は一定量の糸半田９を供給すべく
図示せぬ糸半田供給装置と接続されている。 The iron portion 29 of the soldering iron unit 25 is provided with a soldering iron tip 36 at the tip thereof, and a flux-containing wire solder 9 is applied toward the tip of the soldering iron tip 36.
A guide tube 37 is provided that can freely supply. This guide tube 37 is connected to a thread solder supply device (not shown) to supply a fixed amount of thread solder 9.
吸取りワイヤ供給装置３０は、吸取りワイヤ２
３を巻付けた巻取ロール３８と、該吸取りワイヤ
２３を一定量送出す送出しローラ３９と、上下一
対のカツター４０とを備えてある〔第６図参照〕。
そして、巻取ロール３８に巻付けてある吸取りワ
イヤ２３を送出しローラ３９にて一定量だけ取出
口より突出させ、ロボツトアームのヘツド２２に
より移動させられたセツトフインガーユニツト２
４がこの吸取りワイヤ２３を掴みに来た際に、カ
ツター４０にて切断し、一定長さサイズの吸取り
ワイヤ２３をセツトフインガーユニツト２４に受
け渡しできるようになつている。 The suction wire supply device 30 is a suction wire supply device 30 that
3, a delivery roller 39 for delivering a fixed amount of the suction wire 23, and a pair of upper and lower cutters 40 (see FIG. 6).
Then, the suction wire 23 wound around the take-up roll 38 is made to protrude by a certain amount from the take-out port by the delivery roller 39, and the set finger unit 2 is moved by the head 22 of the robot arm.
When the suction wire 23 comes to grab the suction wire 23, the suction wire 23 is cut with a cutter 40, and the suction wire 23 of a certain length can be delivered to the set finger unit 24.
次に、この自動再半田付け装置２１の使用方法
を説明する〔第７図ａ，ｂ，ｃ参照〕。 Next, a method of using this automatic resoldering device 21 will be explained (see FIGS. 7a, b, and c).
まず、ロボツトアームのヘツド２２の運動にて
セツトフインガーユニツト２４及び半田コテユニ
ツト２５を、吸取りワイヤ供給装置３０の上方へ
移動させ、セツトフインガーユニツト２４の爪先
３３にて一定長さサイズの吸取りワイヤ２３を掴
む。そして、図示せぬ自動検査装置からの信号に
より、前記セツトフインガーユニツト２４及び半
田コテユニツト２５をプリント基板１７の上方に
もつていき、作業対象である不良半田２０にて固
定されたピン１９の上部に位置決めする。そし
て、シリンダ２６，２７にてコテ部２９及びフイ
ンガー部２８を各々傾斜方向に沿つて下降させ
る。すると、不良半田２０上に吸取りワイヤ２３
がのせられ、そしてこの吸取りワイヤ２３上にコ
テ先３６が押当てられると同時に、コテ先３６め
がけて糸半田９を少量送り出す〔第７図ａ参照〕。
そうすることにより、糸半田９は少しだけコテ先
３６にて溶融され吸取りワイヤ２３に吸収され
る。不良半田２０にはコテ先３６かららの熱が吸
取りワイヤ２３を介して伝達されるのですぐに溶
融する。溶融した不良半田２０は毛管現象により
吸取りワイヤ２３に吸収される〔第７図ｂ参照〕。 First, the set finger unit 24 and the soldering iron unit 25 are moved above the blotting wire supply device 30 by the movement of the head 22 of the robot arm, and the tip 33 of the set finger unit 24 is used to pick up a blotting wire of a certain length. Grab 23. Then, in response to a signal from an automatic inspection device (not shown), the set finger unit 24 and soldering iron unit 25 are moved above the printed circuit board 17, and the upper part of the pin 19 fixed with the defective solder 20, which is the work target, is moved. position. Then, the iron part 29 and the finger part 28 are each lowered along the inclination direction using the cylinders 26 and 27. Then, the blotting wire 23 is placed on the defective solder 20.
is placed on the suction wire 23, and at the same time the soldering iron tip 36 is pressed onto the suction wire 23, a small amount of thread solder 9 is sent out toward the soldering iron tip 36 (see FIG. 7a).
By doing so, the thread solder 9 is slightly melted at the soldering iron tip 36 and absorbed by the suction wire 23. Since the heat from the soldering iron tip 36 is transmitted to the defective solder 20 via the suction wire 23, the defective solder 20 melts immediately. The melted defective solder 20 is absorbed by the suction wire 23 by capillary action (see FIG. 7b).
そして、吸取りワイヤ２３にて溶融の不良半田
２０を吸収したら、セツトフインガーユニツト２
４及び半田コテユニツト２５をいつたん上方へ移
動させた後、今度は半田コテユニツト２５だけを
再度下降させ、不良半田２０を除去した後のピン
１９にコテ先３６を押当て、糸半田９だけを供給
することにより、ピン１９の半田付けの「やり直
し」を行うことができる〔第７図ｃ参照〕。そし
て、この半田付けの「やり直し（再半田付け作
業）」が終了したら、ロボツトアームのヘツド２
２の運動により半田コテユニツト２５及びセツト
フインガーユニツト２４を各々大きく移動させ、
前記不良半田２０を吸収した吸取りワイヤ２３を
所定位置に捨てる。そして、自動半田検査装置か
らの次の信号により、別の不良半田に対して上述
の動作を繰り返し行い、プリント基板１７上にお
ける全ての不良半田２０の「やり直し（再半田付
へ作業）」を順次行うことができる。 After absorbing the defective melted solder 20 with the suction wire 23, the set finger unit 2
4 and the soldering iron unit 25 upward, this time only the soldering iron unit 25 is lowered again, the iron tip 36 is pressed against the pin 19 from which the defective solder 20 has been removed, and only the thread solder 9 is supplied. By doing so, it is possible to "redo" the soldering of the pin 19 (see FIG. 7c). After this soldering "redo (re-soldering work)" is completed, head 2 of the robot arm is
2, the soldering iron unit 25 and the setting finger unit 24 are each moved greatly,
The suction wire 23 that has absorbed the defective solder 20 is discarded at a predetermined position. Then, in response to the next signal from the automatic solder inspection device, the above-mentioned operation is repeated for another defective solder, and all the defective solders 20 on the printed circuit board 17 are "re-soldered" (re-soldered) in sequence. It can be carried out.
尚、上記説明において、「吸取りワイヤ」とし
て細い鋼線を編んだ帯状のものを例にしたがこれ
に限定されない。また、前記自動再半田付け装置
２１に関しては、吸取りワイヤの供給を、上記実
施例の如く別置きタイプの吸取りワイヤ供給装置
３０にて行つても良いが、セツトフインガーユニ
ツト２４自体に吸取りワイヤ供給機構を組付ける
ようにしても良い。 Incidentally, in the above description, a belt-shaped thing made of thin steel wires was used as an example of the "blotting wire", but the present invention is not limited thereto. Regarding the automatic resoldering device 21, the suction wire may be supplied by a separate type suction wire supply device 30 as in the above embodiment, but the suction wire is supplied to the set finger unit 24 itself. The mechanism may be assembled.
＜効 果＞
この発明に係る再半田付け装置及びそれを用い
た再半田付け方法は、以上説明してきた如き内容
のものなので、半田付けに失敗した不良半田が生
じたとしても、その不良半田の除去を簡単且つ確
実に行うことができると共に、正しい半田付けの
「やり直し（再半田付け作業）」を容易に行うこと
ができるため、半田付け作業における全体的な作
業性の改善を図ることができる。<Effects> Since the re-soldering device and the re-soldering method using the same according to the present invention have the contents as described above, even if defective solder that fails in soldering occurs, the defective solder can be removed. Not only can it be removed easily and reliably, but it can also be easily re-soldered (re-soldering work), which can improve the overall workability of soldering work. .
また、実施例で示しさ如く、自動半田検査装置
などと組も合わせることにより、再半田付け作業
の自動化を行うこともできる。 Further, as shown in the embodiment, re-soldering work can be automated by combining the present invention with an automatic solder inspection device or the like.
更に、吸取りワイヤの毛管現象という物理現象
を利用して不良半田の除去を行うので、除去作業
にトラブルが少なく、メンテナンス上も有利であ
る。 Furthermore, since defective solder is removed using the physical phenomenon of capillarity of the blotting wire, there are fewer troubles in the removal work and it is advantageous in terms of maintenance.
第１図はこの発明の一実施例を示す手動用再半
田付け装置の概略説明図、第２図は吸取りワイヤ
用カツター機構を示す説明図、第３図ａ，ｂ，ｃ
は、各々手動用再半田付け装置における不良半田
の除去工程を示すプリント基板の拡大断面図、第
４図はこの発明の他の実施例を示す自動再半田付
け装置の平面図、第５図は自動再半田付け装置の
側面図、第６図は吸取りワイヤ供給装置を示す概
略説明図、そして第７図ａ，ｂ，ｃは、各々自動
再半田付け装置における不良半田の除去及び半田
付け工程を示すプリント基板の拡大断面図であ
る。
１……手動用再半田付け装置、２……半田コテ
本体、３，２３……吸取りワイヤ、４……吸い取
りワイヤ供給ユニツト、９……糸半田、１７……
プリント基板、１９……ピン、２０……不良半
田、２１……自動再半田付け装置、２２……ロボ
ツトアームのヘツド、２４……セツトフインガー
ユニツト、２５……半田コテユニツト、２９……
コテ部（半田コテ本体）、３０……吸取りワイヤ
供給装置（吸い取りワイヤ供給ユニツト）。
Fig. 1 is a schematic explanatory diagram of a manual resoldering device showing an embodiment of the present invention, Fig. 2 is an explanatory diagram showing a cutter mechanism for blotting wire, and Figs. 3 a, b, c.
4 is an enlarged sectional view of a printed circuit board showing the process of removing defective solder in a manual resoldering device, FIG. 4 is a plan view of an automatic resoldering device showing another embodiment of the present invention, and FIG. A side view of the automatic resoldering device, FIG. 6 is a schematic explanatory diagram showing the suction wire supply device, and FIGS. 7a, b, and c respectively show the removal of defective solder and the soldering process in the automatic resoldering device. FIG. 3 is an enlarged cross-sectional view of the printed circuit board shown in FIG. DESCRIPTION OF SYMBOLS 1... Manual resoldering device, 2... Soldering iron main body, 3, 23... Blotting wire, 4... Blotting wire supply unit, 9... Thread soldering, 17...
Printed circuit board, 19... pin, 20... defective solder, 21... automatic resoldering device, 22... head of robot arm, 24... set finger unit, 25... soldering iron unit, 29...
Soldering iron part (soldering iron main body), 30... blotting wire supply device (blotting wire supply unit).
Claims (1)
先の先端めがけて吸取りワイヤを供給自在で且つ
供給した吸取りワイヤを切断する吸取りワイヤ用
カツター機構を備えた吸取りワイヤ供給ユニツト
と、コテ先の先端めがけて糸半田を供給自在な糸
半田供給ユニツトと、が一体的に組合わされてい
ることを特徴とする再半田付け装置。 ２ 請求項１記載の再半田付け装置を用いて、下
記の各工程を行う再半田付け方法。 (イ) 吸取りワイヤ供給ユニツトから吸取りワイヤ
を一定量送り出し、該吸取りワイヤをプリント
基板の不良半田の上に載せる工程 (ロ) 吸取りワイヤの不良半田に対応する部分へ半
田コテ本体のコテ先を押付ける工程 (ハ) 糸半田供給ユニツトから糸半田をコテ先めが
けて少量送り出し、コテ先を押付けている部分
の吸取りワイヤに溶融ハンダを施す工程 (ニ) 少量の溶融半田とコテ先の熱により不良半田
を加熱して溶融させ、該溶融した不良半田を吸
取りワイヤによる毛管現象を利用して吸取り除
去する工程 (ホ) プリント基板の不良半田が除去された部位に
コテ先を押付ける工程 (ヘ) 糸半田供給ユニツトから糸半田をコテ先めが
けて一定量送り出し、コテ先を押付けている部
位に再ハンダ付け用の溶融ハンダを施す工程[Scope of Claims] 1. A blotting wire supply unit that is equipped with a blotting wire cutter mechanism that can freely supply a blotting wire toward the tip of the soldering iron tip and cut the supplied blotting wire to a soldering iron body having a soldering iron tip at the tip. and a thread solder supply unit capable of freely supplying thread solder to the tip of a soldering iron tip. 2. A re-soldering method comprising performing the following steps using the re-soldering device according to claim 1. (b) Step of sending out a certain amount of blotting wire from the blotting wire supply unit and placing the blotting wire on top of the defective solder on the printed circuit board.(B) Pushing the tip of the soldering iron body to the part of the blotting wire that corresponds to the defective solder. Attaching process (c) Sending out a small amount of thread solder from the thread solder supply unit toward the tip of the iron, and applying molten solder to the suction wire in the area where the soldering iron tip is pressed (d) Failure due to a small amount of molten solder and the heat of the iron tip A process of heating and melting the solder and removing the molten defective solder by using capillary action with a blotting wire (e) A process of pressing the tip of a soldering iron to the part of the printed circuit board from which the defective solder has been removed (f) A process in which a fixed amount of thread solder is sent from the thread solder supply unit toward the tip of the iron, and molten solder for re-soldering is applied to the area where the tip is pressed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6203088A JPH01237073A (en) | 1988-03-17 | 1988-03-17 | Method and device for removing defective solder |
| PCT/JP1989/000190 WO1989008527A1 (en) | 1988-03-17 | 1989-02-23 | Method and apparatus for removing defective solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6203088A JPH01237073A (en) | 1988-03-17 | 1988-03-17 | Method and device for removing defective solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01237073A JPH01237073A (en) | 1989-09-21 |
| JPH0258027B2 true JPH0258027B2 (en) | 1990-12-06 |
Family
ID=13188360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6203088A Granted JPH01237073A (en) | 1988-03-17 | 1988-03-17 | Method and device for removing defective solder |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01237073A (en) |
| WO (1) | WO1989008527A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5072874A (en) * | 1991-01-31 | 1991-12-17 | Microelectronics And Computer Technology Corporation | Method and apparatus for using desoldering material |
| CN104439596A (en) * | 2014-11-14 | 2015-03-25 | 柳州市安龙机械设备有限公司 | Welding gun |
| CN104475908A (en) * | 2014-11-14 | 2015-04-01 | 柳州市安龙机械设备有限公司 | Automatic welding gun |
| CN106392240B (en) * | 2016-12-05 | 2018-07-31 | 辽宁工程技术大学 | A kind of integration soldering handle |
| CN110977078B (en) * | 2019-12-04 | 2021-05-25 | 绍兴柯桥星蓝能环境科技有限公司 | Special-shaped battery output wire welding device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS517428B2 (en) * | 1973-02-01 | 1976-03-08 | ||
| JPS5490047A (en) * | 1977-11-08 | 1979-07-17 | Spirig Ernst | Apparatus for removing solder alloy |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS517428U (en) * | 1974-07-06 | 1976-01-20 | ||
| JPS5543657U (en) * | 1978-09-13 | 1980-03-21 | ||
| JPS5634849Y2 (en) * | 1978-12-09 | 1981-08-17 | ||
| JPS58119965U (en) * | 1982-02-05 | 1983-08-16 | 大日機工株式会社 | Industrial robot soldering hand |
| JPS60121067A (en) * | 1983-12-01 | 1985-06-28 | Mitsubishi Electric Corp | Soldering iron with automatic solder feeder |
| JPS60166465U (en) * | 1984-04-13 | 1985-11-05 | 日本電気株式会社 | All-purpose soldering iron |
| JPS61200649U (en) * | 1985-06-04 | 1986-12-16 | ||
| JPH0248133Y2 (en) * | 1986-02-25 | 1990-12-18 |
-
1988
- 1988-03-17 JP JP6203088A patent/JPH01237073A/en active Granted
-
1989
- 1989-02-23 WO PCT/JP1989/000190 patent/WO1989008527A1/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS517428B2 (en) * | 1973-02-01 | 1976-03-08 | ||
| JPS5490047A (en) * | 1977-11-08 | 1979-07-17 | Spirig Ernst | Apparatus for removing solder alloy |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01237073A (en) | 1989-09-21 |
| WO1989008527A1 (en) | 1989-09-21 |
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